JP2022089380A - Pressure monitoring device, resin sealing device, and pressure monitoring method - Google Patents

Abstract

To provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method that can suppress the occurrence of molding defects.SOLUTION: A pressure monitoring device (100) has: an adsorption pressure sensor (122) that detects the adsorption pressure of an exhaust hole (322) that adsorbs a release film (RF) in a cavity (201); a degassing pressure sensor (111) that detects the degassing pressure of an exhaust hole (311) that exhausts air in the cavity (201); and a monitoring section (110) connected to the adsorption pressure sensor (122) and the degassing pressure sensor (111). The monitoring unit (110) monitors the amount of change per unit period of at least one of adsorption pressure and depressurization pressure, and after the decompression period during which the amount of change per unit period in adsorption and decompression pressure increases, an error is determined when the amount of change exceeds a predetermined amount during the equilibrium period when the amount of change per unit period in adsorption and decompression pressure asymptotically approaches 0.SELECTED DRAWING: Figure 1

Description

The present invention relates to a pressure monitoring device, a resin sealing device, and a pressure monitoring method.

The resin sealing mold of the resin sealing device is provided with an exhaust hole for adsorbing the release film and degassing the internal space.

For example, in Patent Document 1, a lower die provided with an exhaust hole for degassing an internal space and an exhaust hole for fixing a work, and an upper die provided with an exhaust hole for fixing a release film. A resin-sealed mold having the above is disclosed.

Japanese Unexamined Patent Publication No. 2018-51841

In the case of the resin encapsulation device described in Patent Document 1, if a phenomenon such as a release film falling off or a degassing defect occurs, a molding defect may occur.

The present invention has been made in view of such circumstances, and an object of the present invention is to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method capable of suppressing the occurrence of molding defects.

The pressure monitoring device according to one aspect of the present invention is a pressure monitoring device for a resin-sealed mold that monitors the exhaust pressure from one mold and a resin-sealed mold having the other mold, and is a resin. Remove the suction pressure sensor that detects the suction pressure of the exhaust hole that sucks the release film into the cavity provided in one of the sealing molds and the cavity provided in the other mold of the resin sealing mold. It includes a degassing pressure sensor that detects the depressure of the exhaust hole to be anxious, and a monitoring unit connected to the suction pressure sensor and the degassing pressure sensor. The monitoring unit is a unit of at least one of suction pressure and depressure. An equilibrium period in which the amount of change per unit period of adsorption pressure and depressurization approaches 0 after the decompression period in which the amount of change per unit period of adsorption pressure and depressurization increases by monitoring the amount of change per period. If the amount of change exceeds a predetermined amount, it is judged as an error.

According to this aspect, it is possible to detect a defect accompanied by a minute pressure change of adsorption pressure or depressurization. For example, by detecting the temporary separation of the release film from the mold and warning the contact between the release film and the work, it is possible to suppress the outflow of defective products in which the element characteristics of the work fluctuate. Further, by detecting a vacuum leak due to deterioration of the resin sealing mold and promoting maintenance, it is possible to suppress voids generated when air is embraced in the sealing resin.

In the above embodiment, the monitoring unit may determine that an error occurs when the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds a predetermined amount twice or more in succession.

In the above aspect, the monitoring unit may determine that an error occurs when at least one of the suction pressure and the depressurization pressure value exceeds a predetermined value.

In the above embodiment, the monitoring unit may monitor the amount of change in at least one of the adsorption pressure and the depressurization per unit period when the pressure value of at least one of the adsorption pressure and the depressurization is a predetermined value or less.

In the above aspect, one mold of the resin-sealed mold may be an upper mold, and the other mold of the resin-sealed mold may be a lower mold.

In the above embodiment, the monitoring unit may monitor the amount of change in the adsorption pressure per unit period during the degassing of the cavity.

In the above embodiment, the monitoring unit may monitor the amount of change in depressurization per unit period after degassing the cavity.

The resin encapsulation device according to one aspect of the present invention includes a pressure monitoring device according to any one of the above embodiments, a resin encapsulation mold, an adsorption pump connected to one of the resin encapsulation dies, and a resin. It includes a degassing pump connected to the other mold of the sealing die, and a control unit for controlling the suction pump and the degassing pump.

According to this aspect, it is possible to detect a defect accompanied by a minute pressure change of adsorption pressure or depressurization. For example, by detecting the temporary separation of the release film from the mold and warning the contact between the release film and the work, it is possible to suppress the outflow of defective products in which the element characteristics of the work fluctuate. Further, by detecting a vacuum leak due to deterioration of the resin sealing mold and promoting maintenance, it is possible to suppress voids generated when air is embraced in the sealing resin.

The pressure monitoring method according to one aspect of the present invention is a pressure monitoring method for a resin-sealed mold that monitors the exhaust pressure from one mold and a resin-sealed mold having the other mold, and is a resin. Detecting the suction pressure of the exhaust hole that sucks the release film into the cavity provided in one mold of the sealing mold, and the air in the cavity provided in the other mold of the resin sealing mold. A depressurization period in which the depressurization of the exhaust hole to be exhausted is detected and the amount of change in at least one of the adsorption pressure and depressurization per unit period is monitored, and the amount of change in the adsorption pressure and depressurization per unit period increases. It includes determining that an error occurs when the amount of change exceeds a predetermined amount in the equilibrium period in which the amount of change in adsorption pressure and depressurization per unit period approaches 0 after that.

According to this aspect, it is possible to detect a defect accompanied by a minute pressure change of adsorption pressure or depressurization. For example, by detecting the temporary separation of the release film from the mold and warning the contact between the release film and the work, it is possible to suppress the outflow of defective products in which the element characteristics of the work fluctuate. Further, by detecting a vacuum leak due to deterioration of the resin sealing mold and promoting maintenance, it is possible to suppress voids generated when air is embraced in the sealing resin.

In the above embodiment, the determination of an error may be determined as an error when the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds a predetermined amount twice or more in succession.

According to the present invention, it is possible to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method capable of suppressing the occurrence of molding defects.

It is a figure which shows schematic structure of the resin sealing apparatus which concerns on embodiment. It is a graph which shows the normal suction pressure, depressure, and the change of a clamp position. It is a graph which shows the change of the adsorption pressure and the depressurization when the release film is peeled off. It is a graph which shows the change of the adsorption pressure and the depressurization when the vacuum leakage of a resin sealing die occurs. It is a flowchart which shows the manufacturing method of the resin sealed product which concerns on embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. The drawings of each embodiment are examples, and the dimensions and shapes of each part are schematic, and the technical scope of the present invention should not be limited to the embodiment.

<Embodiment>
The configuration of the resin sealing device 1 according to the embodiment of the present invention will be described with reference to FIG. 1. FIG. 1 is a diagram schematically showing a configuration of a resin sealing device according to an embodiment.

The resin sealing device 1 is a device used for resin-sealing (molding) the work W with the resin P. The resin sealing device 1 includes a resin sealing mold 200, a vacuum pump 411, 421, 421, 422, and a pressure monitoring device 100. The resin sealing device 1 is a transfer type molding machine that pressurizes the resin P by the pressure of pushing it out, but the resin sealing device 1 is not limited to this. The resin sealing device is not limited to the transfer type molding machine, and may be a compression type molding machine that pressurizes the resin by the pressure of pressing the resin with the resin sealing mold.

The work W has a substrate and an element, and the element is fixed on the substrate. For example, the element is wire-bonded mounted on the substrate. As an example, the substrate is a resin substrate and the element is a semiconductor chip, but the substrate and the element are not limited thereto. For example, the substrate may be a glass substrate, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, a semiconductor wafer, or the like. The element may be a MEMS device, an electronic device, or the like. The element may be flip-chip mounted on the substrate or may be detachably bonded.

The resin sealing mold 200 includes a lower mold 210 and an upper mold 220. The upper mold 220 corresponds to one mold, and the lower mold 210 corresponds to the other mold. The resin sealing mold 200 has an upper mold cavity structure having a cavity 201 in the upper mold 220. An internal space is formed by the cavity 201 between the molded lower mold 210 and the upper mold 220. The resin-sealed mold 200 includes a seal ring 203 (for example, an O-ring) that seals the internal space of the resin-sealed mold 200. Note that FIG. 1 shows a chase structure (lower mold chase) among the lower mold 210, but the lower mold 210 has a base structure (lower mold base) that accommodates the illustrated lower mold chase. You may prepare. Similarly, FIG. 1 shows a chase structure (upper mold chase) among the upper mold 220, but the upper mold 220 has a base structure (upper mold base) not shown, which accommodates the illustrated upper mold chase. May be provided. The resin sealing mold 200 may have a chase change structure in which the chase structure can be replaced. Although not shown, the resin encapsulation device 1 includes a temperature control unit (for example, a heater) for adjusting the internal temperature (molding temperature) of the resin encapsulation mold 200. The heater may be provided on the base structure, for example, to heat the entire chase structure.

The lower mold 210 is provided with exhaust holes 311, 312. Negative pressure (depressurization) for degassing the cavity 201 (internal space of the molded resin-sealed mold 200) is applied to the exhaust hole 311, and the exhaust hole 312 fixes the work W to the lower mold 210. Negative pressure (work fixing pressure) is applied. Further, the lower mold 210 is provided with a pot for heating and softening the resin P, and a plunger J for extruding the resin P.

The upper die 220 includes a chase block 221, a cavity piece 223, a clamper 225 that is in sliding contact with the cavity piece 223, and a chamber block 227 that is provided on the outside of the clamper 225 at intervals. In addition, these members may be collectively referred to as an upper type chase. The cavity piece 223 is fixed to the chase block 221. The clamper 225 protrudes from the cavity piece 223 toward the lower mold 210 and constitutes the cavity 201 together with the cavity piece 223. When the mold is fastened, the outer edge portion of the work W is sandwiched between the clamper 225 and the lower mold 210. When the mold is fastened, the seal ring 203 is sandwiched between the chamber block 227 and the lower mold 210.

The upper mold 220 is provided with exhaust holes 321 and 322. A negative pressure (film adsorption pressure) for adsorbing the release film RF to the upper mold 220 is applied to the exhaust hole 321, and a negative pressure (film cavity adsorption pressure) for adsorbing the release film RF along the wall surface of the cavity 201 in the exhaust hole 322. Is applied. The exhaust hole 321 is provided in the clamper 225, and the exhaust hole 322 is provided between the cavity piece 223 and the clamper 225.

A plurality of vacuum pumps are provided in the resin sealing device 1, and suction of the work W, depressurization of the cavity 201, and suction of the release film RF are performed. The vacuum pump 411 is a degassing pump that is connected to the exhaust hole 311 of the lower mold 210 and applies degassing. The vacuum pump 412 is a fixed pump connected to the exhaust hole 312 of the lower mold 210 and applying a work fixing pressure. The vacuum pump 421 is a suction pump that is connected to the exhaust hole 321 of the upper die 220 and applies a film suction pressure. The vacuum pump 422 is a suction pump that is connected to the exhaust hole 322 of the upper die 220 and applies a film cavity suction pressure. Hereinafter, the vacuum pumps 421 and 422 are collectively referred to as an “adsorption pump”, and the film adsorption pressure and the film cavity adsorption pressure are collectively referred to as an “adsorption pressure”.

The configuration of the vacuum pumps 411,421,421,422 is not limited to the above. For example, the exhaust holes 311, 312 may be connected to a common vacuum pump. That is, the depressurization and the work fixing pressure may be equivalent. Similarly, the exhaust holes 321 and 322 may be connected to a common vacuum pump, and the film suction pressure and the film cavity suction pressure may be the same.

The pressure monitoring device 100 includes pressure gauges 111, 112, 121, 122, a monitoring unit 110, and a control unit 130.

The pressure gauge 111 is a degassing pressure sensor connected to the vacuum pump 411 and detecting degassing. The pressure gauge 112 is a suction pressure sensor connected to the vacuum pump 412 and detecting the work fixing pressure. The pressure gauge 121 is a suction pressure sensor connected to the vacuum pump 421 and detects the film suction pressure. The pressure gauge 122 is a suction pressure sensor connected to the vacuum pump 422 and detects the suction pressure of the film cavity.

The monitoring unit 110 is connected to the pressure gauges 111, 112, 121, 122 and monitors the depressurization pressure, the work fixing pressure, the pressure values of the film adsorption pressure and the film cavity adsorption pressure, and the amount of change of these pressures per unit period. do. The monitoring of the change amount is performed immediately after the start of the vacuum pumps 411,421,421,422 after the decompression period in which the change amount increases, and in the equilibrium period in which the change amount approaches 0. The monitoring unit 110 determines that an error occurs when the change amount exceeds a predetermined amount, and performs error processing. The monitoring unit 110 displays error processing such as warning of the occurrence of defective products, stopping the operation of the resin sealing device 1, requesting maintenance of the resin sealing mold 200, and the like on a display unit (not shown). be able to.

The control unit 130 controls the operation of the vacuum pumps 411,421,421,422. Further, the control unit 130 controls the clamp position (the position relative to the upper mold 220 of the lower mold 210) and switches between the mold tightening state and the mold opening state of the resin sealing mold 200. The control unit 130 is connected to the monitoring unit 110 and changes the operation of the vacuum pumps 411,421,421,422 based on the monitoring data sent from the monitoring unit 110. For example, the control unit 130 may control the operation of the vacuum pumps 411,421,421,422 linked to the clamp position during normal operation including starting and stopping, and the vacuum pumps 411,421,421,422 based on error processing. Performs emergency operation control including output adjustment and stop. It should be noted that the control unit that controls the operation in the normal state and the control unit that controls the operation in the emergency may be provided separately.

Next, an example of the operation of the monitoring unit 110 and the control unit 130 will be described with reference to FIG. FIG. 2 is a graph showing normal suction pressure, depressurization, and changes in clamp position. The horizontal axis of the graph indicates time, and the unit is sec (seconds). The left vertical axis of the graph shows the adsorption pressure and the depressurization, and the unit is kPa. The right vertical axis of the graph indicates the clamp position, and the unit is mm. Here, since the same negative pressure is applied to the film adsorption pressure and the film cavity adsorption pressure at the same time, they are collectively referred to as the adsorption pressure. The clamp position is based on the position of the lower mold 210 in the opened state (0 mm), and increases when the lower mold 210 approaches the upper mold 220. For example, when the clamp position is 170 mm, the mold is fastened.

When sealing the resin, first, the control unit 130 starts the vacuum pumps (suction pumps) 421 and 422. In the decompression period immediately after the start of the vacuum pumps 421 and 422, the amount of change in the suction pressure increases negatively, and the suction pressure, which is substantially the same as the atmospheric pressure, drops sharply. In the subsequent equilibrium period, the performance limit of the vacuum pumps 421 and 422 is reached, and the suction pressure gradually approaches zero. When the suction pressure is sufficiently lowered, for example, after the suction pressure falls below a predetermined value (threshold value), the control unit 130 raises the clamp position and starts mold clamping.

After the rise of the clamp position is completed and the mold clamping of the resin sealing mold 200 is completed, the control unit 130 starts the vacuum pump (degassing pump) 411 and starts degassing. In the decompression period immediately after the start of the vacuum pump 411, the amount of change in decompression increases negatively, and the decompression, which is substantially the same as the atmospheric pressure, drops sharply. In the subsequent equilibrium period S1, the performance limit of the vacuum pump 411 is reached, and the degassing gradually approaches zero. The lower limit of depressurization is lower than the lower limit of exhaust pressure. The performance limit of the vacuum pump referred to here refers to the maximum output with a margin when operating assuming a predetermined depressurization / suction force, and does not refer to the performance limit of the pump itself.

In the equilibrium period S1 of depressurization, in the first half S2 until the resin P is heated and pressed inside the resin encapsulation mold 200 to be cured, the control unit 130 is evacuated with the vacuum pumps (suction pumps) 421 and 422. Continue to operate the pump (deaeration pump) 411. In the latter stage S3 after the resin P is cured and the work W is sealed with the resin in the depressurization equilibrium period S1, the control unit 130 stops the vacuum pumps 421 and 422 and the vacuum pump 411. In this late S3, the control unit 130 does not lower the clamp position, and the suction pressure and the depressurization are maintained. That is, when no problem has occurred, the amount of change in depressurization per unit period in the equilibrium period S1 is approximately 0 from the early stage S2 to the late stage S3.

The monitoring unit 110 determines that an error occurs when the pressure values of the suction pressure and the depressurization exceed the threshold value in the equilibrium period S1. In the equilibrium period S1, when the pressure values of the suction pressure and the depressurization are lower than the monitoring pressure, the monitoring unit 110 monitors the amount of change in the suction pressure and the depressurization per unit period, and the change amount is a predetermined amount. If it exceeds, it is judged as an error. The monitoring pressure is, for example, a threshold, but the monitoring pressure may be lower than the threshold. Therefore, the monitoring unit 110 detects even an abnormality in the pressure range lower than the threshold value as a change amount.

The start of the equilibrium period S1 at which the monitoring unit 110 starts monitoring the amount of change in the suction pressure and the depressurization is, for example, the timing when the degassing falls below the threshold value, but is not limited to this. For example, the beginning of the equilibrium period S1 may be the timing when the depressurization falls below the adsorption pressure.

Next, with reference to FIGS. 3 and 4, changes in the suction pressure and the depressurization that the monitoring unit 110 determines as an error will be described. FIG. 3 is a graph showing changes in adsorption pressure and depressurization when the release film is peeled off. FIG. 4 is a graph showing changes in adsorption pressure and depressurization when a vacuum leak occurs in the resin encapsulation mold.

In the first half S2 shown in FIG. 3, both the adsorption pressure and the depressurization are applied to the release film RF. Since the force caused by the suction pressure is stronger than the force caused by the depressurization, the release film RF is adsorbed on the upper mold 220. On the other hand, when the depressurization becomes dominant over the adsorption pressure locally and temporarily, a part of the release film RF is temporarily separated from the upper mold 220. At this time, the amount of change in the adsorption pressure and the depressurization per unit period increases positively at substantially the same timing. After that, in the process of the temporarily separated release film RF being adsorbed to the upper mold 220 again, the amount of change in the adsorption pressure and the depressurization per unit period increases negatively and then gradually approaches 0. As described above, even if the abnormality of the release film RF does not change the suction pressure and the depressurization to the extent that the threshold value is exceeded, the monitoring unit 110 can detect the change amount of the suction pressure and the depressurization per unit period. ..

In the late S3 shown in FIG. 4, after the degassing pump was stopped, the depressurization increased with time even though the mold was not opened. This indicates that the airtightness is lowered when the configuration of the resin-sealed mold 200 changes with time. For example, deterioration of the seal ring 203 and other packings for maintaining airtightness provided in the mold may occur. Such a change in the resin sealing die 200 gradually progresses, but the monitoring unit 110 can detect the abnormality at an early stage as a change amount per unit period of depressurization. Therefore, the monitoring unit 110 determines that maintenance of the resin-sealed mold 200 is necessary before the air that has entered from the deteriorated portion of the resin-sealed mold 200 is embraced by the resin and causes voids or the like. And can issue a warning.

Next, with reference to FIG. 5, an example of a method for manufacturing a resin-sealed product including a method for monitoring the pressure of the resin-sealed mold 200 will be described. FIG. 5 is a flowchart showing a method for manufacturing a resin-sealed product according to an embodiment.

First, the suction pump is started (S11), and the suction pressure is detected (S12). Next, the degassing pump is started (S13), and degassing is detected (S14).

Next, the amount of change in the adsorption pressure and the depressurization per unit period is monitored until the curing time of the resin P elapses, that is, in the first half S2 of the equilibrium period S1. Specifically, first, it is determined whether or not the resin curing time has elapsed (S21). If it has not passed, it is determined whether or not the amount of change in at least one of the adsorption pressure and the depressurization for one period exceeds a predetermined amount (S22). If the amount does not exceed the predetermined amount, the process returns to step S21 for determining whether or not the resin curing time of the resin P has elapsed. When the amount of change in one period exceeds a predetermined amount, it is determined whether or not the amount of change in at least one of the adsorption pressure and the depressurization in the next period exceeds the predetermined amount (S23). If the amount does not exceed the predetermined amount, the process returns to step S21 for determining whether or not the resin curing time has elapsed. If the amount of change in the next period exceeds the predetermined amount, that is, if the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds the predetermined amount twice in a row, it is judged as an error (S24). ).

When it is determined in step S21 that the resin curing time has elapsed, the degassing pump is stopped (S31). Next, it is determined whether or not the mold opening time has elapsed (S32). If it has not passed, it is determined whether or not the amount of change in at least one of the adsorption pressure and the depressurization for one period exceeds a predetermined amount (S33). If the predetermined amount is not exceeded, the process returns to step S32 for determining whether or not the mold opening time has elapsed. When the amount of change in one period exceeds a predetermined amount, it is determined whether or not the amount of change in at least one of the adsorption pressure and the depressurization in the next period exceeds the predetermined amount (S34). If the predetermined amount is not exceeded, the process returns to step S32 for determining whether or not the mold opening time has elapsed. If the amount of change in the next period exceeds the predetermined amount, that is, if the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds the predetermined amount twice in a row, it is judged as an error (S35). ).

The error processing after determining an error in the steps S24 and S35 is not particularly limited. In the error processing after the step S24, for example, the operation of the resin sealing device 1 may be stopped, or the resin sealing may be continued leaving a log warning of the occurrence of defective products. In the error processing after the step S35, for example, maintenance of the resin-sealed mold 200 may be requested, or the deterioration level of the resin-sealed mold 200 may be notified.

According to the configuration described in the above embodiment, the monitoring unit 110 that monitors the suction pressure and the depressurization has the change amount in the equilibrium period S1 in which the change amount of the suction pressure and the depressurization per unit period approaches 0. If it exceeds the fixed amount, it is judged as an error. The monitoring unit 110 monitors the amount of change in at least one of the adsorption pressure and the depressurization per unit period, and may monitor the amount of change in both the adsorption pressure and the depressurization per unit period. According to this, it is possible to detect a defect accompanied by a minute pressure change of adsorption pressure or depressurization. For example, by detecting the temporary separation of the release film RF from the resin encapsulation mold 200 and warning the contact between the release film RF and the work W, the outflow of defective products whose element characteristics of the work W fluctuate is suppressed. can. Further, by detecting a vacuum leak due to deterioration of the resin sealing mold 200 and promoting maintenance, it is possible to suppress voids generated when air is embraced in the sealing resin P.

The monitoring unit 110 determines that an error occurs when the amount of change in the suction pressure and the depressurization per unit period exceeds the predetermined amount twice in succession. In particular, when the amount of change in the decompression period is negative, an error is determined when the amount of positive change exceeds a predetermined amount two or more times in a row. According to this, erroneous judgment is reduced and monitoring accuracy is improved.

The monitoring unit 110 may set a threshold value for at least one of the suction pressure and the depressurization, and may determine that an error occurs when the threshold value is exceeded. Further, the monitoring unit 110 may monitor the amount of change in the suction pressure and the depressurization per unit period when the suction pressure and the depressurization are equal to or less than the monitoring pressure, and the monitoring pressure is the suction pressure or the depressurization. It may be a threshold of atmospheric pressure. According to this, the monitoring unit 110 can detect an abnormality even if the pressure change is minute or less than the threshold value.

By monitoring the amount of change in the adsorption pressure per unit period during degassing of the cavity 201, the monitoring unit 110 can detect the local and temporary separation of the release film RF from the resin sealing mold 200.

The monitoring unit 110 monitors the amount of change in the degassing of the cavity 201 after degassing per unit period, so that it is possible to determine the deterioration of the airtightness of the resin-sealed mold 200.

As described above, it is possible to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method capable of suppressing the occurrence of molding defects.

The embodiments described above are for facilitating the understanding of the present invention, and are not for limiting the interpretation of the present invention. Each element included in the embodiment and its arrangement, material, condition, shape, size, and the like are not limited to those exemplified, and can be appropriately changed. Further, it is possible to partially replace or combine the configurations shown in different embodiments.

1 ... Resin sealing device, 100 ... Pressure monitoring device, 110 ... Monitoring unit, 111, 112, 121, 122 ... Pressure gauge, 130 ... Control unit, 200 ... Resin sealing mold, 210 ... Lower mold, 220 ... Upper Mold, 311, 312, 321, 322 ... Exhaust hole, 411, 421, 421, 422 ... Vacuum pump.

Claims (10)

A pressure monitoring device for the resin-sealed mold that monitors the exhaust pressure from one mold and a resin-sealed mold having the other mold.
A suction pressure sensor that detects the suction pressure of the exhaust hole that sucks the release film into the cavity provided in one of the resin-sealed molds, and
A degassing pressure sensor for detecting the degassing of the exhaust hole for degassing the cavity provided in the other mold of the resin-sealed mold, and a degassing pressure sensor.
A monitoring unit connected to the suction pressure sensor and the degassing pressure sensor,
Equipped with
The monitoring unit monitors the amount of change in at least one of the adsorption pressure and the decompression per unit period, and is after the decompression period in which the amount of change in the adsorption pressure and the decompression per unit period increases. A pressure monitoring device that determines that an error occurs when the amount of change in the suction pressure and the amount of decompression per unit period approaches 0 in the equilibrium period and the amount of change exceeds a predetermined amount. The monitoring unit determines that an error occurs when the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds a predetermined amount two or more times in a row.
The pressure monitoring device according to claim 1. The monitoring unit determines that an error occurs when at least one of the suction pressure and the depressurization pressure value exceeds a predetermined value.
The pressure monitoring device according to claim 1 or 2. The monitoring unit monitors the amount of change in at least one of the adsorption pressure and the depressurization per unit period when the pressure value of at least one of the adsorption pressure and the depressurization is a predetermined value or less.
The pressure monitoring device according to claim 3. One of the resin-sealed molds is an upper mold, and the other mold of the resin-sealed mold is a lower mold.
The pressure monitoring device according to any one of claims 1 to 4. The monitoring unit monitors the amount of change in the adsorption pressure per unit period during degassing of the cavity.
The pressure monitoring device according to claim 5. The monitoring unit monitors the amount of change in the depressurization per unit period after degassing the cavity.
The pressure monitoring device according to claim 5 or 6. The pressure monitoring device according to any one of claims 1 to 7.
With the resin sealing mold
A suction pump connected to one of the resin-sealed molds,
A degassing pump connected to the other mold of the resin-sealed mold, and
A control unit that controls the suction pump and the degassing pump,
A resin sealing device. It is a pressure monitoring method for a resin-sealed mold that monitors the exhaust pressure from one mold and a resin-sealed mold having the other mold.
Detecting the suction pressure of the exhaust hole that sucks the release film into the cavity provided in one of the resin-sealed molds, and
Detecting the de-atmospheric pressure of the exhaust hole for exhausting the air in the cavity provided in the other mold of the resin-sealed mold, and
The amount of change in at least one of the adsorption pressure and the decompression per unit period is monitored, and the adsorption pressure and the decompression are after the decompression period in which the amount of change in the adsorption pressure and the decompression per unit period increases. If the amount of change in decompression exceeds a predetermined amount in the equilibrium period when the amount of change per unit period approaches 0, it is judged as an error.
Pressure monitoring methods, including. The error is determined when the amount of change in at least one of the adsorption pressure and the depressurization per unit period exceeds a predetermined amount two or more times in a row.
The pressure monitoring method according to claim 9.

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