JP2021181148A - 基板処理装置、研磨ヘッド、及び基板処理方法 - Google Patents
基板処理装置、研磨ヘッド、及び基板処理方法 Download PDFInfo
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02082—Cleaning product to be cleaned
- H01L21/02087—Cleaning of wafer edges
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02096—Cleaning only mechanical cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
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- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
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- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
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- Condensed Matter Physics & Semiconductors (AREA)
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
12 保持部
13 回転部
20 研磨ヘッド
30 ホルダ
Claims (18)
- ベベルと端面とを周縁部に含む基板を保持する保持部と、
前記保持部を回転させる回転部と、
前記保持部に保持されている前記基板の前記周縁部に当接され、前記基板の前記周縁部を研磨する研磨ヘッドと、
前記研磨ヘッドが取付けられるホルダと、を備える、基板処理装置。 - 前記研磨ヘッドは、研磨砥粒を含む研磨シートと、前記研磨シートが固定される平坦面を含む研磨ブロックと、を備え、
前記研磨シートは、前記研磨ブロックの前記平坦面に固定され、前記基板の前記周縁部に当接される、請求項1に記載の基板処理装置。 - 前記研磨ブロックは、角錐体を有し、
前記角錐体は、前記平坦面である角錐面を含み、
前記研磨シートは、前記角錐体の前記角錐面に固定され、前記基板の前記ベベルを研磨する、請求項2に記載の基板処理装置。 - 前記研磨ブロックは、角柱体を有し、
前記角柱体は、前記平坦面である側面を含み、
前記研磨シートは、前記角柱体の前記側面に固定され、前記基板の前記端面を研磨する、請求項2又は3に記載の基板処理装置。 - 前記ホルダは、回転可能であって、前記基板の研磨中には回転停止され、
前記研磨ブロックは、前記ホルダの回転中心線を中心に回転対称に配置される複数の前記平坦面を有し、
前記研磨シートは、複数の前記平坦面に固定され、前記ホルダの前記回転中心線を中心に回転対称に配置される、請求項2〜4のいずれか1項に記載の基板処理装置。 - 前記ホルダの回転による前記研磨シートの切換の要否を判断する回転要否判断部と、
前記回転要否判断部の判断結果に応じて前記ホルダの回転を促す報知制御を行う報知制御部と、を備える、請求項5に記載の基板処理装置。 - 前記回転中心線を中心に前記ホルダを回転させる回転機構と、
前記回転機構を制御する回転制御部と、
前記ホルダの回転による前記研磨シートの切換の要否を判断する回転要否判断部と、を備え、
前記回転制御部は、前記回転要否判断部の判断結果に応じて前記ホルダを回転させる、請求項5に記載の基板処理装置。 - 前記ホルダを、前記研磨ヘッドを前記基板の前記周縁部に当接させる研磨位置と、前記基板の搬入出時に前記基板と前記ホルダの干渉を防止する待機位置との間で移動させる移動機構と、
前記移動機構を制御する移動制御部と、
前記ホルダの前記研磨位置の変更の要否を判断する変更要否判断部と、を備え、
前記移動制御部は、前記変更要否判断部の判断結果に応じて前記ホルダの前記研磨位置を変更する、請求項2〜7のいずれか1項に記載の基板処理装置。 - 前記研磨ヘッドは、前記研磨シートと前記研磨ブロックとの間に配置される可撓性シートを更に備える、請求項2〜8のいずれか1項に記載の基板処理装置。
- 前記研磨ヘッドを前記ホルダに交換可能に取付ける取付け具を備える、請求項1〜9のいずれか1項に記載の基板処理装置。
- 前記保持部に保持されている前記基板に洗浄液を供給する液供給部を備え、
前記液供給部は、前記基板の前記周縁部に向けて前記洗浄液を吐出するノズルを含み、
前記ノズルは、前記ホルダと共に移動させられる、請求項1〜10のいずれか1項に記載の基板処理装置。 - ベベルと端面とを周縁部に含む基板の前記周縁部を研磨する研磨ヘッドであって、
研磨砥粒を含む研磨シートと、
前記研磨シートが固定される平坦面を含む研磨ブロックと、を備え、
前記研磨シートは、前記研磨ブロックの前記平坦面に固定され、前記基板の前記周縁部に当接される、研磨ヘッド。 - 前記研磨ブロックは、角錐体を有し、
前記角錐体は、前記平坦面である角錐面を含み、
前記研磨シートは、前記角錐体の前記角錐面に固定され、前記基板の前記ベベルを研磨する、請求項12に記載の研磨ヘッド。 - 前記研磨ブロックは、角柱体を有し、
前記角柱体は、前記平坦面である側面を含み、
前記研磨シートは、前記角柱体の前記側面に固定され、前記基板の前記端面を研磨する、請求項12又は13に記載の研磨ヘッド。 - 前記研磨ブロックは、回転可能なホルダに取付けられ、前記ホルダの回転中心線を中心に回転対称に配置される複数の前記平坦面を有し、
前記研磨シートは、複数の前記平坦面に固定され、前記ホルダの前記回転中心線を中心に回転対称に配置される、請求項12〜14のいずれか1項に記載の研磨ヘッド。 - 前記研磨シートと前記研磨ブロックとの間に配置される可撓性シートを更に備える、請求項12〜15のいずれか1項に記載の研磨ヘッド。
- ベベルと端面とを周縁部に含む基板を回転させることと、
前記基板の前記周縁部に研磨ヘッドを当接させ、前記基板の前記周縁部を前記研磨ヘッドで研磨することと、を有する、基板処理方法。 - 前記研磨ヘッドは、研磨砥粒を含む研磨シートと、前記研磨シートが固定される平坦面を含む研磨ブロックと、を備え、
前記研磨シートは、前記研磨ブロックの前記平坦面に固定され、前記基板の前記周縁部に当接される、請求項17に記載の基板処理方法。
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JP2020088304A JP7479194B2 (ja) | 2020-05-20 | 2020-05-20 | 基板処理装置、及び基板処理方法 |
KR1020210058417A KR20210143654A (ko) | 2020-05-20 | 2021-05-06 | 기판 처리 장치, 연마 헤드, 및 기판 처리 방법 |
TW110116504A TW202204093A (zh) | 2020-05-20 | 2021-05-07 | 基板處理裝置、研磨頭及基板處理方法 |
US17/314,542 US11787006B2 (en) | 2020-05-20 | 2021-05-07 | Substrate processing apparatus, polishing head, and substrate processing method |
CN202110522747.3A CN114102423A (zh) | 2020-05-20 | 2021-05-13 | 基板处理装置、研磨头和基板处理方法 |
CN202121019889.XU CN215588812U (zh) | 2020-05-20 | 2021-05-13 | 基板处理装置和研磨头 |
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JP2738392B1 (ja) * | 1996-11-05 | 1998-04-08 | 日本電気株式会社 | 半導体装置の研磨装置及び研磨方法 |
US6913520B1 (en) * | 2004-01-16 | 2005-07-05 | United Microelectronics Corp. | All-in-one polishing process for a semiconductor wafer |
JP4284215B2 (ja) | 2004-03-24 | 2009-06-24 | 株式会社東芝 | 基板処理方法 |
JP2006022185A (ja) | 2004-07-07 | 2006-01-26 | Nitta Haas Inc | 両面粘着テープ |
CN102513920B (zh) * | 2004-11-01 | 2016-04-27 | 株式会社荏原制作所 | 抛光设备 |
JP2009147044A (ja) | 2007-12-13 | 2009-07-02 | Panasonic Corp | 半導体装置の製造方法および製造装置 |
WO2009154075A1 (ja) * | 2008-06-16 | 2009-12-23 | 東京エレクトロン株式会社 | 処理装置 |
KR20110077314A (ko) * | 2009-12-30 | 2011-07-07 | 주식회사 엘지실트론 | 웨이퍼 에지 연마용 챔퍼 유니트 및 이를 이용한 에지 연마방법 |
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US10460926B2 (en) * | 2017-11-17 | 2019-10-29 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for chemical mechanical polishing process |
CN110450018A (zh) * | 2019-07-29 | 2019-11-15 | 云和县凯毅德电子设备厂 | 一种外圈滚子沟槽自动打磨装置 |
CN110919485B (zh) * | 2019-12-17 | 2021-06-04 | 赣州市桐鑫金属制品有限公司 | 一种可自动进行不同精度打磨的建筑圆形板材加工设备 |
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