JP2021528854A5 - - Google Patents

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Publication number
JP2021528854A5
JP2021528854A5 JP2020570899A JP2020570899A JP2021528854A5 JP 2021528854 A5 JP2021528854 A5 JP 2021528854A5 JP 2020570899 A JP2020570899 A JP 2020570899A JP 2020570899 A JP2020570899 A JP 2020570899A JP 2021528854 A5 JP2021528854 A5 JP 2021528854A5
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JP
Japan
Prior art keywords
fluid
equipment
support assembly
parameter
substrate support
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JP2020570899A
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English (en)
Japanese (ja)
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JP7454509B2 (ja
JP2021528854A (ja
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Priority claimed from US16/014,606 external-priority patent/US10741429B2/en
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Publication of JP2021528854A publication Critical patent/JP2021528854A/ja
Publication of JP2021528854A5 publication Critical patent/JP2021528854A5/ja
Application granted granted Critical
Publication of JP7454509B2 publication Critical patent/JP7454509B2/ja
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JP2020570899A 2018-06-21 2019-06-14 基板処理システムのモデルベースの制御 Active JP7454509B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/014,606 US10741429B2 (en) 2018-06-21 2018-06-21 Model-based control of substrate processing systems
US16/014,606 2018-06-21
PCT/US2019/037234 WO2019245908A1 (en) 2018-06-21 2019-06-14 Model-based control of substrate processing systems

Publications (3)

Publication Number Publication Date
JP2021528854A JP2021528854A (ja) 2021-10-21
JP2021528854A5 true JP2021528854A5 (https=) 2022-06-17
JP7454509B2 JP7454509B2 (ja) 2024-03-22

Family

ID=68981660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020570899A Active JP7454509B2 (ja) 2018-06-21 2019-06-14 基板処理システムのモデルベースの制御

Country Status (4)

Country Link
US (1) US10741429B2 (https=)
JP (1) JP7454509B2 (https=)
KR (3) KR102915461B1 (https=)
WO (1) WO2019245908A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102858027B1 (ko) * 2020-09-30 2025-09-11 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 온도 제어 프로그램, 반도체 장치의 제조 방법 및 온도 제어 방법
US12130606B2 (en) * 2021-12-22 2024-10-29 Applied Materials, Inc. Disturbance compensation for substrate processing recipes
JP7763421B2 (ja) * 2021-12-24 2025-11-04 Ntt株式会社 温度制御装置、温度制御システム及び温度制御方法
KR102952769B1 (ko) 2022-12-07 2026-04-15 삼성전자주식회사 반도체 공정 설비용 온도 제어 시스템 및 온도 제어 방법

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US5341663A (en) * 1992-04-22 1994-08-30 Aluminum Company Of America Automatic process control and noise suppression
US6299753B1 (en) 1999-09-01 2001-10-09 Applied Materials, Inc. Double pressure vessel chemical dispenser unit
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
JP2009064814A (ja) 2007-09-04 2009-03-26 Hitachi High-Technologies Corp プラズマ処理装置
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
JP5540586B2 (ja) 2009-07-01 2014-07-02 ソニー株式会社 信号処理回路、agc回路、および記録再生装置
KR20110054837A (ko) 2009-11-18 2011-05-25 삼성전자주식회사 온도제어시스템
DE102010013568A1 (de) 2010-03-30 2011-10-06 Ksb Aktiengesellschaft Entkopplung der Regelgrößen in einem Fluidfördersystem mit Totzeit
JP5604201B2 (ja) 2010-07-15 2014-10-08 株式会社日立メディコ 無駄時間補償装置及びこれを用いたx線ct装置
US8825185B2 (en) * 2011-01-04 2014-09-02 Johnson Controls Technology Company Delay compensation for feedback controllers
JP6034231B2 (ja) * 2012-07-25 2016-11-30 株式会社Kelk 半導体製造装置用温度調整装置、半導体製造におけるpid定数演算方法、及び半導体製造装置用温度調整装置の運転方法
KR101367086B1 (ko) 2013-10-17 2014-02-24 (주)테키스트 반도체 제조 설비를 위한 온도제어 시스템
JP6362019B2 (ja) 2013-12-09 2018-07-25 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに防振装置及び防振方法
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KR102476377B1 (ko) * 2017-09-18 2022-12-12 현대자동차주식회사 전력공급장치의 전압강하보상 제어 시스템 및 방법

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