JP2022157694A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2022157694A5 JP2022157694A5 JP2021062056A JP2021062056A JP2022157694A5 JP 2022157694 A5 JP2022157694 A5 JP 2022157694A5 JP 2021062056 A JP2021062056 A JP 2021062056A JP 2021062056 A JP2021062056 A JP 2021062056A JP 2022157694 A5 JP2022157694 A5 JP 2022157694A5
- Authority
- JP
- Japan
- Prior art keywords
- resin layer
- cured product
- polyphenylene ether
- young
- modulus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021062056A JP7705268B2 (ja) | 2021-03-31 | 2021-03-31 | 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品 |
| TW111112568A TWI862911B (zh) | 2021-03-31 | 2022-03-31 | 硬化性樹脂積層體、乾薄膜、硬化物及電子零件 |
| KR1020237028278A KR20230164007A (ko) | 2021-03-31 | 2022-03-31 | 경화성 수지 적층체, 드라이 필름, 경화물 및 전자부품 |
| US18/552,743 US12447725B2 (en) | 2021-03-31 | 2022-03-31 | Curable resin multilayer body, dry film, cured product and electronic component |
| CN202280014146.4A CN116867646B (zh) | 2021-03-31 | 2022-03-31 | 固化性树脂层叠体、干膜、固化物和电子部件 |
| PCT/JP2022/016760 WO2022211071A1 (ja) | 2021-03-31 | 2022-03-31 | 硬化性樹脂積層体、ドライフィルム、硬化物及び電子部品 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021062056A JP7705268B2 (ja) | 2021-03-31 | 2021-03-31 | 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2022157694A JP2022157694A (ja) | 2022-10-14 |
| JP2022157694A5 true JP2022157694A5 (cg-RX-API-DMAC7.html) | 2024-03-08 |
| JP7705268B2 JP7705268B2 (ja) | 2025-07-09 |
Family
ID=83559983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2021062056A Active JP7705268B2 (ja) | 2021-03-31 | 2021-03-31 | 硬化性樹脂積層体、ドライフィルムおよび硬化物、電子部品 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP7705268B2 (cg-RX-API-DMAC7.html) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11227077A (ja) * | 1998-02-13 | 1999-08-24 | Mitsubishi Eng Plast Corp | 多層中空体 |
| JP2003017861A (ja) | 2001-06-28 | 2003-01-17 | Kyocera Corp | 多層配線基板及びその製造方法 |
| JP4276137B2 (ja) | 2003-08-08 | 2009-06-10 | 積水化成品工業株式会社 | 自動車内装材用発泡シート |
| JP7418985B2 (ja) | 2018-09-28 | 2024-01-22 | 太陽ホールディングス株式会社 | 硬化性組成物、ドライフィルム、硬化物および電子部品 |
| JP7497143B2 (ja) | 2019-05-31 | 2024-06-10 | 太陽ホールディングス株式会社 | ポリフェニレンエーテル、硬化性組成物、ドライフィルム、プリプレグ、硬化物および電子部品 |
-
2021
- 2021-03-31 JP JP2021062056A patent/JP7705268B2/ja active Active