JP2022138462A - 基板処理装置および供給弁 - Google Patents

基板処理装置および供給弁 Download PDF

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Publication number
JP2022138462A
JP2022138462A JP2021038356A JP2021038356A JP2022138462A JP 2022138462 A JP2022138462 A JP 2022138462A JP 2021038356 A JP2021038356 A JP 2021038356A JP 2021038356 A JP2021038356 A JP 2021038356A JP 2022138462 A JP2022138462 A JP 2022138462A
Authority
JP
Japan
Prior art keywords
valve
liquid
pump
chamber
valve chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021038356A
Other languages
English (en)
Japanese (ja)
Inventor
真人 柏山
Masato Kashiwayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Priority to JP2021038356A priority Critical patent/JP2022138462A/ja
Priority to TW111104725A priority patent/TWI816298B/zh
Priority to KR1020220028595A priority patent/KR20220127162A/ko
Priority to CN202210223005.5A priority patent/CN115083954A/zh
Publication of JP2022138462A publication Critical patent/JP2022138462A/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
    • B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
    • B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
    • B05C11/1026—Valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K27/00—Construction of housing; Use of materials therefor
    • F16K27/02—Construction of housing; Use of materials therefor of lift valves
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16K—VALVES; TAPS; COCKS; ACTUATING-FLOATS; DEVICES FOR VENTING OR AERATING
    • F16K31/00—Actuating devices; Operating means; Releasing devices
    • F16K31/02—Actuating devices; Operating means; Releasing devices electric; magnetic
    • F16K31/04—Actuating devices; Operating means; Releasing devices electric; magnetic using a motor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D1/00—Pipe-line systems
    • F17D1/08—Pipe-line systems for liquids or viscous products
    • F17D1/14—Conveying liquids or viscous products by pumping
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17D—PIPE-LINE SYSTEMS; PIPE-LINES
    • F17D3/00—Arrangements for supervising or controlling working operations
    • F17D3/01—Arrangements for supervising or controlling working operations for controlling, signalling, or supervising the conveyance of a product
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Water Supply & Treatment (AREA)
  • Public Health (AREA)
  • Health & Medical Sciences (AREA)
  • Coating Apparatus (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Threshing Machine Elements (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Fluid-Driven Valves (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Details Of Valves (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2021038356A 2021-03-10 2021-03-10 基板処理装置および供給弁 Pending JP2022138462A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2021038356A JP2022138462A (ja) 2021-03-10 2021-03-10 基板処理装置および供給弁
TW111104725A TWI816298B (zh) 2021-03-10 2022-02-09 基板處理裝置及供給閥
KR1020220028595A KR20220127162A (ko) 2021-03-10 2022-03-07 기판 처리 장치 및 공급 밸브
CN202210223005.5A CN115083954A (zh) 2021-03-10 2022-03-09 衬底处理装置及供给阀

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2021038356A JP2022138462A (ja) 2021-03-10 2021-03-10 基板処理装置および供給弁

Publications (1)

Publication Number Publication Date
JP2022138462A true JP2022138462A (ja) 2022-09-26

Family

ID=83246505

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021038356A Pending JP2022138462A (ja) 2021-03-10 2021-03-10 基板処理装置および供給弁

Country Status (4)

Country Link
JP (1) JP2022138462A (zh)
KR (1) KR20220127162A (zh)
CN (1) CN115083954A (zh)
TW (1) TWI816298B (zh)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR0175048B1 (ko) * 1996-03-19 1999-04-01 김광호 포토레지스트 분사장치
JPH1133471A (ja) * 1997-07-23 1999-02-09 Tokyo Electron Ltd 塗布装置
JP2000173902A (ja) 1998-12-08 2000-06-23 Dainippon Screen Mfg Co Ltd 基板処理装置
JP4553256B2 (ja) 2005-06-24 2010-09-29 東京エレクトロン株式会社 基板処理システム及びその制御方法

Also Published As

Publication number Publication date
TWI816298B (zh) 2023-09-21
TW202244994A (zh) 2022-11-16
KR20220127162A (ko) 2022-09-19
CN115083954A (zh) 2022-09-20

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Effective date: 20231218