JP2021506054A - メモリ書き込み補助のための容量構造 - Google Patents
メモリ書き込み補助のための容量構造 Download PDFInfo
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 102100032471 Transmembrane protease serine 4 Human genes 0.000 description 2
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/12—Bit line control circuits, e.g. drivers, boosters, pull-up circuits, pull-down circuits, precharging circuits, equalising circuits, for bit lines
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/412—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger using field-effect transistors only
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/41—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming static cells with positive feedback, i.e. cells not needing refreshing or charge regeneration, e.g. bistable multivibrator or Schmitt trigger
- G11C11/413—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction
- G11C11/417—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing, timing or power reduction for memory cells of the field-effect type
- G11C11/419—Read-write [R-W] circuits
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C5/00—Details of stores covered by group G11C11/00
- G11C5/06—Arrangements for interconnecting storage elements electrically, e.g. by wiring
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/10—Input/output [I/O] data interface arrangements, e.g. I/O data control circuits, I/O data buffers
- G11C7/1078—Data input circuits, e.g. write amplifiers, data input buffers, data input registers, data input level conversion circuits
- G11C7/1096—Write circuits, e.g. I/O line write drivers
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C7/00—Arrangements for writing information into, or reading information out from, a digital store
- G11C7/18—Bit line organisation; Bit line lay-out
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/5222—Capacitive arrangements or effects of, or between wiring layers
- H01L23/5223—Capacitor integral with wiring layers
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- Static Random-Access Memory (AREA)
Abstract
Description
Claims (20)
- メモリセルのセットと、
第1金属層の第1容量線構造であって、前記メモリセルのセットに接続された第1容量線構造と、
第2金属層の第2容量線構造であって、前記メモリセルのセットに接続された第2容量線構造と、
前記メモリセルのセットと、前記第1容量線構造及び前記第2容量線構造のうち少なくとも一方と、に接続されたビット線書き込みドライバであって、前記第1容量線構造及び前記第2容量線構造を前記メモリセルのセットのメモリセルに選択的に接続することによって、書き込み動作中に前記メモリセルのセットのうち少なくとも1つのメモリセルに書き込み補助電圧を印加するように構成されたビット線書き込みドライバと、を備える、
メモリデバイス。 - 前記ビット線書き込みドライバは、前記第2容量線構造を前記メモリセルに接続する前に、前記第1容量線構造を前記メモリセルに接続する、
請求項1のメモリデバイス。 - 前記第1金属層は、前記メモリデバイスにおいて前記第2金属層に隣接する金属層であり、前記第1金属層は、絶縁層によって前記第2金属層から分離されている、
請求項1のメモリデバイス。 - 前記第1容量線構造は、前記第1金属層において第1方向に実質的に線状であり、前記第2容量線構造は、前記第2金属層において第2方向に実質的に線状であり、前記第2方向は前記第1方向と実質的に直交する、
請求項1のメモリデバイス。 - 前記ビット線書き込みドライバは、前記書き込み動作中に、前記第1容量線構造及び前記第2容量線構造のうち1つ以上を、複数の物理ビット線のうち1つに容量結合するように構成されている、
請求項1のメモリデバイス。 - 前記第1容量線構造を前記第2容量線構造に電気的に接続するビアであって、前記書き込み補助電圧を印加する場合に、前記書き込み動作中に前記第1容量線構造及び前記第2容量線構造を前記メモリセルのセットに容量結合するビアを備える、
請求項1のメモリデバイス。 - 前記第1金属層内の第1ビット線及び第1相補ビット線であって、前記第1容量線構造又は前記第2容量線構造は、前記第1ビット線及び前記第1相補ビット線のうち一方に隣接して平行に位置する、第1ビット線及び第1相補ビット線を備える、
請求項1のメモリデバイス。 - 前記第1金属層内の第2ビット線及び第2相補ビット線であって、前記第1容量線構造又は前記第2容量線構造は、前記第2ビット線及び前記第2相補ビット線のうち一方に隣接して平行に位置する、第2ビット線及び第2相補ビット線を備える、
請求項7のメモリデバイス。 - ビット値を記憶するための構造を含むビットセルと、
前記ビットセルに接続された第1ペアのビット線であって、第1金属層内の第1ペアのビット線と、
一対の書き込みデータ(WD)線と、
前記一対のWD線のうち一方に隣接する第1容量線と、
前記一対のWD線のうち他方に隣接する第2容量線と、を備える、
装置。 - 前記第1容量線は前記第1金属層内に位置し、前記一対のWD線のうち少なくとも一方は第2金属層内に位置する、
請求項9の装置。 - 前記第1金属層は、前記第2金属層に対して単一の絶縁層によって分離されている、
請求項10の装置。 - 前記第1容量線は、前記第2容量線と実質的に直交する、
請求項9の装置。 - 前記第1容量線は、前記第2容量線の金属層とは異なる金属層内に位置する、
請求項9の装置。 - 書き込みデータドライバであって、前記書き込みデータドライバに供給された信号の状態に応じて、前記第1ペアのビット線を駆動するために前記第1ペアのビット線に接続され、前記ビットセルへの書き込み補助動作のために前記第1容量線及び前記第2容量線を使用する、書き込みデータドライバを備える、
請求項9の装置。 - 並列に配置された複数のビットセル列であって、前記複数のビットセル列のうち第1列内に前記ビットセルが存在する、複数のビットセル列と、
列選択信号に応じて前記複数のビットセル列のうち1つを選択するように動作可能な列選択コンポーネントと、を備える、
請求項9の装置。 - 前記第1容量線は、第1デバイス層において第1方向に実質的に線状であり、前記第2容量は、第2デバイス層において第2方向に実質的に線状であり、前記第2方向は前記第1方向と実質的に直交する、
請求項9の装置。 - 前記第1容量線を前記第2容量線に電気的に接続する第1ビアと、
前記第1ペアのビット線と、前記一対のWD線と、第1容量線及び前記第2容量線のうち少なくとも一方と、に接続されたビット線書き込みドライバであって、負の書き込み補助動作中に前記第1ペアのビット線に負の電圧を印加する、ビット線書き込みドライバと、を備える、
請求項9の装置。 - 集積回路ダイのメモリセルを動作させる方法であって、
前記メモリセルに負の書き込み補助電圧を供給するために、第1方向に向く第1容量線及び第2方向に向く第2容量線を、前記メモリセルのビット線又は相補ビット線に同時に容量結合することを含む、
方法。 - 前記メモリセルに負の書き込み補助電圧を供給するために、負の書き込み補助信号を供給することと、
前記メモリセルに0又は1の値を書き込むことと、を含む、
請求項18の方法。 - 前記第1容量線及び前記第2容量線を前記ビット線又は前記相補ビット線に同時に容量結合する前に、前記メモリセルを書き込みドライバから切断することを含む、
請求項18の方法。
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US15/834,644 | 2017-12-07 | ||
US15/834,644 US10438636B2 (en) | 2017-12-07 | 2017-12-07 | Capacitive structure for memory write assist |
PCT/US2018/052841 WO2019112680A1 (en) | 2017-12-07 | 2018-09-26 | Capacitive structure for memory write assist |
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JP7307063B2 JP7307063B2 (ja) | 2023-07-11 |
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EP (1) | EP3721432A4 (ja) |
JP (1) | JP7307063B2 (ja) |
KR (1) | KR20200086370A (ja) |
CN (1) | CN111542881A (ja) |
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2017
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- 2018-09-26 EP EP18885061.4A patent/EP3721432A4/en active Pending
- 2018-09-26 CN CN201880083642.9A patent/CN111542881A/zh active Pending
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US20170092352A1 (en) * | 2014-03-25 | 2017-03-30 | Renesas Electronics Corporation | Semiconductor storage device |
US20150287460A1 (en) * | 2014-04-04 | 2015-10-08 | Yong-kyu Lee | Memory devices and methods of operating the same |
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WO2019118045A1 (en) * | 2017-12-12 | 2019-06-20 | Advanced Micro Devices, Inc. | Multi-voltage negative bitline write driver |
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US20190180798A1 (en) | 2019-06-13 |
EP3721432A4 (en) | 2021-08-04 |
KR20200086370A (ko) | 2020-07-16 |
WO2019112680A1 (en) | 2019-06-13 |
JP7307063B2 (ja) | 2023-07-11 |
US10438636B2 (en) | 2019-10-08 |
CN111542881A (zh) | 2020-08-14 |
EP3721432A1 (en) | 2020-10-14 |
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