JP2022116078A - ウェハにガラス粉末を充填する装置 - Google Patents
ウェハにガラス粉末を充填する装置 Download PDFInfo
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- 239000011521 glass Substances 0.000 title claims abstract description 81
- 239000000843 powder Substances 0.000 title claims abstract description 81
- 238000011049 filling Methods 0.000 title claims description 18
- 238000007790 scraping Methods 0.000 claims abstract description 84
- 239000000463 material Substances 0.000 claims description 185
- 235000012431 wafers Nutrition 0.000 claims description 146
- 238000013016 damping Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 3
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- 238000003032 molecular docking Methods 0.000 description 12
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- 238000012546 transfer Methods 0.000 description 7
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- 230000005540 biological transmission Effects 0.000 description 5
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G53/00—Conveying materials in bulk through troughs, pipes or tubes by floating the materials or by flow of gas, liquid or foam
- B65G53/04—Conveying materials in bulk pneumatically through pipes or tubes; Air slides
- B65G53/24—Gas suction systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Coating Apparatus (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
2 乾燥室
3 供給マニピュレータ
4 ウェハカセット
401 支持溝
5 材料供給装置
6 掻取装置
7 搬送ベルト
8 送出マニピュレータ
9 ガラス粉末撹拌装置
10 材料供給用支持装置
11 V字形ナイフ
12 掻取用支持装置
13 ウェハカセット昇降モータ
14 ウェハカセット昇降フレーム
15 ウェハカセットステー
16 供給用平行移動フレーム
17 マニピュレータ用平行移動レール
18 供給シリンダ
19 ウェハパレット
1901 退避口
20 送出用平行移動フレーム
21 送出シリンダ
22 センタリング昇降シリンダ
23 センタリングシリンダ
24 センタリングモジュール
25 材料供給ガントリ
26 材料供給用平行移動シリンダ
27 材料取得昇降シリンダ
28 材料取得シリンダ
29 材料取得管
2901 材料吸込部
30 材料吸込ロッド
31 材料供給用トレイ昇降シリンダ
32 材料供給用回転モータ
33 トレイ
3301 昇降部
34 撹拌シリンダ
35 材料溝
36 撹拌軸
37 撹拌リンク
38 撹拌ブロック
39 掻取ガントリ
40 掻取用平行移動シリンダ
41 スクレーパ昇降シリンダ
42 スクレーパホルダ
4201 取付長孔
43 スクレーパ
44 スクレーパ挟持板
45 取付ピン
46 突き当て板
47 掻取用回転モータ
48 掻取用トレイ昇降シリンダ
49 トレイ接続管
50 ドッキングスリーブ
51 伝動スリーブ
52 緩衝ばね。
Claims (11)
- ウェハを支持するための支持装置と、材料供給装置(5)と、掻取装置(6)とを含み、材料供給装置(5)と掻取装置(6)は、いずれも支持装置の上側に設けられ、材料供給装置(5)の下側に材料取得部が取り付けられ、材料供給装置(5)は材料取得部を移動させるように駆動し、掻取装置(6)の下側にスクレーパ(43)が取り付けられ、掻取装置(6)はスクレーパ(43)を移動させるように駆動することを特徴とする、ウェハにガラス粉末を充填する装置。
- 前記材料取得部は、材料取得管(29)、材料吸込ロッド(30)及び材料取得シリンダ(28)を含み、材料吸込ロッド(30)の一端が材料取得管(29)内に入り込み、材料吸込ロッド(30)と材料取得管(29)とが摺動可能かつ密封的に接続され、材料取得管(29)が材料供給装置(5)に取り付けられ、材料取得シリンダ(28)は、材料供給装置(5)に取り付けられ、材料吸込ロッド(30)に接続され、かつ材料吸込ロッド(30)を軸方向に移動させるように駆動することを特徴とする、請求項1に記載のウェハにガラス粉末を充填する装置。
- 前記材料取得管(29)は、垂直方向に設けられ、下端の外径が中間部の外径より小さく、下端に材料吸込部(2901)が形成されていることを特徴とする、請求項2に記載のウェハにガラス粉末を充填する装置。
- 前記材料供給装置(5)は、材料供給用平行移動装置と、材料供給用平行移動装置に取り付けられる材料供給用昇降装置とを含み、材料取得部は、材料供給用昇降装置に設けられていることを特徴とする、請求項1に記載のウェハにガラス粉末を充填する装置。
- 前記材料供給装置(5)は、材料供給用平行移動装置と、材料供給用平行移動装置に取り付けられる材料供給用昇降装置とを含み、材料取得部は、材料供給用昇降装置に設けられていることを特徴とする、請求項2に記載のウェハにガラス粉末を充填する装置。
- 前記スクレーパ(43)は、スクレーパホルダ(42)により掻取装置(6)に取り付けられ、スクレーパ(43)の上部がスクレーパホルダ(42)に摺動可能に接続され、スクレーパ(43)とスクレーパホルダ(42)との間に緩衝ばね(52)が設けられていることを特徴とする、請求項1に記載のウェハにガラス粉末を充填する装置。
- 前記スクレーパ(43)の上側に、両端に取付ピン(45)が対称に設けられているスクレーパ挟持板(44)が固定され、スクレーパホルダ(42)の両側に、対応する側の取付ピン(45)に適合する取付長孔(4201)が設けられ、スクレーパ挟持板(44)の上部は、スクレーパホルダ(42)内に摺動可能に設けられ、緩衝ばね(52)は、スクレーパ挟持板(44)とスクレーパホルダ(42)との間に設けられていることを特徴とする、請求項6に記載のウェハにガラス粉末を充填する装置。
- 前記スクレーパ挟持板(44)の両側は、いずれもスクレーパホルダ(42)から間隔をおいて設けられていることを特徴とする、請求項7に記載のウェハにガラス粉末を充填する装置。
- 前記スクレーパ(43)の一側にV字形ナイフ(11)が設けられ、V字形ナイフ(11)の開口が上向きに設けられ、かつV字形ナイフ(11)とスクレーパ(43)とが垂直に設けられることを特徴とする、請求項1に記載のウェハにガラス粉末を充填する装置。
- 前記支持装置は、材料供給用支持装置(10)及び掻取用支持装置(12)を含み、材料供給装置(5)は、材料供給用支持装置(10)の上側に設けられ、掻取装置(6)は、掻取用支持装置(12)の下側に設けられていることを特徴とする、請求項1に記載のウェハにガラス粉末を充填する装置。
- 前記材料供給用支持装置(10)は、水平に設けられるトレイ(33)と、トレイ(33)に接続され、かつトレイを回転させるように駆動する材料供給用回転電機(32)とを含み、トレイ(33)の上側に、負圧吸引装置が接続されている複数の吸込溝が設けられることを特徴とする、請求項10に記載のウェハにガラス粉末を充填する装置。
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910117921.9 | 2019-02-15 | ||
CN201910117921.9A CN109712919B (zh) | 2019-02-15 | 2019-02-15 | 一种为晶圆填充玻璃粉的装置 |
JP2021547402A JP7076650B2 (ja) | 2019-02-15 | 2020-02-14 | ウェハにガラス粉末を充填する装置 |
PCT/CN2020/075300 WO2020164595A1 (zh) | 2019-02-15 | 2020-02-14 | 一种为晶圆填充玻璃粉的装置 |
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JP2021547402A Division JP7076650B2 (ja) | 2019-02-15 | 2020-02-14 | ウェハにガラス粉末を充填する装置 |
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JP2022116078A true JP2022116078A (ja) | 2022-08-09 |
JP7300539B2 JP7300539B2 (ja) | 2023-06-29 |
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JP2022080381A Active JP7300539B2 (ja) | 2019-02-15 | 2022-05-16 | ウェハにガラス粉末を充填する装置 |
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US (1) | US11972959B2 (ja) |
EP (1) | EP3926666B1 (ja) |
JP (2) | JP7076650B2 (ja) |
KR (1) | KR102551148B1 (ja) |
CN (1) | CN109712919B (ja) |
WO (1) | WO2020164595A1 (ja) |
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CN109712919B (zh) * | 2019-02-15 | 2024-05-28 | 山东才聚电子科技有限公司 | 一种为晶圆填充玻璃粉的装置 |
CN112592073A (zh) * | 2020-12-30 | 2021-04-02 | 惠州市宝斯特实业有限公司 | 一种用于玻璃的防霉粉涂刷设备 |
CN112864058B (zh) * | 2021-03-04 | 2022-09-23 | 山东才聚电子科技有限公司 | 一种晶圆玻璃粉擦粉装置 |
CN114446840B (zh) * | 2022-04-08 | 2022-07-01 | 四川上特科技有限公司 | 一种晶圆玻璃粉擦除装置 |
CN116525488B (zh) * | 2023-04-26 | 2024-05-14 | 华中科技大学 | 一种晶圆沟道的直写填充装置 |
CN117393480B (zh) * | 2023-10-16 | 2024-03-19 | 济南兰星电子有限公司 | 二极管芯片生产用玻璃浆自动擦拭装置 |
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JPS556805A (en) * | 1978-06-29 | 1980-01-18 | Toshiba Corp | Method of producing semiconductor |
JP2006150233A (ja) * | 2004-11-29 | 2006-06-15 | Tokyo Ohka Kogyo Co Ltd | 塗布装置、塗布方法および被膜形成装置 |
WO2018101031A1 (ja) * | 2016-12-01 | 2018-06-07 | 住友精密工業株式会社 | 塗膜形成方法および塗膜形成装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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JPS55163847A (en) * | 1979-06-08 | 1980-12-20 | Rohm Co Ltd | Manufacture of semiconductor device |
JPS59130431A (ja) * | 1983-01-17 | 1984-07-27 | Hitachi Ltd | ガラス被覆半導体装置の製造方法 |
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JP2022517437A (ja) | 2022-03-08 |
EP3926666A4 (en) | 2022-05-04 |
KR20210110694A (ko) | 2021-09-08 |
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US20220013378A1 (en) | 2022-01-13 |
JP7076650B2 (ja) | 2022-05-27 |
CN109712919B (zh) | 2024-05-28 |
KR102551148B1 (ko) | 2023-07-03 |
EP3926666A1 (en) | 2021-12-22 |
CN109712919A (zh) | 2019-05-03 |
US11972959B2 (en) | 2024-04-30 |
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