JP2021510742A - 太陽光発電封止材フィルムのためのポリオレフィン組成物 - Google Patents
太陽光発電封止材フィルムのためのポリオレフィン組成物 Download PDFInfo
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- JP2021510742A JP2021510742A JP2020523357A JP2020523357A JP2021510742A JP 2021510742 A JP2021510742 A JP 2021510742A JP 2020523357 A JP2020523357 A JP 2020523357A JP 2020523357 A JP2020523357 A JP 2020523357A JP 2021510742 A JP2021510742 A JP 2021510742A
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- 239000000203 mixture Substances 0.000 title claims abstract description 125
- 229920000098 polyolefin Polymers 0.000 title claims abstract description 88
- 239000008393 encapsulating agent Substances 0.000 title claims description 140
- 229920000642 polymer Polymers 0.000 claims abstract description 97
- 125000002950 monocyclic group Chemical group 0.000 claims abstract description 59
- 150000001451 organic peroxides Chemical class 0.000 claims abstract description 42
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 37
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 34
- 239000005977 Ethylene Substances 0.000 claims description 35
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 34
- 239000004711 α-olefin Substances 0.000 claims description 30
- 125000003342 alkenyl group Chemical group 0.000 claims description 23
- -1 and (v) each R 1 is Chemical group 0.000 claims description 23
- 125000000217 alkyl group Chemical group 0.000 claims description 20
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 19
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 claims description 18
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 18
- 229920002554 vinyl polymer Polymers 0.000 claims description 18
- 229920006037 cross link polymer Polymers 0.000 claims description 13
- 229920001577 copolymer Polymers 0.000 claims description 11
- 239000007795 chemical reaction product Substances 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 5
- 125000004178 (C1-C4) alkyl group Chemical group 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 4
- RFSBGZWBVNPVNN-UHFFFAOYSA-N 2,4,6-tris(ethenyl)-2,4,6-trimethyl-1,3,5,2,4,6-triazatrisilinane Chemical compound C=C[Si]1(C)N[Si](C)(C=C)N[Si](C)(C=C)N1 RFSBGZWBVNPVNN-UHFFFAOYSA-N 0.000 claims description 3
- 125000006526 (C1-C2) alkyl group Chemical group 0.000 claims 8
- 239000003566 sealing material Substances 0.000 abstract description 5
- 238000010586 diagram Methods 0.000 abstract 1
- 238000007654 immersion Methods 0.000 description 34
- 238000000034 method Methods 0.000 description 27
- 238000004132 cross linking Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 20
- 239000011521 glass Substances 0.000 description 18
- 239000000178 monomer Substances 0.000 description 17
- 239000008188 pellet Substances 0.000 description 15
- 239000000463 material Substances 0.000 description 14
- 239000005038 ethylene vinyl acetate Substances 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 12
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 12
- 239000000654 additive Substances 0.000 description 11
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 11
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 229920006124 polyolefin elastomer Polymers 0.000 description 9
- 238000012360 testing method Methods 0.000 description 9
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 8
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 239000000047 product Substances 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 6
- 230000000996 additive effect Effects 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- 238000001125 extrusion Methods 0.000 description 6
- 150000002978 peroxides Chemical class 0.000 description 6
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 5
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 229910052799 carbon Inorganic materials 0.000 description 5
- 150000002430 hydrocarbons Chemical class 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 230000036961 partial effect Effects 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- 239000004215 Carbon black (E152) Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000000748 compression moulding Methods 0.000 description 4
- 150000001993 dienes Chemical class 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 229930195733 hydrocarbon Natural products 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 238000011068 loading method Methods 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000006116 polymerization reaction Methods 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 3
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 3
- 125000003118 aryl group Chemical group 0.000 description 3
- IAQRGUVFOMOMEM-UHFFFAOYSA-N butene Natural products CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 230000008094 contradictory effect Effects 0.000 description 3
- 238000007598 dipping method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- HQQADJVZYDDRJT-UHFFFAOYSA-N ethene;prop-1-ene Chemical group C=C.CC=C HQQADJVZYDDRJT-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- 229910052733 gallium Inorganic materials 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229920001519 homopolymer Polymers 0.000 description 3
- 239000011256 inorganic filler Substances 0.000 description 3
- 229910003475 inorganic filler Inorganic materials 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 3
- 125000004433 nitrogen atom Chemical group N* 0.000 description 3
- 230000002028 premature Effects 0.000 description 3
- 239000003381 stabilizer Substances 0.000 description 3
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 2
- 125000006702 (C1-C18) alkyl group Chemical group 0.000 description 2
- 125000003837 (C1-C20) alkyl group Chemical group 0.000 description 2
- NALFRYPTRXKZPN-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)-3,3,5-trimethylcyclohexane Chemical compound CC1CC(C)(C)CC(OOC(C)(C)C)(OOC(C)(C)C)C1 NALFRYPTRXKZPN-UHFFFAOYSA-N 0.000 description 2
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 2
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 2
- DMWVYCCGCQPJEA-UHFFFAOYSA-N 2,5-bis(tert-butylperoxy)-2,5-dimethylhexane Chemical compound CC(C)(C)OOC(C)(C)CCC(C)(C)OOC(C)(C)C DMWVYCCGCQPJEA-UHFFFAOYSA-N 0.000 description 2
- XMNIXWIUMCBBBL-UHFFFAOYSA-N 2-(2-phenylpropan-2-ylperoxy)propan-2-ylbenzene Chemical compound C=1C=CC=CC=1C(C)(C)OOC(C)(C)C1=CC=CC=C1 XMNIXWIUMCBBBL-UHFFFAOYSA-N 0.000 description 2
- BIISIZOQPWZPPS-UHFFFAOYSA-N 2-tert-butylperoxypropan-2-ylbenzene Chemical compound CC(C)(C)OOC(C)(C)C1=CC=CC=C1 BIISIZOQPWZPPS-UHFFFAOYSA-N 0.000 description 2
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 239000004342 Benzoyl peroxide Substances 0.000 description 2
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 2
- RGSFGYAAUTVSQA-UHFFFAOYSA-N Cyclopentane Chemical compound C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- KVOZXXSUSRZIKD-UHFFFAOYSA-N Prop-2-enylcyclohexane Chemical compound C=CCC1CCCCC1 KVOZXXSUSRZIKD-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001260 acyclic compounds Chemical class 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 235000019400 benzoyl peroxide Nutrition 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 2
- 150000001923 cyclic compounds Chemical class 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical compound CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000002952 polymeric resin Substances 0.000 description 2
- 239000002685 polymerization catalyst Substances 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 238000010248 power generation Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- GJBRNHKUVLOCEB-UHFFFAOYSA-N tert-butyl benzenecarboperoxoate Chemical compound CC(C)(C)OOC(=O)C1=CC=CC=C1 GJBRNHKUVLOCEB-UHFFFAOYSA-N 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- LFRDHGNFBLIJIY-UHFFFAOYSA-N trimethoxy(prop-2-enyl)silane Chemical compound CO[Si](OC)(OC)CC=C LFRDHGNFBLIJIY-UHFFFAOYSA-N 0.000 description 2
- MYOQALXKVOJACM-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy pentaneperoxoate Chemical compound CCCCC(=O)OOOC(C)(C)C MYOQALXKVOJACM-UHFFFAOYSA-N 0.000 description 1
- 125000000008 (C1-C10) alkyl group Chemical group 0.000 description 1
- 125000006681 (C2-C10) alkylene group Chemical group 0.000 description 1
- 125000006736 (C6-C20) aryl group Chemical group 0.000 description 1
- LGJCFVYMIJLQJO-UHFFFAOYSA-N 1-dodecylperoxydodecane Chemical compound CCCCCCCCCCCCOOCCCCCCCCCCCC LGJCFVYMIJLQJO-UHFFFAOYSA-N 0.000 description 1
- FCHGUOSEXNGSMK-UHFFFAOYSA-N 1-tert-butylperoxy-2,3-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=CC(OOC(C)(C)C)=C1C(C)C FCHGUOSEXNGSMK-UHFFFAOYSA-N 0.000 description 1
- NOSXUFXBUISMPR-UHFFFAOYSA-N 1-tert-butylperoxyhexane Chemical compound CCCCCCOOC(C)(C)C NOSXUFXBUISMPR-UHFFFAOYSA-N 0.000 description 1
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 1
- FIYMNUNPPYABMU-UHFFFAOYSA-N 2-benzyl-5-chloro-1h-indole Chemical compound C=1C2=CC(Cl)=CC=C2NC=1CC1=CC=CC=C1 FIYMNUNPPYABMU-UHFFFAOYSA-N 0.000 description 1
- JJRDRFZYKKFYMO-UHFFFAOYSA-N 2-methyl-2-(2-methylbutan-2-ylperoxy)butane Chemical compound CCC(C)(C)OOC(C)(C)CC JJRDRFZYKKFYMO-UHFFFAOYSA-N 0.000 description 1
- NFPBWZOKGZKYRE-UHFFFAOYSA-N 2-propan-2-ylperoxypropane Chemical compound CC(C)OOC(C)C NFPBWZOKGZKYRE-UHFFFAOYSA-N 0.000 description 1
- VFTWMPNBHNNMAV-UHFFFAOYSA-N 2-tert-butylperoxy-1,4-di(propan-2-yl)benzene Chemical compound CC(C)C1=CC=C(C(C)C)C(OOC(C)(C)C)=C1 VFTWMPNBHNNMAV-UHFFFAOYSA-N 0.000 description 1
- 238000005133 29Si NMR spectroscopy Methods 0.000 description 1
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 1
- OXYZDRAJMHGSMW-UHFFFAOYSA-N 3-chloropropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCCl OXYZDRAJMHGSMW-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- MARUHZGHZWCEQU-UHFFFAOYSA-N 5-phenyl-2h-tetrazole Chemical compound C1=CC=CC=C1C1=NNN=N1 MARUHZGHZWCEQU-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N Acrylic acid Chemical group OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-OUBTZVSYSA-N Carbon-13 Chemical compound [13C] OKTJSMMVPCPJKN-OUBTZVSYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002841 Lewis acid Substances 0.000 description 1
- 238000005481 NMR spectroscopy Methods 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- IOVCWXUNBOPUCH-UHFFFAOYSA-M Nitrite anion Chemical compound [O-]N=O IOVCWXUNBOPUCH-UHFFFAOYSA-M 0.000 description 1
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- WGLPBDUCMAPZCE-UHFFFAOYSA-N Trioxochromium Chemical compound O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 1
- 238000000333 X-ray scattering Methods 0.000 description 1
- XSHJLFOMGJTADT-UHFFFAOYSA-N [4-methyl-2-(4-methyl-2-phenylpentan-2-yl)peroxypentan-2-yl]benzene Chemical compound C=1C=CC=CC=1C(C)(CC(C)C)OOC(C)(CC(C)C)C1=CC=CC=C1 XSHJLFOMGJTADT-UHFFFAOYSA-N 0.000 description 1
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002671 adjuvant Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 125000003545 alkoxy group Chemical group 0.000 description 1
- 230000001668 ameliorated effect Effects 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000000149 argon plasma sintering Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000000751 azo group Chemical group [*]N=N[*] 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000000071 blow moulding Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- 239000000378 calcium silicate Substances 0.000 description 1
- 229910052918 calcium silicate Inorganic materials 0.000 description 1
- OYACROKNLOSFPA-UHFFFAOYSA-N calcium;dioxido(oxo)silane Chemical compound [Ca+2].[O-][Si]([O-])=O OYACROKNLOSFPA-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 235000019241 carbon black Nutrition 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- 150000001733 carboxylic acid esters Chemical class 0.000 description 1
- 229910000423 chromium oxide Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000012718 coordination polymerization Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 125000002993 cycloalkylene group Chemical group 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 238000007872 degassing Methods 0.000 description 1
- 239000007857 degradation product Substances 0.000 description 1
- 229920000359 diblock copolymer Polymers 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000001941 electron spectroscopy Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000006353 environmental stress Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- HEAMQYHBJQWOSS-UHFFFAOYSA-N ethene;oct-1-ene Chemical compound C=C.CCCCCCC=C HEAMQYHBJQWOSS-UHFFFAOYSA-N 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- LDLDYFCCDKENPD-UHFFFAOYSA-N ethenylcyclohexane Chemical compound C=CC1CCCCC1 LDLDYFCCDKENPD-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- DMEGYFMYUHOHGS-UHFFFAOYSA-N heptamethylene Natural products C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 150000002466 imines Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 150000007517 lewis acids Chemical class 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- HCWCAKKEBCNQJP-UHFFFAOYSA-N magnesium orthosilicate Chemical compound [Mg+2].[Mg+2].[O-][Si]([O-])([O-])[O-] HCWCAKKEBCNQJP-UHFFFAOYSA-N 0.000 description 1
- 239000000391 magnesium silicate Substances 0.000 description 1
- 229910052919 magnesium silicate Inorganic materials 0.000 description 1
- 235000019792 magnesium silicate Nutrition 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- WCYWZMWISLQXQU-UHFFFAOYSA-N methyl Chemical compound [CH3] WCYWZMWISLQXQU-UHFFFAOYSA-N 0.000 description 1
- 239000008267 milk Substances 0.000 description 1
- 210000004080 milk Anatomy 0.000 description 1
- 235000013336 milk Nutrition 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- GKTNLYAAZKKMTQ-UHFFFAOYSA-N n-[bis(dimethylamino)phosphinimyl]-n-methylmethanamine Chemical compound CN(C)P(=N)(N(C)C)N(C)C GKTNLYAAZKKMTQ-UHFFFAOYSA-N 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920006113 non-polar polymer Polymers 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000002667 nucleating agent Substances 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 125000002081 peroxide group Chemical group 0.000 description 1
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000012005 post-metallocene catalyst Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229920001384 propylene homopolymer Polymers 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229930195734 saturated hydrocarbon Natural products 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-OUBTZVSYSA-N silicon-29 atom Chemical compound [29Si] XUIMIQQOPSSXEZ-OUBTZVSYSA-N 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000001973 tert-pentyl group Chemical group [H]C([H])([H])C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- 229940070710 valerate Drugs 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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Abstract
Description
(a)ポリオレフィンポリマーと、
(b)有機過酸化物と、
(c)シランカップリング剤と、
(d)式(I)の単環式オルガノシラザンを含む助剤であって、
[R1,R2SiN(R3)2/2]n(I)、式中、下付き文字nが、3以上の整数であり、各R1が、独立して、(C2〜C4)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C4)アルキル、フェニル、またはR1である、助剤と、を含む。
(a)ポリオレフィンポリマーと、
(b)有機過酸化物と、
(c)シランカップリング剤と、
(d)式(I)の単環式オルガノシラザンを含む助剤であって、
[R1,R2SiN(R3)2/2]n(I)、式中、下付き文字nが、3以上の整数であり、各R1が、独立して、(C2〜C4)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C4)アルキル、フェニル、またはR1である、助剤と、の反応生成物を含む架橋ポリマー組成物を含む、封止材フィルムを対象とする。
元素周期表への任意の参照は、CRC Press,Inc.,1990−1991によって発行されたときのものである。この表での元素群への参照は、群に番号を付けるための新しい表記法によるものである。
本開示の組成物(「本組成物」)は、封止材フィルムを形成するための硬化性組成物であり、組成物は、(A)ポリオレフィンポリマーと、(B)有機過酸化物と、(C)シランカップリング剤と、(D)式(I)の単環式オルガノシラザンを含む助剤と、を含む。
(i)0.850g/cc、または0.855g/cc、または0.860g/cc、または0.865g/cc、または0.870g/cc、または0.875g/cc、または0.880g/cc〜0.885g/cc、または0.890g/cc、または0.900g/ccの密度、
(ii)1g/10分、または5g/10分、または10g/10分、または15g/10分、または18g/10分〜20g/10分、または25g/10分、または30g/10分、または35g/10分、または40g/10分、または45g/10分、または50g/10分、または75g/10分、または100g/10分のメルトインデックス、および/あるいは
(iii)40℃、または45℃、または50℃、または55℃から、60℃、または65℃、または70℃、または80℃、または90℃、または95℃、または100℃、または110℃、または120℃、または125℃の融点(Tm)。
ビス(1,1−ジメチルエチルペルオキシ)−3,3,5−トリメチルシクロヘキサン、過酸化ベンゾイル、過安息香酸tert−ブチル、過酸化ジ−tert−アミル(「DTAP」)、ビス(アルファ−t−ブチル−ペルオキシイソプロピル)ベンゼン(「BIPB」)、過酸化イソプロピルクミルt−ブチル、t−ブチルクミルペルオキシド、過酸化ジ−t−ブチル、2,5−ビス(tブチルペルオキシ)−2,5−ジメチルヘキサン、2,5−ビス(t−ブチルペルオキシ)−2,5−ジメチルヘキシン−3,1,1−ビス(tブチルペルオキシ)−3,3,5−トリメチルシクロヘキサン、イソプロピルクミルクミルペルオキシド、4,4−ジ(tertブチルペルオキシ)吉草酸ブチル、過酸化ジ(イソプロピルクミル)などが挙げられる。
((A)ポリオレフィンポリマーとのカップリングによる)架橋ポリオレフィン生成物中の式(I)の単環式オルガノシラザンの不飽和オルガノ基(例えば、R1)の炭素−炭素二重結合の不在、または低減したレベルは、炭素−13またはケイ素−29核磁気共鳴(13C−NMR分光法および/または29Si−NMR)分光法によって検出され得る。
特定の実施形態では、本開示は、(A)ポリオレフィンポリマーと、(B)有機過酸化物と、(C)シランカップリング剤と、(D)式(I)の単環式オルガノシラザンを含む助剤と、を含む、硬化性組成物を含む封止材フィルムに関する。いくつかの実施形態では、硬化性組成物は、封止材フィルムの全体を形成する。
本開示の封止材フィルムは、電子デバイスモジュールを構築するために使用される。封止材フィルムは、電子デバイスの1つ以上の「スキン」として使用され、すなわち、電子デバイスの片面または両面に、例えば、前面封止材フィルムもしくは裏面封止材フィルムとして、または前面封止材フィルムおよび裏面封止材フィルムの両方として適用され、例えば、電子デバイスがその材料内に完全に封入される。
密度は、ASTM D792に従って測定する。結果は、1立方センチメートル当たりのグラム(g)(g/ccまたはg/cm3)単位で報告される。
ρ=(V×A)/(I×t)
式中、ρは、体積抵抗率(オーム−cm)であり、Vは、印加電圧(ボルト)であり、Aは、電極接触面積(cm2)であり、Iは、リーク電流(アンプ)であり、tは、試料の平均厚さである。試料の平均厚さを得るために、各試料の厚さが試験前に測定され、試料の5つの点が測定されて、平均厚さが得られる。体積抵抗率試験は、室温(RT)および60℃で1000ボルトで行う。2つの圧縮成形封止材フィルムを試験して、平均を得る。
以下の材料を、本開示の例を調製するために使用する。
浸漬:組成物を、以下の表1の配合に従って、まず有機過酸化物、シランカップリング剤、および助剤を表1に記載の所望の重量パーセントで密封可能なボトルにおいて予め混合することにより調製する。各組成物についての有機過酸化物、シランカップリング剤、および助剤の総重量をX1として記録する。例(表1参照)に応じて、POEの乾燥ペレットを計量し(各組成物についての乾燥ペレットの重量をX2として記録する)、次いで浸漬のためにボトルに入れる。硬化パッケージ(すなわち、有機過酸化物、シランカップリング剤、および助剤)のペレットへの均一な分布および完全な浸漬を確保するために、ボトルを1分間回転させ、次いで室温(RT)または40℃で特定の時間(表2および3参照)にわたってローラー上に配置する。特定の時間(表2および3参照)後、ペレットをボトルから取り出し、紙を使用して、使用した紙に湿り気が見られなくなるまで、ペレットの表面を十分に拭き取る。次いで、拭き取ったペレットを計量し、X3として記録する。次いで、浸漬パーセンテージを、上で議論された以下の式:(X3−X2)/X1*100%によって決定する。
Claims (17)
- 封止材フィルムを形成するための硬化性組成物であって、
(a)ポリオレフィンポリマーと、
(b)有機過酸化物と、
(c)シランカップリング剤と、
(d)式(I)の単環式オルガノシラザンを含む助剤であって、
[R1,R2SiN(R3)2/2]n(I)、式中、下付き文字nが、3以上の整数であり、各R1が、独立して、(C2〜C4)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C4)アルキル、フェニル、またはR1である、助剤と、を含む、硬化性組成物。 - (a)80重量%〜99.88重量%の前記ポリオレフィンポリマーと、
(b)0.1重量%〜5重量%の前記有機過酸化物と、
(c)0.01重量%〜2重量%の前記シランカップリング剤と、
(d)式(I)の前記単環式オルガノシラザンを含む0.01重量%〜5重量%の前記助剤と、を含む、請求項1に記載の組成物。 - 前記ポリオレフィンポリマーが、0.850g/cc〜0.890g/ccの密度(ASTM D792)および1.0g/10分〜50.0g/10分のメルトインデックス(ASTM D1238、190℃/2.16kg)を含む、エチレン/アルファオレフィンコポリマーである、請求項1または2に記載の組成物。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、3であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項1〜3のいずれか一項に記載の組成物。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、4であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項1〜3のいずれか一項に記載の組成物。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、5または6であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項1〜3のいずれか一項に記載の組成物。
- 式(I)の前記単環式オルガノシラザンが、2,4,6−トリメチル−2,4,6−トリビニルシクロトリシラザン、1,3,5,7−テトラビニル−1,3,5,7−テトラメチルシクロテトラシラザン、およびそれらの組み合わせからなる群から選択される、請求項1〜6のいずれか一項に記載の組成物。
- (a)ポリオレフィンポリマーと、
(b)有機過酸化物と、
(c)シランカップリング剤と、
(d)式(I)の単環式オルガノシラザンを含む助剤であって、
[R1,R2SiN(R3)2/2]n(I)、式中、下付き文字nが、3以上の整数であり、各R1が、独立して、(C2〜C4)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C4)アルキル、フェニル、またはR1である、助剤と、の反応生成物を含む架橋ポリマー組成物を含む、封止材フィルム。 - (a)80重量%〜99.88重量%の前記ポリオレフィンポリマーと、
(b)0.1重量%〜5重量%の前記有機過酸化物と、
(c)0.01重量%〜2重量%の前記シランカップリング剤と、
(d)式(I)の前記単環式オルガノシラザンを含む0.01重量%〜5重量%の前記助剤と、の反応生成物を含む架橋ポリマー組成物を含む、請求項8に記載の封止材フィルム。 - 前記ポリオレフィンポリマーが、0.850g/cc〜0.890g/ccの密度(ASTM D792)および1.0g/10分〜50.0g/10分のメルトインデックス(ASTM D1238、190℃/2.16kg)を含む、エチレン/アルファオレフィンコポリマーである、請求項8または9に記載の封止材フィルム。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、3であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項8〜10のいずれか一項に記載の封止材フィルム。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、4であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項8〜10のいずれか一項に記載の封止材フィルム。
- 式(I)の前記単環式オルガノシラザンが、(i)下付き文字nが、5または6であり、(ii)各R1が、独立して、(C2〜C3)アルケニルであり、各R2およびR3が、独立して、H、(C1〜C2)アルキル、または(C2〜C3)アルケニルであり、(iii)各R1が、ビニルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(iv)各R1が、ビニルであり、各R2およびR3が、メチルであり、(v)各R1が、アリルであり、各R2およびR3が、独立して、(C1〜C2)アルキルであり、(vi)各R1が、アリルであり、各R2およびR3が、メチルである、限定(i)〜(vi)のいずれか1つによりさらに説明される、請求項8〜10のいずれか一項に記載の封止材フィルム。
- 式(I)の前記単環式オルガノシラザンが、2,4,6−トリメチル−2,4,6−トリビニルシクロトリシラザン、1,3,5,7−テトラビニル−1,3,5,7−テトラメチルシクロテトラシラザン、およびそれらの組み合わせからなる群から選択される、請求項8〜13のいずれか一項に記載の封止材フィルム。
- 室温で1.0×1014オーム−cm以上の体積抵抗率をさらに含む、請求項8〜14のいずれか一項に記載の封止材フィルム。
- 60℃で1.0×1014オーム−cm以上の体積抵抗率をさらに含む、請求項8〜15のいずれか一項に記載の封止材フィルム。
- 電子デバイスモジュールであって、
電子デバイスと、
カバーシートと、
請求項8〜16のいずれか一項に記載の封止材フィルムと、を含む、電子デバイスモジュール。
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US20200347212A1 (en) | 2020-11-05 |
EP3704744B1 (en) | 2022-11-23 |
KR20200070328A (ko) | 2020-06-17 |
CN111263981B (zh) | 2024-06-25 |
WO2019084773A1 (en) | 2019-05-09 |
BR112020008060A2 (pt) | 2020-11-03 |
KR102427691B1 (ko) | 2022-08-01 |
US11193010B2 (en) | 2021-12-07 |
CN111263981A (zh) | 2020-06-09 |
JP7064585B2 (ja) | 2022-05-10 |
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