JP2022043557A - ロボット及びワーク搬送方法 - Google Patents
ロボット及びワーク搬送方法 Download PDFInfo
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- JP2022043557A JP2022043557A JP2020148886A JP2020148886A JP2022043557A JP 2022043557 A JP2022043557 A JP 2022043557A JP 2020148886 A JP2020148886 A JP 2020148886A JP 2020148886 A JP2020148886 A JP 2020148886A JP 2022043557 A JP2022043557 A JP 2022043557A
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 230000007246 mechanism Effects 0.000 claims abstract description 51
- 230000001133 acceleration Effects 0.000 claims abstract description 45
- 230000008569 process Effects 0.000 claims abstract description 12
- 238000012546 transfer Methods 0.000 claims description 21
- 238000006073 displacement reaction Methods 0.000 abstract description 4
- 230000003028 elevating effect Effects 0.000 description 16
- 239000000758 substrate Substances 0.000 description 12
- 210000000707 wrist Anatomy 0.000 description 10
- 230000032258 transport Effects 0.000 description 9
- 239000012636 effector Substances 0.000 description 6
- 238000012545 processing Methods 0.000 description 5
- 238000004891 communication Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/915—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers provided with drive systems with rotary movements only
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J13/00—Controls for manipulators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/0014—Gripping heads and other end effectors having fork, comb or plate shaped means for engaging the lower surface on a object to be transported
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/16—Programme controls
- B25J9/1656—Programme controls characterised by programming, planning systems for manipulators
- B25J9/1664—Programme controls characterised by programming, planning systems for manipulators characterised by motion, path, trajectory planning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Press Drives And Press Lines (AREA)
Abstract
Description
11 昇降軸
2 ロボットアーム(アーム部)
21 第1アーム
22 第2アーム
3 ロボットハンド(ハンド部)
31 手首部
32 ハンド本体部
32a 第1指部
32b 第2指部
4 チルト機構
41 下板部
42 上板部
5 高さ調整機構
51,52,53 支持部
56 オネジ
57 メネジ
58 球面軸受
61 ベルヌーイチャック
9 ロボット制御部(ハンド姿勢制御部)
100 ロボット
Claims (7)
- ワークを搬送するためのロボットであって、
アーム部と、
前記アーム部に設けられ、前記ワークを上面側に保持して搬送するハンド部と、
前記ハンド部の姿勢を傾けることが可能なチルト機構と、
前記ハンド部によって前記ワークを保持して搬送する過程で当該ハンド部に加速度が生じる場合に、前記チルト機構によって、前記加速度の水平方向成分の向きと反対側が高くなるように前記ハンド部の姿勢を傾斜させるハンド姿勢制御部と、
を備えることを特徴とするロボット。 - 請求項1に記載のロボットであって、
前記ハンド姿勢制御部は、前記ハンド部に生じる加速度の水平方向成分が大きい場合は、小さい場合に比べて、前記ハンド部の姿勢の傾斜を大きくすることを特徴とするロボット。 - 請求項1又は2に記載のロボットであって、
第1位置から、前記第1位置と平面視で異なる第2位置へ前記ワークを搬送する場合に、
前記ハンド姿勢制御部は、前記第1位置から前記ワークの搬送を開始した直後の状態において、搬送方向始端側が高くなるように前記ハンド部の姿勢を傾斜させ、
前記ハンド姿勢制御部は、前記第2位置に前記ワークが到達する直前の状態において、搬送方向終端側が高くなるように前記ハンド部の姿勢を傾斜させることを特徴とするロボット。 - 請求項1から3までの何れか一項に記載のロボットであって、
前記ハンド部は、前記ワークの下面にのみ作用することで、前記ワークを当該ハンド部の上面側に保持することを特徴とするロボット。 - アーム部と、
前記アーム部に設けられ、ワークを上面側に保持して搬送するハンド部と、
前記ハンド部の姿勢を傾けることが可能なチルト機構と、
を備えるロボットによって、前記ワークを搬送するワーク搬送方法であって、
前記ハンド部によって前記ワークを保持して搬送する過程で当該ハンド部に加速度が生じる場合に、前記チルト機構によって、前記加速度の水平方向成分の向きと反対側が高くなるように前記ハンド部の姿勢を傾斜させることを特徴とするワーク搬送方法。 - ワークを搬送するためのロボットであって、
アーム部と、
前記アーム部に設けられ、前記ワークを下面側に保持して搬送するハンド部と、
前記ハンド部の姿勢を傾けることが可能なチルト機構と、
前記ハンド部によって前記ワークを保持して搬送する過程で当該ハンド部に加速度が生じる場合に、前記チルト機構によって、前記加速度の水平方向成分の向きと同じ側が高くなるように前記ハンド部の姿勢を傾斜させるハンド姿勢制御部と、
を備えることを特徴とするロボット。 - アーム部と、
前記アーム部に設けられ、ワークを下面側に保持して搬送するハンド部と、
前記ハンド部の姿勢を傾けることが可能なチルト機構と、
を備えるロボットによって、前記ワークを搬送するワーク搬送方法であって、
前記ハンド部によって前記ワークを保持して搬送する過程で当該ハンド部に加速度が生じる場合に、前記チルト機構によって、前記加速度の水平方向成分の向きと同じ側が高くなるように前記ハンド部の姿勢を傾斜させることを特徴とするワーク搬送方法。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020148886A JP2022043557A (ja) | 2020-09-04 | 2020-09-04 | ロボット及びワーク搬送方法 |
CN202180054595.7A CN116096537A (zh) | 2020-09-04 | 2021-08-29 | 机器人以及工件运送方法 |
US18/024,499 US20240010444A1 (en) | 2020-09-04 | 2021-08-29 | Robot and workpiece transfer method |
KR1020237003968A KR20230031954A (ko) | 2020-09-04 | 2021-08-29 | 로봇 및 워크 반송 방법 |
PCT/JP2021/031629 WO2022050203A1 (ja) | 2020-09-04 | 2021-08-29 | ロボット及びワーク搬送方法 |
TW110132737A TWI795900B (zh) | 2020-09-04 | 2021-09-03 | 機器人以及工件運送方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020148886A JP2022043557A (ja) | 2020-09-04 | 2020-09-04 | ロボット及びワーク搬送方法 |
Publications (1)
Publication Number | Publication Date |
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JP2022043557A true JP2022043557A (ja) | 2022-03-16 |
Family
ID=80491758
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020148886A Pending JP2022043557A (ja) | 2020-09-04 | 2020-09-04 | ロボット及びワーク搬送方法 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20240010444A1 (ja) |
JP (1) | JP2022043557A (ja) |
KR (1) | KR20230031954A (ja) |
CN (1) | CN116096537A (ja) |
TW (1) | TWI795900B (ja) |
WO (1) | WO2022050203A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117253843B (zh) * | 2023-11-20 | 2024-01-26 | 泓浒(苏州)半导体科技有限公司 | 一种晶圆运输真空机器人 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11138473A (ja) * | 1997-11-06 | 1999-05-25 | Toshiba Corp | ロボット装置および基板搬送方法 |
JPH11312728A (ja) * | 1998-04-30 | 1999-11-09 | Dainippon Screen Mfg Co Ltd | 基板搬送装置および方法 |
JP2000006064A (ja) * | 1998-06-18 | 2000-01-11 | Mecs Corp | 基板搬送ロボット |
JP2000216234A (ja) * | 1999-01-19 | 2000-08-04 | Hm Acty:Kk | 半導体ウエハハンドリング装置 |
JP4121257B2 (ja) * | 2001-07-11 | 2008-07-23 | 富士フイルム株式会社 | シート体ハンドリング装置 |
JP2006120861A (ja) | 2004-10-21 | 2006-05-11 | Rorze Corp | 傾き補正装置及びそれを備えた搬送ロボット |
JP6809964B2 (ja) * | 2017-03-30 | 2021-01-06 | 株式会社ダイヘン | 制御装置 |
-
2020
- 2020-09-04 JP JP2020148886A patent/JP2022043557A/ja active Pending
-
2021
- 2021-08-29 KR KR1020237003968A patent/KR20230031954A/ko not_active Application Discontinuation
- 2021-08-29 US US18/024,499 patent/US20240010444A1/en active Pending
- 2021-08-29 CN CN202180054595.7A patent/CN116096537A/zh active Pending
- 2021-08-29 WO PCT/JP2021/031629 patent/WO2022050203A1/ja active Application Filing
- 2021-09-03 TW TW110132737A patent/TWI795900B/zh active
Also Published As
Publication number | Publication date |
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TWI795900B (zh) | 2023-03-11 |
WO2022050203A1 (ja) | 2022-03-10 |
TW202218024A (zh) | 2022-05-01 |
CN116096537A (zh) | 2023-05-09 |
KR20230031954A (ko) | 2023-03-07 |
US20240010444A1 (en) | 2024-01-11 |
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