JP2024003999A - Substrate inspection device and substrate inspection method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable an insulation state between a plurality of conductor patterns to be inspected in a short time.

SOLUTION: When inspecting a substrate X that is an object to be inspected, in which a plurality of conductor patterns that should be insulated from each other is formed, the present invention executes a process to move eight probes 2 independently of each other bringing each probe 2 into contact with eight conductor patterns, respectively, and measure a measurement amount between M conductor patterns, except one conductor pattern out of the eight conductor patterns and a conductor pattern that satisfies a predefined exclusion condition for excluding an insulation state to the one conductor pattern from the inspection object, as well as inspect the insulation state between the one conductor pattern and the M conductor patterns on the basis of the measured measurement amount, with said process executed multiple times after changing a combination of the one conductor pattern and the M conductor patterns in accordance with a predefined change procedure, whereby the mutual insulation state between the eight conductor patterns is inspected.

SELECTED DRAWING: Figure 1

COPYRIGHT: (C)2024,JPO&INPIT

Description

The present invention relates to a board testing device and a board testing method that test the insulation state between conductive patterns through a probe that is brought into contact with each conductive pattern formed on a board to be tested.

As this type of board testing device and board testing method, the applicant has developed a system that detects the resistance value between two conductor patterns on a circuit board to be tested (hereinafter also referred to as "board to be tested") via a pair of testing probes. A circuit board inspection device capable of measuring the resistance value and inspecting the insulation state between both conductor patterns based on the measured resistance value, and a circuit board inspection method thereof (hereinafter also simply referred to as "board inspection device" and "board inspection method") ) is disclosed in the following patent documents.

When inspecting a board to be inspected using this board inspection device, first, two inspection lines are applied to two conductor patterns (inspection positions) whose insulation state is to be inspected on the board to be inspected placed on the electrode section. contact each probe. Next, the capacitance between the conductor pattern and the electrode that was in contact with one test probe, and the capacitance between the conductor pattern and the electrode that was in contact with the other test probe were measured. The contact state between the test probe and the conductor pattern is determined by comparing the capacitance with the contact state determination data.

At this time, if it is determined that the contact condition is good, the resistance value between both conductor patterns is measured via both test probes, and the measured resistance value is compared with the value of the test reference data. Inspect the insulation condition between both conductor patterns. By sequentially performing such an inspection process by changing the combination of conductor patterns that bring both inspection probes into contact, the mutual insulation state of the conductor patterns formed on the substrate to be inspected is inspected.

Japanese Patent Application Publication No. 2001-242211 (pages 3-5, figures 1 and 2)

However, the board inspection apparatus and the board inspection method disclosed by the applicant have the following problems to be improved. Specifically, the board inspection device and board inspection method disclosed by the applicant use a pair of inspection probes that are movably arranged separately, and a conductor pattern that brings the two inspection probes into contact with each other. A configuration and method is adopted in which the mutual insulation state of each conductor pattern is tested by changing the combination of (inspection positions) and sequentially measuring the resistance value and comparing it with the value of the test reference data.

Therefore, in this board testing apparatus and board testing method, it is necessary to move the testing probe and measure the resistance value as many times as there are combinations of two conductor patterns whose insulation state is to be tested. As an example, in order to inspect the mutual insulation state of eight conductor patterns on a board to be inspected, it is necessary to move the inspection probe and measure the resistance value 28 times. Therefore, in the board inspection device and the board inspection method disclosed by the applicant, when the number of conductor patterns formed on the board to be tested is large, it is necessary to inspect the quality of one board to be tested. The current situation is that it takes a long time, and it is desirable to improve this point.

The present invention has been made in view of the problem that should be improved, and a main object of the present invention is to provide a board inspection device and a board inspection method that can inspect the insulation state between a plurality of conductor patterns in a short time.

The board inspection apparatus according to the present invention is capable of determining the distance between each conductor pattern in advance through a probe brought into contact with each conductor pattern on a board to be inspected on which a plurality of conductor patterns which should be mutually insulated are formed. This is a board inspection device configured to be able to measure a measured quantity and inspect the insulation state between each conductor pattern based on the measured quantity, a defined natural number), Na probe moving mechanisms configured to be able to move the Na probes separately and independently, a measuring unit that measures the measured quantity, and the probe moving mechanism. a processing section that controls movement of the probe and measurement of the quantity to be measured by the measurement section, and inspects an insulation state between the conductor patterns based on the measured quantity; , controlling each of the probe moving mechanisms to bring the Na probes into contact with each of the Na conductor patterns, and contacting one of the Na conductor patterns with one of the conductor patterns; The measurement unit measures the measured quantity between M conductor patterns excluding the conductor pattern that satisfies predefined exclusion conditions to exclude the insulation state of the pattern from being inspected, and An inspection process for inspecting the insulation state between the one conductor pattern and the M conductor patterns based on the quantity to be measured is performed based on a predefined combination of the one conductor pattern and the M conductor patterns. The insulation state between the Na conductor patterns is inspected by changing the change procedure and executing the change a plurality of times.

Further, the board inspection method according to the present invention includes a test target board on which a plurality of conductor patterns which should be mutually insulated are formed, and a probe is brought into contact with each of the conductor patterns to conduct a test in advance between the conductor patterns. A board inspection method that measures a specified quantity to be measured and also inspects the insulation state between each conductor pattern based on the measured quantity, wherein (a natural number) of the probes are moved separately and independently to bring the Na probes into contact with the Na conductor patterns, respectively, and contact one of the Na conductor patterns with the conductor pattern. The measured quantity is measured between the M conductor patterns excluding the conductor pattern that satisfies predefined exclusion conditions for excluding one conductor pattern from being inspected for the insulation state, and the measured quantity is measured. An inspection process for inspecting the insulation state between the one conductor pattern and the M conductor patterns based on the measured quantity is performed using a predefined combination of the one conductor pattern and the M conductor patterns. The mutual insulation state of the Na conductor patterns is inspected by changing the changing procedure and executing it multiple times.

Therefore, according to the board inspection apparatus and the board inspection method according to the present invention, when inspecting a board to be inspected on which a plurality of conductor patterns are formed, the structure and method are for individually inspecting the insulation state between two conductor patterns. By inspecting the insulation condition between one conductor pattern and M conductor patterns all at once, the number of inspection processes required to inspect one board to be inspected can be sufficiently reduced. can do. Thus, according to this board inspection apparatus and board inspection method, the insulation state between a plurality of conductor patterns can be inspected in a short time.

Further, the substrate inspection apparatus according to the present invention includes Nb probes (Nb is a natural number of 4 or more) and Nb probe moving mechanisms, and the processing section performs the change procedure by detecting the one probe. Nb conductor patterns according to a procedure that when a plurality of combinations of conductor patterns and the M conductor patterns exist, the inspection process is performed with priority given to combinations excluding the combination in which the number of the M conductor patterns is the smallest. An insulation state between the conductor patterns is inspected.

Further, in the board inspection method according to the present invention, Nb (Nb is a natural number of 4 or more) of the probes are brought into contact with each of the Nb conductor patterns, and as the changing step, the one conductor pattern and Nb conductor patterns according to a procedure for performing the inspection process with priority given to combinations excluding the combination in which the number of M conductor patterns is the smallest when a plurality of combinations of the M conductor patterns exist; Inspect the insulation condition between the two.

Therefore, according to the board inspection apparatus and the board inspection method according to the present invention, by giving priority to combinations with a large number of M conductor patterns, insulation between a large number of conductor patterns can be achieved at an early stage of multiple inspection processes. Since the state can be determined, the number of inspection processes required to inspect one substrate to be inspected can be further reduced. Thereby, according to this board inspection apparatus and board inspection method, the insulation state between a plurality of conductor patterns can be inspected in a shorter time.

Further, in the board inspection apparatus according to the present invention, the processing unit, as the changing procedure, performs the change in the number of the M conductor patterns when a plurality of combinations of the one conductor pattern and the M conductor patterns exist. The mutual insulation state of the Nb conductor patterns is tested according to the procedure of executing the test process with priority given to the combination with the largest number of Nb conductor patterns.

Further, in the board inspection method according to the present invention, as the changing step, when a plurality of combinations of the one conductor pattern and the M conductor patterns exist, the number of the M conductor patterns is the largest. The mutual insulation state of the Nb conductive patterns is tested according to the procedure of performing the testing process with priority given to the combination.

Therefore, according to the board inspection apparatus and the board inspection method according to the present invention, by giving priority to the combination with the largest number of M conductor patterns, it is possible to Since the insulation state can be suitably determined, the number of inspection processes required to inspect one substrate to be inspected can be further reduced. Thereby, according to this board inspection apparatus and board inspection method, the insulation state between a plurality of conductor patterns can be inspected in a shorter time.

Further, in the board inspection apparatus according to the present invention, the processing unit determines that the conductor pattern whose distance between the shortest separated parts with respect to the one conductor pattern exceeds a predefined distance is a conductor pattern that satisfies the exclusion condition. .

Further, in the board inspection method according to the present invention, the conductor pattern whose distance between the shortest separated portions with respect to the one conductor pattern exceeds a predetermined distance is a conductor pattern that satisfies the exclusion condition.

Therefore, according to the board inspection apparatus and the board inspection method according to the present invention, the inspection process required to inspect one board to be inspected is reduced by the amount of inspection process required for the inspection of one board to be inspected. The number of times can be further reduced. Thereby, according to this board inspection apparatus and board inspection method, the insulation state between a plurality of conductor patterns can be inspected in a shorter time.

According to the board inspection device and the board inspection method according to the present invention, regarding the plurality of conductor patterns formed on the board to be inspected, the insulation state between one conductor pattern and M conductor patterns can be checked at once. By performing the inspection, the number of inspection processes required to inspect one substrate to be inspected can be sufficiently reduced. Thereby, the insulation state between the plurality of conductor patterns can be inspected in a short time.

1 is a configuration diagram showing the configuration of a board inspection apparatus 1. FIG. FIG. 7 is an explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8. FIG. 7 is yet another explanatory diagram for explaining an inspection procedure for inspecting the mutual insulation state of conductor patterns X1 to X8.

An example of a board inspection apparatus and a board inspection method will be described below with reference to the accompanying drawings.

A board inspection apparatus 1 shown in FIG. 1 is an example of a "board inspection apparatus" and is configured to be able to inspect the insulation state of a conductor pattern formed on a board X to be inspected according to a "board inspection method" described later. ing. In this case, the substrate to be inspected X is an example of a "substrate to be inspected," and is formed with a plurality of conductor patterns (not shown) that should be mutually insulated. The substrate inspection apparatus 1 includes probes 2, 2, . . . , moving mechanisms 3, 3, .

The probe 2 is an example of a "probe" and is connected to the measurement unit 4 while being attached to the moving mechanism 3. In this case, the substrate inspection apparatus 1 of this example is configured to include eight probes 2, as an example (an example of a configuration in which "Na" and "Nb" are "8"). The moving mechanism 3 is an example of a "probe moving mechanism" and moves each probe 2 separately and independently under the control of the processing section 5 to bring the probes 2 into contact with the conductor pattern on the substrate X to be inspected. In this case, the substrate inspection apparatus 1 of this example, which includes Na=Nb=8 probes 2, is configured to include eight moving mechanisms 3 so that each probe 2 can be moved separately and independently.

The measuring unit 4 is an example of a "measuring unit", and as described later, under the control of the processing unit 5, the resistance value between the probes 2, 2, etc. that are in contact with the conductive pattern of the board to be inspected X is measured. is measured as the “quantity to be measured”. In this case, in the board inspection apparatus 1 of this example, the measuring section 4 is configured to include a connection switching section (not shown) that can change the connection mode of each probe 2 to itself under the control of the processing section 5. .

The processing section 5 is an example of a "processing section" and controls the substrate inspection apparatus 1 in general. Specifically, the processing unit 5 performs processing to generate inspection procedure data D1 based on the inspection target board data D0, movement of the probe 2 by the moving mechanism 3, and measurement unit 4 according to the inspection target board data D0 and the inspection procedure data D1. Inspect the insulation state between the conductor patterns by comparing the measured resistance value with a comparison value specified based on the inspection target board data D0, and generate inspection result data D2. It is configured to be able to execute processing, etc.

In this case, in the board inspection apparatus 1 of this example, the processing unit 5 controls each moving mechanism 3 to move the Na=Nb=8 probes 2 into the Na=Nb=8 conductor patterns as described later. Excludes one conductor pattern among the eight conductor patterns and conductor patterns that satisfy predefined "exclusion conditions" that exclude the conductor pattern from being inspected for the insulation condition of that one conductor pattern. The measuring unit 4 measures the resistance values between the M conductor patterns, and inspects the insulation state between the one conductor pattern and the M conductor patterns based on the measured resistance values. The configuration is such that the insulation state between eight conductor patterns is inspected by performing the inspection process multiple times by changing one conductor pattern and the combination of M conductor patterns according to a predefined change procedure. It has been adopted.

The storage unit 6 specifies the operation program of the processing unit 5, the inspection target board data D0 that can specify inspection points on the inspection target board X, resistance values to be measured, etc., and the inspection procedure for the inspection target board X. Possible inspection procedure data D1 and the above-mentioned inspection result data D2 that can specify the inspection results by the processing unit 5 are stored. In this case, the test target board data D0 is, for example, data generated in an external processing device by the manufacturer (designer) of the test target board Coordinates to be brought into contact, information that allows identification of conductor patterns whose minimum distance between adjacent conductor patterns (the distance between the shortest distances) is less than a predefined distance (proximity pattern information), and measurements between each conductor pattern. It consists of data that can specify the resistance that should be applied.

When inspecting the substrate X to be inspected by the substrate inspection apparatus 1, first, the inspection procedure data D1 is stored in the storage section 6. The inspection procedure data D1 can be generated in an external device, inputted into the board inspection apparatus 1, and stored in the storage unit 6, but in this example, it is generated by the processing unit 5 based on the inspection target board data D0. An example will be explained below. It is assumed that the inspection target board data D0 is stored in the storage unit 6 in advance.

As mentioned above, in the substrate inspection apparatus 1 of this example, which is equipped with eight probes 2 that are arranged to be movable separately and independently, one movement of the eight probes 2 by each moving mechanism 3 The probes 2 are brought into contact with eight conductor patterns (hereinafter, these eight conductor patterns are also referred to as "conductor patterns X1 to X8") among the conductor patterns formed on the board X to be inspected, and each conductor is The insulation state between the patterns X1 to X8 can be inspected. When generating the inspection procedure data D1 for inspecting the insulation state between the conductor patterns X1 to X8, the processing unit 5 first selects a combination of patterns satisfying predefined "exclusion conditions" from the inspection target. exclude.

Specifically, the processing unit 5 sets "exclusion conditions" for patterns whose minimum separation distance exceeds a predetermined distance among the conductor patterns X1 to X8, based on the above-mentioned proximity pattern information in the inspection target board data D0. Specify as a combination of patterns that satisfy. Note that the above-mentioned "predefined distance" is defined as a distance that does not pose a risk of short circuits between adjacent conductor patterns in the board surface direction and thickness direction of the board X to be inspected. It is defined by the manufacturer of the board X to be inspected, etc.

In this case, in this example, conductor patterns X1-X2, conductor patterns X1-X3, conductor patterns X1-X4, conductor patterns X1-X7, conductor patterns X1-X8, conductor patterns X2-X3, conductor patterns X2- The shortest separation distance is predefined for X5, conductor patterns X2-X6, conductor patterns X3-X5, conductor patterns X3-X6, conductor patterns X3-X7, conductor patterns X4-X5, conductor patterns X5-X6, and conductor patterns X6-X8. It is assumed that such proximity pattern information is specified based on the inspection target board data D0.

Therefore, as shown in FIG. 2, the processing unit 5 selects conductor patterns X1-X5, conductor patterns X1-X6, conductor patterns X2-X4, conductor patterns X2-X7, conductor pattern X2-X8, conductor pattern X3-X4, conductor pattern X3-X8, conductor pattern X4-X6, conductor pattern X4-X7, conductor pattern X4-X8, conductor pattern X5-X7, conductor pattern X5- X8, conductor patterns X6-X7, and conductor patterns X7-X8 are identified as patterns that satisfy the "exclusion condition" (patterns that do not require inspection of the mutual insulation state). Note that in FIG. 2 and FIGS. 3 to 15 to be referred to later, combinations of conductor patterns that satisfy the "exclusion condition" are represented by "0", and combinations of conductor patterns to be inspected are represented by "1".

In other words, in the example shown in FIG. 2, it is necessary to inspect five conductor patterns X2, X3, X4, It is necessary to inspect the four conductor patterns X5 and X6 as the objects for inspection of the insulation state, and it is necessary to inspect the five conductor patterns X1, X2, X5, X6, and X7 for the conductor pattern X3 as the objects for inspection for the insulation state. Regarding conductor pattern X4, it is necessary to inspect two conductor patterns X1 and X5 as objects to be inspected for insulation state, and for conductor pattern X5, four conductor patterns X2, X3, X4, and X6 need to be inspected as objects for inspection for insulation state. For conductor pattern X6, it is necessary to inspect four conductor patterns X2, X3, X5, and X8 for insulation condition, and for conductor pattern X7, two conductor patterns X1 and X3 must be tested for insulation condition. This indicates that the processing unit 5 has specified that the two conductor patterns X1 and X6 of the conductor pattern X8 need to be inspected as the targets for insulation state inspection.

Next, in the inspection of the eight conductor patterns X1 to X8, the processing unit 5 checks the insulation state between one conductor pattern among the eight conductor patterns and the other M conductor patterns. When performing an inspection process a plurality of times by changing the combination of one conductor pattern and M conductor patterns, it is specified which combination should be given priority to execute the inspection process.

In this case, in the board inspection apparatus 1 of this example and its board inspection method, when there are multiple combinations of one conductor pattern among the eight conductor patterns and M conductor patterns, Inspect the mutual insulation state of the eight conductor patterns according to the procedure (an example of a predefined "change procedure") of performing the inspection process with priority given to combinations excluding the combination with the smallest number of patterns. The structure/method has been adopted. Specifically, in the board inspection apparatus 1 of this example and its board inspection method, when there are multiple combinations of one conductor pattern and M conductor patterns, the number of M conductor patterns is the largest. A configuration/method is adopted in which the mutual insulation state of the eight conductor patterns is inspected according to a procedure (a specific example of a predefined "change procedure") that prioritizes the combinations in which the inspection process is executed. ing.

Therefore, in the example shown in FIG. 2, the processing unit 5 inspects the combination of the conductor pattern X1 and the conductor patterns X2, X3, X4, X7, and It is specified that processing and inspection processing for the combination of conductor pattern X3 and conductor patterns X1, X2, X5, X6, and X7 are to be performed with priority. In this case, as an example, it is specified that the inspection process for the combination of the conductor pattern X1 and the conductor patterns X2, X3, X4, X7, and X8 is to be executed first.

On the other hand, when the above first inspection process is completed, the insulation states of conductor patterns X1-X2, conductor patterns X1-X3, conductor patterns X1-X4, conductor patterns X1-X7, and conductor patterns X1-X8 are determined, Inspection of the insulation state of these combinations becomes unnecessary. Therefore, as shown in FIG. 3, when specifying the second inspection process to be executed, the processing unit 5 satisfies the above-mentioned combination of conductor patterns, which makes inspection unnecessary upon completion of the first inspection process, as an "exclusion condition". Newly identified as a pattern.

Next, the processing unit 5 performs an inspection process on the combination of the conductor pattern X3 and the conductor patterns X2, X5, X6, and X7 in which the number of M conductor patterns is the largest number, 4, and the conductor pattern X5 and the conductor pattern X1. , X3, X5, and X8, and testing processing for the combination of conductor pattern X6 and conductor patterns X1, X2, X5, and X8 are specified to be executed with priority. At this time, as an example, it is specified that the inspection process for the combination of conductor pattern X3 and conductor patterns X2, X5, X6, and X7 is to be executed second.

Furthermore, when the above-mentioned second inspection process is completed, the insulation states of conductor patterns X3-X2, conductor patterns X3-X5, conductor patterns X3-X6, and conductor patterns X3-X7 are determined, and the There is no need to inspect the insulation state. Therefore, as shown in FIG. 4, when specifying the third inspection process to be executed, the processing unit 5 sets the above-mentioned combination of conductor patterns for which inspection is unnecessary upon completion of the second inspection process as an "exclusion condition". Newly identified as a pattern that satisfies.

Next, the processing unit 5 performs an inspection process on the combination of the conductor pattern X5 and the conductor patterns X2, X4, and It is specified that the inspection process for the combination of X5 and X8 is to be executed with priority. In this case, as an example, it is specified that the inspection process for the combination of conductor pattern X5 and conductor patterns X2, X4, and X6 is to be executed thirdly.

Furthermore, when the third inspection process described above is completed, the insulation conditions of conductor patterns X5-X2, conductor patterns X5-X4, and conductor patterns X5-X6 are determined, and the insulation conditions of these combinations can be inspected. No longer needed. Therefore, as shown in FIG. 5, when specifying the fourth inspection process to be executed, the processing unit 5 sets the above-mentioned combination of conductor patterns for which inspection is unnecessary upon completion of the third inspection process as an "exclusion condition". Newly identified as a pattern that satisfies. Next, the processing unit 5 specifies that the inspection process for the combination of the conductor pattern X6 and the conductor patterns X2 and X8, which has the largest number of M conductor patterns (two), is to be performed fourth.

As a result, as shown in FIG. 6, by completing the above-mentioned fourth inspection, each pattern formed at a close distance where a short circuit may occur regarding the eight conductor patterns X1 to X8 is removed. It becomes possible to determine the mutual insulation state between the two. Therefore, the processing unit 5 generates inspection procedure data D1 such that the execution order of the above-mentioned inspection processes can be specified, and stores the generated inspection procedure data D1 in the storage unit 6. In this way, the process of generating the inspection procedure data D1 for inspecting the mutual insulation status of eight conductor patterns can be performed by inspecting the insulation status of the conductor patterns formed on the substrate X to be inspected. By repeating the test on all the conductor patterns to be inspected, preparations are made for the inspection of the substrate X to be inspected.

On the other hand, when inspecting the substrate X to be inspected, the processing unit 5 selects eight conductor patterns (such as conductor patterns X1 to ), and also specify the positions (X-Y-Z coordinates on the test target board X) where the probe 2 should contact the eight conductor patterns based on the test target board data D0, and Each probe 2 is brought into contact with the specified position (conductor pattern) under control. Furthermore, the processing section 5 controls the measuring section 4 to measure the resistance value between each conductive pattern with which the probe 2 is in contact.

Specifically, regarding the conductor patterns X1 to X8 described above with reference to FIGS. 2 to 6, the processing unit 5 processes the conductor patterns X1, X2, X3, X4, X7, X8 (resistance value between conductor patterns X1-X2, resistance value between conductor patterns X1-X3, resistance value between conductor patterns X1X4, resistance value between conductor patterns X1X7, and conductor patterns X1-X8) The measurement unit 4 measures the composite resistance value of the resistance values between the two.

The processing unit 5 also determines the resistance value between the conductor patterns X1 and X2, the resistance value between the conductor patterns X1 and X3, the resistance value between the conductor patterns X1 and X4, and the resistance value between the conductor patterns X1 and X7 based on the inspection target board data D0. Specify the resistance value and the composite resistance value of the resistance value between conductor patterns X1-X8, respectively, and measure it as the resistance value (composite resistance value) between conductor pattern X1 and conductor patterns X2, X3, X4, X7, and X8. Calculate the value to be used. Furthermore, the processing unit 5 determines whether the insulation state between the conductor pattern X1 and the conductor patterns X2, X3, X4, X7, and X8 is good based on the calculated resistance value and the resistance value measured by the measurement unit 4. Determine whether it exists or not.

Specifically, when the measured resistance value is a small value outside the predefined tolerance range for the resistance value calculated based on the inspection target board data D0, the processing unit 5 It is determined that the insulation state is poor between X1 and X2, between conductor patterns X1 and X3, between conductor patterns X1X4, between conductor patterns X1 and X7, and between conductor patterns X1 and X8. At this time, the processing unit 5 controls the measurement unit 4 to measure the distance between the conductor patterns X1 and X2, between the conductor patterns X1 and X3, between the conductor patterns X1 and X4, between the conductor patterns X1 and X7, and between the conductor patterns X1 and X8, for example. By measuring the resistance value between each pattern and comparing the measured resistance value with the resistance value between corresponding patterns specified based on the inspection target board data D0, it is possible to determine whether the insulation state between any of the patterns is poor. Determine whether This completes the first "inspection process" targeting the conductor patterns X1 to X8.

On the other hand, when the resistance value (combined resistance value) measured by the measurement unit 4 is within a predefined tolerance range with respect to the resistance value (combined resistance value) calculated based on the test target board data D0, The processing unit 5 determines that the insulation state between the conductor patterns X1 and X2, between the conductor patterns X1 and X3, between the conductor patterns X1X4, between the conductor patterns X1 and X7, and between the conductor patterns X1 and X8 is good. This completes the first "inspection process" targeting the conductor patterns X1 to X8.

Next, the processing unit 5 performs the inspection process on the conductor pattern X3 and the conductor pattern The second "inspection process" is based on the resistance value between the conductor patterns X2, X5, X6, and X7, and the third "inspection process" is based on the resistance value between the conductor pattern X5 and the conductor patterns X2, X4, and X6. ", and a fourth "inspection process" based on the resistance values between the conductor pattern X6 and the conductor patterns X2 and X8. As a result, the mutual insulation state of the eight conductor patterns X1 to X8 is tested.

In this case, for example, even if the board inspection apparatus 1 of this embodiment is equipped with eight probes 2 that are movably arranged separately, the conventional inspection method and the Similarly, when the resistance value between two conductor patterns was measured and the insulation condition between each conductor pattern was inspected, 28 inspection processes were performed to inspect the insulation condition between the 8 conductor patterns. There is a need to do. Therefore, compared to inspection using a board inspection device equipped with only two probes, by moving eight probes 2 at the same time, the time required to move the probes 2 can be reduced to 2/8. The time required to measure the "quantity to be measured (in this example, resistance value)" (total time of 28 measurements) is the same as the conventional configuration and method, so it is possible to It becomes difficult to sufficiently shorten the required time.

On the other hand, even if the above inspection method does not exclude patterns whose minimum separation distance exceeds a predetermined distance from the inspection target as patterns that meet the "exclusion conditions," one conductor When a method is adopted in which the insulation condition between one conductor pattern and seven conductor patterns is tested all at once by measuring the resistance value between the pattern and seven other conductor patterns, the test is performed seven times. The insulation state between the eight conductor patterns can be inspected by simply measuring the resistance values of the eight conductor patterns. Therefore, by providing eight probes 2 that are movable separately and independently, it is possible to shorten the time required to move the probes 2, and also to )'' (the total time of seven measurements) can also be sufficiently shortened, and therefore the time required to inspect one substrate X to be inspected can be sufficiently shortened.

In addition, as in the above inspection method, patterns whose minimum separation distance exceeds a predetermined distance or patterns whose insulation state is determined by the completed inspection process are excluded from the inspection target as patterns that satisfy the "exclusion condition". When there are multiple combinations of one conductor pattern and M conductor patterns, the combination excluding the combination with the smallest number of M conductor patterns (for example, the combination with the largest number of M conductor patterns) In the board inspection apparatus 1 and its board inspection method of this example, which inspect the mutual insulation state of eight conductor patterns according to the "change procedure" in which the inspection process is performed with priority given to combinations such as In the example shown in FIG. 6, the insulation state between eight conductor patterns can be inspected by simply measuring the resistance value four times. Therefore, the time required to inspect one substrate X to be inspected is further reduced.

Thereafter, the processing unit 5 sequentially inspects the other conductor patterns formed on the substrate X to be inspected in the same manner as when inspecting the mutual insulation state of the eight conductor patterns X1 to X8. Execute "inspection processing". Further, the processing unit 5 generates test result data D2 using the determined insulation state as a test result, and stores the data in the storage unit 6. This completes the inspection of the conductor pattern whose insulation state is to be inspected among the conductor patterns formed on the substrate X to be inspected.

Note that when there are multiple combinations of one conductor pattern and M conductor patterns, the Na =Nb=The configuration and method for inspecting the mutual insulation state of 8 conductor patterns has been explained as an example, but when there are multiple combinations of 1 conductor pattern and M conductor patterns, M This is a configuration/method that executes "inspection processing" by giving priority to combinations other than combinations where the number of M conductor patterns is the smallest, without prioritizing the combination where the number of M conductor patterns is the largest. If so, the number of "inspection processing" required to test the mutual insulation state of the eight conductor patterns can be reduced to a small number.

Specifically, when generating the inspection procedure data D1, when there are multiple combinations of one conductor pattern and M conductor patterns, the combination with the smallest number of M conductor patterns and the combination with the smallest number of M conductor patterns are selected. Adopt a configuration and method for inspecting the mutual insulation state of Na=Nb=8 conductor patterns according to the procedure of performing "inspection processing" giving priority to combinations excluding the combination with the largest number of conductor patterns. be able to. As an example, when there are multiple combinations of one conductor pattern out of eight conductor patterns and M conductor patterns, priority is given to the combination with the second largest number of M conductor patterns. The mutual insulation state of the eight conductor patterns can be inspected according to the procedure for executing the inspection process (another example of the predefined "change procedure").

When generating the inspection procedure data D1 for inspecting the mutual insulation state of the aforementioned boards to be inspected X1 to X8 in the board to be inspected X in accordance with such a "change procedure", the processing unit 5 performs the following steps as shown in FIG. In the example shown, the inspection process for the combination of conductor pattern X2 and conductor patterns X1, It is specified that inspection processing for the combination of X3, X4, and X6 and inspection processing for the combination of conductor pattern X6 and conductor patterns X2, X3, X5, and X8 are to be executed with priority. In this case, as an example, it is specified that the inspection process for the combination of the conductor pattern X2 and the conductor patterns X1, X3, X5, and X6 is to be executed first.

On the other hand, when the above-mentioned first inspection process is completed, the insulation states of conductor patterns X2-X1, conductor patterns X2-X3, conductor patterns X2-X5, and conductor patterns X2-X6 are determined, and the insulation conditions of these combinations are There is no need to inspect the condition. Therefore, as shown in FIG. 8, when specifying the second inspection process to be executed, the processing unit 5 satisfies the above-mentioned combination of conductor patterns, which makes the inspection unnecessary upon completion of the first inspection process, as an "exclusion condition". Newly identified as a pattern.

Next, the processing unit 5 performs an inspection process on the combination of the conductor pattern X5 and the conductor patterns X3, X4, and It is specified that the inspection process for the combination of X3, X5, and X8 is to be executed with priority. At this time, as an example, it is specified that the inspection process for the combination of conductor pattern X5 and conductor patterns X3, X4, and X6 is to be executed second.

Furthermore, when the second inspection process described above is completed, the insulation states of conductor patterns X5-X3, conductor patterns X5-X4, and conductor patterns X5-X6 are determined, and the insulation state of these combinations can be inspected. No longer needed. Therefore, as shown in FIG. 9, when specifying the third inspection process to be executed, the processing unit 5 sets the above-mentioned combination of conductor patterns for which inspection is unnecessary upon completion of the second inspection process as an "exclusion condition". Newly identified as a pattern that satisfies.

Next, the processing unit 5 prioritizes the inspection process for the combination of the conductor pattern X3 and the conductor patterns X1, X6, and Specify the third execution. Furthermore, when the third inspection process is completed, the insulation conditions of conductor patterns X3-X1, conductor patterns X3-X6, and conductor patterns X3-X7 are determined, and inspection of the insulation conditions of these combinations is unnecessary. Become. Therefore, as shown in FIG. 10, when specifying the fourth inspection process to be executed, the processing unit 5 sets the above-mentioned combination of conductor patterns for which inspection is unnecessary upon completion of the third inspection process as an "exclusion condition". Newly identified as a pattern that satisfies.

Next, the processing unit 5 prioritizes the inspection process for the combination of the conductor pattern X8 and the conductor patterns X1 and Specify when it is executed. Further, when the fourth inspection process is completed, the insulation state of conductor patterns X8-X1 and conductor patterns X8-X6 is determined, and there is no need to test the insulation state of these combinations. Therefore, as shown in FIG. 11, when specifying the fifth inspection process to be executed, the processing unit 5 sets the above-mentioned combination of conductor patterns for which inspection is unnecessary upon completion of the fourth inspection process as an "exclusion condition". Newly identified as a pattern that satisfies.

Next, the processing unit 5 preferentially executes the inspection process for the conductor patterns X4-X1, which has the second largest number of M conductor patterns, and the inspection process for the conductor patterns X7-X1. Identify. At this time, as an example, it is specified that the inspection process for conductor patterns X4-X1 is to be executed fifth. Further, when the fifth inspection process is completed, the insulation state of the conductor patterns X4-X1 is determined, and there is no need to inspect the insulation state of this conductor pattern. Therefore, as shown in FIG. 12, when specifying the sixth inspection process to be executed, the processing unit 5 selects a pattern that satisfies the above-mentioned conductor pattern, which becomes unnecessary to inspect upon completion of the fifth inspection process, as an "exclusion condition". Newly identified as

Thereafter, the processing unit 5 specifies that the inspection process for the uncompleted conductor patterns X1-X7 will be executed sixth. As a result, as shown in FIG. 13, by completing the sixth test described above, it becomes possible to determine the mutual insulation state of the eight conductor patterns X1 to X8.

Therefore, the processing unit 5 generates inspection procedure data D1 such that the execution order of the above-mentioned inspection processes can be specified, and stores the generated inspection procedure data D1 in the storage unit 6. Further, the processing section 5 sequentially executes an inspection process targeting the conductor patterns X1 to X8 based on the generated inspection procedure data D1 and the inspection target board data D0 stored in the storage section 6. As a result, in the examples shown in FIGS. 7 to 13, the mutual insulation state of eight conductor patterns can be inspected by simply measuring the resistance value six times. Therefore, the time required to inspect one substrate X to be inspected is sufficiently shortened.

Further, although a detailed explanation is omitted, when there are multiple combinations of one conductor pattern and M conductor patterns, except for the combination with the smallest number of M conductor patterns, It is also possible to perform the "inspection process" with priority given to the combination with the largest number of conductor patterns and the combination arbitrarily selected from among the second and subsequent largest number of combinations. Specifically, as an example, the first "inspection process" is performed with the combination that has the largest number of M conductor patterns, and the second "inspection process" is performed with the combination that has the largest number of M conductor patterns. It is possible to arbitrarily change the selection criteria (change procedure) for the "inspection process" to be executed with priority, such as executing the combination with the second largest number. Even when such a configuration and method are adopted, the number of "inspection processing" required to test the insulation state between the conductor patterns can be reduced to a small number.

In this case, as in the examples described with reference to FIGS. 2 to 6, when there are multiple combinations of one conductor pattern and M conductor patterns, the number of M conductor patterns is the largest. In the configuration and method of testing the mutual insulation state of Na = Nb = 8 conductor patterns according to the procedure of performing "inspection processing" giving priority to combinations, depending on the combination of conductor patterns that satisfy the "exclusion condition" , the mutual insulation state of the eight conductor patterns can be tested by performing the "inspection process" a very small number of times.

Specifically, as an example, among the conductor patterns X1 to X8, conductor patterns X1-X6, conductor patterns X2-X6, conductor patterns X3-X6, conductor patterns X4-X6, conductor patterns X5-X6, and conductor patterns X6- The shortest separation distance between X7 and conductor patterns X6-X8 is less than or equal to a predetermined distance (an example of board X to be inspected with fewer adjacent patterns than the examples described with reference to FIGS. 2 to 13). ), such proximity pattern information is specified based on the inspection target board data D0.

Regarding the inspection target board X in such an example, as shown in FIG. (patterns that do not require inspection of insulation status). Furthermore, regarding the conductor patterns X1 to X5, X7, and It is specified that seven of these need to be inspected as insulation state inspection targets.

At this time, when there are multiple combinations of one conductor pattern out of the eight conductor patterns and M conductor patterns, the combination with the largest number of M conductor patterns is prioritized for inspection processing. In the configuration and method of inspecting the mutual insulation state of eight conductor patterns according to the procedure of performing the following, the conductor pattern X6, which has the largest number of M conductor patterns, 7, and the conductor patterns X1 to X5, If the inspection process for the combination of X7 and X8 is executed first, it will be specified. Further, as shown in FIG. 15, in this example of the board X to be inspected, by performing the inspection process on the combination of the conductor pattern X6 and the conductor patterns X1 to X5, X7, and X8, eight of the conductor patterns With regard to the individual conductor patterns, it is possible to determine the insulation state between the patterns formed at close distances where a short circuit may occur.

In this way, in this board inspection apparatus 1 and its board inspection method, the Na=8 probes 2 are moved separately and independently to bring the eight probes 2 into contact with the Na=8 conductor patterns, respectively. And one conductor pattern among the eight conductor patterns, and M conductor patterns excluding the conductor pattern that satisfies the predefined "exclusion condition" to exclude from the insulation condition inspection target for that one conductor pattern. In addition to measuring the amount to be measured (resistance value) between the The conductor pattern and the combination of the M conductor patterns are changed according to a predefined "change procedure" and executed multiple times to test the mutual insulation state of the eight conductor patterns.

Therefore, according to this board inspection apparatus 1 and board inspection method, when inspecting a board to be inspected In comparison, by collectively inspecting the insulation state between one conductor pattern and M conductor patterns, the number of "inspection processes" required to inspect one board to be inspected can be sufficiently reduced. It is possible to reduce the number of people. Thereby, according to the board inspection apparatus 1 and the board inspection method, the insulation state between a plurality of conductor patterns can be inspected in a short time.

In addition, in this board inspection apparatus 1 and its board inspection method, the Na=Nb=8 probes 2 are brought into contact with each of the Na=Nb=8 conductor patterns, and as a "change procedure", one conductor In accordance with the procedure that when there are multiple combinations of patterns and M conductor patterns, inspection processing is performed with priority given to combinations excluding the combination with the smallest number of M conductor patterns. Inspect the insulation condition between.

Therefore, according to this board inspection apparatus 1 and board inspection method, by giving priority to combinations with a large number of M conductor patterns, the insulation state between a large number of conductor patterns can be checked at an early stage of multiple inspection processes. Since it can be determined, the number of "inspection processes" required to inspect one substrate X to be inspected can be further reduced. Thereby, according to the board inspection apparatus 1 and the board inspection method, the insulation state between the plurality of conductor patterns can be inspected in a shorter time.

In addition, in this board inspection apparatus 1 and its board inspection method, when there are multiple combinations of one conductor pattern and M conductor patterns, as a "change procedure", the number of M conductor patterns is the largest number. The mutual insulation state of the eight conductor patterns is inspected according to the procedure of executing the inspection process with priority given to the combinations where .

Therefore, according to this board inspection apparatus 1 and board inspection method, by giving priority to the combination with the largest number of M conductor patterns, the insulation state between a large number of conductor patterns can be checked at an early stage of multiple inspection processes. can be suitably determined, so the number of "inspection processes" required to inspect one substrate X to be inspected can be further reduced. Thereby, according to the board inspection apparatus 1 and the board inspection method, the insulation state between the plurality of conductor patterns can be inspected in a shorter time.

Further, in this board inspection apparatus 1 and its board inspection method, a conductor pattern whose distance between the shortest separated portions of one conductor pattern exceeds a predetermined distance is determined as a conductor pattern that satisfies the "exclusion condition". Therefore, according to this board inspection apparatus 1 and board inspection method, the "inspection processing" required to inspect one board to be inspected The number of times of "processing" can be further reduced. Thereby, according to the board inspection apparatus 1 and the board inspection method, the insulation state between the plurality of conductor patterns can be inspected in a shorter time.

Note that the configuration of the "board inspection apparatus" and the specific contents of the "board inspection method" are not limited to the above-described configuration of the board inspection apparatus 1 and the example of the board inspection method. For example, although the configuration and method for generating the inspection procedure data D1 before starting the inspection on the conductor pattern X and performing the inspection process according to the generated inspection procedure data D1 have been described as an example, It is also possible to perform the inspection and the generation of the inspection procedure data D1 (determining between which conductor patterns the "insulation inspection" should be performed with priority) in parallel. The "quantity to be measured" is not limited to the resistance value, and a configuration and method for measuring any electrical parameter such as a current value or a voltage value as the "quantity to be measured" can be adopted.

According to the present invention, three or more probes are used to collectively test the insulation state between one conductor pattern and a plurality of other conductor patterns, so that a single board to be inspected can be inspected. The number of inspection processes required for inspection can be sufficiently reduced. This makes it possible to test the insulation state between multiple conductor patterns in a short time, so a board inspection device and a board inspection method for inspecting a board to be inspected on which multiple conductor patterns that should be mutually insulated are formed. It can be suitably used for.

1 Board inspection device 2 Probe 3 Movement mechanism 4 Measuring unit 5 Processing unit 6 Storage unit D0 Inspection target board data D1 Inspection procedure data D2 Inspection result data X Inspection target board X1, X2... Conductor pattern

Claims (8)

Measuring a predetermined quantity to be measured between each conductor pattern through a probe in contact with each conductor pattern on a board to be inspected on which a plurality of conductor patterns that should be mutually insulated are formed, A board inspection device configured to be able to inspect the insulation state between each conductor pattern based on the measured quantity,
Na probes (Na is a predefined natural number of 3 or more);
Na probe moving mechanisms configured to be able to move the Na probes separately and independently;
a measurement unit that measures the quantity to be measured;
A processing unit that controls the movement of the probe by the probe moving mechanism and the measurement of the measured quantity by the measuring unit, and inspects the insulation state between the conductor patterns based on the measured measured quantity. ,
The processing unit controls each of the probe moving mechanisms to bring the Na probes into contact with the Na conductor patterns, and to contact one of the Na conductor patterns with the Na conductor pattern. causing the measurement unit to measure the quantity to be measured between M conductor patterns excluding the conductor pattern that satisfies predefined exclusion conditions for excluding one conductor pattern from being inspected for the insulation state; An inspection process for inspecting the insulation state between the one conductor pattern and the M conductor patterns based on the measured quantity is performed on the combination of the one conductor pattern and the M conductor patterns. A board inspection device that inspects the mutual insulation state of the Na conductor patterns by changing the change according to a predefined change procedure and executing the change multiple times. comprising Nb (Nb is a natural number of 4 or more) said probes and Nb said probe moving mechanisms;
As the change procedure, when there are multiple combinations of the one conductor pattern and the M conductor patterns, the processing unit prioritizes combinations excluding the combination in which the number of the M conductor patterns is the smallest. 2. The board inspection apparatus according to claim 1, wherein the insulation state between the Nb conductor patterns is inspected according to the procedure of executing the inspection process. As the changing procedure, when a plurality of combinations of the one conductor pattern and the M conductor patterns exist, the processing unit gives priority to the combination in which the number of the M conductor patterns is the largest. 3. The board inspection apparatus according to claim 2, wherein the mutual insulation state of the Nb conductor patterns is inspected according to a procedure for executing an inspection process. 4. The processing unit determines, as a conductor pattern that satisfies the exclusion condition, a conductor pattern in which a distance between the shortest separated portions of the conductor pattern exceeds a predetermined distance. Board inspection equipment. Measuring a predetermined quantity to be measured between each conductor pattern through a probe in contact with each conductor pattern on a board to be inspected on which a plurality of conductor patterns that should be mutually insulated are formed, A board inspection method for inspecting the insulation state between each conductive pattern based on the measured quantity, the method comprising:
moving Na probes (Na is a predefined natural number of 3 or more) of the probes separately and independently to bring the Na probes into contact with the Na conductor patterns, and the Na conductor patterns; between one of the conductor patterns and M conductor patterns excluding the conductor pattern that satisfies predefined exclusion conditions for excluding the conductor pattern from being inspected for the insulation state of the one conductor pattern. In addition to measuring the measured quantity, an inspection process for inspecting the insulation state between the single conductive pattern and the M conductive patterns based on the measured quantity is performed on the single conductive pattern and the M conductive patterns. A board inspection method for inspecting the mutual insulation state of the Na conductor patterns by changing the combination of the M conductor patterns according to a predefined change procedure and performing the process multiple times. Nb (Nb is a natural number of 4 or more) of the probes are brought into contact with each of the Nb conductor patterns, and as the changing procedure, a plurality of combinations of the one conductor pattern and the M conductor patterns exist. The insulation state between the Nb conductor patterns is inspected according to a procedure in which the inspection process is performed with priority given to combinations excluding the combination in which the number of the M conductor patterns is the smallest when the number of the Nb conductor patterns is the smallest. 5. The board inspection method described in 5. As the changing procedure, when there are a plurality of combinations of the one conductor pattern and the M conductor patterns, the inspection process is performed with priority given to the combination with the largest number of the M conductor patterns. 7. The board inspection method according to claim 6, wherein the mutual insulation state of the Nb conductor patterns is inspected according to the procedure described in the following. 8. The board inspection method according to claim 5, wherein the conductor pattern whose distance between the shortest separated portions of the one conductor pattern exceeds a predetermined distance is a conductor pattern that satisfies the exclusion condition.

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