JP2022061161A - Thermal print head and manufacturing method of thermal print head - Google Patents

Abstract

To provide a thermal print head which can be manufactured more easily, and to provide a manufacturing method of the thermal print head.SOLUTION: A thermal print head includes: a substrate 1 including a base material 10 formed of a single-crystal semiconductor; a resistor layer 4 supported by the substrate 1 and having a plurality of heating parts 41 arranged in a main scanning direction x; and a wiring layer 3 supported by the substrate 1 and forming an energizing path to the plurality of heating parts 41. The wiring layer 3 contacts with the substrate 1 and the resistor layer 4 has a portion that overlaps with the wiring layer 3 from an opposite side of the substrate 1 in a thickness direction z.SELECTED DRAWING: Figure 3

Description

The present disclosure relates to a thermal print head and a method for manufacturing a thermal print head.

The thermal print head is a device that realizes the main functions of a thermal printer that prints on an object to be printed such as thermal paper. Patent Document 1 discloses an example of a conventional thermal print head. The thermal printhead disclosed in the same document includes a substrate, a resistor layer and a wiring layer. The substrate contains a substrate made of a semiconductor single crystal. The resistor layer is formed directly on the substrate. The wiring layer is formed on the resistor layer.

Japanese Unexamined Patent Publication No. 2017-114051

The resistor layer and the wiring layer are formed by a thin film forming method such as sputtering or CVD. In such cases, the resistor layer is formed between all parts of the wiring layer and the substrate. Generally, after that, a wiring pattern is formed by applying a photolithography technique to the wiring layer, and a resistor pattern is formed by applying a photolithography technique to the resistor layer. The resistor pattern includes a plurality of heat generating parts. Each photolithography technique includes resist coating, prebaking, exposure, development, rinsing, post-baking, etching, and resist removal steps.

The present disclosure has been conceived under the above circumstances, and an object of the present invention is to provide a thermal print head and a method for manufacturing a thermal print head, which can be manufactured more easily.

The thermal printhead provided by the first aspect of the present disclosure is a resistance having a substrate including a substrate made of a single crystal semiconductor and a plurality of heat generating portions supported by the substrate and arranged in the main scanning direction. A body layer and a wiring layer supported by the substrate and forming an energization path to the plurality of heat generating portions are provided, the wiring layer is in contact with the substrate, and the resistor layer is in contact with the substrate. It has a portion that overlaps the wiring layer from the side opposite to the substrate in the thickness direction.

The method for manufacturing a thermal printhead provided by the second aspect of the present disclosure includes a step of preparing a substrate including a substrate made of a single crystal semiconductor, a step of forming a wiring layer supported by the substrate, and the above-mentioned step. The step of forming the resistor layer includes a step of forming the wiring layer, the step of forming the wiring layer includes a conductive film forming process using sputtering or CVD, and the step of forming the resistor layer is a step of forming a resistor paste. It includes a process of applying and a process of firing the resistor paste.

According to the present disclosure, the thermal printhead can be manufactured more easily.

Other features and advantages of the present disclosure will be more apparent by the detailed description given below with reference to the accompanying drawings.

It is a top view which shows the thermal print head which concerns on 1st Embodiment of this disclosure. It is a main part plan view which enlarged a part of the plan view shown in FIG. FIG. 3 is an enlarged plan view of a main part obtained by enlarging a part of the plan view shown in FIG. It is a partially enlarged sectional view of the thermal printer provided with the thermal print head which concerns on 1st Embodiment, and is the sectional view which follows the IV-IV line of FIG. It is a cross-sectional view of a main part which enlarged a part of the cross-sectional view shown in FIG. FIG. 5 is an enlarged cross-sectional view of a main part obtained by enlarging a part of the cross-sectional view shown in FIG. It is a flowchart which shows an example of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is sectional drawing of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is sectional drawing of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is sectional drawing of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is an enlarged sectional view of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is an enlarged plan view of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is an enlarged sectional view of a main part along the line XIII-XIII of FIG. It is an enlarged plan view of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. It is an enlarged sectional view of the main part along the XV-XV line of FIG. It is an enlarged plan view of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. 16 is an enlarged cross-sectional view of a main part along the line XVII-XVII of FIG. It is an enlarged plan view of the main part which shows one step of the manufacturing method of the thermal print head which concerns on 1st Embodiment of this disclosure. FIG. 8 is an enlarged cross-sectional view of a main part along the XIX-XIX line of FIG. It is an enlarged sectional view of the main part which shows the 1st modification of the thermal print head which concerns on 1st Embodiment of this disclosure. It is an enlarged plan view of the main part which shows the 2nd modification of the thermal print head which concerns on 1st Embodiment of this disclosure. FIG. 2 is an enlarged cross-sectional view of a main part along the line XXII-XXII of FIG. 21. It is an enlarged plan view of the main part which shows the thermal print head which concerns on 2nd Embodiment of this disclosure. It is an enlarged plan view of the main part which shows the thermal print head which concerns on 3rd Embodiment of this disclosure. It is an enlarged plan view of the main part which shows the 1st modification of the thermal print head which concerns on 3rd Embodiment of this disclosure. It is a flowchart which shows an example of the manufacturing method of the 1st modification of the thermal print head which concerns on 3rd Embodiment of this disclosure. It is an enlarged sectional view of the main part which shows the thermal print head which concerns on 4th Embodiment of this disclosure.

Hereinafter, preferred embodiments of the present disclosure will be specifically described with reference to the drawings. Each of the drawings is schematically drawn. In addition, each of the drawings may include omitted and exaggerated parts.

The terms "first", "second", "third", etc. in the present disclosure are merely used as labels and are not necessarily intended to order those objects.

<First Embodiment>
1 to 6 show a thermal print head according to the first embodiment of the present disclosure. The thermal print head A1 of the present embodiment includes a substrate 1, a protective layer 2, a wiring layer 3, a resistor layer 4, a connection substrate 5, a plurality of wires 61, 62, a plurality of driver ICs 7, a protective resin 78, and a heat dissipation member 8. Be prepared. As shown in FIGS. 1 to 3, the plurality of heat generating portions 41 included in the resistor layer 4 are arranged in a row. The direction in which the plurality of heat generating portions 41 are arranged is called the main scanning direction x. The direction perpendicular to the main scanning direction x is called the sub-scanning direction y. The thermal print head A1 is incorporated in a thermal printer Pr (see FIG. 4) that prints on a print object (not shown). The thermal printer Pr includes a thermal print head A1 and a platen roller 91. The platen roller 91 faces the thermal print head A1. The object to be printed is sandwiched between the thermal print head A1 and the platen roller 91, and is conveyed in the sub-scanning direction by the platen roller 91. Examples of such a printable object include a bar code sheet and a thermal paper for producing a receipt. Instead of the platen roller 91, a platen made of flat rubber may be used. This platen contains a portion of a columnar rubber with a large radius of curvature that is arched in cross section. In the present disclosure, the term "platen" includes both the platen roller 91 and the flat platen.

FIG. 1 is a plan view showing the thermal print head A1. FIG. 2 is an enlarged plan view of a main part of the plan view shown in FIG. FIG. 3 is an enlarged plan view of a main part obtained by enlarging a part of the plan view shown in FIG. FIG. 4 is a partially enlarged cross-sectional view of a thermal printer including the thermal print head A1 and is a cross-sectional view taken along the line IV-IV of FIG. FIG. 5 is an enlarged cross-sectional view of a main part of the cross-sectional view shown in FIG. FIG. 6 is an enlarged cross-sectional view of a main part, which is an enlarged part of the cross-sectional view shown in FIG. In FIGS. 1 to 3, the protective layer 2 is omitted. In FIGS. 1 and 2, the protective resin 78 is omitted. In FIG. 2, a plurality of wires 61 are omitted. In the figure, the side pointed by the arrow indicating the coordinate axis in the sub-scanning direction y (upper side in FIG. 1) is called the downstream side, and corresponds to the side of the output destination of the print target. In the figure, the side opposite to the downstream side (lower side in FIG. 1) along the sub-scanning direction y is called the upstream side, and corresponds to the side of the supply source of the print target.

[Board 1]
The substrate 1 supports the wiring layer 3 and the resistor layer 4. The substrate 1 of this embodiment includes a substrate 10 and an insulating layer 19.

The base material 10 has an elongated rectangular shape with the main scanning direction x as the longitudinal direction. In the following description, the thickness direction of the base material 10 is defined as the thickness direction z. The size of the base material 10 is not particularly limited, but for example, the thickness (z dimension in the thickness direction) is 725 μm, the main scanning direction x dimension is 50 mm or more and 150 mm or less, and the sub scanning direction y dimension is. It is 2.0 mm or more and 5.0 mm or less.

The base material 10 is made of a single crystal semiconductor, and the single crystal semiconductor is, for example, silicon (Si). The base material 10 has a main surface 11 and a back surface 12 as shown in FIGS. 4 and 5. The main surface 11 and the back surface 12 are separated from each other in the thickness direction z and face each other in the thickness direction z. The wiring layer 3 and the resistor layer 4 are provided on the side of the main surface 11.

The base material 10 of the present embodiment has a convex portion 13. The convex portion 13 projects from the main surface 11 in the thickness direction z and extends long in the main scanning direction x. In the illustrated example, the convex portion 13 is formed in the sub-scanning direction y downstream of the base material 10. Since the convex portion 13 is a part of the base material 10, it is made of Si, which is a single crystal semiconductor.

The convex portion 13 has a top portion 130, a pair of first inclined portions 131A and 131B, and a pair of second inclined portions 132A and 132B.

The top portion 130 is the portion of the convex portion 13 having the largest distance from the main surface 11. The top 130 is, for example, a plane substantially parallel to the main surface 11. The top portion 130 has an elongated rectangular shape that extends long in the main scanning direction x in the z-viewing in the thickness direction.

As shown in FIG. 6, the pair of first inclined portions 131A and 131B are connected to both sides of the sub-scanning direction y of the top portion 130. The first inclined portion 131A is connected to the top portion 130 from the upstream side in the sub-scanning direction y. The first inclined portion 131B is connected to the top portion 130 from the downstream side in the sub-scanning direction y. The first inclined portion 131A corresponds to the "upstream side first inclined portion" described in the claims, and the first inclined portion 131B corresponds to the "downstream side first inclined portion" described in the claims. do. Each of the pair of first inclined portions 131A and 131B is inclined by an angle α1 with respect to the main surface 11 (inclined with the first inclined angle α1). Each of the pair of first inclined portions 131A and 131B is an elongated rectangular plane extending long in the main scanning direction x in the thickness direction z-view. The convex portion 13 may be connected to a pair of first inclined portions 131A and 131B and may have inclined portions (not shown) adjacent to both ends of the main scanning direction x of the top portion 130.

As shown in FIG. 6, the pair of second inclined portions 132A and 132B are connected to the pair of first inclined portions 131A and 131B from the side opposite to the top portion 130 in the sub-scanning direction y. The second inclined portion 132A is sandwiched between the first inclined portion 131A and the main surface 11 in the sub-scanning direction y. The second inclined portion 132A is connected to the first inclined portion 131A from the upstream side in the sub-scanning direction y, and is connected to the main surface 11 from the downstream side in the sub-scanning direction y. The second inclined portion 132B is sandwiched between the first inclined portion 131B and the main surface 11 in the sub-scanning direction y. The second inclined portion 132B is connected to the first inclined portion 131B from the downstream side in the sub-scanning direction y, and is connected to the main surface 11 from the upstream side in the sub-scanning direction y. The second inclined portion 132A corresponds to the "upstream side second inclined portion" described in the claims, and the second inclined portion 132B corresponds to the "downstream side second inclined portion" described in the claims. do. The pair of second inclined portions 132A and 132B are each inclined by an angle α2 with respect to the main surface 11 (inclined with the second inclined angle α2). The angle α2 is larger than the angle α1. The pair of second inclined portions 132A and 132B are elongated rectangular planes extending long in the main scanning direction x in the thickness direction z-view, respectively. The pair of second inclined portions 132A and 132B are connected to the main surface 11, respectively. The convex portion 13 may be connected to a pair of second inclined portions 132A and 132B and may have an inclined portion (not shown) located outside the main scanning direction x both ends of the main scanning direction of the top portion 130. ..

In the base material 10, the main surface 11 is the (100) surface. According to the manufacturing method example described later, the angle α1 (see FIG. 6) of each of the first inclined portions 131A and 131B with respect to the main surface 11 is, for example, 30.1 degrees, and each of the second inclined portions 132A with respect to the main surface 11 The angle α2 (see FIG. 6) of 132B is, for example, 54.7 degrees. The z dimension in the thickness direction of the convex portion 13 is, for example, 150 μm or more and 300 μm or less.

The insulating layer 19 covers the main surface 11 and the convex portion 13 as shown in FIGS. 5 and 6. The insulating layer 19 is for more reliably insulating the main surface 11 side of the base material 10. The insulating layer 19 is made of an insulating material. As the insulating material, for example, SiO ₂ (TEOS-SiO ₂ ) formed by using TEOS (tetraethyl orthosilicate) as a raw material gas is adopted. Instead of TEOS-SiO ₂ , for example, SiO ₂ formed by another method or SiN may be adopted. The thickness of the insulating layer 19 is not particularly limited, and one example thereof is, for example, 5 μm or more and 15 μm or less (preferably 5 μm or more and 10 μm or less).

[Wiring layer 3]
The wiring layer 3 constitutes an energization path for energizing a plurality of heat generating portions 41 of the resistor layer 4 described later. The wiring layer 3 is supported by the base material 10, and in the present embodiment, as shown in FIGS. 5 and 6, the wiring layer 3 is directly laminated on the insulating layer 19.

The material and the laminated structure of the wiring layer 3 are not limited in any way. For example, a case where the wiring layer 3 is composed of two layers, a lower layer and an upper layer (both not shown), will be described as an example. For example, Ti (titanium) is used as the constituent material of the lower layer, but Ta, Ga, Sn, PtIr, Pt, TI (thallium), V (vanadium), Cr, etc. may be used instead of Ti. good. The method for forming the lower layer is not particularly limited, but is formed by, for example, a sputtering method, a CVD method, plating, or the like, and is appropriately selected depending on the constituent material to be adopted. For example, when the constituent material of the lower layer is Ti, the lower layer is formed by a sputtering method. The thickness of the lower layer is not particularly limited, but one example thereof is 0.1 μm or more and 0.2 μm or less.

The upper layer is formed on the lower layer. For example, Cu is adopted as the constituent material of the upper layer, but Cu alloy, Al, Al alloy, Au, Ag, Ni, W (tungsten) or the like may be adopted instead of Cu. The method for forming the upper layer is not particularly limited, but is formed by, for example, a sputtering method, a CVD method, plating, or the like, and is appropriately selected depending on the constituent material to be adopted. For example, when the constituent material of the upper layer is Cu, the upper layer is formed by a sputtering method. When the constituent material of the upper layer is Au, Ag, or Ni, it is generally formed by plating, but in this case, the upper layer may contain a seed layer (for example, Cu). The upper layer is thicker than the lower layer. The thickness of the upper layer depends on the material used, the value of the current flowing through the wiring layer 3, and the like. An example of the thickness of the upper layer is 0.5 μm or more and 5 μm or less.

As shown in FIGS. 3 and 6, the wiring layer 3 of the present embodiment has a plurality of individual electrodes 32, a plurality of common electrodes 31, and a plurality of relay electrodes 33.

As shown in FIG. 3, the plurality of individual electrodes 32 and the plurality of common electrodes 31 are arranged on the side upstream of the sub-scanning direction y with respect to the plurality of heat generating portions 41 of the resistor layer 4 described later. Further, the plurality of relay electrodes 33 are arranged on the downstream side in the sub-scanning direction y with respect to the plurality of heat generating portions 41. The plurality of individual electrodes 32 and the plurality of common electrodes 31 are alternately arranged along the main scanning direction x. The plurality of relay electrodes 33 are arranged at a predetermined pitch in the main scanning direction x.

The common electrode 31 has a base portion 341 and a pair of first band-shaped portions 342. The pair of first band-shaped portions 342 are connected to a pair of heat generating portions 41 (a pair of first heat generating portions 411 described later) adjacent to each other in the main scanning direction x, and are arranged apart from each other along the main scanning direction x. .. The first band-shaped portion 342 is a band-shaped portion extending along the sub-scanning direction y. The base portion 341 is connected to both of the pair of first band-shaped portions 342 and is located on the upstream side in the sub-scanning direction y. In this example, the tip of the first strip 342 is located on the top 130.

The individual electrode 32 has a second band-shaped portion 345. The second band-shaped portion 345 is arranged at a position adjacent to the first band-shaped portion 342 of the individual electrode 32 in the main scanning direction x, and is connected to the heat generating portion 41 (the second heat generating portion 412 described later). .. The second band-shaped portion 345 is a band-shaped portion extending along the sub-scanning direction y. In the present embodiment, the pair of second band-shaped portions 345 are arranged on both sides of the main scanning direction x with the pair of first strip-shaped portions 342 of the common electrode 31 interposed therebetween. In this example, the tip of the second strip 345 is located on the top 130, and the position of the tip of the second strip 345 in the sub-scanning direction y is almost the same as the position of the tip of the first strip 342. It is the same.

The relay electrode 33 has a shape that constitutes an energization path that folds back in the sub-scanning direction y. The relay electrode 33 is connected to a first heat-generating unit 411 and a second heat-generating unit 412, which will be described later, adjacent to each other. In this example, each relay electrode 33 is formed so as to straddle the first inclined portion 131B of the convex portion 13, the second inclined portion 132B, and the main surface 11. The tip of the relay electrode 33 on the upstream side in the sub-scanning direction y is located on the first inclined portion 131B.

[Resistance layer 4]
The resistor layer 4 is made of a material having a higher resistivity than the material constituting the wiring layer 3. The resistor layer 4 is made of, for example, ruthenium oxide. The formation position of the resistor layer 4 in this example is not limited in any way, and in this example, it is formed on the top 130 of the convex portion 13 and the first inclined portion 131B as shown in FIGS. 3 and 6. .. The thickness of the resistor layer 4 is, for example, 3 μm or more and 6 μm or less. The material and thickness of the resistor layer 4 are not limited. In this example, the thickness of the resistor layer 4 is thicker than that of the wiring layer 3. The resistor layer 4 has a plurality of heat generating portions 41. The shape of the heat generating portion 41 is not limited in any way, and is, for example, a long rectangular shape having the sub-scanning direction y as the longitudinal direction. The method for forming the resistor layer 4 is not limited in any way, and in the present embodiment, a paste containing ruthenium oxide is applied and fired to obtain a resistor film, as described later. By removing a predetermined portion of the resistor film, a resistor layer 4 including a plurality of heat generating portions 41 (first heat generating portion 411 and second heat generating portion 412) can be obtained.

The plurality of heat generating portions 41 are arranged apart from each other in the main scanning direction x. The plurality of heat generating units include a first heat generating unit 411 and a second heat generating unit 412. In the illustrated example, the pair of first heat generating portions 411 are arranged apart from each other in the main scanning direction x. Further, a pair of second heat generating portions 412 are arranged on both sides of the main scanning direction x with the pair of first heat generating portions 411 interposed therebetween. A plurality of pairs of the pair of first heat generating portions 411 and the pair of second heat generating portions 412 are arranged in the main scanning direction x.

The first heat generating portion 411 overlaps each of the tip portion of the first band-shaped portion 342 and one tip portion of the relay electrode 33. That is, the first heat generating portion 411 has a portion that is in direct contact with the substrate 1 (insulating layer 19) and a portion that overlaps the first band-shaped portion 342 and the relay electrode 33 from the side opposite to the substrate 1 in the thickness direction z. Therefore, the dimension of the first heat generating portion 411 along the sub-scanning direction y is larger than the distance between the tip of the first band-shaped portion 342 and the tip of the relay electrode 33.

The second heat generating portion 412 overlaps the tip portion of the second band-shaped portion 345 and the other tip portion of the relay electrode 33, respectively. That is, the second heat generating portion 412 has a portion that is in direct contact with the substrate 1 (insulating layer 19) and a portion that overlaps the second band-shaped portion 345 and the relay electrode 33 from the side opposite to the substrate 1 in the thickness direction z. Therefore, the dimension of the second heat generating portion 412 along the sub-scanning direction y is larger than the distance between the tip of the second band-shaped portion 345 and the tip of the relay electrode 33.

When any of the individual electrodes 32 is energized, a current flows through the conduction path including the second band-shaped portion 345, the second heat generating portion 412, the relay electrode 33, the first heat generating portion 411, and the first band-shaped portion 342. As a result, the first heat generating unit 411 and the second heat generating unit 412, which are adjacent to each other, generate heat. That is, in the thermal print head A1 of the present embodiment, one printing dot (one point formed on the object to be printed) is formed by one adjacent first heat generating unit 411 and one second heat generating unit 412. ) Is configured. For example, the first heat-generating unit 411, which is the fourth from the left, and the second heat-generating unit 412, which is the third from the left, constitute one print dot.

[Protective layer 2]
The protective layer 2 covers the wiring layer 3 and the resistor layer 4, and protects the wiring layer 3 and the resistor layer 4. The protective layer 2 is made of an insulating material. As the insulating material, for example, SiN (silicon nitride) is adopted, but SiO ₂ (silicon oxide), SiC (silicon carbide), AlN (aluminum nitride) and the like may be adopted instead of SiN. The protective layer 2 is composed of a single layer or a plurality of layers including the above-mentioned insulating material. The thickness of the protective layer 2 is not particularly limited, and one example thereof is 1.0 μm or more and 10 μm or less.

As shown in FIG. 5, the protective layer 2 has a plurality of pad openings 21. Each pad opening 21 penetrates the protective layer 2 in the thickness direction z. Each of the plurality of pad openings 21 exposes the individual pads 321 of the individual electrodes 32. Unlike the illustrated illustration, the plurality of pad openings 21 may be filled with a conductive material. In this case, a plating layer may be formed on this conductive material. The structure of this plating layer is not particularly limited, but to give an example, Ni, Pd (palladium), and Au are laminated in this order from the surface of the conductive material.

[Connection board 5]
As shown in FIGS. 1 and 4, the connection substrate 5 is arranged on the side upstream of the sub-scanning direction y with respect to the substrate 1. The connection board 5 is, for example, a PCB board on which a driver IC 7 and a connector 59 described later are mounted. The shape of the connection substrate 5 is not particularly limited, but in the present embodiment, it is a rectangular shape having the main scanning direction x as the longitudinal direction. The connection board 5 has a main surface 51 and a back surface 52. The main surface 51 is a surface facing the same side as the main surface 11 of the base material 10, and the back surface 52 is a surface facing the same side as the back surface 12 of the base material 10. In the present embodiment, the main surface 51 is located below the main surface 11 in the thickness direction z figure.

A connector 59 is attached to the connection board 5. The connector 59 is used to connect the thermal print head A1 to a control unit (not shown) included in the thermal printer Pr. The connector 59 is connected to a wiring pattern (not shown) of the connection board 5.

[Driver IC7]
The driver IC 7 is mounted on the main surface 51 of the connection board 5, and is for energizing a plurality of heat generating portions 41 individually. The plurality of driver ICs 7 are connected to the plurality of individual electrodes 32 by the plurality of wires 61. The energization control of the plurality of heat generating portions 41 by the plurality of driver ICs 7 follows a command signal input from the outside of the thermal print head A1 via the connection board 5. The plurality of driver ICs 7 are connected to the wiring pattern (not shown) of the connection board 5 by the plurality of wires 62. The plurality of driver ICs 7 are appropriately provided according to the number of the plurality of heat generating portions 41.

[Protective resin 78]
The protective resin 78 covers a plurality of driver ICs 7, a plurality of wires 61, and a plurality of wires 62. The protective resin 78 is made of an insulating resin such as an epoxy resin and is, for example, black. The protective resin 78 is formed so as to straddle the substrate 1 and the connection substrate 5.

[Heat dissipation member 8]
The heat radiating member 8 supports the substrate 1 and the connecting substrate 5, and is for radiating a part of the heat generated by the plurality of heat generating portions 41 to the outside through the base material 10 of the substrate 1. .. The heat radiating member 8 is a block-shaped member made of a metal such as Al. The heat radiating member 8 has a first support surface 81 and a second support surface 82. The first support surface 81 and the second support surface 82 each face the upper side in the thickness direction z, and are arranged side by side in the sub-scanning direction y. The back surface 12 of the base material 10 is bonded to the first support surface 81. The back surface 52 of the connection substrate 5 is joined to the second support surface 82.

Next, an example of a method for manufacturing the thermal print head A1 will be described below with reference to FIGS. 7 to 19.

FIG. 7 is a flowchart showing an example of a method for manufacturing the thermal print head A1. As shown in the figure, the method for manufacturing the thermal printhead A1 of the present embodiment includes a substrate preparation step, a wiring layer forming step, a resistor layer forming step, and a protective layer forming step.

[Board preparation process]
First, as shown in FIG. 8, the substrate material 1K is prepared. The substrate material 1K is made of a single crystal semiconductor and is, for example, a part of a substantially circular Si wafer. One Si wafer contains a plurality of substrate materials 1K. In the figure below, one substrate material 1K (base material 10), which is a part of a Si wafer and corresponds to one thermal printhead A1, may be shown as a target. The thickness of the substrate material 1K (in other words, the thickness of the Si wafer) is not particularly limited, but in the present embodiment, it is, for example, about 725 μm. The substrate material 1K has a main surface 11K and a back surface 12K facing opposite sides. The main surface 11K is the (100) surface.

Next, after covering the main surface 11K with a predetermined mask layer, anisotropic etching using, for example, KOH is performed. Then the mask layer is removed. As a result, as shown in FIG. 9, a convex portion 13K is formed on the substrate material 1K. The convex portion 13K protrudes from the main surface 11K and extends long in the main scanning direction x. The convex portion 13K has a top portion 130K and a pair of inclined portions 132K. The top 130K is a plane parallel to the main surface 11K and is the same (100) plane as the main surface 11K. The pair of inclined portions 132K are located on both sides of the top portion 130K in the sub-scanning direction y, and are interposed between the top portion 130K and the main surface 11K. The pair of inclined portions 132K are planes inclined with respect to the top portion 130K and the main surface 11K, respectively. The angle between each of the pair of inclined portions 132K and the main surface 11K and the top portion 130K is 54.7 degrees.

Then, after removing the mask layer, anisotropic etching using, for example, TMAH (trimethylammonium hydroxide) is performed. As a result, the substrate material 1K becomes the substrate 10 having the main surface 11, the back surface 12, and the convex portion 13, as shown in FIG. The convex portion 13 has a top portion 130, a pair of first inclined portions 131A and 131B, and a pair of second inclined portions 132A and 132B. The top portion 130 is a portion that was the top portion 130K, and the pair of second inclined portions 132A and 132B is a portion that was the pair of inclined portions 132K. The pair of first inclined portions 131A and 131B is a portion where the boundary between the top portion 130K and the pair of inclined portions 132K is etched by TMAH. The angle α1 of the first inclined portions 131A and 131B with respect to the main surface 11 (see FIGS. 6 and 10) is 30.1 degrees, and the angle α2 of the second inclined portions 132A and 132B with respect to the main surface 11 (FIG. 6). And see FIG. 10) is 54.7 degrees.

Next, as shown in FIG. 11, the insulating layer 19 is formed. The insulating layer 19 is formed by depositing SiO ₂ formed using TEOS (tetraethyl orthosilicate) as a raw material gas on the base material 10, for example, by using CVD. The method for forming the insulating layer 19 is not limited to this. By the above steps, the substrate 1 having the base material 10 and the insulating layer 19 is obtained.

[Wiring layer forming process]
The wiring layer forming step includes a conductive film forming process and a conductive film patterning process.

(Condensate forming process)
Then, as shown in FIGS. 12 and 13, a conductive film 3K is formed. In the step of forming the conductive film 3K, for example, the above-mentioned lower layer and upper layer are formed in order. In the step of forming the lower layer, for example, a thin film of Ti is formed on the insulating layer 19 of the substrate 1 by sputtering. At this time, the lower layer covers substantially the entire surface of the substrate 1. In the step of forming the upper layer, for example, a layer made of Cu is formed on the lower layer by plating, sputtering, or the like. At this time, the upper layer covers almost the entire surface of the lower layer.

(Membrane patterning process)
Next, a conductive film patterning process for partially removing the conductive film 3K is performed. The conductive film patterning process is performed, for example, by creating a mask using a photolithography technique and etching using the mask. As a result, as shown in FIGS. 14 and 15, a wiring layer 3 having a plurality of common electrodes 31, a plurality of individual electrodes 32, and a plurality of relay electrodes 33 is obtained.

[Resistance layer forming step]
The resistor layer forming step includes a resistor paste coating process, a resistor paste firing process, and a resistor film removing process.

(Resistance paste application treatment)
As shown in FIGS. 16 and 17, a resistor paste containing ruthenium oxide is applied onto the substrate 1 by thick film printing or the like. At this time, the resistor paste is applied in a band shape extending in the main scanning direction x. Further, the resistor paste is applied so as to overlap the tip portion of the first strip-shaped portion 342 and the second strip-shaped portion 345 on the downstream side of the sub-scanning direction y and the tip portion of the relay electrode 33 on the upstream side of the sub-scanning direction y. The dimension of the band-shaped resistor paste in the sub-scanning direction y is larger than the distance between the first band-shaped portion 342 and the second band-shaped portion 345 and the relay electrode 33 in the sub-scanning direction y. The resistor paste may be discharged onto the substrate 1 using a dispenser.

(Resistance paste firing process)
The resistor paste is then dried and then solidified by firing the resistor paste. This gives the solidified resistor film 4K shown in FIGS. 16 and 17. The resistor film 4K is located on the top 130 and the first inclined portion 131B of the convex portion 13, and has the first band-shaped portion 342 of the plurality of common electrodes 31 and the second band-shaped portion 345 and the plurality of individual electrodes 32. It overlaps with each part of the relay electrode 33 of.

(Resistance film removal treatment)
Then, a part of the solidified resistor film 40 is removed. In this removal process, as shown in FIG. 16, a plurality of removal regions 49K are set in the resistor film 4K, and these removal regions 49K are removed. The removal region 49K is located between the adjacent first band-shaped portions 342 in the main scanning direction x, or between the first band-shaped portion 342 and the second band-shaped portion 345, and is an elongated band-shaped or elongated band extending in the sub-scanning direction y. It is a linear area. Further, the removal region 49K is located between adjacent relay electrodes 33 in the main scanning direction x, or between a pair of tips on the upstream side of the sub scanning direction y of the relay electrodes 33. The removal area 49K is set according to the manufacturing conditions for performing the removal process, and the resistor film 4K is not necessarily marked with a visible mark, a characteristic geometric shape is formed, a jig or the like is used. Does not mean to place. As described above, the timing for performing the process of removing a part of the resistor film 40 is after the resistor paste is solidified by firing. This also applies to other embodiments.

In the present embodiment, the method for removing the removal region 49K of the resistor film 4K is not limited in any way. Examples of the removal method include a method using a laser beam, a rotary blade (dicing blade) containing abrasive grains, a cutting method using a cutting tool such as a wire saw, and the like. In this embodiment, as shown in FIGS. 18 and 19, a plurality of removal regions 49K are removed by using the laser beam L. The type of the laser beam L is not limited at all, and any laser beam L may be used as long as it can remove the removal region 49K. In the present embodiment, as the laser beam L, a so-called picosecond laser beam having a pulse width of, for example, about 1 ps to about 25 ps is used. Alternatively, so-called nanosecond laser light may be used. Further, the wavelength of the laser beam L is not limited in any way, and for example, an infrared laser beam having a wavelength in the infrared region is used.

In the present embodiment, the laser beam L is scanned along the sub-scanning direction y toward the removal region 49K. That is, from a position downstream of the removal region 49K of the resistor layer 4 in the sub-scanning direction y, via the removal region 49K of the resistor layer 4, the sub-scanning direction y upstream side of the removal region 49K of the resistor layer 4 The laser beam L is scanned along the sub-scanning direction y toward the position of. As a result, a slit extending in the sub-scanning direction y is formed in the resistor film 4K, and the heat generating portion 41 is sequentially formed. Then, by removing all the removal regions 49K, the resistor layer 4 including the plurality of heat generating portions 41 shown in FIG. 3 is formed. In FIG. 3, a portion irradiated with the laser beam L is shown by an imaginary line. In this portion, the trace of irradiation with the laser beam L may be discolored or the like, and may remain as a processing mark 109 for partitioning the adjacent heat generating portions 41. When the removal region 49K is removed by using a rotary blade or the like containing the abrasive grains, the processing marks 109 due to the abrasive grains remain on the surface formed by removing the resistor layer 4.

In the resistor film removing process of the present disclosure, the process of removing the removed region 49K is limited to a configuration in which the resistor film 4K is clearly divided and a plurality of heat generating portions 41 are completely formed in individual regions. Not done. For example, depending on the output setting of the laser beam L, the thickness of the resistor film 4K, and the like, a configuration may occur in which adjacent heat generating portions 41 are connected to each other by a small portion of the resistor layer 4. Even with such a configuration, if the individual heat generating portions 41 generate heat substantially individually and each can form individual print dots, the heat generating portions 41 are formed by the resistor film removing treatment in the present disclosure. Included in things. This point is the same in the subsequent embodiments.

[Protective layer forming process]
Next, the protective layer 2 is formed. The formation of the protective layer 2 is performed, for example, by depositing SiN on the insulating layer 19, the wiring layer 3, and the resistor layer 4 using CVD. Further, the pad opening 21 is formed by partially removing the protective layer 2 by etching or the like. After that, one Si wafer is separated into a plurality of base materials 10 (see FIGS. 1, 4 and 5) by using a dicing device or the like.

After that, an assembly process is performed on one base material 10. The process includes mounting the base material 10 and the connecting board 5 on the heat radiating member 8, mounting the driver IC 7 on the connecting board 5, bonding the plurality of wires 61 and the plurality of wires 62, and forming the protective resin 78. The above-mentioned thermal print head A1 is obtained.

In the present embodiment, one adjacent first heat-generating unit 411 and one second heat-generating unit 412 (for example, the fourth heat-generating unit 411 from the left and 3 from the left in FIG. 3) constituting one printing dot are adjacent to each other. Also at the boundary of the second second heat generating portion 412), the removal region 49K is set to remove the resistor layer 4. Not limited to this, it is not necessary to set the removal area 49K at the above-mentioned boundary. As a result, the resistor layer 4 remains at the boundary. Therefore, one horizontally long rectangular area in which one adjacent first heat generating unit 411 and one second heat generating unit 412 are connected constitutes one print dot. When this horizontally long rectangular region generates heat, the temperature at the center of the region may rise. If the increased temperature does not adversely affect the shape of one print dot, a configuration in which one adjacent first heat generating unit 411 and one second heat generating unit 412 are connected can be adopted. In this case, since the processing time for removing the removal area 49K is halved, the man-hours for manufacturing the thermal print head A1 can be reduced.

Next, the operation of the thermal print head A1 and the method of manufacturing the thermal print head A1 will be described.

In the thermal print head A1, the entire wiring layer 3 is in direct contact with the insulating layer 19 of the substrate 1. The wiring layer 3 is formed by a thin film forming method such as sputtering or CVD. On the other hand, the resistor layer 4 has a structure that overlaps with a part of the wiring layer 3, and is not essential to be formed by a thin film forming method such as sputtering or CVD. Then, in the present embodiment, the resistor layer 4 is coated with a resistor paste and fired to obtain a resistor film. Then, by partially removing the resistor film, a plurality of heat generating portions 41 are formed. Therefore, first, the resistor layer 4 can be formed more easily than the case where the resistor layer 4 interposed between the substrate 1 and the wiring layer 3 is formed on the entire surface of the substrate 1 by the thin film forming method. Is. Secondly, it is possible to more easily form the plurality of heat generating portions 41 as compared with the case where the resistor pattern is formed by applying the photolithography technique. Therefore, the thermal print head A1 can be manufactured more easily.

As shown in FIG. 3, one print dot is formed by the adjacent first heat generating unit 411 and the second heat generating unit 412. First, the dimension yd of one print dot along the sub-scanning direction y is not determined by the width of the printed resistor (dimension along the sub-scanning direction y), but with the tip of the second band-shaped portion 345. It is defined by the distance from the tip of the relay electrode 33. This distance is determined by etching the conductive film 3K (see FIGS. 3 and 14). When a current flows through the region of the resistor corresponding to this distance, the region of the resistor generates heat. Therefore, since this distance can be obtained with high accuracy by etching, the accuracy of the dimension yd can be improved as compared with the case where the dimension yd of one print dot is determined by the width of the resistor (see FIG. 24).

Second, the dimension xd along the main scanning direction x of one print dot is the dimension (one) along the main scanning direction x of one processing mark 109 from the dot pitch (distance between the centers of adjacent dots). It is defined by the length obtained by subtracting the width of the machined mark 109). This length is determined by the width (dimension along the main scanning direction x) of one machining mark 109 by the laser beam L or the cutting tool. Therefore, since this length can be obtained with high accuracy, the accuracy of the dimension xd of one print dot is improved. Further, since the resistor layer 4 does not exist in the width portion of one processing mark 109, it becomes difficult for heat to be transferred from the heating element corresponding to one dot to both sides in the x direction. As a result, the dimensions and shape of the print dots formed by the thermal print head A1 can be made uniform, and the thermal print head A1 that realizes good print quality can be obtained.

As shown in FIG. 16, after forming a band-shaped resistor film 4K extending in the main scanning direction x, as shown in FIGS. 18 and 19, by removing a plurality of removal regions 49K of the resistor film 4K. , A plurality of heat generating portions 41 are formed. In this method, for example, the manufacturing efficiency can be improved as compared with the case where the resistor paste is applied to a plurality of small regions having a size, shape and number corresponding to the plurality of heat generating portions 41.

In the resistor film removing process shown in FIGS. 18 and 19, the removal region 49K can be removed more accurately by using the laser beam L. Further, if the laser beam L is used, the removal region 49K having various shapes can be removed. Further, if a picosecond laser having a pulse width of, for example, about 1 ps to about 25 ps is used as the laser beam L, a heat generating portion 41 having a sharper outer shape can be formed.

In the thermal print head A1, a plurality of heat generating portions 41 are arranged on the top portion 130 of the convex portion 13 and the first inclined portion 131B. As a result, good print quality can be obtained even when the radius 910 (see FIG. 4) passing through the contact position of the platen roller 91 with respect to each heat generating portion 41 is biased to the downstream side in the sub-scanning direction with respect to the convex portion 13. .. Such an arrangement is advantageous in avoiding interference between the platen roller 91 and the protective resin 78 described later, and the sub-scanning direction y of the substrate 1 can be reduced.

20-27 show other embodiments of the present disclosure. In these figures, the same or similar elements as those in the above embodiment are designated by the same reference numerals as those in the above embodiment.

<1st Embodiment 1st modification>
FIG. 20 shows a first modification of the thermal print head A1. In the thermal print head A11 of this example, the formation positions of the wiring layer 3 and the resistor layer 4 are different from those of the thermal print head A1 described above.

In this example, the resistor layer 4 (plurality of heat generating portions 41) is formed on the top 130 of the convex portion 13. The tips of the first strip 342 and the second strip 345 are located on the apex 130. Further, the tip of the relay electrode 33 on the upstream side in the sub-scanning direction y is located on the top 130.

The thermal print head A11 can be manufactured more easily by this modification as well. Further, as can be understood from this modification, the arrangement of the wiring layer 3 and the resistor layer 4 as viewed along the thickness direction z is not limited in any way.

<First Embodiment Second Modification Example>
21 and 22 show a second modification of the thermal print head A1. In the thermal print head A12 of this modification, the base material 10 has an end face 15. The end surface 15 is a surface facing the downstream side in the sub-scanning direction y. Further, the convex portion 13 is in contact with the end face 15. That is, the main surface 11 exists only on the sub-scanning direction y upstream side with respect to the convex portion 13, and does not have a portion located on the sub-scanning direction y downstream side with respect to the convex portion 13.

The relay electrode 33 is formed on the first inclined portion 131B and the second inclined portion 132B. The relay electrode 33 does not have a portion protruding from the convex portion 13.

The thermal print head A12 can be manufactured more easily by this modification as well. Further, since the main surface 11 exists only on the side upstream of the sub-scanning direction y with respect to the convex portion 13, the thermal printer Pr is set in a state where the radius 910 is further tilted as compared with the printing state shown in FIG. It is possible to do. This is preferable for suppressing interference between the thermal printer Pr and the protective resin 78.

<Second Embodiment>
FIG. 23 shows a thermal printhead according to a second embodiment of the present disclosure. The thermal print head A2 of the present embodiment has a different configuration of the wiring layer 3 from the above-described embodiment.

The wiring layer 3 of the present embodiment has a common electrode 31 and a plurality of individual electrodes 32. The common electrode 31 is connected to the plurality of heat generating portions 41 of the resistor layer 4 from the downstream side in the sub-scanning direction y. The plurality of individual electrodes 32 are connected to the plurality of heat generating portions 41 of the resistor layer 4 from the upstream side in the sub-scanning direction y.

The common electrode 31 of the present embodiment has a connecting portion 351 and a plurality of third band-shaped portions 352. The connecting portion 351 is arranged near the edge of the substrate 1 on the downstream side in the sub-scanning direction y, and has a band shape extending in the main scanning direction x. Each of the plurality of third band-shaped portions 352 extends from the connecting portion 351 to the upstream side in the sub-scanning direction y, and is arranged at equal pitches in the main scanning direction x. The common electrode 31 is connected to a portion (not shown) of the wiring layer 3 that conducts to the common line to which the printing voltage is supplied in the connector 59. The portion is located on the side upstream of the convex portion 13 in the sub-scanning direction y. The specific configuration of the path for conducting the common electrode 31 and the portion concerned is not limited in any way. A path bypassing one or both sides of the main scanning direction x of the convex portion 13 may be adopted. Alternatively, a conductive layer provided between the base material 10 and the insulating layer 19 may be used as a conduction path.

Each of the plurality of individual electrodes 32 has a fourth band-shaped portion 355. The fourth band-shaped portion 355 has a band shape extending along the sub-scanning direction y, and is arranged to face the third band-shaped portion 352 of the common electrode 31 on the upstream side in the sub-scanning direction y. One third band-shaped portion 352 and one fourth strip-shaped portion 355 are connected to one heat generating portion 41.

The method for manufacturing the thermal printhead A2 is, for example, the same as the method for manufacturing the thermal printhead A1 described above. Therefore, the resistor layer 4 (heat generating portion 41) has a portion that overlaps the tip portion of the third strip-shaped portion 352 and the tip portion of the fourth strip-shaped portion 355. Therefore, the dimension of the heat generating portion 41 along the sub-scanning direction y is larger than the distance between the tip of the fourth strip-shaped portion 355 and the tip of the third strip-shaped portion 352.

Also in this embodiment, the thermal print head A2 can be manufactured more easily. Further, by energizing any of the individual electrodes 32, only one heat generating portion 41 generates heat. Therefore, one printing dot is formed by one heat generating portion 41. This makes it possible to improve the definition of the thermal print head A2.

For example, the first embodiment (see FIG. 3) and the present embodiment (see FIG. 23) are compared. In FIG. 3, one printing dot composed of a first heat generating unit 411 and a third heat generating unit 412, which are the fourth from the left, and a first heat generating unit 411 and a sixth, respectively, which are the fifth from the left. Consider the dot pitch between the two heat generating portions 412 and one printing dot. When this dot pitch is 84.7 μm, it corresponds to a dot density of 300 dpi (dots per inch). According to the present embodiment, one heat generating unit 41 shown in FIG. 23 constitutes one printing dot. When the wiring shown in FIG. 3 and the wiring shown in FIG. 23 have the same wiring pitch (distance between the centers of adjacent wirings), as shown in FIG. 23, the pitch between the two adjacent heat generating portions 41. (Distance between centers of adjacent heat generating portions 41) is 42.3 (≈84.7 / 2) μm. In this case, it corresponds to a dot density of 600 dpi (dots per inch).

<Third Embodiment>
FIG. 24 shows a thermal printhead according to a third embodiment of the present disclosure. In the thermal print head A3 of the present embodiment, the configurations of the wiring layer 3 and the resistor layer 4 are different from those of the above-described embodiment.

The common electrode 31 has a connecting portion 361 and a fifth band-shaped portion 362. The connecting portion 361 is arranged near the edge of the substrate 1 on the downstream side in the sub-scanning direction y, and has a band shape extending in the main scanning direction x. Each of the plurality of fifth band-shaped portions 362 extends from the connecting portion 361 to the upstream side in the sub-scanning direction y, and is arranged at equal pitches in the main scanning direction x. The fifth strip-shaped portion 362 of the present embodiment reaches the first inclined portion 131A from the secondary scanning direction y downstream side via the main surface 11, the second inclined portion 132B, the first inclined portion 131B, and the top portion 130. .. When viewed along the thickness direction z, the tips of the plurality of fifth strips 362 on the upstream side in the sub-scanning direction y project from the resistor layer 4.

Each of the plurality of individual electrodes 32 has a sixth band-shaped portion 365. The sixth band-shaped portion 365 is a band-shaped portion extending along the sub-scanning direction y, and is arranged between adjacent fifth band-shaped portions 362 in the main scanning direction x. The sixth strip-shaped portion 365 reaches the second inclined portion 132B from the secondary scanning direction y upstream side via the main surface 11, the second inclined portion 132A, the first inclined portion 131A, the top portion 130, and the first inclined portion 131B. ing. When viewed along the thickness direction z, the tip of each sixth band-shaped portion 365 on the downstream side in the sub-scanning direction y protrudes from the resistor layer 4.

The resistor layer 4 has a band shape extending in the main scanning direction x, and is composed of one continuous region as a whole. The resistor layer 4 straddles the plurality of fifth strips 362 and the plurality of sixth strips 365, and overlaps with each of the plurality of fifth strips 362 and the plurality of sixth strips 365. The resistor layer 4 is manufactured by a manufacturing method that omits the resistor film removing process in the resistor layer forming step of the above-mentioned manufacturing method of the thermal print head A1.

In the thermal print head A3, when any of the individual electrodes 32 is conducted to the ground electrode, the connecting portion 361 is connected to the two fifth band-shaped portions 362 adjacent to the one sixth strip-shaped portion 365 connected to the individual electrode 32. Current flows from. Therefore, each of the portions of the resistor layer 4 sandwiched between the one sixth band-shaped portion 365 and the two adjacent fifth band-shaped portions 362 is the heat generating portion 41. The two heat generating portions 41 form one print dot.

Also in this embodiment, the thermal print head A3 can be manufactured more easily. Further, the resistor layer 4 of the present embodiment is composed of one continuous region and does not have a plurality of small regions partitioned from each other. Therefore, it is not necessary to perform the resistor film removing process in the resistor layer forming step. This is preferable for improving the manufacturing efficiency.

<Third Embodiment First Modification Example>
FIG. 25 shows a thermal printhead according to a third embodiment of the present disclosure. The configuration of the wiring layer 3 and the resistor layer 4 of the thermal print head A31 of this modification is different from that of the above-described embodiment. In the thermal print head A31, the resistor layer 4 is interposed between the wiring layer 3 and the substrate 1 (insulating layer 19) at the portion where the wiring layer 3 and the resistor layer 4 overlap. That is, the resistor layer 4 is in direct contact with the substrate 1 (insulating layer 19). It should be noted that such a modification can be appropriately applied to the above-mentioned thermal print heads A1 and A2.

FIG. 26 is a flowchart showing an example of a method for manufacturing the thermal print head A31. As shown in the figure, in the manufacturing method of this example, the substrate preparation step, the resistor layer forming step, the wiring layer forming step, and the protective layer forming step are performed in this order. The processing and the like performed in each step are the same as the processing in the manufacturing method of the thermal print head A1 described above.

The thermal print head A31 can be manufactured more easily by this modification as well. Further, as can be understood from this modification, the effect of forming the resistor layer 4 by a method using coating and firing is such that the resistor layer 4 is interposed between the substrate 1 and the wiring layer 3. Even if it can be played.

<Fourth Embodiment>
FIG. 27 shows a thermal printhead according to a fourth embodiment of the present disclosure. In the thermal print head A4 of the present embodiment, the configuration of the substrate 1 is different from that of the above-described embodiment.

In the substrate 1 of the present embodiment, the convex portion 13 is not formed on the substrate 10. That is, the base material 10 does not have a portion protruding from the main surface 11. The wiring layer 3 and the resistor layer 4 are arranged on the main surface 11.

Even with such an embodiment, the thermal print head A4 can be manufactured more easily. Further, as understood from the present embodiment, the base material 10 of the substrate 1 is not limited to the configuration having the convex portion 13.

The thermal print head and the method for manufacturing the thermal print head according to the present disclosure are not limited to the above-described embodiment. The specific configuration of each part of the thermal print head and the method for manufacturing the thermal print head according to the present disclosure can be freely changed in design.

[Appendix 1]
A substrate containing a base material made of a single crystal semiconductor,
A resistor layer supported by the substrate and having a plurality of heat generating portions arranged in the main scanning direction,
A wiring layer that is supported by the substrate and constitutes an energization path to the plurality of heat generating portions.
Equipped with
The wiring layer is in contact with the substrate and is in contact with the substrate.
The resistor layer is a thermal print head having a portion overlapping the wiring layer from the side opposite to the substrate in the thickness direction.
[Appendix 2]
The thermal print head according to Appendix 1, wherein the substrate includes an insulating layer interposed between the base material and the wiring layer.
[Appendix 3]
The substrate has a main surface facing in the thickness direction and a convex portion protruding from the main surface and extending in the main scanning direction.
The thermal print head according to Appendix 2, wherein the plurality of heat generating portions overlap the convex portions when viewed along the thickness direction.
[Appendix 4]
The convex portion has a top portion having the largest distance from the main surface, a first inclined portion on the upstream side connecting from the upstream side in the sub-scanning direction to the top portion, and a downstream side connecting the downstream side in the sub-scanning direction to the top portion. Including 1 inclined part
The thermal print head according to Appendix 3, wherein the heat generating portion overlaps the top portion when viewed along the thickness direction.
[Appendix 5]
The convex portion is the upstream side second inclined portion connected to the side opposite to the top in the sub-scanning direction with respect to the upstream side first inclined portion, and the upstream side second inclined portion connected to the downstream side first inclined portion in the sub-scanning direction. The thermal printhead according to Appendix 4, further comprising a second sloping portion on the downstream side connected to the opposite side to the top.
[Appendix 6]
The plurality of heat generating portions are arranged so as to be separated from each other in the main scanning direction, and the pair of first heat generating portions adjacent to each other in the main scanning direction and the pair of first heat generating portions are interposed therebetween on both sides in the main scanning direction. Including a pair of second heat generating portions arranged apart from each other.
The wiring layer is
A common electrode having a pair of first band-shaped portions each extending in the sub-scanning direction and spaced apart from each other in the main scanning direction, and a base portion connected to the pair of first band-shaped portions from the upstream side in the sub-scanning direction.
A pair of individual electrodes having a second band-shaped portion spaced apart from each other on both sides in the main scanning direction with the pair of first strip-shaped portions interposed therebetween.
With a pair of relay electrodes,
The pair of first band-shaped portions are individually connected to the pair of first heat generating portions from the upstream side in the sub-scanning direction.
The second band-shaped portion of the pair of individual electrodes is connected to the pair of second heat generating portions in the main scanning direction from the upstream side in the sub-scanning direction.
The thermal print head according to any one of Supplementary note 1 to 5, wherein the relay electrode is connected to the first heat generating portion and the second heat generating portion adjacent to each other in the main scanning direction from the downstream side in the sub scanning direction.
[Appendix 7]
The dimension of the first heat generating portion and the second heat generating portion in the sub-scanning direction is larger than the distance between the first band-shaped portion or the second band-shaped portion and the relay electrode in the sub-scanning direction, according to Appendix 6. Thermal print head.
[Appendix 8]
The thermal according to Appendix 6 or 7, wherein the dimensions of the first heat generating portion and the second heat generating portion in the main scanning direction are larger than the dimensions of the first band-shaped portion and the second band-shaped portion in the main scanning direction, respectively. Print head.
[Appendix 9]
The thermal print head according to any one of Supplementary note 6 to 8, wherein the substrate is formed with processing marks for partitioning the heat generating portions adjacent to each other in the main scanning direction.
[Appendix 10]
The wiring layer has a common electrode connected to each of the plurality of heat generating portions of the resistor layer from the downstream side in the sub-scanning direction, and the plurality of heat generating portions of the resistor layer individually from the upstream side in the sub-scanning direction. The thermal printhead according to any one of Appendix 1 to 5, comprising a plurality of individual electrodes to be connected.
[Appendix 11]
The plurality of heat generating portions are arranged so as to be separated from each other in the main scanning direction.
The common electrode has a connecting portion extending in the main scanning direction and a plurality of third band-shaped portions extending from the connecting portion to the upstream side in the sub-scanning direction and arranged apart from each other along the main scanning direction. Have,
Each of the plurality of individual electrodes extends in the sub-scanning direction and has a plurality of fourth band-shaped portions each facing each other on the upstream side in the sub-scanning direction with respect to the plurality of third band-shaped portions.
The thermal print head according to Appendix 10, wherein the plurality of third strips and the plurality of fourth strips are individually connected to the plurality of heat generating portions.
[Appendix 12]
The thermal print head according to Appendix 11, wherein the dimension of the heat generating portion in the sub-scanning direction is larger than the distance between the third band-shaped portion and the fourth band-shaped portion in the sub-scanning direction.
[Appendix 13]
The thermal print head according to Appendix 11 or 12, wherein the dimension of the heat generating portion in the main scanning direction is larger than the dimension of the third band-shaped portion and the fourth strip-shaped portion in the main scanning direction, respectively.
[Appendix 14]
The thermal print head according to any one of Supplementary note 11 to 13, wherein the substrate is formed with processing marks for partitioning the heat generating portions adjacent to each other in the main scanning direction.
[Appendix 15]
The common electrode has a connecting portion extending in the main scanning direction and a plurality of fifth band-shaped portions extending from the connecting portion to the upstream side in the sub-scanning direction and arranged apart from each other along the main scanning direction. Have,
Each of the plurality of individual electrodes has a sixth band-shaped portion extending in the sub-scanning direction and located between the fifth band-shaped portions adjacent to each other in the main scanning direction.
The resistor layer has a band shape extending in the main scanning direction, overlapping the plurality of fifth band-shaped portions and the plurality of sixth band-shaped portions.
The thermal print head according to Appendix 10, wherein a portion of the resistor layer sandwiched between adjacent fifth strips constitutes the heat generating portion.
[Appendix 16]
The fifth band-shaped portion extends from the resistance layer to the upstream side in the sub-scanning direction.
The thermal print head according to Appendix 15, wherein the sixth strip extends from the resistor layer to the downstream side in the sub-scanning direction.
[Appendix 17]
The process of preparing a substrate containing a base material made of a single crystal semiconductor, and
The process of forming the wiring layer supported by the substrate and
The step of forming the resistance layer is provided.
The step of forming the wiring layer includes a conductive film forming process using sputtering or CVD.
A method for manufacturing a thermal printhead, wherein the step of forming the resistor layer includes a process of applying the resistor paste and a process of firing the resistor paste.
[Appendix 18]
The method for manufacturing a thermal print head according to Appendix 17, wherein the step of forming the resistor layer is performed after the step of forming the wiring layer.
[Appendix 19]
The method for manufacturing a thermal printhead according to Appendix 17, wherein the step of forming the resistor layer is performed before the step of forming the wiring layer.
[Appendix 20]
In the step of forming the resistor layer, after the process of firing the resistor paste, the resistor layer is partially removed to form a plurality of heat generating portions spaced apart from each other in the main scanning direction. The method for manufacturing a thermal printhead according to any one of Supplementary note 17 to 19, further comprising.

A1, A11, A12, A2, A3, A31, A4: Thermal printhead 1: Substrate 1K: Substrate material 2: Protective layer 3: Wiring layer 3K: Conductive film 4: Resistor layer 4K: Resistor film 5: Connection substrate 7: Driver IC
8: Heat dissipation member 10: Base material 11, 11K: Main surface 12, 12K: Back surface 13, 13K: Convex portion 15: End surface 19: Insulation layer 21: Pad opening 31: Common electrode 32: Individual electrode 33: Relay electrode 40 : Resistor film 41: Heat generation part 49K: Removal area 51: Main surface 52: Back surface 59: Connector 61, 62: Wire 78: Protective resin 81: First support surface 82: Second support surface 91: Platen roller 109: Processing Traces 130, 130K: Top 131A, 131B: First inclined portion 132A, 132B: Second inclined portion 132K: Inclined portion 321: Individual pad 341: Base 342: First strip-shaped portion 345: Second strip-shaped portion 351: Connecting portion 352 : 3rd band-shaped part 355: 4th band-shaped part 361: Connecting part 362: 5th band-shaped part 365: 6th band-shaped part 411: 1st heat-generating part 412: 2nd heat-generating part 910: Radius L: Laser light Pr: Thermal printer x: Main scanning direction y: Sub-scanning direction z: Thickness direction α1: First tilt angle α2: Second tilt angle

Claims (20)

A substrate containing a substrate made of a single crystal semiconductor and a substrate
A resistor layer supported by the substrate and having a plurality of heat generating portions arranged in the main scanning direction,
A wiring layer that is supported by the substrate and constitutes an energization path to the plurality of heat generating portions.
Equipped with
The wiring layer is in contact with the substrate and is in contact with the substrate.
The resistor layer is a thermal print head having a portion overlapping the wiring layer from the side opposite to the substrate in the thickness direction. The thermal print head according to claim 1, wherein the substrate includes an insulating layer interposed between the base material and the wiring layer. The substrate has a main surface facing in the thickness direction and a convex portion protruding from the main surface and extending in the main scanning direction.
The thermal print head according to claim 2, wherein the plurality of heat generating portions overlap the convex portions when viewed along the thickness direction. The convex portion has a top portion having the largest distance from the main surface, a first inclined portion on the upstream side connecting from the upstream side in the sub-scanning direction to the top portion, and a downstream side connecting the downstream side in the sub-scanning direction to the top portion. Including 1 inclined part
The thermal print head according to claim 3, wherein the heat generating portion overlaps the top portion when viewed along the thickness direction. The convex portion is the upstream side second inclined portion connected to the side opposite to the top in the sub-scanning direction with respect to the upstream side first inclined portion, and the upstream side second inclined portion connected to the downstream side first inclined portion in the sub-scanning direction. The thermal print head according to claim 4, further comprising a second inclined portion on the downstream side connected to the side opposite to the top portion. The plurality of heat generating portions are arranged so as to be separated from each other in the main scanning direction, and the pair of first heat generating portions adjacent to each other in the main scanning direction and the pair of first heat generating portions are interposed therebetween on both sides in the main scanning direction. Including a pair of second heat generating portions arranged apart from each other.
The wiring layer is
A common electrode having a pair of first band-shaped portions each extending in the sub-scanning direction and spaced apart from each other in the main scanning direction, and a base portion connected to the pair of first band-shaped portions from the upstream side in the sub-scanning direction.
A pair of individual electrodes having a second band-shaped portion spaced apart from each other on both sides in the main scanning direction with the pair of first strip-shaped portions interposed therebetween.
With a pair of relay electrodes,
The pair of first band-shaped portions are individually connected to the pair of first heat generating portions from the upstream side in the sub-scanning direction.
The second band-shaped portion of the pair of individual electrodes is connected to the pair of second heat generating portions in the main scanning direction from the upstream side in the sub-scanning direction.
The thermal print head according to any one of claims 1 to 5, wherein the relay electrode is connected to the first heat generating portion and the second heat generating portion adjacent to each other in the main scanning direction from the downstream side in the sub scanning direction. The sixth aspect of claim 6, wherein the dimensions of the first heat generating portion and the second heat generating portion in the sub-scanning direction are larger than the distance between the first band-shaped portion or the second band-shaped portion and the relay electrode in the sub-scanning direction. Thermal print head. 6. Thermal print head. The thermal print head according to any one of claims 6 to 8, wherein the substrate is formed with processing marks for partitioning the heat generating portions adjacent to each other in the main scanning direction. The wiring layer has a common electrode connected to each of the plurality of heat generating portions of the resistor layer from the downstream side in the sub-scanning direction, and the plurality of heat generating portions of the resistor layer individually from the upstream side in the sub-scanning direction. The thermal printhead according to any one of claims 1 to 5, comprising a plurality of individual electrodes to be connected. The plurality of heat generating portions are arranged so as to be separated from each other in the main scanning direction.
The common electrode has a connecting portion extending in the main scanning direction and a plurality of third band-shaped portions extending from the connecting portion to the upstream side in the sub-scanning direction and arranged apart from each other along the main scanning direction. Have,
Each of the plurality of individual electrodes extends in the sub-scanning direction and has a plurality of fourth band-shaped portions each facing each other on the upstream side in the sub-scanning direction with respect to the plurality of third band-shaped portions.
The thermal print head according to claim 10, wherein the plurality of third strips and the plurality of fourth strips are individually connected to the plurality of heat generating portions. The thermal print head according to claim 11, wherein the dimension of the heat generating portion in the sub-scanning direction is larger than the distance between the third band-shaped portion and the fourth band-shaped portion in the sub-scanning direction. The thermal print head according to claim 11 or 12, wherein the dimension of the heat generating portion in the main scanning direction is larger than the dimension of the third band-shaped portion and the fourth strip-shaped portion in the main scanning direction, respectively. The thermal print head according to any one of claims 11 to 13, wherein the substrate is formed with processing marks for partitioning the heat generating portions adjacent to each other in the main scanning direction. The common electrode has a connecting portion extending in the main scanning direction and a plurality of fifth band-shaped portions extending from the connecting portion to the upstream side in the sub-scanning direction and arranged apart from each other along the main scanning direction. Have,
Each of the plurality of individual electrodes has a sixth band-shaped portion extending in the sub-scanning direction and located between the fifth band-shaped portions adjacent to each other in the main scanning direction.
The resistor layer has a band shape extending in the main scanning direction, overlapping the plurality of fifth band-shaped portions and the plurality of sixth band-shaped portions.
The thermal print head according to claim 10, wherein a portion of the resistor layer sandwiched between adjacent fifth strips constitutes the heat generating portion. The fifth band-shaped portion extends from the resistance layer to the upstream side in the sub-scanning direction.
The thermal print head according to claim 15, wherein the sixth band-shaped portion extends downstream from the resistor layer in the sub-scanning direction. The process of preparing a substrate containing a base material made of a single crystal semiconductor, and
The process of forming the wiring layer supported by the substrate and
The step of forming the resistance layer is provided.
The step of forming the wiring layer includes a conductive film forming process using sputtering or CVD.
A method for manufacturing a thermal printhead, wherein the step of forming the resistor layer includes a process of applying the resistor paste and a process of firing the resistor paste. The method for manufacturing a thermal print head according to claim 17, wherein the step of forming the resistor layer is performed after the step of forming the wiring layer. The method for manufacturing a thermal print head according to claim 17, wherein the step of forming the resistor layer is performed before the step of forming the wiring layer. In the step of forming the resistor layer, after the process of firing the resistor paste, the resistor layer is partially removed to form a plurality of heat generating portions spaced apart from each other in the main scanning direction. The method for manufacturing a thermal printhead according to any one of claims 17 to 19, further comprising.

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