JP2021196296A - Wiring allocation device and wiring allocation method - Google Patents

Abstract

To automatically allocate wiring formed in a wiring board into a plurality of fixtures.SOLUTION: In allocation processing of allocating all wiring to each fixtures TF1, TF2,... of an inspection device 3, which includes a flying prober 31 arranged on a board surface BF1 of a wiring board 4, and a bath inspection machine 35 that is arranged on the side of a board surface BF2, executes insulation inspection between all wiring of the wiring board 4 in mounting of the fixture TF1 and conduction inspection of conduction inspecting the previously allocated wiring, and executes conduction inspection of conduction inspecting the previously allocated wiring in mounting of the fixtures TF2, TF3,..., classification processing of classifying the wiring where there exists an inspection point of contacting the batch inspection machine 35 on the board surface BF2 into one wiring group, first wiring determination processing of determining wiring allocated to the fixture TF1, and second wiring determination processing of determining wiring allocated to the fixtures TF2, TF3,... are executed.SELECTED DRAWING: Figure 2

Description

The present invention relates to a wiring allocation device and a wiring allocation method for allocating all of a plurality of wirings formed on one wiring board to a plurality of inspection devices that share inspection.

A plurality of wirings formed on a wiring board are automatically inspected by an inspection device (wire inspection machine) as disclosed in Patent Document 1 below. This inspection device is configured to have a batch inspection machine and a flying probe having different wiring inspection means (inspection jig using a spring probe (inspection fixture; hereinafter, also simply referred to as a fixture)). Then, the inspection data produced by the inspection data production machine is used to perform an inspection on a plurality of wirings. In this case, in the batch inspection machine, a plurality of probes are arranged on the inspection jig according to the inspection points included in the wiring, and the plurality of probes can contact the corresponding inspection points all at once. As a result of being able to inspect multiple points (wiring inspection sites) by contact operation, the batch inspection machine has the advantage of high inspection speed. On the other hand, in the batch inspection machine, the pitch of inspection points has a lower limit (in this Patent Document 1, about 120 μm is the lower limit), so that the number of spring probes that can be arranged on the substrate surface of the wiring board is increased. There is an upper limit. In addition, in the batch inspection machine, from multiple probes placed on the inspection jig, when using the flying prober together, select one (the other is the one on the flying prober side), and do not use the flying prober together. Sometimes the two are selectively connected via a switch (scanner) to, for example, a measuring unit (a signal source of an inspection signal such as an electric current and a component including a measuring circuit for measuring this inspection signal) in an inspection device. Since the configuration is usually adopted, the upper limit may be specified depending on the number of switching circuits provided in the switch (scanner). Therefore, the batch inspection machine has a disadvantage that the number of inspection points used in the inspection is limited. On the other hand, in the flying probe, since the probe is driven with high accuracy in the XYZ direction, the flying probe has a narrow pitch that cannot be handled by the batch inspection machine (the lower limit of the pitch of the inspection points in the batch inspection machine). It has the advantage of being able to sufficiently cope with inspection points having a pitch of less than 1, for example, a pitch of less than 120 μm). On the other hand, in the flying prober, the probe is moved to the inspection point for inspection each time to make contact (that is, because one contact operation is required to inspect only one place). It has the disadvantage of slow inspection speed.

The above-mentioned inspection data making machine is based on Gerber data, which is CAD design data of wiring (wiring pattern) formed on a wiring board, and the above-mentioned advantages and disadvantages of a batch inspection machine and a flying prober, for each inspection site ( From the process of selecting and distributing the wiring inspection method (batch inspection machine or flying prober) suitable for each inspection site of wiring, and the time and cost data required for inspection for each inspection site, to the entire inspection of the wiring board. The process of determining the time and cost for each wiring inspection means is performed.

As a result, this inspection data production machine can almost automatically determine the wiring inspection means (batch inspection machine or flying prober) suitable for wiring (wiring pattern) from the Gerber data, and based on this, the inspection can be performed. Can be automatically distributed (allocated) to each wiring inspection means. Although not disclosed in Patent Document 1 below, a netlist (a list showing the connection relationship of each inspection point specified in the wiring) and a position list (specified in the wiring) for each wiring created from Gerber data. There is also a configuration in which the wiring inspection means suitable for each wiring is determined from the list showing the position information of each inspection point, and each wiring is automatically distributed (allocated) to the wiring inspection means suitable for inspection. It is possible.

Japanese Unexamined Patent Publication No. 2006-329851 (page 2-6)

By the way, the applicant of the present application is a flying prober which is arranged on one substrate surface side of the wiring board arranged at the inspection position and brings the probe into contact with the inspection point defined for each wiring formed on the one substrate surface. And a batch inspection machine that is arranged on the other substrate surface side of this wiring board and simultaneously contacts the probe to each of a plurality of inspection points defined for each wiring formed on the other substrate surface. We are developing an inspection data creation device that creates inspection data (inspection data for flying probers and inspection data for batch inspection machines) used in the inspection device based on the net list and location list for this wiring board.

In this case, the total number of inspection points included in the net list corresponding to each wiring formed on the other board surface of the wiring board is the number of spring probes of the inspection jig (fixture) mounted on the batch inspection machine. When the number is less than the upper limit, the inspection data creation device under development is suitable for inspecting all the wiring inspection parts of the wiring board by adopting the technique disclosed in Patent Document 1 above. It is possible to automatically distribute (allocate) to the wiring inspection means (either the flying probe or the batch inspection machine that constitutes one inspection device), and thereby the above-mentioned inspection for the flying probe. It is possible to create data and inspection data for batch inspection machines.

However, the total number of inspection points included in the netlist corresponding to each wiring formed on the other board surface of the wiring board is the upper limit of the number of spring probes of the inspection jig (fixture) mounted on the batch inspection machine. When it is exceeded, there are inspection points where the spring probe cannot be placed. Therefore, even if the technique disclosed in Patent Document 1 is adopted in the inspection data creating device under development, there is a problem to be improved that wiring that cannot be allocated to the fixture of the batch inspection machine remains. is doing.

The present invention has been made in view of the above problems, and has a configuration in which a batch inspection machine of an inspection device equipped with a flying prober and a batch inspection machine can be interchangeably mounted on a plurality of fixtures on one wiring board. The main purpose is to provide a wiring allocation device and a wiring allocation method capable of automatically allocating all of a plurality of formed wirings to each fixture.

The wiring allocation device according to claim 1 for achieving the above object has a probe that is arranged on one substrate surface side of the wiring substrate arranged at the inspection position and can contact an arbitrary position on the one substrate surface. A maximum of a flying probe and a probe that is arranged on the other substrate surface side of the wiring substrate so as to be movable in contact with the other substrate surface and can contact a predetermined position on the other substrate surface. It is equipped with a press jig type batch inspection machine that can replace multiple types of fixtures that can be arranged with G pieces, and when the first fixture of the multiple types of fixtures is mounted, the above Insulation inspection between all wirings formed on the wiring board and continuity inspection targeting the wiring pre-allocated from all the wirings for continuity inspection are performed, and the other thirst of the plurality of types of fixtures is performed. When the two fixtures are attached, the first fixture and the second fixture in the inspection device that executes the continuity inspection by targeting the wiring pre-allocated from all the wirings for the continuity inspection, A wiring allocation device including a processing unit that executes an allocation process for allocating all the wirings as a continuity inspection target, wherein the processing unit is the other substrate of the all wirings in the allocation process. The classification process for classifying the wiring having the inspection point for contacting the probe of the batch inspection machine on the surface into one wiring group, and the first wiring for determining the wiring to be allocated to the first fixture as the continuity inspection target. The determination process and the second wiring determination process for determining the wiring to be allocated to the second fixture as the continuity inspection target are executed, and in the first wiring determination process, the wiring classified into the wiring group is used. 1 from the total number and the number of the inspection points existing on the other board surface for each wiring classified into the wiring group among the wirings selected as continuity inspection target candidates from all the wirings. Under the condition that the total number of the subtracted numbers is less than G, the wiring of the continuity inspection target candidate is selected so that the number of the wiring of the continuity inspection target candidate is larger, and the selection is made. The wiring of the continuity inspection target candidate is determined as the wiring to be allocated to the first fixture as the continuity inspection target, and is not determined as the continuity inspection target among all the wirings in the second wiring determination process. Before the wiring selected as a candidate for continuity inspection from the wiring Under the condition that the total number of the inspection points existing on the other board surface of each wiring classified into the wiring group is less than G, the number of wirings of the continuity inspection target candidate is higher. The wiring of the candidate for continuity inspection is selected so as to be large, and the wiring of the selected candidate for continuity inspection is determined as the wiring to be allocated to the second fixture as the continuity inspection target.

Further, the wiring allocation method according to claim 2 is a flying probe having a probe arranged on one board surface side of the wiring board arranged at the inspection position and capable of contacting an arbitrary position on the one board surface. A maximum of G probes can be arranged on the other substrate surface side of the wiring substrate so as to be movable in contact with the other substrate surface and can contact a predetermined position on the other substrate surface. It is equipped with a press jig type batch inspection machine that allows multiple types of fixtures to be exchangeably mounted, and is formed on the wiring board when the first fixture of the plurality of types of fixtures is mounted. Insulation inspection between all the wirings made and continuity inspection targeting the wiring pre-allocated from all the wirings for continuity inspection are performed, and the other second fixture of the plurality of types of fixtures When mounted, all the wiring is attached to the first fixture and the second fixture in the inspection device that executes the continuity inspection targeting the wiring pre-allocated from all the wiring. Is a wiring allocation method that executes an allocation process for allocating A classification process for classifying existing wiring into one wiring group, a first wiring determination process for determining the wiring to be allocated to the first fixture as the continuity inspection target, and a continuity inspection target for the second fixture. In addition to executing the second wiring determination process for determining the wiring to be allocated, in the first wiring determination process, the wiring is selected as a continuity inspection target candidate from the total number of the wirings classified into the wiring group and all the wirings. The total number of the wirings classified into the wiring group among the wirings is less than G, which is the total number obtained by subtracting 1 from each number of the inspection points existing on the other board surface. Under the above conditions, the wiring of the continuity inspection target candidate is selected so that the number of wirings of the continuity inspection target candidate is larger, and the wiring of the selected continuity inspection target candidate is set as the continuity inspection target. It is determined as the wiring to be allocated to one fixture, and in the second wiring determination process, among the wirings not determined as the continuity inspection target among all the wirings, among the wirings selected as continuity inspection target candidates. The other of the above for each wiring classified into the wiring group of Under the condition that the total number of each of the inspection points existing on the substrate surface is less than G, the wiring of the continuity inspection target candidate is selected so that the number of the wiring of the continuity inspection target candidate is larger. Then, the selected wiring of the continuity inspection target candidate is determined as the wiring to be allocated to the second fixture as the continuity inspection target.

In the wiring allocation device according to claim 1 and the wiring allocation method according to claim 2, the wiring to be allocated to the first fixture is determined by executing the above-mentioned first wiring determination process, and at this point, the first fixture is used. When the unallocated wiring remains, the second wiring determination process for determining the wiring to be allocated to the second fixture is executed. Therefore, according to this wiring allocation device and this wiring allocation method, the flying probe and the first fixture and the second fixture are interchangeably mounted on all of the plurality of wirings formed on one wiring board. It can be automatically assigned to the first fixture and the second fixture of the inspection device equipped with the batch inspection machine.

It is each block diagram of the wiring allocation device 1 and the inspection data creation device 2. It is each block diagram of _{each fixture TF 1} , TF ₂ , TF ₃ , ... that can be attached to the inspection apparatus 3 and the collective inspection machine 35 of the inspection apparatus 3. It is a flowchart mainly explaining the allocation process for the _{fixture TF 1} in the flowchart for explaining the allocation process 50 (the flowchart for explaining the wiring allocation method). It is a flowchart which mainly explains the allocation process for _{fixtures TF 2} , TF ₃ , ... Of the flowchart for explaining the allocation process 50. It is sectional drawing of the wiring board 4 which shows each structure of the wiring Wa of the 1st aspect, the wiring Wb of the 2nd aspect, and the wiring Wc of the 3rd aspect which are formed on the wiring board 4. It is explanatory drawing for demonstrating each configuration of the _{specific example (wiring W 1} to wiring W ₁₅ ) of the wiring W formed on the wiring board 4.

Hereinafter, embodiments of the wiring allocation device and the wiring allocation method will be described with reference to the accompanying drawings.

First, the outline of the function of the wiring allocation device 1 shown in FIG. 1 will be described.

First, a wiring board 4 in which the formed wiring is allocated to a plurality of fixture TFs that can be mounted on the collective inspection machine 35 of the inspection device 3 described later by the wiring allocation device 1 will be described with reference to FIGS. 2 and 5. do. The wiring board 4 has a plurality of wirings (not shown in FIG. 2) on both one of the substrate surface BF1 (also simply referred to as “board surface BF1”) and the other substrate surface BF2 (also simply referred to as “board surface BF2”). ) Is formed. As shown in FIG. 5, the wiring is formed only on the substrate surface BF1 like the wiring Wa, and the inspection point P exists only on the substrate surface BF1 (hereinafter, for the sake of distinction, the first aspect). Wiring) and wiring that is formed only on the board surface BF2 like wiring Wb and has an inspection point P only on the board surface BF2 (hereinafter, also referred to as wiring of the second aspect for distinction). Like the wiring Wc, the portion formed on the substrate surface BF1 and the portion formed on the substrate surface BF2 are connected via a through hole or a via hole penetrating the wiring substrate 4, and the substrate surface BF1 and the substrate surface BF2 are connected. There is a wiring in which the inspection point P exists in both of the above (hereinafter, also referred to as a wiring of the third aspect for the sake of distinction).

For each wiring of the wiring board 4, the insulation inspection and the continuity inspection are automatically performed by the inspection device 3 having the configuration shown in FIG. As will be described later, the inspection device 3 is attached to the wiring formed on the substrate surface BF1 of the wiring board 4 arranged at the inspection position (the position where the wiring board 4 shown by the solid line or the broken line in FIG. 2 is arranged). A predetermined inspection point among the inspection points specified in the wiring formed on the substrate surface BF2 of the wiring board 4 and the flying probe 31 having the probes 32 and 33 capable of contacting any specified inspection point. A batch inspection in which one fixture TF that can arrange up to G probes 37 that can be contacted all at once (corresponding inspection points) is attached (multiple types of fixture TFs are interchangeably (selectively) attached). It is configured to include a machine 35.

In this case, a plurality of inspection points as described above are predetermined for each wiring of the wiring board 4. This inspection point is usually defined on a pad and a land included in each wiring formed on the wiring board 4. Then, in the insulation inspection for inspecting the insulation between one wiring and the other wiring, the inspection device 3 contacts one of the inspection points among the plurality of inspection points specified in one wiring. One probe (probe 32, 33, 37) and one probe (probe 32, 33, 37) and a known inspection method (eg, the current value of the current flowing when a voltage of a specified voltage value is applied between one wire and another wire). This insulation is inspected by a method (inspection method based on the resistance value of the insulation resistance calculated from the voltage value and the current value). Further, in the continuity inspection for inspecting whether one wiring is satisfactorily conducted throughout, the inspection device 3 is all probes (probes) that are in contact with a plurality of inspection points defined in this one wiring. An attempt is made to use one of 32, 33, or 37) to supply an inspection current between a pair of adjacent inspection points among a plurality of inspection points specified in this one wiring, using a known inspection method (eg, this one wiring). When this is done, is the inspection method based on whether or not this inspection current flows performed between all the pair of adjacent inspection points), and is one wiring satisfactorily conducted throughout? It is inspected (specified) whether or not, and when there is no continuity (that is, the wire is broken), which inspection point is broken.

Therefore, as described in the background technology, the total number of inspection points defined for each wiring formed on the substrate surface BF2 of the wiring board 4 is the fixture TF of the batch inspection machine 35 (specifically, the base plate 36 thereof). ) Exceeds the maximum number of probes 37 that can be arranged (G, in other words, the upper limit, hereinafter also referred to as the maximum number G), the probe 37 is placed in the inspection points existing on the substrate surface BF2. There will be inspection points that cannot be placed. On the other hand, with respect to the inspection points specified for each wiring formed on the substrate surface BF1 of the wiring board 4, the probes 32 and 33 of the flying probe 31 move to any position on the substrate surface BF1 with high accuracy and come into contact with each other. Since it is possible, there will be no inspection points where the probes 32 and 33 cannot be contacted. From the above, the wiring allocation device 1 performs a batch inspection of one inspection device 3 while considering the condition that the insulation inspection between each wiring of the wiring board 4 must be performed by one inspection device 3. A function of allocating wirings to be inspected for continuity to a plurality of fixtures TF so that the total number of inspection points of each wiring to be inspected for continuity (each wiring formed on the substrate surface BF2) in the machine 35 does not exceed the above maximum number G. It is equipped with.

Next, the configuration of the wiring allocation device 1 will be described. As shown in FIG. 1, the wiring allocation device 1 includes at least a processing unit 11 configured by, for example, a computer. In this case, the processing unit 11 executes the allocation processing 50 (see FIGS. 3 and 4) described later. In this allocation process 50, the processing unit 11 includes a netlist Ln showing information on a net of pads and lands (parts defined as inspection points) included in each wiring formed on the wiring board 4, and a netlist Ln of the pads and lands. The position list Lp showing the information of the position on the wiring board 4 (that is, the position of the inspection point) is input. Further, the processing unit 11 inputs when it is necessary to allocate the continuity inspection of each wiring formed on the wiring board 4 to a plurality of fixture TFs (fixture TF ₁ , TF ₂ , TF _{3, ...).} Individual inspection data for _{each fixture TF 1} , TF ₂ , TF ₃ , ... Based on the netlist Ln and the position list Lp, _{Dex 1} , Dex ₂ , Dex ₃ , ... , "Dex") and individual netlist Ln for creating individual location list Lp (fixture TF ₁ , TF ₂ , TF ₃ , ...) Netlist Ln ₁ , location list Lp ₁ , Netlist Ln ₂ , Position list Lp ₂ , Netlist Ln ₃ , Position list Lp ₃ , ...) Is created and output.

Subsequently, the configuration of the inspection data creating device 2 will be described. As shown in FIG. 1, the inspection data creating device 2 includes at least a processing unit 21 configured by, for example, a computer. In this case, the processing unit 21 has individual netlists Ln ₁ , Ln ₂ , Ln ₃ , ... (For _{each fixture TF 1} , TF ₂ , TF _{3, ... Created by the wiring allocation device 1.} Hereinafter, when not distinguished, it is also referred to as "Ln") and individual position lists Lp ₁ , Lp ₂ , Lp ₃ , ... (Hereinafter referred to as "Lp" when not distinguished), and these are individually entered. based on the net list Ln and discrete locations list Lp, each fixture _{TF 1, TF 2, TF 3} , to inspect the wiring allocated to ..., fixture _{TF 1, TF 2, TF 3} , _{The inspection data Dex 1} , Dex ₂ , Dex ₃ , ... Used in the inspection device 3 in a state where any one of the ... is selectively mounted on the batch inspection machine 35 is created and output.

In this example, as an example, as will be described later, the inspection device 3 (the inspection device 3 that first inspects the wiring board 4) to which the first _{fixture TF 1 of the plurality of fixture TFs is mounted is a wiring board.} An insulation inspection is performed between all the wirings formed in No. 4, and a continuity inspection is performed on the wirings assigned to the own device. Further, the inspection device 3 to which one of the second and subsequent fixtures TF ₂ , TF ₃ , ... Of the plurality of fixture TFs is attached is among the wirings not allocated to the _{fixture TF 1.} Performs a continuity check on the wiring assigned to the own device (mounted fixture TF). Therefore, the inspection data creating device 2 is _{used as the inspection data Dex 1} used in the inspection device 3 to which the _{fixture TF 1} is mounted, and is used as an insulation inspection for all wirings (inspection of insulation between all wirings). ), And the inspection data Dex for executing the continuity inspection for the wiring assigned to the _{fixture TF 1 is created.} Further, the inspection data generating apparatus 2, the second and subsequent fixture _TF 2, _TF 3, test one of the ... are used in the inspection apparatus 3 attached data _Dex 2, _Dex 3, ... As an example, the inspection data Dex for executing the continuity inspection for the wiring allocated to the mounted fixture TF is created.

Next, the configuration of the inspection device 3 will be described.

As shown in FIG. 2, the inspection device 3 has a flying probe 31 (having the same function as the flying probe described in the background technology) and a batch inspection machine 35 (function equivalent to the batch inspection machine described in the background technology). The wiring board 4 is provided with an input unit (not shown), a measurement unit (not shown), a processing unit (not shown), and an output unit (display unit (as an example)) (not shown). Perform inspections (insulation inspection and continuity inspection) for each formed wiring.

Specifically, the flying probe 31 includes one or two or more probes (in this example, two flying probes 32, 33 as an example) arranged on the substrate surface BF1 side of the wiring board 4 arranged at the inspection position. , A moving mechanism (not shown below) that moves each flying probe 32, 33 (hereinafter, also simply referred to as a probe 32, 33) in the XYZ direction on the substrate surface BF1 side with high accuracy (hereinafter, also referred to as a prober 31 side moving mechanism). It is configured with and. Further, in the flying probe 31, each probe 32, 33 is configured to be able to contact all inspection points existing on the substrate surface BF1 (all pads and lands included in each wiring formed on the substrate surface BF1). There is.

Further, the batch inspection machine 35 is a press jig type batch inspection machine, and is a base plate 36 arranged on the substrate surface BF2 side of the wiring board 4 arranged at the inspection position so as to face the substrate surface BF2. A plurality of probes 37 (for example, a spring probe with a built-in spring) erected on the surface of the base plate 36 facing the substrate surface BF2 and the base plate 36 are linearly contacted and separated from the substrate surface BF2 (for example, a spring probe with a built-in spring). It is configured to include a moving mechanism (hereinafter, also referred to as a moving mechanism on the batch inspection machine 35 side) which is not shown (hereinafter, also referred to as a moving mechanism on the batch inspection machine 35 side). Further, in the base plate 36, the probes 37 are spaced apart from each other by a minimum arrangement interval or more so that they do not come into contact with each other, and each of the pads and lands included in each wiring W formed on the substrate surface BF2. It is erected at a position where it can contact one corresponding one (corresponding one inspection point among a plurality of inspection points included in each wiring W). As described above, since the probe 37 has an upper limit on the number of erected probes 37, the maximum number of erected probes 37 (maximum number of arrangements, for example, about several hundred to several thousand) is described above. It is limited to G pieces. In this example, the number of probes 37 is limited to G by the number of switch circuits inside the scanner, which will be described later.

Further, in the batch inspection machine 35, the base plate 36 and the plurality of probes 37 erected on the base plate 36 together form one fixture (inspection fixture) TF. Further, in the batch inspection machine 35, the fixture TF is detachably attached to the moving mechanism on the batch inspection machine 35 side. The fixture TF mounted on the batch inspection machine 35 is automatically connected to the measuring unit. Further, this fixture TF is produced for the number (type) of the fixture TF to which the wiring is allocated by the wiring allocation device 1 for the continuity inspection. Therefore, the number of the fixture TFs (the number of the fixtures TFs that share the inspection of the wiring) is increased or decreased according to the number of inspection points existing on the substrate surface BF2 of the wiring board 4.

Further, the input unit is composed of various interface circuits such as a communication interface circuit and a medium interface circuit, and is via a transmission line connected to the inspection data creation device 2 or via a storage medium mounted on the input unit. The inspection data Dex is input and output to the processing unit.

Although not shown, the measuring unit includes, for example, a scanner, a measurement signal source (for example, a constant voltage source and a constant current source), and a measuring instrument (for example, an ammeter). In this case, the scanner is connected to probes 32, 33 and all probes 37, as well as to measurement signal sources and instruments. Further, in the scanner, the connection state of a plurality of switch circuits existing inside is switched by the processing unit, so that the measurement signal source and the measurement can be performed between the probes 32 and 33 and any two probes among all the probes 37. Connect the devices in series. As a result, when the two probes are in contact with the inspection point (pad or land) included in the wiring W, the wiring W in contact with one of the two probes, the wiring W, the one of the probes, Wiring W that is in contact with the other probe via the series circuit of the measurement signal source and the measuring instrument, and the other probe of the two probes (at the time of continuity inspection, one probe is in contact). A current path is formed to the same wiring W as the wiring W, and at the time of insulation inspection, a wiring W) different from the wiring W with which one probe is in contact is formed.

Further, the measurement signal source is controlled by the processing unit, and the measurement signal (constant voltage signal from the constant voltage source (known voltage value) or constant current from the constant current source) selected by the processing unit in the above current path. Signal (known current value)) is supplied. Further, the measuring instrument measures the current value of the current flowing in the above current path and outputs it to the processing unit.

Further, the processing unit is composed of a computer (not shown), and uses the inspection data Dex to control the moving mechanism on the prober 31 side, the moving mechanism on the batch inspection machine 35 side, and the scanner and the measurement signal source of the measuring unit. The process is executed to bring the probes 32 and 33 into contact with the wiring W to be inspected, or the probe 37 in contact with the wiring W to be inspected is selected to be inspected. A measurement signal is supplied between the two probes in contact with the wiring W. Further, the processing unit checks the continuity of the wiring W with which the two probes are in contact, or two probes are in contact with each other, based on the current value measured by the measuring instrument in the supply state of the measurement signal. An insulation inspection is executed for the wiring W, and an inspection process for storing the inspection result and an output process for displaying the stored inspection result on the display unit are executed.

Next, each operation of the wiring allocation device 1, the inspection data creation device 2, and the inspection device 3 will be described. Further, a specific example will be described by taking as an example a wiring board 4 on which the wiring W having the configuration shown in FIG. 6 is formed. For ease of understanding, it is assumed that 15 wiring Ws, which are significantly smaller than the original number, are formed on the wiring board 4, and each wiring W has a serial number (1, 2, 3, ...・, 14,15) shall be attached. Accordingly, in the following, when distinguishing each wiring W, the corresponding serial number is added, for example, as a subscript, and is expressed as W ₁ , W ₂ , ..., W ₁₄ , W _15. do.

As for the wiring W shown in FIG. 6, for example as in the wiring W _1, wiring test points on both the substrate surface BF1 and the substrate surface BF2 is present, a third aspect of the wirings described above. Further, the wiring W in which the inspection point exists only on the substrate surface BF1, such as the wiring W _{2, is the wiring of the first aspect described above.} Further, the wiring W in which the inspection point exists only on the substrate surface BF2, such as the wiring W _{3, is the wiring of the second aspect described above.}

First, the operation of the wiring allocation device 1 (the wiring allocation method executed by the wiring allocation device 1) will be described with reference to FIGS. 1, 3, 4, and 6. It is assumed that the maximum number G of the probes 37 in each fixture TF of the batch inspection machine 35 of the inspection device 3 is 4000 (pieces) as an example.

In the wiring allocation device 1, when the processing unit 11 inputs the netlist Ln and the position list Lp for the wiring board 4, the processing unit 11 executes the allocation process 50 based on the netlist Ln and the position list Lp.

In the allocation process 50, the processing unit 11 first executes the classification process (step 51). In this classification process, the processing unit 11 determines all the wirings formed on the wiring board 4 (all the wirings to be inspected for the insulation inspection and the continuity inspection) based on the input above-mentioned net list Ln and position list Lp. ) Is a first wiring group composed of only wiring (wiring of the first aspect such as wiring Wa shown in FIG. 5) in which an inspection point (inspection point for contacting probes 32 and 33) exists only on the substrate surface BF1. And only the wiring in which the inspection point (inspection point for contacting the probe 37) exists on the substrate surface BF2 (the wiring of the second aspect such as the wiring Wb shown in FIG. 5 and the wiring of the third aspect such as the wiring Wc). It is classified into a second wiring group as one constituent wiring group.

Thus, for each wire W shown in FIG. 6, the wiring _{W 2,} W _7, W _9, 4 pieces of wires W of the _{W 14} is classified into the first wiring group, other than the 11 wire _W 1, W _{3 to} W ₆ , W ₈ , W _{10 to} W ₁₃ , and W ₁₅ are classified into the second wiring group.

Next, the processing unit 11 acquires and stores the maximum number G of the probes 37 (4000 (in this example)). Further, the processing unit 11 acquires and stores the total number A of the wirings W classified in the second wiring group (step 52). As for each wiring W shown in FIG. 6, since the number of wirings W classified into the second wiring group is 11 as described above, the processing unit 11 stores it as A = 11.

Subsequently, the processing unit 11 substitutes the initial value "1" for the count value m for counting the serial number of the wiring W, and the initial value "1" is assigned to the count value j for counting the serial number of the fixture TF. , And substitute the initial value "1" for the first serial number k of the wiring W to be assigned to the fixture TF, and the total number A as the initial value of the total number of inspection points N of the wiring W _{to be assigned to the first fixture TF 1.} Is substituted (step 53). Here, the reason for substituting the total number A as the initial value of the total number of inspection points N is that all the wiring formed on the wiring board 4 in the inspection device 3 in which the _{first fixture TF 1 is mounted on the batch inspection machine 35.} For W, an insulation inspection with another wiring W is performed. For this purpose, considering the existence of the wiring W in which the inspection point (inspection point for contacting the probe 37) exists only on the substrate surface BF2, at least 1 is used for all the wiring Ws in which the inspection point exists on the substrate surface BF2. This is because it is necessary to erect the probe 37 on the _{fixture TF 1} so as to correspond to one inspection point (one inspection point in this example).

Next, since the count value j of the serial number of the fixture TF is the initial value "1" as described above, the processing unit 11 allocates the wiring W to the _{first fixture TF 1 (first wiring determination).} Processing) starts to be executed. In this allocation process, the processing unit 11 first determines whether or not the wiring W having the same serial number as the count value m (that is, the wiring W _m having the serial number m) is included in the second wiring group (step). 54). Here, the processing unit 11, when the wire W _m is determined to have been included in the second wiring group, when selected as to allocate the wiring W _m in fixture TF _1, this wire W _m The total number N of inspection points on the substrate surface BF2 side including the inspection points existing on the substrate surface BF2 is recalculated (step 55). Specifically, the processing unit 11, the wire W value obtained by subtracting 1 from the inspection points present on the substrate surface BF2 for _m (wire W to test points on the substrate surface BF2 is present as the wiring W _m Since one of these inspection points is already included in the total number A as described above, subtract that amount) is added to the initial total number of inspection points N to obtain a new total number of inspection points N. Perform the calculation.

Further, when the total number of inspection points N is recalculated in step 55, the processing unit 11 _{can arrange the new total number of inspection points N on the fixture TF 1} (specifically, the base plate 36 thereof) of the batch inspection machine 35. It is determined whether or not the maximum number G of the probe 37 is exceeded (step 56). As a result of this determination, when the value is not exceeded, the processing unit 11 increments (m = m + 1) the count value m in order to execute the above step 54 for the wiring W having the next serial number (step 57). At the same time, it is determined whether or not the new count value m after the increment exceeds the total number of wirings W formed on the wiring board 4 (step 58). As a result of this determination, when the number is not exceeded, the wiring W for executing the above step 54 exists. Therefore, the processing unit 11 shifts to the step 54 and has the same serial number as the new count value m. It is determined whether or not the wiring W (that is, the wiring W _m having the serial number m) is included in the second wiring group.

The processing unit 11 executes each process from step 54 to step 58 while incrementing the count value m, and when the wiring W _m is included in the second wiring group, the substrate of the _{wiring W m is included.} The new total number of inspection points N is recalculated by adding all the inspection points existing on the surface BF2 to the total number of inspection points N immediately before.

The processing unit 11 determines that the total number of new inspection points N exceeds the maximum number G for the probe 37 of the fixture TF in step 56 when each processing from step 54 to step 58 is being executed. When this is done, the wiring W (that is, the wiring W) of the serial number (m-1) having the count value (m-1) _{immediately before the wiring W (that is, the wiring W 1) having the serial number k (at this point, k = 1) is used.} Wiring W _m-1 ) is determined to be the wiring W (wiring W to be inspected for continuity) to be allocated to the _first fixture TF 1 (step 59). As a result, _{the inspection device 3 in the state where the first} fixture TF 1 is mounted on the batch inspection machine 35 inspects the continuity _{from the wiring W 1} to the wiring W _m-1 in addition to the insulation inspection for all the wiring W. Will be executed. In other words, in this first wiring determination process, the processing unit 11 selects the continuity inspection target candidate from the total number A of the wirings W classified in the second wiring group and all the wirings W formed on the wiring board 4. ₁ from the number of inspection points existing on the board surface BF2 for each wiring W classified into the second wiring group in the selected wiring W (wiring W from wiring W 1 to wiring W _m-1). The number of wiring W of the continuity inspection target candidate is larger under the condition that the total number (the total number of inspection points N when the initial value is the above total number A) is less than the maximum number G. The wiring W of the candidate for continuity inspection is selected so as to be, and the wiring W of the selected candidate for continuity inspection is assigned as the wiring W to be assigned to the _{first fixture TF 1 which is the first fixture as the continuity inspection target.} decide.

In this case, if the count value m exceeds the total number of wirings W formed on the wiring board 4, it is in a state before the processing unit 11 determines in step 58, so that it is allocated to the _{first fixture TF 1.} The wiring W that cannot be used remains.

On the other hand, in step 58 when each process from step 54 to step 58 is being executed, the processing unit 11 determines the total number of wirings W formed on the wiring board 4 by the new count value m after incrementing. When it is determined that the value is exceeded, the wiring W (that is, the wiring W) of the serial number (m-1) having the count value (m-1) _{immediately before the wiring W (that is, the wiring W 1) having the serial number k (= 1) is determined.} , Wiring W _m-1 ) is determined as the wiring W (wiring W to be inspected for continuity) to be allocated to the _first fixture TF 1 (step 60). As a result, _{the inspection device 3 in the state where the first} fixture TF 1 is mounted on the batch inspection machine 35 inspects the continuity _{from the wiring W 1} to the wiring W _m-1 in addition to the insulation inspection for all the wiring W. Will be executed.

In this case, it is the state before the processing unit 11 determines in step 56 that the total number N of new inspection points exceeds the maximum number G of the probes 37 that can be arranged on the base plate 36 of the _{first fixture TF 1.} Therefore, all of the wiring W formed on the wiring board 4 is in a state of being allocated to the _{first fixture TF 1.} Therefore, the allocation process (first wiring determination process) for allocating the wiring W to the _{first fixture TF 1 is completed, and the allocation process 50 is completed.}

When the wiring board 4 constituting the wire W is formed as shown in FIG. 6 and example, the processing unit 11, when the count value m is "1", the serial number m is the wiring W ₁ of "1" first _{It is determined whether or not the wiring W 1} is included in the second wiring group (step 54), and it is determined that the wiring W 1 is included in the second wiring group. As a result, in the processing unit 11, the total number A of the wiring boards 4 having the configuration shown in FIG. 6 is “11”, and this “11” is substituted as the initial value of the total number of inspection points N. the test point the total number N at the present time (= 11), the number obtained by adding the number "999" obtained by subtracting 1 from the number "1000" of the inspection points present on the substrate surface BF2 side of the wiring W ₁ " 1010 ”is recalculated as the total number of new inspection points N (step 55). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 56), and does not exceed the maximum number G. Therefore, in order to execute the above step 54 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 57). As a result, the new count value m becomes "2". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number of wirings W formed on the wiring board 4 (“15” in the wiring board 4 of FIG. 6) (). Step 58) Since the number has not exceeded, the process proceeds to step 54.

_{After that, the processing unit 11 determines whether or not the wiring W 2} having the serial number m of "2" is included in the second wiring group (step 54), and the wiring W ₂ is included in the second wiring group. It is determined that there is no such thing. As a result, the processing unit 11 shifts to step 57 without shifting to step 55 (that is, without recalculating the total number of new inspection points N), and increments the count value m (m = m + 1). )do. As a result, the new count value m becomes "3". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 58), and does not exceed the total number "15". , Step 54.

_{After that, the processing unit 11 determines whether or not the wiring W 3} having the serial number m of "3" is included in the second wiring group (step 54), and the wiring W ₃ is included in the second wiring group. To determine. Thus, the processing unit 11, the test point the total number N (= 1010) at the present time, the number "1299" obtained by subtracting 1 from the number "1300" of the inspection points present on the substrate surface BF2 side of the wiring _{W 3} The number "2309" obtained by adding is recalculated as the total number of new inspection points N (step 55). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 56), and does not exceed the maximum number G. Therefore, in order to execute the above step 54 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 57). As a result, the new count value m becomes "4". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 58), and does not exceed the total number "15". , Step 54.

_{After that, the processing unit 11 determines whether or not the wiring W 4} having the serial number m of "4" is included in the second wiring group (step 54), and the wiring W ₄ is included in the second wiring group. To determine. Thus, the processing unit 11, the test point the total number N (= 2309) at the present time, the number "999" obtained by subtracting 1 from the number "1000" of the inspection points present on the substrate surface BF2 side of the wiring _{W 4} The number "3308" obtained by adding is recalculated as the total number of new inspection points N (step 55). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 56), and does not exceed the maximum number G. Therefore, in order to execute the above step 54 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 57). As a result, the new count value m becomes "5". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 58), and does not exceed the total number "15". , Step 54.

_{After that, the processing unit 11 determines whether or not the wiring W 5} having the serial number m of "5" is included in the second wiring group (step 54), and the wiring W ₅ is included in the second wiring group. To determine. Thus, the processing unit 11, the test point the total number N (= 3308) at the present time, the number "1499" obtained by subtracting 1 from the number "1500" of the inspection points present on the substrate surface BF2 side of the wiring _{W 5} The number "4807" obtained by adding is recalculated as the total number of new inspection points N (step 55). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 56), and exceeds the maximum number G. Therefore, the process proceeds to step 59. Then, the processing unit 11, (since at this time k is the number "1", the wiring W ₁₎ wiring W serial number k from the previous count value (m-1) serial number of the (m-1 ) Wiring W (Since the count value m at this point is the number "5", wiring W _{4 with serial number 4 (= 5-1)) is allocated to the first} fixture TF 1 (that is, wiring). It is determined that the _{wiring W 1} to the wiring W ₄ is the wiring W for conducting the continuity inspection by the inspection device 3 in the state where the _first fixture TF 1 is mounted on the batch inspection machine 35), and the wiring allocation result is stored. .. As a result, the wiring W allocation process (first wiring determination process) for the first _{fixture TF 1 is completed.}

Next, the processing unit 11 proceeds to step 61 and starts executing the wiring W allocation processing (second wiring determination processing) for the _{second and subsequent fixtures TF 2, ... As the second fixture.} ..

In step 61, the processing unit 11 increments the serial number j of the fixture TF (j = j + 1), and the current count is added to the first serial number k of the wiring W allocated to _{the fixture TF j of the incremented serial number j.} The value m is substituted, and zero is substituted as the initial value of the total number of inspection points N of the wiring W to be allocated to _{this fixture TF j (step 61).} Since the insulation inspection is not performed on the second and subsequent fixtures TF, it is not necessary to substitute the total number A as the initial value of the total number of inspection points N as in the case of the _{first fixture TF 1 described above.} .. Therefore, zero is substituted as the initial value of the total number of inspection points N.

Next, the processing unit 11 determines whether or not the wiring W having the same serial number as the count value m (that is, the wiring W _m having the serial number m) is included in the second wiring group (step 62). Here, when the processing unit 11 determines that the wiring W _m is included in the second wiring group _{, the processing unit 11 selects this wiring W m} as the one to be allocated to the j-th fixture TF _j , and then this wiring. Recalculate the total number N of inspection points on the substrate surface BF2 side including the inspection points existing on the substrate surface BF2 for W _{m (step 63).} Specifically, the processing unit 11 executes a calculation to add all the number of inspection points existing on the board surface BF2 of the _{wiring W m to the initial total number of inspection points N to obtain a new total number of inspection points N.} ..

Further, when the total number of inspection points N is recalculated in step 63, the processing unit 11 determines whether or not the total number of new inspection points N exceeds the maximum number G for the probe 37 of the fixture TF (step 64). ). As a result of this determination, when the value is not exceeded, the processing unit 11 increments (m = m + 1) the count value m in order to execute the above step 62 for the wiring W having the next serial number (step 65). At the same time, it is determined whether or not the new count value m after incrementing exceeds the total number of wirings W formed on the wiring board 4 (step 66). As a result of this determination, when the value is not exceeded, the wiring W for executing the above step 62 exists. Therefore, the processing unit 11 shifts to the step 62 and has the same serial number as the new count value m. It is determined whether or not the wiring W (that is, the wiring W _m having the serial number m) is included in the second wiring group.

The processing unit 11 executes each process from step 62 to step 66 while incrementing the count value m, and when the wiring W _m is included in the second wiring group, the substrate of the _{wiring W m is included.} The new total number of inspection points N is recalculated by adding all the inspection points existing on the surface BF2 to the total number of inspection points N immediately before.

The processing unit 11 determines that the total number of new inspection points N exceeds the maximum number G for the probe 37 of the fixture TF in step 64 when each processing from step 62 to step 66 is being executed. When this is done, the wiring W from the wiring W of the serial number k to the wiring W of the serial number (m-1) of the previous count value (m-1) _{is allocated to the jth} fixture TF j (the continuity inspection target). Wiring W) is determined (step 67). As a result, the inspection device 3 in the state where the j-th fixture TF _j is mounted on the batch inspection machine 35 executes the continuity inspection _{from the wiring W k} to the wiring W _m-1. In other words, in this second wiring determination process, the wiring W selected as the continuity inspection target candidate from the wiring W not determined as the continuity inspection target among all the wiring W formed on the wiring board 4 ( The total number of inspection points existing on the board surface BF2 for each wiring W classified into the second wiring group (wiring W _{from wiring W k} to wiring W _{m-1) (initial value is zero).} Under the condition that the total number of inspection points N) is less than the maximum value G, the wiring W of the continuity inspection target candidate is selected and selected so that the number of the continuity inspection target candidate wiring W is larger. It was determined as the second fixture TF ₂ and subsequent lines W allocated to each fixture TF of the wire W of the continuity test candidate as the second fixture TF as continuity inspection target.

In this case, since the processing unit 11 is in the state before determining in step 66 that the count value m exceeds the total number of wirings W formed on the wiring board 4, the fixture TF up to the jth is used. The unallocated wiring W remains.

On the other hand, in step 66 when each process from step 62 to step 66 is being executed, the processing unit 11 determines the total number of wirings W formed on the wiring board 4 by the new count value m after incrementing. When it is determined that the wiring exceeds, the wiring W of the serial number k to the wiring W of the serial number (m-1) of the previous count value (m-1) (in this case, the wiring W _k to the last wiring W). Up to) is determined as the wiring W (wiring W subject to continuity inspection _{) to be assigned to the jth fixture TF j (step 68).} As a result, the inspection device 3 in the state where the j-th fixture TF _j is mounted on the batch inspection machine 35 executes the continuity inspection from _{the wiring W k to the last wiring W.} In this case, since the _{allocation process (second wiring determination process) for allocating the wiring W to the second and subsequent fixtures TF 2} , ... Is completed, the first of all the wiring W formed on the wiring board 4 Fixture TF ₁ to jth fixture TF _j is completed. As a result, the allocation process 50 is completed.

Taking the wiring board 4 on which the wiring W having the configuration shown in FIG. 6 is formed as a specific example, the processing unit 11 with respect to the _{first fixture TF 1 when the count value m is “5” as described above.} The wiring W allocation process (first wiring determination process) is completed. Therefore, in the wiring W allocation processing (second wiring determination processing) for the second and subsequent fixtures TF, the processing unit 11 first increments the serial number j of the fixture TF in step 61 to obtain the number “2”. The second fixture TF ₂ is targeted for allocating the wiring W, and the current count value m (= 5) is substituted for the first serial number k of the wiring W to be allocated to the _{fixture TF 2 (that is,).} , The serial number k is set to the smallest serial number m among the unallocated wirings W). Further, as described above, the processing unit 11 sets the initial value of the total number of inspection points N to zero.

_{Next, the processing unit 11 determines whether or not the wiring W 5} having the serial number m of "5" is included in the second wiring group (step 62), and the wiring W ₅ is included in the second wiring group. To determine. Thus, the processing unit 11, the test point the total number N (= 0) at the present time, the number "1500" obtained by adding the number "1500" of the inspection points present on the substrate surface BF2 side of the wiring W ₅ Is recalculated as the total number of new inspection points N (step 63). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 64), and does not exceed the maximum number G. Therefore, in order to execute the above step 62 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 65). As a result, the new count value m becomes "6". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 6} having the serial number m of "6" is included in the second wiring group (step 62), and the wiring W ₆ is included in the second wiring group. To determine. Thus, the processing unit 11, the test point the total number N (= 1500) at the present time, the number "1700" obtained by adding the number "200" of the inspection points present on the substrate surface BF2 side of the wiring _{W 6} Is recalculated as the total number of new inspection points N (step 63). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 64), and does not exceed the maximum number G. Therefore, in order to execute the above step 62 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 65). As a result, the new count value m becomes "7". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 7} having the serial number m of "7" is included in the second wiring group (step 62), and the wiring W ₇ is included in the second wiring group. It is determined that there is no such thing. As a result, the processing unit 11 shifts to step 65 without shifting to step 63 (that is, without recalculating the total number of new inspection points N), and increments the count value m (m = m + 1). )do. As a result, the new count value m becomes "8". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 8} having the serial number m of "8" is included in the second wiring group (step 62), and the wiring W ₈ is included in the second wiring group. To determine. As a result, the processing unit 11 adds the number of inspection points "1500" existing on the board surface BF2 side of the _{wiring W 8} to the total number of inspection points N (= 1700) at the present time, and obtains the number "3200". Is recalculated as the total number of new inspection points N (step 63). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 64), and does not exceed the maximum number G. Therefore, in order to execute the above step 62 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 65). As a result, the new count value m becomes "9". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 9} having the serial number m of "9" is included in the second wiring group (step 62), and the wiring W ₉ is included in the second wiring group. It is determined that there is no such thing. As a result, the processing unit 11 shifts to step 65 without shifting to step 63 (that is, without recalculating the total number of new inspection points N), and increments the count value m (m = m + 1). )do. As a result, the new count value m becomes "10". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 8} having the serial number m of "10" is included in the second wiring group (step 62), and the wiring W ₁₀ is included in the second wiring group. To determine. As a result, the processing unit 11 obtains the number "3700" obtained by adding the number "500" of the inspection points existing on the board surface BF2 side of the _{wiring W 10} to the total number of inspection points N (= 3200) at the present time. Is recalculated as the total number of new inspection points N (step 63). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 64), and does not exceed the maximum number G. Therefore, in order to execute the above step 62 for the wiring W having the next serial number, the count value m is incremented (m = m + 1) (step 65). As a result, the new count value m becomes "11". Subsequently, the processing unit 11 determines whether or not the new count value m exceeds the total number "15" of the wirings W formed on the wiring board 4 (step 66), and does not exceed the total number "15". , Step 62.

_{After that, the processing unit 11 determines whether or not the wiring W 11} having the serial number m of "11" is included in the second wiring group (step 62), and the wiring W ₁₁ is included in the second wiring group. To determine. As a result, the processing unit 11 adds the number of inspection points "700" existing on the board surface BF2 side of the _{wiring W 11} to the total number of inspection points N (= 3700) at the present time, and obtains the number "4400". Is recalculated as the total number of new inspection points N (step 63). Next, the processing unit 11 determines whether or not the total number N of the new inspection points exceeds the maximum number G (4000 in this example) for the probe 37 of the fixture TF (step 64), and exceeds the maximum number G. Therefore, the process proceeds to step 67. Then, the processing unit 11 has the serial number (m-1) of the count value (m-1) immediately before the wiring W of the serial number k (since k is the number "5" at this point, the wiring W _5). ) (Since the count value m at this point is the number "11", the wiring W _{10 with the} serial number 10 (= 11-1)) is up to the fixture TF with the current serial number j (= 2). _{It is determined} to be allocated to 2 (that is, wiring W _{from wiring W 5} to wiring W ₁₀ is a wiring W for continuity inspection by the inspection device 3 with the second fixture TF _{2 mounted on the batch inspection machine 35).} The result of this wiring allocation is stored. As a result, the wiring W allocation process for the _{second fixture TF 2 is completed.}

Further, at this point, since the count value m does not exceed the total number "15" of the wirings W formed on the wiring board 4, the processing unit 11 shifts to the step 61 and moves to the next third fixture. The wiring W allocation process to the cha TF _{3 is started.} Processing unit 11, first, at step 61, as the number "3" increments the serial number j fixture TF, together with targeted allocate wire W a third fixture TF _3, the fixture TF ₃ The current count value m (= 11) is substituted for the first serial number k of the wiring W allocated to (that is, the serial number k is set to the smallest serial number m of the unallocated wiring W). Further, as described above, the processing unit 11 sets the initial value of the total number of inspection points N to zero.

Next, the processing unit 11 repeatedly executes the above-mentioned processes from step 62 to step 66. _{In this case, in the allocation process in which the wiring W 11} having the serial number 11 is the first wiring W to be allocated to the fixture TF _{3 , the processing unit 11 is the wiring W 15} having the serial number m "15", which is the last wiring W. Even when the recalculation of the new total number of inspection points N by adding the number of inspection points "1900" existing on the board surface BF2 side for (wiring W included in the second wiring group) is executed in step 63, this The total number of new inspection points N (= 3600) does not exceed the maximum number G (4000 in this example) for the probe 37 of the fixture TF. Therefore, the processing unit 11 proceeds to step 65 and increments the count value m (m = m + 1), whereby the new count value m becomes “16” and is formed on the wiring board 4. It exceeds the total number of wiring W "15". Therefore, in step 66, the processing unit 11 determines that the count value m (= 16) exceeds the total number of wirings W “15”, and proceeds to step 68.

In this step 68, in step 67, the processing unit 11 counts the value (m-1) immediately before the wiring W of the serial number k (since k is the number “11” at this point, the wiring W _11). Wiring W of serial number (m-1) (Since the count value m at this point is the number "16", wiring W _{15 of} serial number 15 (= 16-1)) is the j (= 3) th. allocated to the fixture TF ₃ (i.e., the wiring from W ₁₁ to wire W ₁₅ is a wiring W to conduct inspection in the third fixture TF ₃₎ and determines and stores the wiring allocation result. As a result, the _{wiring W allocation process for the third fixture TF 3} is completed (the second wiring determination process is also completed), and all the wirings W ₁ to W _{15 formed on the wiring board 4 are completed.} The allocation process 50 to the fixture TF is completed. _{Therefore, with respect to the wiring board 4 on which the wirings W 1} to W ₁₅ having the configuration shown in FIG. 6 are formed, the processing unit 11 executes the allocation processing 50 shown in FIGS. 3 and 4, as shown in FIG. , Wiring W ₁ to Wiring W ₄ are assigned to the _first fixture TF _{1, Wiring W 5} to Wiring W _{10 are assigned to the second} fixture TF 2, and Wiring W ₁₁ to Wiring W ₁₅ are the third. Allotted to fixture TF ₃ .

Subsequently, after the allocation process 50 is completed, the processing unit 11 collectively inspects each fixture TF based on the above-mentioned wiring allocation result to each fixture TF and the input netlist Ln and position list Lp. An individual netlist Ln and an individual position list Lp (that is, a netlist for each fixture TF) for causing the inspection data creation device 2 to create the inspection data Dex used by the inspection device 3 mounted on the machine 35. Ln and position list Lp) are created. In the specific example of the wiring board 4 shown in FIG. 6, the processing unit 11 _{inspects the inspection data Dex 1} used in the inspection apparatus 3 in the state where the _{first fixture TF 1 is mounted on the batch inspection machine 35. Inspection data Ex 2} used in the inspection device 3 with _{the net list Ln 1} and the position list Lp ₁ and the second fixture TF ₂ for the creation device 2 to be created in the batch inspection machine 35. _{Inspect the inspection data Dex 3 used in the inspection device 3 with the net list Ln 2} and the position list Lp ₂ for making the creation device 2 to create, and the third fixture TF ₃ mounted on the batch inspection machine 35. _{The net list Ln 3} and the position list Lp ₃ to be created by the data creation device 2 are created.

In this case, the first fixture TF ₁ inspection apparatus that is mounted on the collective inspection device 35 3, not only the continuity test of allocated wires W _{1 ~} wiring W _4, are formed on the wiring board 4 Since the insulation inspection for all the wirings W ₁ to W ₁₅ is also executed, the processing unit 11 can execute the continuity inspection and the insulation inspection for _{the net list Ln 1} and the position list Lp _{1 described above.} It is assumed that Dex ₁ is created by the inspection data creating device 2.

Here, a probe 37 is erected for each of the wirings W ₅ , W ₆ , W ₈ , W _{10 to} W ₁₃ , and W _{15 to perform the insulation inspection (wiring W 1} to wiring W _4). Is already allocated for continuity inspection, and probes 37 are installed at all the inspection points included in these.) For each wiring W ₅ , W ₆ , W ₈ , W _{10 to} W ₁₃ , it will be erected to the position (contact may position) corresponding to any one of the inspection points present on the substrate surface BF2 of W _15. In this case, for example, by prescribing in advance that the inspection points are assigned specific numbers such as the smallest number and the largest number in the netlist Ln among these inspection points, the wiring allocation device 1 can be automatically determined for each of the _{wirings W 5} , W ₆ , W ₈ , W _{10 to} W ₁₃ , and W _{15 based on this regulation.} In this example, as an example, it is defined in advance that this arbitrary one inspection point is the inspection point to which the smallest number is assigned. As a result, the wiring allocation device 1 of this example is the smallest of the inspection points included in the respective netlist Ln for _{each of the above wirings W 5} , W ₆ , W ₈ , W _{10 to} W ₁₃ , and W _15. The numbered inspection points are automatically determined as inspection points for insulation inspection.

From the above, regarding the wiring board 4 having the configuration shown in FIG. 6, the processing unit 11 is used for the above-mentioned inspection used in the inspection device 3 in the state where the _{first fixture TF 1 is mounted on the batch inspection machine 35.} As the netlist Ln ₁ and the position list Lp ₁ for creating the data Dex _{1 , each wiring W 1} to W _{4 are assigned to the fixture TF 1} of the net list Ln and the position list Lp and the continuity check is performed. _{Wiring W (wiring W 5} , W ₆ , W ₈₎ that is a wiring W other than these wiring Ws used at the time of insulation inspection and is included in the second wiring group while using the net list itself and the position list itself. , W _{10 to} W ₁₃ , W ₁₅ ) Generate a netlist consisting of only one inspection point assigned the smallest number in the netlist Ln among the inspection points existing on the substrate surface BF2. Used with a list of inspection point locations.

Further, the processing unit 11 has a netlist Ln ₂ and a position list _{for creating the above-mentioned inspection data Dex 2} used in the inspection device 3 in a state where the _{second fixture TF 2 is mounted on the batch inspection machine 35.} as Lp _2, continuity test allocated to fixture TF ₂ of the netlist Ln and position list Lp is used netlist itself and location list itself for each wire W _{5 ~} wiring W ₁₀ to be performed. Similarly, the processing unit 11 has the netlist Ln ₃ and _{the netlist Ln 3 for creating the above-mentioned inspection data Dex 3} used in the inspection apparatus 3 in which the _{third fixture TF 3 is mounted on the batch inspection machine 35.} as location list Lp _3, continuity test allocated to fixture TF ₃ of the netlist Ln and position list Lp is the wiring W _{11 ~} using netlist itself and location list itself regarding wiring W ₁₅ to be performed.

The manufacturer of the inspection device 3 knows the number (type) of the fixtures TF required for the inspection for each wiring W of the wiring board 4 based on the allocation result of the wiring W to each fixture TF by the wiring allocation device 1. In addition to being able to be obtained, the number (number) of probes 37 to be arranged in each fixture TF (specifically, standing on the base plate 36 thereof) and the standing position of each probe 37 are determined for each fixture TF. It becomes possible to know. Therefore, the manufacturer of the inspection device 3 is based on this knowledge (the number (type) of the fixture TF and the number (number) and position of the probes 37 erected on the base plate 36 of each fixture TF). , It becomes possible to manufacture the inspection apparatus 3 including the number of fixture TFs required for the inspection of the wiring board 4.

_{As a specific example, for the inspection device 3 for inspecting the wiring board 4 on which the wirings W 1} to W ₁₅ having the configuration shown in FIG. 6 are formed, the manufacturer of the inspection device 3 can use the wiring W by the wiring allocation device 1. ₁ ~ Based on the above allocation result to the fixture TF _u to the fixture TF _{3 of the} wiring W ₁₅ , it can be known that the number of the required fixture TF 3 is three.

Moreover, the manufacturer of the test apparatus 3, for the first fixture TF _1, since performing the continuity test of the wiring W _{1 ~} wiring W ₄ allocated, the probe 37 to be erected on the base plate 36 The number (number) is the board surface of the inspection points included in the wiring W (in this example, wiring W ₁ , W ₃ , W _{4 ) included in the second wiring group of wiring W 1} to wiring W _4. It can be known that the total number of inspection points existing in BF2 (in this example, 3300 (= 1000 + 1300 + 1000)) is required at least. Further, since the manufacturer of the inspection device 3 performs an insulation inspection between all the wirings W ₁ to W _{15 for the first} fixture TF 1, the probe 37 erected on the base plate 36 is used. The number (number) is the wiring W included in the second wiring group among the other wirings W (each wiring W from the wiring W _{5 to the wiring W 15 ) not allocated to the first fixture TF 1.} (in this example, the wiring _{W 5, W 6, W 8} , W 10 ~W 13, W 15) can be to know that the number (eight) of the component which is the only necessary.

Moreover, the manufacturer of the test apparatus 3, for the upright position of the probe 37 to the base plate 36 of the fixture TF _1, wires W _{1 ~} 3300 probesets for performing a continuity test on the wiring W ₄ for 37, it is possible to find that the wiring W _1, W _3, W positions corresponding to the inspection point present on the substrate surface BF2 of ₄ (contact may position). Further, for the probe 37 which is erected one by one for each of the wirings W ₅ , W ₆ , W ₈ , W _{10 to} W ₁₃ , and W _{15 to execute the insulation inspection, each wiring W 5} , W ₆ , The position corresponding to one inspection point assigned the smallest number in the netlist Ln among the inspection points existing on the substrate surface BF2 of _{W 8} , W _{10 to} W ₁₃ , and W _{15 (positions that can be contacted).} You can know what to do.

Moreover, the manufacturer of the test apparatus 3, for the second and subsequent fixture _TF 2, TF _3, the wiring W (fixture in TF ₂ wires _{W 5} ~ wiring _{W 10} allocated to each fixture TF ₃ Then, since the continuity inspection is performed for the _{wiring W 11} to the wiring W ₁₅ ), the number (number) of the probes 37 erected on the base plate 36 of _{the fixture TF 2} is among the _{wiring W 5} to the wiring W _10. The total number of inspection points existing on the substrate surface BF2 among the inspection points included in the wiring W (in this example, wirings W ₅ , W ₆ , W ₈ , W _{10) included in the second wiring group (this example).} Then, only 3700 pieces (= 1500 + 200 + 1500 + 500) are required, and the standing position of each probe 37 should be a position (position that can be contacted) corresponding to each of these inspection points existing on the substrate surface BF2. Can be known. Similarly, the manufacturer of the inspection device 3 includes the number (number) of probes 37 erected on the base plate 36 of _{the fixture TF 3} in the second wiring group of the _{wirings W 11} to W _15. The total number of inspection points existing on the board surface BF2 among the inspection points included in the wiring W (wiring W _{11 to} W ₁₃ , W _{15 in} this example) (3600 (= 700 + 200 + 800 + 1900) in this example). It can be known that the upright position of each probe 37 is a position (position that can be contacted) corresponding to each of these inspection points existing on the substrate surface BF2.

In the inspection data creation device 2, the processing unit 21 _{of the inspection device 3 in each state in which the fixtures TF 1} , TF ₂ , TF ₃ , ... Created by the wiring allocation device 1 are mounted on the batch inspection machine 35. Fixtures TF ₁ , TF ₂ , TF ₃ , based on netlist Ln ₁ and location list Lp ₁ , netlist Ln ₂ and location list Lp ₂ , netlist Ln ₃ and location list Lp _{3, ... ... Creates inspection data Dex 1} , Dex ₂ , Dex ₃ , ... Used in the inspection device 3 in each state mounted on the batch inspection machine 35.

In this case, the processing unit 21 is used in the inspection device 3 based on _{the netlist Ln 1} and the position list Lp ₁ for the inspection device 3 in the state where the _{first fixture TF 1 is mounted on the batch inspection machine 35.} As the inspection data Dex ₁ to be performed, the insulation inspection data for the insulation inspection and the continuity inspection data for the continuity inspection are created. Further, the processing unit 21 has _{a netlist Ln 2} and a position list Lp ₂ for the inspection device 3 in each state in which the _{second and subsequent fixtures TF 2} , TF ₃ , ... Are mounted on the batch inspection machine 35. Based on the netlist Ln ₃ and the position list Lp _{3 , ..., As each inspection data Dex 2} , Dex ₃ , ... Used in the inspection device 3 in each state, continuity inspection data for continuity inspection. And create.

In the inspection device 3, when the wiring board 4 is arranged at the inspection position, the processing unit is attached to the fixture TF mounted on the batch inspection machine 35 among the _{inspection data Dex 1} , Dex ₂ , Dex _{3, ....} The corresponding inspection data Dex is used to perform an insulation inspection and a continuity inspection on the wiring W.

As described above, in the wiring allocation device 1 and the wiring allocation method, the _{wiring W to be allocated to the first} fixture TF 1 is determined by executing the first wiring determination process described above, and at this point, the fixture TF _{1 is determined.} When the wiring W that is not allocated to the fixture W remains, the fixture TF is subjected to the second wiring determination process for determining the wiring W to be allocated to the _{second and subsequent fixtures TF 2} , TF _{3, ....} It is executed until there is no unallocated wiring W. Therefore, according to the wiring allocation device 1 and the wiring allocation method, all of the plurality of wirings W formed on one wiring board 4 are collectively inspected by the inspection device 3 provided with the flying probe 31 and the batch inspection machine 35. It can be automatically assigned to each fixture TF that is interchangeably (selectively) mounted on the machine 35.

1 Wiring allocation device
2 Inspection data creation device
3 Inspection equipment
4 Wiring board 11 Processing unit 31 Flying prober 32, 33 Probe 35 Collective inspection machine 36 Base plate 37 Probe BF1 One board surface BF2 The other board surface TF ₁ Fixture (1st fixture)
TF ₂ , TF ₃ fixture (second fixture)

Claims (2)

A flying probe having a probe arranged on one board surface side of the wiring board arranged at the inspection position and capable of contacting an arbitrary position on the one board surface, and the other on the other board surface side of the wiring board. Multiple types of fixtures that can be arranged in contact with and detachable from the substrate surface of the above and can arrange up to G probes that can contact a predetermined position on the other substrate surface are interchangeably mounted. Equipped with a press jig type batch inspection machine, when the first fixture of the plurality of types of fixtures is mounted, the insulation inspection between all the wirings formed on the wiring board and all of them are performed. When a continuity inspection is performed on the wiring allocated in advance from among the wirings of the above and the other second fixture of the plurality of types of fixtures is attached, the wirings of all the wirings are described above. All the wirings are allocated to the first fixture and the second fixture in the inspection device for executing the continuity inspection targeting the wiring pre-allocated from the above to the continuity inspection target. It is a wiring allocation device equipped with a processing unit.
The processing unit is used in the allocation processing.
A classification process for classifying wirings having an inspection point for contacting the probe of the batch inspection machine on the other substrate surface of all the wirings into one wiring group.
The first wiring determination process for determining the wiring to be allocated to the first fixture as the continuity inspection target, and
The second wiring determination process for determining the wiring to be allocated to the second fixture as the continuity inspection target is executed, and at the same time.
In the first wiring determination process, the total number of the wirings classified into the wiring group and each wiring classified into the wiring group among the wirings selected as continuity inspection target candidates from all the wirings. The number of wirings of the continuity inspection target candidate is larger under the condition that the total number of the total number of the inspection points existing on the other substrate surface minus 1 is less than G. The wiring of the candidate for continuity inspection is selected so as to be, and the wiring of the selected candidate for continuity inspection is determined as the wiring to be allocated to the first fixture as the continuity inspection target.
In the second wiring determination process, each wiring classified into the wiring group among the wirings selected as continuity inspection target candidates from the wirings that have not been determined as the continuity inspection targets among all the wirings. Under the condition that the total number of each of the inspection points existing on the other substrate surface is less than G, the continuity inspection target candidate has a larger number of wirings of the continuity inspection target candidate. A wiring allocation device that selects wiring and allocates the selected wiring of the candidate for continuity inspection target to the second fixture as the continuity inspection target. A flying probe having a probe arranged on one board surface side of the wiring board arranged at the inspection position and capable of contacting an arbitrary position on the one board surface, and the other on the other board surface side of the wiring board. Multiple types of fixtures that can be arranged in contact with and detachable from the substrate surface of the above and can arrange up to G probes that can contact a predetermined position on the other substrate surface are interchangeably mounted. Equipped with a press jig type batch inspection machine, when the first fixture of the plurality of types of fixtures is mounted, the insulation inspection between all the wirings formed on the wiring board and all of them are performed. When a continuity inspection is performed on the wiring allocated in advance from among the wirings of the above and the other second fixture of the plurality of types of fixtures is attached, the wirings of all the wirings are described above. All the wirings are allocated to the first fixture and the second fixture in the inspection device for executing the continuity inspection targeting the wiring pre-allocated from the above to the continuity inspection target. It is a wiring allocation method,
In the allocation process
A classification process for classifying wirings having an inspection point for contacting the probe of the batch inspection machine on the other substrate surface of all the wirings into one wiring group.
The first wiring determination process for determining the wiring to be allocated to the first fixture as the continuity inspection target, and
The second wiring determination process for determining the wiring to be allocated to the second fixture as the continuity inspection target is executed, and at the same time.
In the first wiring determination process, the total number of the wirings classified into the wiring group and each wiring classified into the wiring group among the wirings selected as continuity inspection target candidates from all the wirings. The number of wirings of the continuity inspection target candidate is larger under the condition that the total number of the total number of the inspection points existing on the other substrate surface minus 1 is less than G. The wiring of the candidate for continuity inspection is selected so as to be, and the wiring of the selected candidate for continuity inspection is determined as the wiring to be allocated to the first fixture as the continuity inspection target.
In the second wiring determination process, each wiring classified into the wiring group among the wirings selected as continuity inspection target candidates from the wirings that have not been determined as the continuity inspection targets among all the wirings. Under the condition that the total number of each of the inspection points existing on the other substrate surface is less than G, the continuity inspection target candidate has a larger number of wirings of the continuity inspection target candidate. A wiring allocation method for selecting wiring and allocating the selected wiring of the candidate for continuity inspection target to the second fixture as the continuity inspection target.

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