JP7454509B2 - 基板処理システムのモデルベースの制御 - Google Patents

基板処理システムのモデルベースの制御 Download PDF

Info

Publication number
JP7454509B2
JP7454509B2 JP2020570899A JP2020570899A JP7454509B2 JP 7454509 B2 JP7454509 B2 JP 7454509B2 JP 2020570899 A JP2020570899 A JP 2020570899A JP 2020570899 A JP2020570899 A JP 2020570899A JP 7454509 B2 JP7454509 B2 JP 7454509B2
Authority
JP
Japan
Prior art keywords
equipment
fluid
parameter
support assembly
substrate support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2020570899A
Other languages
English (en)
Japanese (ja)
Other versions
JP2021528854A (ja
JP2021528854A5 (https=
Inventor
ジャン・タオ
リュー・カイ
サムロン・エリック
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lam Research Corp
Original Assignee
Lam Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lam Research Corp filed Critical Lam Research Corp
Publication of JP2021528854A publication Critical patent/JP2021528854A/ja
Publication of JP2021528854A5 publication Critical patent/JP2021528854A5/ja
Application granted granted Critical
Publication of JP7454509B2 publication Critical patent/JP7454509B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0612—Production flow monitoring, e.g. for increasing throughput
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0604—Process monitoring, e.g. flow or thickness monitoring
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B13/00—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion
    • G05B13/02—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric
    • G05B13/04—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators
    • G05B13/048—Adaptive control systems, i.e. systems automatically adjusting themselves to have a performance which is optimum according to some preassigned criterion electric involving the use of models or simulators using a predictor
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B17/00—Systems involving the use of models or simulators of said systems
    • G05B17/02—Systems involving the use of models or simulators of said systems electric
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00—Program-control systems
    • G05B19/02—Program-control systems electric
    • G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H10P72/0602—Temperature monitoring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H10P72/722—Details of electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/41—Servomotor, servo controller till figures
    • G05B2219/41303—Flow rate valve controls speed
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/45—Nc applications
    • G05B2219/45031—Manufacturing semiconductor wafers
    • G—PHYSICS
    • G05—CONTROLLING; REGULATING
    • G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00—Program-control systems
    • G05B2219/30—Nc systems
    • G05B2219/49—Nc machine tool, till multiple
    • G05B2219/49004—Modeling, making, manufacturing model to control machine, cmm

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Software Systems (AREA)
  • Medical Informatics (AREA)
  • Evolutionary Computation (AREA)
  • Health & Medical Sciences (AREA)
  • Artificial Intelligence (AREA)
  • General Engineering & Computer Science (AREA)
  • Quality & Reliability (AREA)
  • Control Of Temperature (AREA)
  • Feedback Control In General (AREA)
JP2020570899A 2018-06-21 2019-06-14 基板処理システムのモデルベースの制御 Active JP7454509B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US16/014,606 US10741429B2 (en) 2018-06-21 2018-06-21 Model-based control of substrate processing systems
US16/014,606 2018-06-21
PCT/US2019/037234 WO2019245908A1 (en) 2018-06-21 2019-06-14 Model-based control of substrate processing systems

Publications (3)

Publication Number Publication Date
JP2021528854A JP2021528854A (ja) 2021-10-21
JP2021528854A5 JP2021528854A5 (https=) 2022-06-17
JP7454509B2 true JP7454509B2 (ja) 2024-03-22

Family

ID=68981660

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020570899A Active JP7454509B2 (ja) 2018-06-21 2019-06-14 基板処理システムのモデルベースの制御

Country Status (4)

Country Link
US (1) US10741429B2 (https=)
JP (1) JP7454509B2 (https=)
KR (3) KR102915461B1 (https=)
WO (1) WO2019245908A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102858027B1 (ko) * 2020-09-30 2025-09-11 가부시키가이샤 코쿠사이 엘렉트릭 기판 처리 장치, 온도 제어 프로그램, 반도체 장치의 제조 방법 및 온도 제어 방법
US12130606B2 (en) * 2021-12-22 2024-10-29 Applied Materials, Inc. Disturbance compensation for substrate processing recipes
JP7763421B2 (ja) * 2021-12-24 2025-11-04 Ｎｔｔ株式会社 温度制御装置、温度制御システム及び温度制御方法
KR102952769B1 (ko) 2022-12-07 2026-04-15 삼성전자주식회사 반도체 공정 설비용 온도 제어 시스템 및 온도 제어 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192893A (ja) 1999-09-01 2001-07-17 Applied Materials Inc 二倍圧力ベッセル化学物質ディスペンサーユニット
JP2011013916A (ja) 2009-07-01 2011-01-20 Sony Corp 信号処理回路、ａｇｃ回路、および記録再生装置
JP2012020008A (ja) 2010-07-15 2012-02-02 Hitachi Medical Corp 無駄時間補償装置及びこれを用いたｘ線ｃｔ装置
US20130037121A1 (en) 2010-03-30 2013-02-14 Joerg Kiesbauer Decoupling of controlled variables in a fluid conveying system with dead time
JP2015079930A (ja) 2013-10-17 2015-04-23 テキスト カンパニー リミテッド 半導体製造設備のための温度制御システム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5341663A (en) * 1992-04-22 1994-08-30 Aluminum Company Of America Automatic process control and noise suppression
US7376472B2 (en) * 2002-09-11 2008-05-20 Fisher-Rosemount Systems, Inc. Integrated model predictive control and optimization within a process control system
JP2009064814A (ja) 2007-09-04 2009-03-26 Hitachi High-Technologies Corp プラズマ処理装置
JP5173500B2 (ja) * 2008-03-11 2013-04-03 大日本スクリーン製造株式会社 処理液供給装置およびそれを備えた基板処理装置
KR20110054837A (ko) 2009-11-18 2011-05-25 삼성전자주식회사 온도제어시스템
US8825185B2 (en) * 2011-01-04 2014-09-02 Johnson Controls Technology Company Delay compensation for feedback controllers
JP6034231B2 (ja) * 2012-07-25 2016-11-30 株式会社Kelk 半導体製造装置用温度調整装置、半導体製造におけるｐｉｄ定数演算方法、及び半導体製造装置用温度調整装置の運転方法
JP6362019B2 (ja) 2013-12-09 2018-07-25 株式会社ニコン 駆動システム及び駆動方法、露光装置及び露光方法、並びに防振装置及び防振方法
US10007255B2 (en) 2014-06-27 2018-06-26 Sunedison Semiconductor Limited (Uen201334164H) Systems and methods for controlling temperatures in an epitaxial reactor
US11837479B2 (en) 2016-05-05 2023-12-05 Applied Materials, Inc. Advanced temperature control for wafer carrier in plasma processing chamber
US10522377B2 (en) 2016-07-01 2019-12-31 Lam Research Corporation System and method for substrate support feed-forward temperature control based on RF power
US20180166300A1 (en) * 2016-12-13 2018-06-14 Lam Research Ag Point-of-use mixing systems and methods for controlling temperatures of liquids dispensed at a substrate
US10121709B2 (en) * 2017-01-24 2018-11-06 Lam Research Corporation Virtual metrology systems and methods for using feedforward critical dimension data to predict other critical dimensions of a wafer
KR102476377B1 (ko) * 2017-09-18 2022-12-12 현대자동차주식회사 전력공급장치의 전압강하보상 제어 시스템 및 방법

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001192893A (ja) 1999-09-01 2001-07-17 Applied Materials Inc 二倍圧力ベッセル化学物質ディスペンサーユニット
JP2011013916A (ja) 2009-07-01 2011-01-20 Sony Corp 信号処理回路、ａｇｃ回路、および記録再生装置
US20130037121A1 (en) 2010-03-30 2013-02-14 Joerg Kiesbauer Decoupling of controlled variables in a fluid conveying system with dead time
JP2012020008A (ja) 2010-07-15 2012-02-02 Hitachi Medical Corp 無駄時間補償装置及びこれを用いたｘ線ｃｔ装置
JP2015079930A (ja) 2013-10-17 2015-04-23 テキスト カンパニー リミテッド 半導体製造設備のための温度制御システム

Also Published As

Publication number Publication date
US20190393059A1 (en) 2019-12-26
US10741429B2 (en) 2020-08-11
WO2019245908A1 (en) 2019-12-26
JP2021528854A (ja) 2021-10-21
KR20260022464A (ko) 2026-02-19
KR102763350B1 (ko) 2025-02-04
KR102915461B1 (ko) 2026-01-19
KR20210014738A (ko) 2021-02-09
KR20250022890A (ko) 2025-02-17

Similar Documents

Publication Publication Date Title
JP7313528B2 (ja) 流れ均一性を改善させるためのフェースプレート穴を有する低容積シャワーヘッド
JP7454509B2 (ja) 基板処理システムのモデルベースの制御
KR102688484B1 (ko) 비말 동반된 증기를 측정하기 위한 시스템들 및 방법들
CN109637947B (zh) 用于使半导体制造设备的用户交互自动化的系统和方法
TWI706504B (zh) 用以降低靜電夾頭中之溫度變遷的系統及方法
TWI506670B (zh) 使用以模型為基礎的控制處理基材的方法及設備
KR102944324B1 (ko) 멀티-패터닝 프로세스들을 위한 멀티-존 가열된 기판 지지부를 사용한 트리밍 및 증착 프로파일 제어
TW201812958A (zh) 基於射頻功率之基板支撐件前饋溫度控制系統及方法
CN110896044B (zh) 自动校准工艺独立前馈控制
KR102492984B1 (ko) 기판 프로세싱 시스템의 전구체 증기 공급 시스템에서 플로우 모니터링을 위한 시스템들 및 방법들
KR20190100972A (ko) TCE들 (thermal control elements) 을 사용한 ESC 온도 추정을 위한 가상 계측 방법
US20210398829A1 (en) Ceramic pedestal with multi-layer heater for enhanced thermal uniformity
KR102527489B1 (ko) 웨이퍼의 다른 cd (critical dimension) 를 예측하기 위해 피드포워드 cd 데이터를 사용하는 가상 계측 시스템들 및 방법들
US11255017B2 (en) Systems and methods for flow monitoring in a precursor vapor supply system of a substrate processing system
KR102447087B1 (ko) 액체 전구체 또는 고체 전구체를 가진, 디펙트 감소를 위한 내부적으로 가열된 다공성 필터
JP2025176776A (ja) 情報処理装置及びプロセス条件予測方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220609

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20220609

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20230718

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20230829

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20231129

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20240213

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240311

R150 Certificate of patent or registration of utility model

Ref document number: 7454509

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150