JP2022106161A - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 135
- 239000000758 substrate Substances 0.000 claims abstract description 49
- 239000012535 impurity Substances 0.000 claims description 24
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 14
- 229920005591 polysilicon Polymers 0.000 claims description 14
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- 230000015556 catabolic process Effects 0.000 abstract 1
- 238000006731 degradation reaction Methods 0.000 abstract 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 89
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- 238000000137 annealing Methods 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 5
- 230000004888 barrier function Effects 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
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- 230000032683 aging Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- 239000005360 phosphosilicate glass Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
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- 238000007740 vapor deposition Methods 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
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- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 238000004151 rapid thermal annealing Methods 0.000 description 1
- 230000006798 recombination Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
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- 239000005368 silicate glass Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 229910052716 thallium Inorganic materials 0.000 description 1
- BKVIYDNLLOSFOA-UHFFFAOYSA-N thallium Chemical compound [Tl] BKVIYDNLLOSFOA-UHFFFAOYSA-N 0.000 description 1
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Abstract
Description
本発明にかかる半導体装置は、シリコンよりもバンドギャップが広い半導体(以下、ワイドバンドギャップ半導体とする)を用いて構成される。ここでは、ワイドバンドギャップ半導体として例えば炭化珪素(SiC)を用いた半導体装置(炭化珪素半導体装置)の構造を例に説明する。図1は、実施の形態にかかる炭化珪素半導体装置の構造を示す上面図である。図2は、実施の形態にかかる炭化珪素半導体装置の構造を示す図1のA-A’部分の断面図である。図3は、実施の形態にかかる炭化珪素半導体装置の構造を示す図1のB-B’部分の断面図である。図4は、実施の形態にかかる炭化珪素半導体装置の構造を示す図1のC-C’部分の断面図である。ここで、図5は、実施の形態にかかる炭化珪素半導体装置の構造を示す図1のD-D’部分の断面図である。図4は、ツナギ領域41のC-C’断面図であり、図5は、素子構造が形成されオン状態のときに基板の厚さ方向に主電流が流れる活性領域のD-D’断面図である。
次に、実施の形態にかかる半導体装置の製造方法について説明する。図7~図11は、実施の形態にかかる炭化珪素半導体装置の製造途中の状態を示す断面図である。図12、図14、図16、図18、図20および図22は、実施の形態にかかる炭化珪素半導体装置の製造途中の状態を示す上面図である。また、図13、図15、図17、図19、図21および図23は、実施の形態にかかる炭化珪素半導体装置の製造途中の状態を示す図12のA-A’部分の断面図である。
2、102 n+型炭化珪素基板
3、103 第1p+型領域
4、104 第2p+型領域
5、105 p+型領域
15、115 n型領域
15a 下側n型領域
15b 上側n型領域
16、116 p型ベース層
17、117 n+型ソース領域
18、118 p++型コンタクト領域
19、119 ゲート絶縁膜
20、120 ゲート電極
21、121 層間絶縁膜
22、122 ソース電極
25 層間絶縁膜
26 ゲートコンタクト領域
27 ゲートランナー
28 ソース電極パッド
29、129 ショットキーメタル
31、131 トレンチゲート
32、132 トレンチSBD
40、140 活性領域
41、141 ツナギ領域
42、142 エッジ領域
43 JTE領域
50、150 SBD内蔵の炭化珪素半導体装置
Claims (4)
- 第1導電型の半導体基板と、
前記半導体基板のおもて面に設けられた、前記半導体基板よりも不純物濃度の低い第1導電型の第1半導体層と、
前記第1半導体層の、前記半導体基板側に対して反対側に設けられた第2導電型の第2半導体層と、
前記第2半導体層の内部に選択的に設けられた、前記半導体基板よりも不純物濃度の高い第1導電型の第1半導体領域と、
前記第1半導体領域および前記第2半導体層を貫通して前記第1半導体層に達する第1トレンチおよび第2トレンチと、
前記第1トレンチの内部にゲート絶縁膜を介して設けられたゲート電極と、
前記第2トレンチの内部に設けられたショットキー電極と、
を備え、
前記第1トレンチは、平面視でストライプ状に設けられ、
前記第2トレンチは、前記第1トレンチを取り囲んでいることを特徴とする半導体装置。 - オン状態のときに電流が流れる活性領域の周囲を囲んで耐圧を保持するエッジ領域に、耐圧を向上させるための接合終端構造を備え、
前記第2トレンチは、前記第1トレンチと平行なストライプ状の部分と、前記ストライプ状の部分を接続する外周の部分を有し、
前記第1トレンチの端と、前記第2トレンチの前記外周の部分との距離は、前記第1トレンチと前記第2トレンチとの間の間隔以上であり、かつ、前記第1トレンチの端は、前記接合終端構造より前記活性領域側に設けられていることを特徴とする請求項1に記載の半導体装置。 - 前記第2トレンチは、ポリシリコンとのヘテロ接合で構成されていることを特徴とする請求項1または2に記載の半導体装置。
- 前記第2トレンチの一部は、前記ゲート電極とゲートランナーとを接続するゲートコンタクト領域と深さ方向に対向する位置に設けられていることを特徴とする請求項1~3のいずれか一つに記載の半導体装置。
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