JP2021515993A5 - - Google Patents
Info
- Publication number
- JP2021515993A5 JP2021515993A5 JP2020571333A JP2020571333A JP2021515993A5 JP 2021515993 A5 JP2021515993 A5 JP 2021515993A5 JP 2020571333 A JP2020571333 A JP 2020571333A JP 2020571333 A JP2020571333 A JP 2020571333A JP 2021515993 A5 JP2021515993 A5 JP 2021515993A5
- Authority
- JP
- Japan
- Prior art keywords
- dies
- steps include
- map
- deviation
- die
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201862641297P | 2018-03-10 | 2018-03-10 | |
| US62/641,297 | 2018-03-10 | ||
| US16/273,876 | 2019-02-12 | ||
| US16/273,876 US10585049B2 (en) | 2018-03-10 | 2019-02-12 | Process-induced excursion characterization |
| PCT/US2019/021389 WO2019177895A1 (en) | 2018-03-10 | 2019-03-08 | Process-induced excursion characterization |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2021515993A JP2021515993A (ja) | 2021-06-24 |
| JP2021515993A5 true JP2021515993A5 (enExample) | 2022-03-10 |
| JP7097466B2 JP7097466B2 (ja) | 2022-07-07 |
Family
ID=67843829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020571333A Active JP7097466B2 (ja) | 2018-03-10 | 2019-03-08 | プロセス誘起逸脱特性評価 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10585049B2 (enExample) |
| JP (1) | JP7097466B2 (enExample) |
| KR (1) | KR102443351B1 (enExample) |
| CN (1) | CN111937129B (enExample) |
| IL (1) | IL277250B2 (enExample) |
| SG (1) | SG11202008760WA (enExample) |
| TW (1) | TWI797271B (enExample) |
| WO (1) | WO2019177895A1 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11656274B2 (en) * | 2021-02-15 | 2023-05-23 | Kla Corporation | Systems and methods for evaluating the reliability of semiconductor die packages |
| US12431393B2 (en) | 2021-10-26 | 2025-09-30 | Nanya Technology Corporation | Manufacturing method for semiconductor structures |
| US12191215B2 (en) * | 2021-10-22 | 2025-01-07 | Nanya Technology Corporation | Manufacturing and measuring system for semiconductor structures |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3698075B2 (ja) * | 2001-06-20 | 2005-09-21 | 株式会社日立製作所 | 半導体基板の検査方法およびその装置 |
| US6885977B2 (en) | 2002-12-20 | 2005-04-26 | Applied Materials, Inc. | System to identify a wafer manufacturing problem and method therefor |
| JP3896996B2 (ja) * | 2003-06-27 | 2007-03-22 | 株式会社日立製作所 | 回路パターンの検査装置および検査方法 |
| US7394534B1 (en) | 2003-11-19 | 2008-07-01 | Kla-Tencor Corporation | Process excursion detection |
| KR100909474B1 (ko) * | 2005-08-10 | 2009-07-28 | 삼성전자주식회사 | 웨이퍼 결함지수를 사용하여 국부성 불량 모드를 갖는결함성 반도체 웨이퍼의 검출 방법들 및 이에 사용되는장비들 |
| US7570796B2 (en) | 2005-11-18 | 2009-08-04 | Kla-Tencor Technologies Corp. | Methods and systems for utilizing design data in combination with inspection data |
| KR20180088924A (ko) | 2005-11-18 | 2018-08-07 | 케이엘에이-텐코 코포레이션 | 검사 데이터와 조합하여 설계 데이터를 활용하는 방법 및 시스템 |
| JP2009526240A (ja) | 2006-02-09 | 2009-07-16 | ケーエルエー−テンカー テクノロジィース コーポレイション | ウエハの特性決定のための方法とシステム |
| US8611639B2 (en) * | 2007-07-30 | 2013-12-17 | Kla-Tencor Technologies Corp | Semiconductor device property extraction, generation, visualization, and monitoring methods |
| US7937234B2 (en) | 2008-08-29 | 2011-05-03 | Intel Corporation | Classification of spatial patterns on wafer maps |
| WO2010090914A2 (en) * | 2009-02-03 | 2010-08-12 | Qcept Technologies, Inc. | Patterned wafer inspection system using a non-vibrating contact potential difference sensor |
| US10192303B2 (en) * | 2012-11-12 | 2019-01-29 | Kla Tencor Corporation | Method and system for mixed mode wafer inspection |
| US10101386B2 (en) | 2014-02-14 | 2018-10-16 | Texas Instruments Incorporated | Real time semiconductor process excursion monitor |
| JP6421237B2 (ja) * | 2014-08-29 | 2018-11-07 | エーエスエムエル ネザーランズ ビー．ブイ． | メトロロジー方法、ターゲット、及び基板 |
| CN107004616B (zh) * | 2014-11-19 | 2022-03-04 | 美国德卡科技公司 | 对单元特定的图案化的自动光学检测 |
| US10747830B2 (en) * | 2014-11-21 | 2020-08-18 | Mesh Labs Inc. | Method and system for displaying electronic information |
| US9779202B2 (en) * | 2015-06-22 | 2017-10-03 | Kla-Tencor Corporation | Process-induced asymmetry detection, quantification, and control using patterned wafer geometry measurements |
-
2019
- 2019-02-12 US US16/273,876 patent/US10585049B2/en active Active
- 2019-03-08 TW TW108107779A patent/TWI797271B/zh active
- 2019-03-08 SG SG11202008760WA patent/SG11202008760WA/en unknown
- 2019-03-08 CN CN201980023479.1A patent/CN111937129B/zh active Active
- 2019-03-08 KR KR1020207028815A patent/KR102443351B1/ko active Active
- 2019-03-08 WO PCT/US2019/021389 patent/WO2019177895A1/en not_active Ceased
- 2019-03-08 JP JP2020571333A patent/JP7097466B2/ja active Active
-
2020
- 2020-09-09 IL IL277250A patent/IL277250B2/en unknown
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