JP2022095302A5 - - Google Patents
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- JP2022095302A5 JP2022095302A5 JP2020208544A JP2020208544A JP2022095302A5 JP 2022095302 A5 JP2022095302 A5 JP 2022095302A5 JP 2020208544 A JP2020208544 A JP 2020208544A JP 2020208544 A JP2020208544 A JP 2020208544A JP 2022095302 A5 JP2022095302 A5 JP 2022095302A5
- Authority
- JP
- Japan
- Prior art keywords
- die
- resin
- film
- adhesive layer
- mass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 28
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- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 3
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 3
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 3
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- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 2
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- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
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- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
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- 229910001425 magnesium ion Inorganic materials 0.000 description 2
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 2
- 239000000391 magnesium silicate Substances 0.000 description 2
- 229910052919 magnesium silicate Inorganic materials 0.000 description 2
- 235000019792 magnesium silicate Nutrition 0.000 description 2
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| TW110146695A TW202239850A (zh) | 2020-12-16 | 2021-12-14 | 晶圓切割膠帶及晶圓切割黏晶膜 |
| KR1020210179328A KR20220086506A (ko) | 2020-12-16 | 2021-12-15 | 다이싱 테이프 및 다이싱 다이 본드 필름 |
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| JP6776081B2 (ja) | 2016-09-28 | 2020-10-28 | リンテック株式会社 | 保護膜付き半導体チップの製造方法及び半導体装置の製造方法 |
| WO2018092671A1 (ja) | 2016-11-18 | 2018-05-24 | 古河電気工業株式会社 | 接合フィルム、ウエハ加工用テープ、接合体の製造方法および接合体 |
| WO2018123804A1 (ja) | 2016-12-27 | 2018-07-05 | 三井・デュポンポリケミカル株式会社 | ダイシングフィルム基材およびダイシングフィルム |
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| CN115699263A (zh) | 2020-06-10 | 2023-02-03 | 三井化学东赛璐株式会社 | 电子装置的制造方法 |
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