CN114603763A - Pressure monitoring device, resin sealing device, and pressure monitoring method - Google Patents

Pressure monitoring device, resin sealing device, and pressure monitoring method Download PDF

Info

Publication number
CN114603763A
CN114603763A CN202111194576.2A CN202111194576A CN114603763A CN 114603763 A CN114603763 A CN 114603763A CN 202111194576 A CN202111194576 A CN 202111194576A CN 114603763 A CN114603763 A CN 114603763A
Authority
CN
China
Prior art keywords
pressure
mold
adsorption
degassing
resin sealing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111194576.2A
Other languages
Chinese (zh)
Inventor
中山栄二
福岛英彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Apic Yamada Corp
Original Assignee
Apic Yamada Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Apic Yamada Corp filed Critical Apic Yamada Corp
Publication of CN114603763A publication Critical patent/CN114603763A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/10—Moulds or cores; Details thereof or accessories therefor with incorporated venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/26—Moulds
    • B29C45/34—Moulds having venting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/76—Measuring, controlling or regulating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/84—Safety devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0007—Fluidic connecting means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould
    • B29C2043/3605—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/56—Compression moulding under special conditions, e.g. vacuum
    • B29C2043/561—Compression moulding under special conditions, e.g. vacuum under vacuum conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/5808—Measuring, controlling or regulating pressure or compressing force
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/58—Measuring, controlling or regulating
    • B29C2043/585—Measuring, controlling or regulating detecting defects, e.g. foreign matter between the moulds, inaccurate position, breakage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14065—Positioning or centering articles in the mould
    • B29C2045/14155—Positioning or centering articles in the mould using vacuum or suction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
    • B29C2045/14663—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame the mould cavity walls being lined with a film, e.g. release film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C2945/00—Indexing scheme relating to injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould
    • B29C2945/76—Measuring, controlling or regulating
    • B29C2945/76003—Measured parameter
    • B29C2945/76006—Pressure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

The invention provides a pressure monitoring device, a resin sealing device and a pressure monitoring method capable of inhibiting the generation of poor molding. A pressure monitoring device (100) is provided with: a suction pressure sensor (122) for detecting a suction pressure at which the isolation film (RF) is sucked to the exhaust hole (322) of the cavity (201); a degassing pressure sensor (111) that detects the degassing pressure of a gas exhaust hole (311) that exhausts the air in the cavity (201); and a monitoring unit (110) connected to the adsorption pressure sensor (122) and the degassing pressure sensor (111), wherein the monitoring unit (110) monitors the amount of change per unit period of at least one of the adsorption pressure and the degassing pressure, and determines that an error has occurred when the amount of change per unit period of the adsorption pressure and the degassing pressure exceeds a predetermined amount after a depressurization period in which the amount of change per unit period of the adsorption pressure and the degassing pressure increases and when an equilibrium period amount of change in the amount of change per unit period of the adsorption pressure and the degassing pressure gradually approaches 0.

Description

Pressure monitoring device, resin sealing device, and pressure monitoring method
Technical Field
The present invention relates to a pressure monitoring device, a resin sealing device, and a pressure monitoring method.
Background
The resin sealing mold of the resin sealing device is provided with an exhaust hole for adsorbing the barrier film or degassing the internal space.
For example, patent document 1 discloses a resin sealing mold having: the lower die is provided with an exhaust hole for degassing the inner space and an exhaust hole for fixing a workpiece; and the upper die is provided with an exhaust hole for fixing the isolating membrane.
[ Prior art documents ]
[ patent document ]
[ patent document 1] Japanese patent laid-open No. 2018-51841
Disclosure of Invention
[ problems to be solved by the invention ]
In the case of the resin sealing device described in patent document 1, if a phenomenon such as separation film detachment or degassing failure occurs, there is a possibility that molding failure occurs.
The present invention has been made in view of such circumstances, and an object of the present invention is to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method that can suppress the occurrence of molding failure.
[ means for solving problems ]
A pressure monitoring device according to an embodiment of the present invention is a pressure monitoring device for a resin sealing mold that monitors an exhaust pressure from the resin sealing mold, the resin sealing mold having one mold and another mold, including: an adsorption pressure sensor for detecting an adsorption pressure at which the isolation film is adsorbed to an exhaust hole provided in one of the resin sealing molds; a degassing pressure sensor that detects a degassing pressure of a degassing hole that degasses a cavity of another mold provided in the resin sealing mold; and a monitoring unit connected to the adsorption pressure sensor and the degassing pressure sensor, the monitoring unit monitoring a change amount per unit period of at least one of the adsorption pressure and the degassing pressure, and determining that the pressure drop is an error when an equilibrium period change amount, in which the change amount per unit period of the adsorption pressure and the degassing pressure gradually approaches 0, exceeds a predetermined amount after a decompression period in which the change amount per unit period of the adsorption pressure and the degassing pressure increases.
According to the embodiment, a problem of a slight pressure change accompanying the adsorption pressure or the desorption pressure can be detected. For example, by detecting that the separator is temporarily separated from the die and warning the contact between the separator and the workpiece, the flow-out of defective products in which the element characteristics of the workpiece vary can be suppressed. Further, by detecting vacuum leakage due to deterioration of the resin sealing mold and promoting maintenance, voids caused by air mixing in the sealing resin can be suppressed.
In the above embodiment, the monitoring unit may determine that the error is generated when the amount of change per unit period of at least one of the suction pressure and the purge pressure exceeds the predetermined amount two or more times in succession.
In the above embodiment, the monitoring unit may determine that the pressure value exceeds a predetermined value, and the monitoring unit may determine that the pressure value exceeds the predetermined value.
In the above embodiment, the monitoring unit may monitor the amount of change per unit period of at least one of the suction pressure and the purge pressure when the pressure value of the at least one of the suction pressure and the purge pressure is equal to or lower than a predetermined value.
In the embodiment, one of the resin sealing molds may be an upper mold, and the other of the resin sealing molds may be a lower mold.
In the embodiment, the monitoring section may monitor the amount of change per unit period of the adsorption pressure during the degassing of the cavity.
In the embodiment, the monitoring section may monitor the amount of change per unit period of the degassing pressure after the degassing of the cavity.
A resin sealing device of an embodiment of the present invention includes: the pressure monitoring device of any of the embodiments; sealing the mold with resin; an adsorption pump connected to one of the resin sealing molds; a degassing pump connected to the other mold of the resin sealing mold; and a control unit for controlling the adsorption pump and the degassing pump.
According to the embodiment, a problem of a slight pressure change accompanying the adsorption pressure or the desorption pressure can be detected. For example, by detecting that the separator is temporarily separated from the die and warning the contact between the separator and the workpiece, the flow-out of defective products in which the element characteristics of the workpiece vary can be suppressed. Further, by detecting vacuum leakage due to deterioration of the resin sealing mold and promoting maintenance, voids caused by air mixing in the sealing resin can be suppressed.
A pressure monitoring method according to an embodiment of the present invention is a pressure monitoring method of a resin sealing mold that monitors an exhaust pressure from the resin sealing mold, the resin sealing mold having one mold and another mold, including: detecting an adsorption pressure at which the separation film is adsorbed to an exhaust hole provided in a cavity of one of the resin-sealed molds; detecting a degassing pressure of a vent hole for exhausting air in a cavity of the other mold of the resin sealing mold; and monitoring a change amount per unit period of at least one of the adsorption pressure and the desorption pressure, and determining that the pressure drop is an error when an equilibrium period change amount, in which the change amount per unit period of the adsorption pressure and the desorption pressure gradually approaches 0, exceeds a predetermined amount after a decompression period in which the change amount per unit period of the adsorption pressure and the desorption pressure increases.
According to the embodiment, a problem of a slight pressure change accompanying the adsorption pressure or the desorption pressure can be detected. For example, by detecting that the separator temporarily leaves the die and warning the contact between the separator and the work, it is possible to suppress the flow of defective products in which the element characteristics of the work vary. Further, by detecting vacuum leakage due to deterioration of the resin sealing mold and promoting maintenance, voids caused by air mixing in the sealing resin can be suppressed.
In the above embodiment, the determination as an error may be made when the amount of change per unit period of at least one of the adsorption pressure and the desorption pressure exceeds a predetermined amount two or more times in succession.
[ Effect of the invention ]
According to the present invention, it is possible to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method that can suppress the occurrence of molding failure.
Drawings
Fig. 1 is a view schematically showing the structure of a resin sealing apparatus according to an embodiment.
Fig. 2 is a graph showing changes in normal suction pressure, deaeration pressure, and clamp position.
Fig. 3 is a graph showing changes in the adsorption pressure and the deaeration pressure when the separator is peeled off.
Fig. 4 is a graph showing changes in the adsorption pressure and the degassing pressure when a vacuum leak occurs in the resin sealing mold.
Fig. 5 is a flowchart showing a method for manufacturing a resin-sealed product according to an embodiment.
[ description of reference numerals ]
1: resin sealing device
100: pressure monitoring device
110: monitoring unit
111. 112, 121, 122: pressure gauge
130: control unit
200: resin sealing mold
201: die cavity
203: closed ring
210: lower die
220: upper die
221: block of die sleeve
223: die cavity block
225: clamp apparatus
227: chamber block
311. 312, 321, 322: air vent
411. 412, 421, 422: vacuum pump
J: plunger piston
RF: isolation film
P: resin composition
W: workpiece
S1: equilibrium period
S2: in the early stage
S3: late stage
S11-S14, S21-S24, S31-S35: procedure (ii)
Detailed Description
Embodiments of the present invention will be described below with reference to the drawings. The drawings of the embodiments are for illustration, and the size and shape of each part are schematic and should not be construed as limiting the technical scope of the invention of the present application to the embodiments.
< embodiment >
The structure of a resin sealing device 1 according to an embodiment of the present invention will be described with reference to fig. 1. Fig. 1 is a view schematically showing the structure of a resin sealing apparatus according to an embodiment.
The resin sealing apparatus 1 is an apparatus for resin-sealing (molding) a workpiece W with a resin P. The resin sealing apparatus 1 includes a resin sealing mold 200, a vacuum pump 411, a vacuum pump 412, a vacuum pump 421, a vacuum pump 422, and a pressure monitoring apparatus 100. The resin sealing apparatus 1 is a transfer type molding machine that pressurizes the resin P by the pressure of extruding the resin P, but is not limited thereto. The resin sealing device is not limited to the transfer type molding machine, and may be a compression type molding machine that pressurizes the resin by the pressure of the resin sealing mold.
The workpiece W includes a substrate and an element, and the element is fixed to the substrate. For example, the element is mounted on the substrate by wire bonding. For example, the substrate is a resin substrate, and the element is a semiconductor chip, but the substrate and the element are not limited thereto. For example, the substrate may be a glass substrate, or may be an interposer substrate (interposer substrate), a lead frame, a carrier with an adhesive sheet, a semiconductor wafer, or the like. The component may be a Micro Electro Mechanical System (MEMS) device, an electronic device, or the like. The element may be flip-chip mounted on the substrate or may be detachably attached.
Resin sealing mold 200 includes lower mold 210 and upper mold 220. The upper mold 220 corresponds to one of the molds, and the lower mold 210 corresponds to the other mold. The resin sealing mold 200 has an upper mold cavity structure having a cavity 201 in an upper mold 220. An inner space is formed by the cavity 201 between the lower mold 210 and the upper mold 220 after the mold closing. The resin sealing mold 200 includes a closing ring 203 (e.g., an O-ring) that closes an inner space of the resin sealing mold 200. Although fig. 1 illustrates a chase (chase) structure (lower die chase) of the lower die 210, the lower die 210 may include a base structure (lower die base) not shown that accommodates the illustrated lower die chase. Similarly, although fig. 1 illustrates a die case structure (upper die case) in the upper die 220, the upper die 220 may include an unillustrated base structure (upper die base) that houses the illustrated upper die case. The resin sealing mold 200 may be a die case replacement structure capable of exchanging the die case structure. Although not shown, the resin sealing apparatus 1 includes a temperature adjusting unit (e.g., a heater) that adjusts the internal temperature (molding temperature) of the resin sealing mold 200. The heater may be disposed on the base structure to heat the entire mold sleeve structure.
Lower mold 210 is provided with air discharge hole 311 and air discharge hole 312. A negative pressure (degassing pressure) for degassing the cavity 201 (the internal space of the resin sealing mold 200 after the mold closing) is applied to the gas discharge hole 311, and a negative pressure (workpiece fixing pressure) for fixing the workpiece W to the lower mold 210 is applied to the gas discharge hole 312. In addition, the lower die 210 includes a pot (pot) that heats and softens the resin P, and a plunger J that extrudes the resin P.
The upper die 220 includes: a chase block 221, a cavity block 223, a clamp 225 slidably coupled to the cavity block 223, and a cavity block 227 spaced outwardly of the clamp 225. These members are also sometimes collectively referred to as an upper die case. The cavity block 223 is fixed to the chase block 221. The jig 225 protrudes toward the lower die 210 than the cavity block 223, and constitutes the cavity 201 together with the cavity block 223. During clamping, the outer edge portion of the workpiece W is clamped between the jig 225 and the lower die 210. When clamped, closure ring 203 is clamped between chamber block 227 and lower die 210.
The upper die 220 is provided with an exhaust hole 321 and an exhaust hole 322. The air vent 321 is applied with a negative pressure (film suction pressure) for sucking the isolation film RF to the upper mold 220, and the air vent 322 is applied with a negative pressure (film cavity suction pressure) for sucking the isolation film RF along the wall surface of the cavity 201. Vent hole 321 is disposed in fixture 225 and vent hole 322 is disposed between mold cavity block 223 and fixture 225.
The resin sealing apparatus 1 is provided with a plurality of vacuum pumps for sucking the work W, reducing the pressure of the cavity 201, and sucking the isolation film RF. The vacuum pump 411 is a degassing pump connected to the gas discharge hole 311 of the lower mold 210 and applying degassing pressure. The vacuum pump 412 is a fixed pump that is connected to the exhaust hole 312 of the lower die 210 and applies a workpiece fixing pressure. The vacuum pump 421 is an adsorption pump connected to the exhaust hole 321 of the upper mold 220 and applying a film adsorption pressure. The vacuum pump 422 is an adsorption pump that is connected to the exhaust hole 322 of the upper mold 220 and applies a mold cavity adsorption pressure. Hereinafter, the vacuum pump 421 and the vacuum pump 422 are collectively referred to as "adsorption pumps", and the film adsorption pressure and the film cavity adsorption pressure are collectively referred to as "adsorption pressures".
The structures of the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, and the vacuum pump 422 are not limited to the above-described structures. For example, the exhaust holes 311 and 312 may be connected to a common vacuum pump. That is, the deaeration pressure and the workpiece fixing pressure may be equal. Similarly, the exhaust holes 321 and 322 may be connected to a common vacuum pump, and the film suction pressure is equal to the film cavity suction pressure.
The pressure monitoring device 100 includes a pressure gauge 111, a pressure gauge 112, a pressure gauge 121, a pressure gauge 122, a monitoring unit 110, and a control unit 130.
The pressure gauge 111 is a degassing pressure sensor connected to the vacuum pump 411 to detect degassing pressure. The pressure gauge 112 is a suction pressure sensor connected to the vacuum pump 412 and detecting a workpiece fixed pressure. The pressure gauge 121 is a suction pressure sensor connected to the vacuum pump 421 to detect a membrane suction pressure. The pressure gauge 122 is a suction pressure sensor connected to the vacuum pump 422 and detecting a suction pressure of the film mold cavity.
The monitoring unit 110 is connected to a pressure gauge 111, a pressure gauge 112, a pressure gauge 121, and a pressure gauge 122, and monitors the pressure values of the degassing pressure, the workpiece fixing pressure, the film suction pressure, and the film cavity suction pressure, and the amount of change in these pressures per unit period. The monitoring of the variation is performed in a balancing period in which the variation gradually approaches 0 after a decompression period in which the variation increases immediately after the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, or the vacuum pump 422 is started. The monitoring unit 110 determines that the amount of change exceeds a predetermined amount as an error, and performs error processing. The monitoring unit 110 may display, on a display unit not shown, an alarm for the occurrence of a defective product, a stop of the operation of the resin sealing apparatus 1, and an error process such as a request for maintenance of the resin sealing mold 200.
The control unit 130 controls the operations of the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, and the vacuum pump 422. The control unit 130 controls the clamping position (relative position of the lower mold 210 to the upper mold 220) and switches between the mold clamping state and the mold opening state of the resin sealing mold 200. The control unit 130 is connected to the monitoring unit 110, and changes the operation of the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, and the vacuum pump 422 based on the monitoring data transmitted from the monitoring unit 110. For example, the control unit 130 performs normal operation control including start and stop of the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, and the vacuum pump 422 in conjunction with the clamping position, or emergency operation control including adjustment and stop of the output of the vacuum pump 411, the vacuum pump 412, the vacuum pump 421, and the vacuum pump 422 by error processing. Further, the control unit for performing the normal operation control and the control unit for performing the emergency operation control may be provided separately.
Next, an example of the operation of the monitoring unit 110 and the control unit 130 will be described with reference to fig. 2. Fig. 2 is a graph showing changes in normal suction pressure, deaeration pressure, and clamping position. The horizontal axis of the graph represents time in sec (seconds). The left vertical axis of the graph represents the adsorption pressure and the degassing pressure in kPa. The right vertical axis of the graph represents the clamping position in mm. Here, since the film suction pressure and the film cavity suction pressure are simultaneously applied with equal negative pressures, the suction pressures are set to be the suction pressures at the same time. The clamping position is increased when the lower mold 210 approaches the upper mold 220, based on the position of the lower mold 210 in the mold opened state (0 mm). For example, when the clamping position is 170mm, the mold is clamped.
In resin sealing, first, the control unit 130 starts the vacuum pump (adsorption pump) 421 and the vacuum pump (adsorption pump) 422. In the decompression period immediately after the start of the vacuum pump 421 or 422, the amount of change in the adsorption pressure increases negatively, and the adsorption pressure substantially equal to the atmospheric pressure decreases rapidly. In the subsequent equilibrium period, the vacuum pumps 421 and 422 reach the performance limit, and the adsorption pressure gradually approaches 0. At a time point when the suction pressure is sufficiently reduced, for example, when the suction pressure is lower than a predetermined value (threshold), the control unit 130 raises the clamp position and starts clamping.
After the raising of the clamping position is completed and the clamping of the resin sealing mold 200 is completed, the control unit 130 starts the vacuum pump (degassing pump) 411 and starts degassing. In the decompression period immediately after the start of the vacuum pump 411, the amount of change in the degassing pressure increases negatively, and the degassing pressure, which is substantially equal to the atmospheric pressure, decreases rapidly. During a subsequent equalization period S1, vacuum pump 411 reaches a performance limit and the degassing pressure gradually approaches 0. The lower limit of the degassing pressure is lower than the lower limit of the exhaust pressure. The performance limit of the vacuum pump described here is the maximum output with a margin for operation assuming a predetermined pressure reduction and adsorption force, and does not mean the limit of the performance of the pump itself.
In the degassing pressure equalization period S1, the controller 130 keeps the vacuum pump (adsorption pump) 421, the vacuum pump (adsorption pump) 422, and the vacuum pump (degassing pump) 411 operating in the first stage S2 before the resin P is cured by heating and pressurizing in the resin sealing mold 200. In the degassing pressure equalizing period S1, the controller 130 stops the vacuum pump 421, the vacuum pump 422, and the vacuum pump 411 in the later period S3 after the resin P is cured and the workpiece W is sealed with the resin. In the latter stage S3, the control unit 130 maintains the suction pressure and the deaeration pressure without lowering the clamping position. That is, when no trouble occurs, the amount of change per unit period of the degassing pressure in the equalizing period S1 is substantially 0 from the first period S2 to the second period S3.
The monitoring unit 110 determines that an error has occurred in the equalization period S1 when the pressure values of the adsorption pressure and the deaeration pressure exceed the threshold values. The monitoring unit 110 monitors the amount of change per unit period of the adsorption pressure and the desorption pressure when the pressure values of the adsorption pressure and the desorption pressure are lower than the monitored pressure in the equalization period S1, and determines that an error has occurred when the amount of change exceeds a predetermined amount. The monitored pressure is, for example, a threshold, but the monitored pressure may be below the threshold. Therefore, even if the abnormality is in the pressure range lower than the threshold value, the monitoring unit 110 detects the abnormality as a change amount.
The start timing of the equalizing period S1 at which the monitoring unit 110 starts monitoring the amounts of change in the suction pressure and the purge pressure is, for example, a time point at which the purge pressure becomes lower than a threshold value, but is not limited thereto. For example, the start period of the equilibrium period S1 may be a point of time when the degassing pressure is lower than the adsorption pressure.
Next, the change in the adsorption pressure and the desorption pressure determined to be erroneous by the monitoring unit 110 will be described with reference to fig. 3 and 4. Fig. 3 is a graph showing changes in the adsorption pressure and the deaeration pressure when the separator is peeled off. Fig. 4 is a graph showing changes in the adsorption pressure and the degassing pressure when a vacuum leak occurs in the resin sealing mold.
In the former stage S2 shown in fig. 3, both the adsorption pressure and the degassing pressure are applied to the isolation film RF. Since the force due to the adsorption pressure is stronger than the force due to the degassing pressure, the separation film RF is adsorbed to the upper mold 220. On the other hand, when the degassing pressure partially and temporarily dominates the adsorption pressure, a part of the isolation film RF is temporarily separated from the upper mold 220. At this time, the amount of change per unit period of the adsorption pressure and the desorption pressure increases at approximately the same time point. Thereafter, in the process where the temporarily separated isolation film RF is again adsorbed to the upper mold 220, the change amount per unit period of the adsorption pressure and the desorption pressure gradually approaches 0 after the negative increase. In this way, even if the adsorption pressure and the degassing pressure do not change to such an extent that they exceed the threshold values, the abnormality of the isolation film RF can be detected by the monitoring unit 110 as the amount of change in the adsorption pressure and the degassing pressure per unit period.
In the latter stage S3 shown in fig. 4, after the degassing pump is stopped, the degassing pressure rises with time although the mold is not opened. This case shows that the airtightness is reduced when the structure of the resin sealing mold 200 changes with time. Such as a gasket for maintaining airtightness provided in the closing ring 203 or other mold, may be deteriorated. Although the change of the resin sealing mold 200 progresses slowly, the monitoring unit 110 can detect the abnormality as an amount of change per unit period of the degassing pressure at an early stage. Therefore, the monitoring unit 110 can determine that maintenance of the resin sealing mold 200 is necessary and issue a warning before air entering from the deteriorated portion of the resin sealing mold 200 is mixed into the resin to cause voids or the like.
Next, an example of a method for manufacturing a resin-sealed product including a method for monitoring the pressure of the resin-sealed mold 200 will be described with reference to fig. 5. Fig. 5 is a flowchart showing a method for manufacturing a resin-sealed product according to an embodiment.
First, the adsorption pump is started (S11), and the adsorption pressure is detected (S12). Next, the deaeration pump is activated (S13), and the deaeration pressure is detected (S14).
Next, the amount of change per unit period of the suction pressure and the deaeration pressure at the first stage S2 of the equilibrium period S1 before the curing time of the resin P has elapsed is monitored. Specifically, first, it is determined whether or not the resin curing time has elapsed (S21). If not, it is determined whether or not the amount of change in at least one of the suction pressure and the deaeration pressure in one period exceeds a predetermined amount (S22). If the amount of the resin P does not exceed the predetermined amount, the process returns to step S21 in which it is determined whether or not the resin curing time of the resin P has elapsed. When the amount of change in one period exceeds the predetermined amount, it is determined whether the amount of change in at least one of the suction pressure and the deaeration pressure in the next period exceeds the predetermined amount (S23). If the amount of the resin does not exceed the predetermined amount, the process returns to step S21 in which it is determined whether or not the resin curing time has elapsed. If the amount of change in the next period exceeds the predetermined amount, that is, if the amount of change in at least one of the suction pressure and the deaeration pressure per unit period exceeds the predetermined amount two consecutive times, it is determined as an error (S24).
When it is determined in step S21 that the resin curing time has elapsed, the degassing pump is stopped (S31). Next, it is determined whether or not the mold opening time has elapsed (S32). If not, it is determined whether or not the amount of change in at least one of the suction pressure and the deaeration pressure in one period exceeds a predetermined amount (S33). If the opening time does not exceed the predetermined amount, the process returns to step S32 in which it is determined whether or not the opening time has elapsed. When the amount of change in one period exceeds the predetermined amount, it is determined whether the amount of change in at least one of the suction pressure and the deaeration pressure in the next period exceeds the predetermined amount (S34). If the opening time does not exceed the predetermined amount, the process returns to step S32 in which it is determined whether or not the opening time has elapsed. If the amount of change in the next period exceeds the predetermined amount, that is, if the amount of change in at least one of the suction pressure and the deaeration pressure per unit period exceeds the predetermined amount two consecutive times, it is determined as an error (S35).
The error processing after the error is determined in steps S24 and S35 is not particularly limited. In the error processing after step S24, for example, the operation of the resin sealing apparatus 1 may be stopped, and the resin sealing may be continued with a log indicating the occurrence of a defective product. In the error processing after step S35, for example, maintenance of the resin sealing mold 200 may be required, or the degradation level of the resin sealing mold 200 may be notified.
According to the configuration described in the above embodiment, the monitoring unit 110 that monitors the suction pressure and the purge pressure determines an error when the amount of change per unit period of the suction pressure and the purge pressure gradually approaches 0 in the equalization period S1 and the amount of change exceeds a predetermined amount. The monitoring unit 110 can monitor the amount of change per unit period of at least one of the adsorption pressure and the degassing pressure, and can monitor the amount of change per unit period of both the adsorption pressure and the degassing pressure. Thus, a problem of a slight pressure change accompanying the adsorption pressure or the desorption pressure can be detected. For example, by detecting that the isolation film RF is temporarily separated from the resin sealing mold 200 and warning the contact between the isolation film RF and the workpiece W, the outflow of defective products in which the element characteristics of the workpiece W are changed can be suppressed. Further, by detecting vacuum leakage due to deterioration of the resin sealing mold 200 and promoting maintenance, it is possible to suppress voids caused by air mixing into the sealing resin P.
The monitoring unit 110 determines that an error occurs when the amount of change per unit period of the suction pressure and the purge pressure exceeds a predetermined amount twice in succession. In particular, when the amount of change in the decompression period is negative, and when the amount of change that is positive continues twice or more and exceeds a predetermined amount, it is determined that the operation is erroneous. Accordingly, erroneous determination is reduced, and monitoring accuracy is improved.
The monitoring unit 110 may set a threshold value for at least one of the suction pressure and the purge pressure, and determine that the pressure exceeds the threshold value as an error. The monitoring of the amount of change per unit period of the suction pressure and the purge pressure by the monitoring unit 110 may be performed when the suction pressure and the purge pressure are equal to or lower than a monitoring pressure, which may be a threshold value of the suction pressure or the purge pressure. Accordingly, the monitoring unit 110 can detect an abnormality even in a slight pressure change of a threshold value or less.
The monitoring unit 110 can detect that the isolation film RF is partially and temporarily separated from the resin sealing mold 200 by monitoring the amount of change per unit period of the adsorption pressure in the degassing process of the cavity 201.
The monitoring unit 110 can determine the deterioration of the airtightness of the resin sealing mold 200 by monitoring the amount of change per unit period of the degassing pressure after the degassing of the cavity 201.
As described above, it is possible to provide a pressure monitoring device, a resin sealing device, and a pressure monitoring method that can suppress the occurrence of molding failure.
The above-described embodiments are intended to facilitate understanding of the present invention, and are not intended to limit the present invention. The elements included in the embodiments, and the arrangement, materials, conditions, shapes, sizes, and the like thereof are not limited to those illustrated in the drawings, and may be appropriately modified. Further, the structures described in the different embodiments may be partially replaced or combined with each other.

Claims (10)

1. A pressure monitoring device for a resin sealing mold for monitoring an exhaust pressure from the resin sealing mold, the resin sealing mold having one mold and the other mold, comprising:
an adsorption pressure sensor that detects an adsorption pressure at which the isolation film is adsorbed to an exhaust hole provided in the cavity of the one of the resin-sealed molds;
a degassing pressure sensor that detects a degassing pressure of a degassing hole that degasses the cavity of the other mold provided in the resin sealing mold; and
a monitoring unit connected to the adsorption pressure sensor and the degassing pressure sensor,
the monitoring unit monitors a change amount per unit period of at least one of the adsorption pressure and the desorption pressure, and determines that the change amount is an error when the change amount exceeds a predetermined amount in an equilibrium period in which the change amount per unit period of the adsorption pressure and the desorption pressure gradually approaches 0 after a decompression period in which the change amount per unit period of the adsorption pressure and the desorption pressure increases.
2. The pressure monitoring device of claim 1, wherein
The monitoring unit determines that the suction pressure is erroneous when a change amount per unit period of at least one of the suction pressure and the purge pressure exceeds a predetermined amount continuously twice or more.
3. A pressure monitoring apparatus according to claim 1 or 2, wherein
The monitoring unit determines that the pressure value exceeds a predetermined value, and determines that the pressure value is an error when the pressure value exceeds the predetermined value.
4. A pressure monitoring apparatus according to claim 3, in which
The monitoring unit monitors a change amount per unit period of at least one of the suction pressure and the purge pressure when a pressure value of the at least one of the suction pressure and the purge pressure is equal to or lower than a predetermined value.
5. A pressure monitoring apparatus according to claim 1 or 2, wherein
One of the resin sealing molds is an upper mold, and the other of the resin sealing molds is a lower mold.
6. The pressure monitoring device of claim 5, wherein
The monitoring unit monitors a change amount per unit period of the adsorption pressure during the degassing of the cavity.
7. The pressure monitoring device of claim 5, wherein
The monitoring unit monitors a change amount per unit period of the degassing pressure after degassing of the cavity.
8. A resin sealing device comprising:
the pressure monitoring device of any one of claims 1 to 7;
the resin sealing mold;
an adsorption pump connected to the one of the resin sealing molds;
a degassing pump connected to the other mold of the resin sealing mold; and
and a control unit for controlling the adsorption pump and the degassing pump.
9. A pressure monitoring method of a resin sealing mold for monitoring a pressure of exhaust gas from the resin sealing mold, the resin sealing mold having one mold and the other mold, comprising:
detecting an adsorption pressure at which the separation film is adsorbed to an exhaust hole provided in the cavity of the one of the resin-sealed molds;
detecting a degassing pressure of a vent hole that exhausts air in the cavity of the other mold of the resin-sealed mold; and
the amount of change per unit period of at least one of the adsorption pressure and the desorption pressure is monitored, and an error is determined when the amount of change exceeds a predetermined amount in an equilibrium period in which the amount of change per unit period of the adsorption pressure and the desorption pressure gradually approaches 0 after a decompression period in which the amount of change per unit period of the adsorption pressure and the desorption pressure increases.
10. The pressure monitoring method of claim 9, wherein
The determination as an error is a determination as an error when the amount of change per unit period of at least one of the adsorption pressure and the desorption pressure exceeds a predetermined amount two or more times in succession.
CN202111194576.2A 2020-12-04 2021-10-13 Pressure monitoring device, resin sealing device, and pressure monitoring method Pending CN114603763A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-201740 2020-12-04
JP2020201740A JP7432925B2 (en) 2020-12-04 2020-12-04 Pressure monitoring device, resin sealing device, and pressure monitoring method

Publications (1)

Publication Number Publication Date
CN114603763A true CN114603763A (en) 2022-06-10

Family

ID=81857397

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111194576.2A Pending CN114603763A (en) 2020-12-04 2021-10-13 Pressure monitoring device, resin sealing device, and pressure monitoring method

Country Status (4)

Country Link
JP (1) JP7432925B2 (en)
KR (1) KR102566228B1 (en)
CN (1) CN114603763A (en)
TW (1) TWI820494B (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163008A (en) * 1997-12-02 1999-06-18 Nec Corp Resin sealing device for semiconductor device
JP2000299334A (en) * 1999-04-14 2000-10-24 Apic Yamada Corp Resin-sealing apparatus
CN107263827A (en) * 2016-03-30 2017-10-20 第精工株式会社 The method for detecting abnormality of resin sealing apparatus and resin sealing apparatus
WO2018061316A1 (en) * 2016-09-27 2018-04-05 アピックヤマダ株式会社 Resin molding method, film conveying device, and resin molding device
CN111267314A (en) * 2018-12-05 2020-06-12 东和株式会社 Resin molding device and method for manufacturing resin molded product

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4081705B2 (en) * 2000-09-29 2008-04-30 富士電機ホールディングス株式会社 Resin sealing device for electronic parts
JP4174263B2 (en) * 2002-08-12 2008-10-29 アピックヤマダ株式会社 Resin molding method
JP2005219297A (en) 2004-02-04 2005-08-18 Apic Yamada Corp Method and apparatus for molding resin
JP2012196870A (en) 2011-03-22 2012-10-18 Nec Corp Device and method for detecting resin clogging
SG191479A1 (en) * 2011-12-27 2013-07-31 Apic Yamada Corp Method for resin molding and resin molding apparatus
JP6143711B2 (en) * 2014-06-02 2017-06-07 Ｔｏｗａ株式会社 Semiconductor compression resin sealing method and semiconductor compression resin sealing device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11163008A (en) * 1997-12-02 1999-06-18 Nec Corp Resin sealing device for semiconductor device
JP2000299334A (en) * 1999-04-14 2000-10-24 Apic Yamada Corp Resin-sealing apparatus
CN107263827A (en) * 2016-03-30 2017-10-20 第精工株式会社 The method for detecting abnormality of resin sealing apparatus and resin sealing apparatus
WO2018061316A1 (en) * 2016-09-27 2018-04-05 アピックヤマダ株式会社 Resin molding method, film conveying device, and resin molding device
CN111267314A (en) * 2018-12-05 2020-06-12 东和株式会社 Resin molding device and method for manufacturing resin molded product

Also Published As

Publication number Publication date
JP7432925B2 (en) 2024-02-19
JP2022089380A (en) 2022-06-16
TWI820494B (en) 2023-11-01
KR102566228B1 (en) 2023-08-14
TW202222529A (en) 2022-06-16
KR20220079787A (en) 2022-06-14

Similar Documents

Publication Publication Date Title
JP4262468B2 (en) Resin molding method, resin molding apparatus, and support jig used therefor
JP5649125B2 (en) Tape applicator
JP5148175B2 (en) Resin sealing device and resin sealing method
JP5781412B2 (en) Lamination method
US20190295895A1 (en) Method of separating electronic devices having a back layer and apparatus
TWI706436B (en) Apparatus and method for processing a semiconductor device
JP2005219297A (en) Method and apparatus for molding resin
KR101419643B1 (en) Resin sealing apparatus and resin sealing method
JP6368882B1 (en) Control method of gate valve
CN114603763A (en) Pressure monitoring device, resin sealing device, and pressure monitoring method
KR20110043620A (en) Method for encapsulating electronic components with a controllable closing force
JP6557428B2 (en) Resin sealing device and resin sealing method
KR100787837B1 (en) Chip&#39;s Compression Bonding Method and Apparatus for Producing a Plate Type Display Module
JP2011022403A (en) Method and device for laminating workpiece
JP2908121B2 (en) Injection molded product sealing device and sealing method
WO2018139631A1 (en) Resin sealing device and resin sealing method
JP3221380B2 (en) Resin sealing device for semiconductor device and defect detection method thereof
JP4975461B2 (en) Resin sealing device
US11664228B2 (en) Vacuumizing device and vacuumizing method for bonding substrate
JP2787037B2 (en) Printed circuit board fixing device
CN109813503B (en) Tightness detection system and method for rubber soft body with inner cavity
CN117810109B (en) Wafer bonding holding method
JP4102953B2 (en) Injection molding machine
CN114166952B (en) Adsorption detection device and adsorption detection method
KR200434862Y1 (en) Chip&#39;s Compression Bonding Apparatus for Producing a Plate Type Display Module

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination