JP2021528854A5 - - Google Patents
Info
- Publication number
- JP2021528854A5 JP2021528854A5 JP2020570899A JP2020570899A JP2021528854A5 JP 2021528854 A5 JP2021528854 A5 JP 2021528854A5 JP 2020570899 A JP2020570899 A JP 2020570899A JP 2020570899 A JP2020570899 A JP 2020570899A JP 2021528854 A5 JP2021528854 A5 JP 2021528854A5
- Authority
- JP
- Japan
- Prior art keywords
- fluid
- equipment
- support assembly
- parameter
- substrate support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US16/014,606 US10741429B2 (en) | 2018-06-21 | 2018-06-21 | Model-based control of substrate processing systems |
| US16/014,606 | 2018-06-21 | ||
| PCT/US2019/037234 WO2019245908A1 (en) | 2018-06-21 | 2019-06-14 | Model-based control of substrate processing systems |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021528854A JP2021528854A (ja) | 2021-10-21 |
| JP2021528854A5 true JP2021528854A5 (https=) | 2022-06-17 |
| JP7454509B2 JP7454509B2 (ja) | 2024-03-22 |
Family
ID=68981660
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020570899A Active JP7454509B2 (ja) | 2018-06-21 | 2019-06-14 | 基板処理システムのモデルベースの制御 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US10741429B2 (https=) |
| JP (1) | JP7454509B2 (https=) |
| KR (3) | KR102915461B1 (https=) |
| WO (1) | WO2019245908A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102858027B1 (ko) * | 2020-09-30 | 2025-09-11 | 가부시키가이샤 코쿠사이 엘렉트릭 | 기판 처리 장치, 온도 제어 프로그램, 반도체 장치의 제조 방법 및 온도 제어 방법 |
| US12130606B2 (en) * | 2021-12-22 | 2024-10-29 | Applied Materials, Inc. | Disturbance compensation for substrate processing recipes |
| JP7763421B2 (ja) * | 2021-12-24 | 2025-11-04 | Ntt株式会社 | 温度制御装置、温度制御システム及び温度制御方法 |
| KR102952769B1 (ko) | 2022-12-07 | 2026-04-15 | 삼성전자주식회사 | 반도체 공정 설비용 온도 제어 시스템 및 온도 제어 방법 |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5341663A (en) * | 1992-04-22 | 1994-08-30 | Aluminum Company Of America | Automatic process control and noise suppression |
| US6299753B1 (en) | 1999-09-01 | 2001-10-09 | Applied Materials, Inc. | Double pressure vessel chemical dispenser unit |
| US7376472B2 (en) * | 2002-09-11 | 2008-05-20 | Fisher-Rosemount Systems, Inc. | Integrated model predictive control and optimization within a process control system |
| JP2009064814A (ja) | 2007-09-04 | 2009-03-26 | Hitachi High-Technologies Corp | プラズマ処理装置 |
| JP5173500B2 (ja) * | 2008-03-11 | 2013-04-03 | 大日本スクリーン製造株式会社 | 処理液供給装置およびそれを備えた基板処理装置 |
| JP5540586B2 (ja) | 2009-07-01 | 2014-07-02 | ソニー株式会社 | 信号処理回路、agc回路、および記録再生装置 |
| KR20110054837A (ko) | 2009-11-18 | 2011-05-25 | 삼성전자주식회사 | 온도제어시스템 |
| DE102010013568A1 (de) | 2010-03-30 | 2011-10-06 | Ksb Aktiengesellschaft | Entkopplung der Regelgrößen in einem Fluidfördersystem mit Totzeit |
| JP5604201B2 (ja) | 2010-07-15 | 2014-10-08 | 株式会社日立メディコ | 無駄時間補償装置及びこれを用いたx線ct装置 |
| US8825185B2 (en) * | 2011-01-04 | 2014-09-02 | Johnson Controls Technology Company | Delay compensation for feedback controllers |
| JP6034231B2 (ja) * | 2012-07-25 | 2016-11-30 | 株式会社Kelk | 半導体製造装置用温度調整装置、半導体製造におけるpid定数演算方法、及び半導体製造装置用温度調整装置の運転方法 |
| KR101367086B1 (ko) | 2013-10-17 | 2014-02-24 | (주)테키스트 | 반도체 제조 설비를 위한 온도제어 시스템 |
| JP6362019B2 (ja) | 2013-12-09 | 2018-07-25 | 株式会社ニコン | 駆動システム及び駆動方法、露光装置及び露光方法、並びに防振装置及び防振方法 |
| US10007255B2 (en) | 2014-06-27 | 2018-06-26 | Sunedison Semiconductor Limited (Uen201334164H) | Systems and methods for controlling temperatures in an epitaxial reactor |
| US11837479B2 (en) | 2016-05-05 | 2023-12-05 | Applied Materials, Inc. | Advanced temperature control for wafer carrier in plasma processing chamber |
| US10522377B2 (en) | 2016-07-01 | 2019-12-31 | Lam Research Corporation | System and method for substrate support feed-forward temperature control based on RF power |
| US20180166300A1 (en) * | 2016-12-13 | 2018-06-14 | Lam Research Ag | Point-of-use mixing systems and methods for controlling temperatures of liquids dispensed at a substrate |
| US10121709B2 (en) * | 2017-01-24 | 2018-11-06 | Lam Research Corporation | Virtual metrology systems and methods for using feedforward critical dimension data to predict other critical dimensions of a wafer |
| KR102476377B1 (ko) * | 2017-09-18 | 2022-12-12 | 현대자동차주식회사 | 전력공급장치의 전압강하보상 제어 시스템 및 방법 |
-
2018
- 2018-06-21 US US16/014,606 patent/US10741429B2/en active Active
-
2019
- 2019-06-14 KR KR1020257003228A patent/KR102915461B1/ko active Active
- 2019-06-14 KR KR1020217001795A patent/KR102763350B1/ko active Active
- 2019-06-14 JP JP2020570899A patent/JP7454509B2/ja active Active
- 2019-06-14 KR KR1020267001517A patent/KR20260022464A/ko active Pending
- 2019-06-14 WO PCT/US2019/037234 patent/WO2019245908A1/en not_active Ceased
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