JP2021162613A - Light source device, luminaire, and exposure device - Google Patents

Light source device, luminaire, and exposure device Download PDF

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JP2021162613A
JP2021162613A JP2020060987A JP2020060987A JP2021162613A JP 2021162613 A JP2021162613 A JP 2021162613A JP 2020060987 A JP2020060987 A JP 2020060987A JP 2020060987 A JP2020060987 A JP 2020060987A JP 2021162613 A JP2021162613 A JP 2021162613A
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led
light source
source device
led chips
substrate
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JP7458853B2 (en
JP2021162613A5 (en
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大輔 安永
Daisuke Yasunaga
健太郎 昼間
Kentaro Hiruma
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Canon Inc
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Canon Inc
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Priority to KR1020210036402A priority patent/KR20210122109A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/56—Cooling arrangements using liquid coolants
    • F21V29/58—Cooling arrangements using liquid coolants characterised by the coolants
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G03F7/70891—Temperature
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V5/00—Refractors for light sources
    • F21V5/04—Refractors for light sources of lens shape
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70008—Production of exposure light, i.e. light sources
    • G03F7/7005—Production of exposure light, i.e. light sources by multiple sources, e.g. light-emitting diodes [LED] or light source arrays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
    • H05B45/10—Controlling the intensity of the light
    • H05B45/14—Controlling the intensity of the light using electrical feedback from LEDs or from LED modules
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

Abstract

To prevent a total output of light from lowering in a light source device having an LED as a light source.SOLUTION: A light source device 1 includes; an LED array having a circuit including a substrate 2 and a plurality of LED chips 3 different in luminous efficiency arranged on the substrate 2; and a cooler 4 for cooling the LED array by a coolant flowing from a coolant inlet 8 to a coolant outlet 9. The light source device irradiates a lighting surface with light from the LED array. The plurality of LED chips 3 are arranged on the substrate according to information showing a cooling power of the cooler 4 and the luminous efficiencies of the LED chips 3.SELECTED DRAWING: Figure 5

Description

本発明は、光源装置、照明装置、及び露光装置に関する。 The present invention relates to a light source device, a lighting device, and an exposure device.

半導体デバイスやフラットパネルディスプレイ（ＦＰＤ）の製造工程において露光装置が用いられている。露光装置は、リソグラフィ工程において、原版であるレチクルやマスクのパターンを、投影光学系を介して感光性の基板（例えば、表面にレジスト層が形成されたウエハやガラスプレート）に転写する。 Exposure devices are used in the manufacturing process of semiconductor devices and flat panel displays (FPDs). In the lithography process, the exposure apparatus transfers the pattern of the original reticle or mask to a photosensitive substrate (for example, a wafer or glass plate having a resist layer formed on the surface) via a projection optical system.

露光装置の光源として、例えば水銀ランプが用いられているが、近年、水銀ランプの代わりに、省エネルギーである発光ダイオード（ＬＥＤ：Ｌｉｇｈｔ Ｅｍｉｔｔｉｎｇ Ｄｉｏｄｅ）へ置換することが期待されている。ＬＥＤは発光を制御する基板回路に電流を流してから、光の出力が安定するまでの時間が短く、水銀ランプのように常時発光させる必要がないため、長寿命でもある。 For example, a mercury lamp is used as a light source of an exposure apparatus, but in recent years, it is expected to replace the mercury lamp with an energy-saving light emitting diode (LED: Light Emitting Diode). An LED has a long life because it takes a short time from when a current is passed through a substrate circuit that controls light emission until the light output stabilizes, and it is not necessary to constantly emit light unlike a mercury lamp.

ただし、ＬＥＤチップ１個当たりの光出力は極めて小さい。そこで、水銀ランプの代わりに光源としてＬＥＤを用いる場合、複数のＬＥＤチップ（一例としては１０００個程度）を基板に整列させたＬＥＤアレイを用いて光の総出力を大きくすることや、発熱したＬＥＤチップを効率よく冷却するための技術が求められる。 However, the light output per LED chip is extremely small. Therefore, when an LED is used as a light source instead of a mercury lamp, the total output of light can be increased by using an LED array in which a plurality of LED chips (for example, about 1000) are arranged on a substrate, or an LED that generates heat can be used. Technology for efficiently cooling the chip is required.

また、同じ規格内のＬＥＤチップであったとしても、ＬＥＤチップを製造する際の製造誤差によって発光効率に差がある場合がある。特許文献１は、ＬＥＤを光源としたバックライトについて開示しており、ＬＥＤチップの発光効率が良い場合には配置するＬＥＤチップの数を減らしてコストを抑えることができる技術を開示している。 Further, even if the LED chips are within the same standard, there may be a difference in luminous efficiency due to a manufacturing error in manufacturing the LED chip. Patent Document 1 discloses a backlight using an LED as a light source, and discloses a technique capable of reducing the number of LED chips to be arranged to reduce the cost when the luminous efficiency of the LED chips is good.

特開２００９−１２９５９１号公報Japanese Unexamined Patent Publication No. 2009-129591

複数のＬＥＤチップを使用する場合、ＬＥＤチップの発熱によりＬＥＤチップの許容温度を越えてしまい、ＬＥＤチップが不点灯となってしまうことが問題となる。特許文献１にはこのような課題認識が存在せず、ＬＥＤチップからの発熱に関する内容について開示していない。 When a plurality of LED chips are used, there is a problem that the heat generated by the LED chips exceeds the allowable temperature of the LED chips and the LED chips are not lit. Patent Document 1 does not have such a problem recognition and does not disclose the contents related to heat generation from the LED chip.

そこで、本発明は、ＬＥＤを光源とした光源装置において、光の総出力の低下を抑制するために有利な技術を提供することを目的としている。 Therefore, an object of the present invention is to provide an advantageous technique for suppressing a decrease in the total output of light in a light source device using an LED as a light source.

上記目的を達成するために、本発明の一側面としての光源装置は、基板と、前記基板上に配置された発光効率が異なる複数のＬＥＤチップを含む回路を備えたＬＥＤアレイと、冷媒入口から冷媒出口に向かって流れる冷媒により、前記ＬＥＤアレイを冷却するための冷却器を有し、前記ＬＥＤアレイからの光を照明面に照明する光源装置において、前記冷却器の冷却力と前記ＬＥＤチップの発光効率を示す情報に基づいて、前記基板上に前記複数のＬＥＤチップが配置されていることを特徴とする。 In order to achieve the above object, the light source device as one aspect of the present invention comprises a substrate, an LED array having a circuit including a plurality of LED chips having different light emission efficiencies arranged on the substrate, and a refrigerant inlet. In a light source device that has a cooler for cooling the LED array by the refrigerant flowing toward the refrigerant outlet and illuminates the illumination surface with light from the LED array, the cooling power of the cooler and the LED chip. The plurality of LED chips are arranged on the substrate based on the information indicating the light emission efficiency.

本発明によれば、例えば、ＬＥＤを光源とした光源装置において、光の総出力の低下を抑制するために有利な技術を提供することができる。 According to the present invention, for example, in a light source device using an LED as a light source, it is possible to provide an advantageous technique for suppressing a decrease in the total output of light.

光学装置の平面図である。It is a top view of an optical device. 冷却器の内部構造を示す図である。It is a figure which shows the internal structure of a cooler. 発光効率を説明する図である。It is a figure explaining the luminous efficiency. 比較例を示す図である。It is a figure which shows the comparative example. 第１実施形態における光学装置の平面図である。It is a top view of the optical apparatus in 1st Embodiment. 第２実施形態における光学装置の平面図である。It is a top view of the optical apparatus in 2nd Embodiment. 第３実施形態における光学装置の平面図である。It is a top view of the optical apparatus in 3rd Embodiment. 照明光学系の概略図である。It is a schematic diagram of an illumination optical system. 光源部の断面概略図である。It is sectional drawing of the light source part. 露光装置の概略図である。It is the schematic of the exposure apparatus.

以下に本発明の好ましい実施形態を添付の図面に基づいて詳細に説明する。 Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

＜第１実施形態＞
図１を用いて光源装置１について説明する。図１は本実施形態の光源装置１の平面図である。光源装置１は、電気基板２、ＬＥＤチップ３、冷却器４、及び制御部５を有する。電気基板２上には、複数のＬＥＤチップ３が配置されており、以下では、電気基板２と複数のＬＥＤチップ３をまとめてＬＥＤアレイと呼ぶ。電気基板２には銅配線がＬＥＤチップ３に接続・実装されており、ＬＥＤチップ３を駆動するための回路が形成されている。回路に電流を流すことで、ＬＥＤチップ３から所定の波長の光が出力され、ＬＥＤチップ３が発熱する。 <First Embodiment>
The light source device 1 will be described with reference to FIG. FIG. 1 is a plan view of the light source device 1 of the present embodiment. The light source device 1 includes an electric board 2, an LED chip 3, a cooler 4, and a control unit 5. A plurality of LED chips 3 are arranged on the electric board 2, and hereinafter, the electric board 2 and the plurality of LED chips 3 are collectively referred to as an LED array. Copper wiring is connected and mounted on the LED chip 3 on the electric board 2, and a circuit for driving the LED chip 3 is formed. By passing a current through the circuit, light having a predetermined wavelength is output from the LED chip 3, and the LED chip 3 generates heat.

本実施形態におけるＬＥＤアレイは、複数のＬＥＤチップ３が電気的に直列に配置されたチップ列を形成している。図１に示すようにチップ列を複数含んでＬＥＤアレイが形成されても良く、チップ列は、コネクタ６ａ、６ｂを介して制御部５に接続されている。 The LED array in this embodiment forms a chip array in which a plurality of LED chips 3 are electrically arranged in series. As shown in FIG. 1, an LED array may be formed by including a plurality of chip rows, and the chip rows are connected to the control unit 5 via connectors 6a and 6b.

制御部５は、電源を含み、ＬＥＤチップ３に流れる電流や電源に印加する電圧を制御し、ＬＥＤチップ３から出力される光量を制御する。制御部５は、光学装置１で照明する照明面で目標照度となるようにＬＥＤチップ３に流れる電流や電源に印加する電圧を制御しても良い。制御部５は、１つの制御部が複数のチップ列に接続されても良いし、複数の制御部がチップ列のまとまり毎に接続されて、制御部毎にＬＥＤチップに流れる電流や電源に印加する電圧を制御しても良い。 The control unit 5 includes a power supply, controls the current flowing through the LED chip 3 and the voltage applied to the power supply, and controls the amount of light output from the LED chip 3. The control unit 5 may control the current flowing through the LED chip 3 and the voltage applied to the power supply so that the target illuminance is achieved on the illumination surface illuminated by the optical device 1. In the control unit 5, one control unit may be connected to a plurality of chip rows, or a plurality of control units may be connected to each chip row and applied to the current or power supply flowing through the LED chip for each control unit. You may control the voltage to be used.

冷却器４は、電気基板２のＬＥＤチップ３が配置されている面とは反対側の面に接している。冷却器４は、冷却器４内部を冷媒が流れることにより、電気基板２から熱を奪ってＬＥＤアレイを冷却する。図２は冷却器４の内部構造を示す図である。冷却器４は、冷凍機７に接続されており、冷却器４の冷媒入口８から冷媒出口９に向かって冷媒が流れる。電気基板２から熱を奪った後の冷媒は、冷却器出口９から冷凍機７へと循環することで、再びＬＥＤアレイを冷却する。 The cooler 4 is in contact with a surface of the electric substrate 2 opposite to the surface on which the LED chip 3 is arranged. The cooler 4 takes heat from the electric board 2 and cools the LED array by allowing the refrigerant to flow inside the cooler 4. FIG. 2 is a diagram showing the internal structure of the cooler 4. The cooler 4 is connected to the refrigerator 7, and the refrigerant flows from the refrigerant inlet 8 of the cooler 4 toward the refrigerant outlet 9. The refrigerant after removing heat from the electric substrate 2 circulates from the cooler outlet 9 to the refrigerator 7 to cool the LED array again.

冷媒が単位時間あたりにＬＥＤアレイから除去できる熱量で定義される冷却力を向上させるため、冷却器４には冷媒入口側から冷媒出口側の方向に沿って複数の仕切り１０が延在している。これにより、冷却器４全体に冷媒を行き届かせる流路を形成する。冷媒は仕切り１０間を流れて、熱交換により電気基板２から熱を奪い、ＬＥＤアレイを冷却する。冷媒には、例えば、冷却力が優れている水を主成分とする液体や、電気絶縁性に優れたオイルを主成分する液体が用いられる。 In order to improve the cooling force defined by the amount of heat that the refrigerant can remove from the LED array per unit time, the cooler 4 has a plurality of partitions 10 extending from the refrigerant inlet side to the refrigerant outlet side. .. As a result, a flow path for delivering the refrigerant to the entire cooler 4 is formed. The refrigerant flows between the partitions 10 and takes heat from the electric board 2 by heat exchange to cool the LED array. As the refrigerant, for example, a liquid containing water as a main component having excellent cooling power or a liquid containing oil having excellent electrical insulation as a main component is used.

上記の冷却力を向上させるために、熱伝導率の良い素材を電気基板２や冷却器４に用いることが好ましい。電気基板２の基材としては、例えば、熱伝導率の高い窒化アルミニウムを用いると良い。冷却器４の素材としては、例えば、銅やアルミニウムなどを用いると良い。 In order to improve the cooling power, it is preferable to use a material having good thermal conductivity for the electric substrate 2 and the cooler 4. As the base material of the electric substrate 2, for example, aluminum nitride having high thermal conductivity may be used. As the material of the cooler 4, for example, copper or aluminum may be used.

（ＬＥＤチップの発光効率と発熱量）
ＬＥＤチップの発光効率について説明する。図３はＬＥＤチップ３に流す電流とＬＥＤチップ３にかかる電力量（光出力量と発熱量の和で表せる）の関係を示す図である。ＬＥＤチップ３に電流が流れると、電流の大きさに応じて、ＬＥＤチップ３から光が出力される。電流に対するＬＥＤチップ３の光出力量は、ＬＥＤチップ３の発光効率により決まる。ＬＥＤチップ３の発光効率は、ＬＥＤチップ３にかかる電力に対するＬＥＤチップ３の光出力の大きさの割合で定義され、
図３（ａ）は発光効率が低い例であり、ＬＥＤチップ３にかかる電力に対してＬＥＤチップの光出力が小さく、ＬＥＤチップの発熱量が大きい。一方、図３（ｂ）は発光効率が高い例であり、ＬＥＤチップ３にかかる電力に対してＬＥＤチップの光出力が大きく、ＬＥＤチップの発熱量が小さい。即ち、発光効率が異なるＬＥＤチップで同じ光出力を得るためには、発光効率が低いＬＥＤチップに流す電流を大きくする必要がある。この時、発光効率が低いＬＥＤチップでは、発光効率が高いＬＥＤチップに比べて発熱量が大きくなる。 (Luminous efficiency and calorific value of LED chip)
The luminous efficiency of the LED chip will be described. FIG. 3 is a diagram showing the relationship between the current flowing through the LED chip 3 and the amount of electric power applied to the LED chip 3 (which can be expressed by the sum of the amount of light output and the amount of heat generated). When a current flows through the LED chip 3, light is output from the LED chip 3 according to the magnitude of the current. The amount of light output of the LED chip 3 with respect to the current is determined by the luminous efficiency of the LED chip 3. The luminous efficiency of the LED chip 3 is defined by the ratio of the magnitude of the light output of the LED chip 3 to the electric power applied to the LED chip 3.
FIG. 3A shows an example in which the luminous efficiency is low, the light output of the LED chip is small with respect to the electric power applied to the LED chip 3, and the amount of heat generated by the LED chip is large. On the other hand, FIG. 3B shows an example in which the luminous efficiency is high, the light output of the LED chip is large with respect to the electric power applied to the LED chip 3, and the amount of heat generated by the LED chip is small. That is, in order to obtain the same light output with LED chips having different luminous efficiencies, it is necessary to increase the current flowing through the LED chips having low luminous efficiencies. At this time, the LED chip having a low luminous efficiency generates a larger amount of heat than the LED chip having a high luminous efficiency.

また、図３に示すように、ＬＥＤチップからの光出力を大きくするには、ＬＥＤチップに流す電流を大きくする必要がある。電流を大きくすると、ＬＥＤチップの発光効率に応じてＬＥＤチップが発熱する。ＬＥＤチップには許容可能なＬＥＤチップの許容温度があり、ＬＥＤチップの温度がその許容温度を超えると、ＬＥＤチップが不点灯となる。ＬＥＤチップの温度は、ＬＥＤチップの発熱量と冷媒の冷却力に依存して決まる。そのため、ＬＥＤチップに流す電流は、ＬＥＤチップの発熱量によって制限される。 Further, as shown in FIG. 3, in order to increase the light output from the LED chip, it is necessary to increase the current flowing through the LED chip. When the current is increased, the LED chip generates heat according to the luminous efficiency of the LED chip. The LED chip has an allowable allowable temperature of the LED chip, and when the temperature of the LED chip exceeds the allowable temperature, the LED chip is turned off. The temperature of the LED chip depends on the calorific value of the LED chip and the cooling power of the refrigerant. Therefore, the current flowing through the LED chip is limited by the amount of heat generated by the LED chip.

また、ＬＥＤチップがチップ列を構成する場合には、１つのＬＥＤチップが不点灯となると、同じチップ列の他のＬＥＤチップも不点灯となってしまう。したがって、チップ列へ投入可能な最大の電流は、ＬＥＤチップの発光効率に依存する。（同様に、冷媒による冷却力にも依存する。）
上記のようなＬＥＤチップの発光効率の違いは、同じ規格のＬＥＤチップの間にも製造誤差等により生じる。ＬＥＤチップは、予め発光効率を示す情報に基づいてランクの分類がされており、発光効率が高いＬＥＤチップを、高いランクのＬＥＤチップと呼ぶ。 Further, when the LED chips form a chip row, if one LED chip is turned off, the other LED chips in the same chip row are also turned off. Therefore, the maximum current that can be applied to the chip row depends on the luminous efficiency of the LED chip. (Similarly, it depends on the cooling power of the refrigerant.)
The difference in luminous efficiency of LED chips as described above occurs due to manufacturing errors and the like even between LED chips of the same standard. The LED chips are classified in rank based on the information indicating the luminous efficiency in advance, and the LED chip having high luminous efficiency is called a high rank LED chip.

（比較例）
本実施例の比較例として、ＬＥＤチップのランクを考慮せずに、ＬＥＤチップがランダムに配置される場合について説明する。図４は異なるランクのＬＥＤチップ３ａ〜３ｃがランダムに配置されている光源装置の図である。ＬＥＤチップ３ａ〜３ｃにおけるランクの高い順番は、３ｃ、３ｂ、３ａとなる。 (Comparison example)
As a comparative example of this embodiment, a case where the LED chips are randomly arranged without considering the rank of the LED chips will be described. FIG. 4 is a diagram of a light source device in which LED chips 3a to 3c of different ranks are randomly arranged. The order of highest rank in the LED chips 3a to 3c is 3c, 3b, 3a.

また、冷却器４は、冷媒入口８付近の領域と冷媒出口９付近の領域とでは冷却力が異なる。冷媒出口９付近の領域では既に熱交換が繰り返されている冷媒が流入してくるために、冷媒入口８付近の領域に比べて冷却力が低い。比較例では、冷却器４内での冷却力の違いを考慮せずにＬＥＤチップ３ａ〜３ｃが配置されている。 Further, the cooling power of the cooler 4 is different between the region near the refrigerant inlet 8 and the region near the refrigerant outlet 9. Since the refrigerant whose heat exchange has already been repeated flows into the region near the refrigerant outlet 9, the cooling power is lower than that in the region near the refrigerant inlet 8. In the comparative example, the LED chips 3a to 3c are arranged without considering the difference in the cooling force in the cooler 4.

冷却器４の冷却力が一様であれば、ＬＥＤチップ３ａ〜３ｃがランダムに配置されても良い。しかしながら、比較例のように、冷却器４の冷却力が領域により異なる場合にはＬＥＤチップ３ａ〜３ｃがランダムに配置されることは好ましくない。冷却力が低い冷媒出口９付近の領域に発光効率が低いＬＥＤチップ３ａが配置された場合、ＬＥＤチップ３ｂ、３ｃと比較して発熱量が大きいにもかかわらず、冷却器４の冷却力は低い。このようにＬＥＤチップの温度が上昇しやすい場合には、ＬＥＤチップが不点灯とならない範囲で電流を流さなければならず、十分な光出力を得ることができない。 If the cooling power of the cooler 4 is uniform, the LED chips 3a to 3c may be randomly arranged. However, when the cooling power of the cooler 4 differs depending on the region as in the comparative example, it is not preferable that the LED chips 3a to 3c are randomly arranged. When the LED chip 3a having low luminous efficiency is arranged in the region near the refrigerant outlet 9 having low cooling power, the cooling power of the cooler 4 is low even though the calorific value is larger than that of the LED chips 3b and 3c. .. When the temperature of the LED chip tends to rise in this way, a current must be passed within a range in which the LED chip does not turn off, and a sufficient light output cannot be obtained.

（本実施例でのＬＥＤチップの配置）
本実施例では、ＬＥＤチップの発光効率のランクを考慮して、ＬＥＤチップの配置を決定している。図５は、異なるランクのＬＥＤチップ３ａ〜３ｃが、冷却器４の冷却力を考慮して配置されている光源装置の図である。冷却器４の冷媒が流れる方向はチップ列におけるＬＥＤチップの配列方向と平行であり、比較例と同様に、冷媒出口９付近の領域では既に熱交換が繰り返されている冷媒が流入してくるために、冷媒入口８付近の領域に比べて冷却力が低い。 (Arrangement of LED chips in this embodiment)
In this embodiment, the arrangement of the LED chips is determined in consideration of the rank of the luminous efficiency of the LED chips. FIG. 5 is a diagram of a light source device in which LED chips 3a to 3c of different ranks are arranged in consideration of the cooling power of the cooler 4. The direction in which the refrigerant of the cooler 4 flows is parallel to the direction in which the LED chips are arranged in the chip row, and as in the comparative example, the refrigerant whose heat exchange has already been repeated flows into the region near the refrigerant outlet 9. In addition, the cooling power is lower than that in the region near the refrigerant inlet 8.

本実施形態では、冷却力が高い冷媒入口８付近の領域には低いランクであるＬＥＤチップ３ａを配置している。ＬＥＤチップ３ａは、ＬＥＤチップ３ｂや３ｃと比較してＬＥＤチップの発熱量が大きいため、冷却力が高い基板領域に配置している。冷却力が高い基板領域にＬＥＤチップ３ａを配置する理由は、冷却力が低い基板領域にＬＥＤチップ３ａを配置する場合に比べて、電流を大きくすることが可能となるためである。即ち、発光効率が低いＬＥＤチップ３ａにおいても、光出力を大きくすることができる。 In the present embodiment, the LED chip 3a having a low rank is arranged in the region near the refrigerant inlet 8 having a high cooling power. Since the LED chip 3a generates a large amount of heat of the LED chip as compared with the LED chips 3b and 3c, the LED chip 3a is arranged in a substrate region having a high cooling power. The reason why the LED chip 3a is arranged in the substrate region where the cooling power is high is that the current can be increased as compared with the case where the LED chip 3a is arranged in the substrate region where the cooling power is low. That is, even in the LED chip 3a having low luminous efficiency, the light output can be increased.

また、本実施形態では、冷却力が低い冷媒出口９付近の領域には高いランクのＬＥＤチップ３ｃを配置している。ＬＥＤチップ３ｃは、ＬＥＤチップ３ａや３ｂと比較してＬＥＤチップの発熱量が小さいため、冷却力が低い基板領域に配置している。冷却力が低い基板領域にＬＥＤチップ３ｃを配置することにより、ＬＥＤチップ３ｃより発光効率が低いＬＥＤチップ３ａや３ｂを冷却力が高い基板領域に配置できるため、ＬＥＤチップが不点灯とならない範囲で最大の電流を流すことができる。 Further, in the present embodiment, the high-ranked LED chip 3c is arranged in the region near the refrigerant outlet 9 having a low cooling power. Since the LED chip 3c generates a smaller amount of heat than the LED chips 3a and 3b, it is arranged in a substrate region where the cooling power is low. By arranging the LED chip 3c in the substrate region where the cooling power is low, the LED chips 3a and 3b having lower luminous efficiency than the LED chip 3c can be arranged in the substrate region where the cooling power is high, so that the LED chip does not turn off. Maximum current can flow.

そのため、ＬＥＤアレイ全体としては光出力を大きくすることができる。したがって、比較例よりもＬＥＤチップの光出力を向上させることができる。 Therefore, the light output of the LED array as a whole can be increased. Therefore, the light output of the LED chip can be improved as compared with the comparative example.

本実施形態では、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向と平行である形態について説明したが、完全に平行でなくても良い。例えば、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向に対して、水平な成分を含むような配置であれば良い。 In the present embodiment, the direction in which the refrigerant of the cooler 4 flows is parallel to the arrangement direction of the LED chips in the chip row, but it does not have to be completely parallel. For example, the arrangement may be such that the direction in which the refrigerant of the cooler 4 flows includes a component horizontal to the arrangement direction of the LED chips in the chip row.

本実施形態では、１つのチップ列に対して３つのＬＥＤチップ３ａ〜３ｃで構成されているが、これに限らず３つ以外の個数のＬＥＤチップで構成されても良い。また、１つのチップ列に３つ以上のＬＥＤチップを使用する場合、冷媒入口側から冷媒出口側に向かって発光効率の低いＬＥＤチップから順番に配置してもよい。また、ＬＥＤチップのランクが３段階である場合について説明したが、２段階でも良いし４段階以上のランクに分類しても良い。 In the present embodiment, one chip row is composed of three LED chips 3a to 3c, but the present invention is not limited to this, and may be composed of a number of LED chips other than three. Further, when three or more LED chips are used in one chip row, the LED chips having the lowest luminous efficiency may be arranged in order from the refrigerant inlet side to the refrigerant outlet side. Further, although the case where the rank of the LED chip has three stages has been described, it may be classified into two stages or four or more stages.

本実施形態では、電気基板２にＬＥＤチップ３ａ〜３ｃを直接実装した形態で説明しているが、回路への接続が容易であるＬＥＤパッケージを使用してもよい。また、同一チップ列内のＬＥＤチップ３ａ〜３ｃの配置は等間隔と不等間隔のどちらでも良いし、チップ列間の配置も等間隔と不等間隔のどちらでも良い。 In the present embodiment, the LED chips 3a to 3c are directly mounted on the electric board 2, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3a to 3c in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows may be either equal intervals or unequal intervals.

＜第２実施形態＞
第１実施形態では、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向と平行である形態について説明した。本実施形態では、ＬＥＤチップの発光効率のランクを考慮してＬＥＤチップの配置を決定しているという点では第１実施形態と同じだが、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向と垂直である形態について説明する。図５は、異なるランクのＬＥＤチップ３ａ〜３ｃが、冷却器４の冷却力を考慮して配置されている光源装置の図である。 <Second Embodiment>
In the first embodiment, the mode in which the direction in which the refrigerant of the cooler 4 flows is parallel to the arrangement direction of the LED chips in the chip row has been described. The present embodiment is the same as the first embodiment in that the arrangement of the LED chips is determined in consideration of the rank of the luminous efficiency of the LED chips, but the direction in which the refrigerant of the cooler 4 flows is the LED in the chip row. The form perpendicular to the arrangement direction of the chips will be described. FIG. 5 is a diagram of a light source device in which LED chips 3a to 3c of different ranks are arranged in consideration of the cooling power of the cooler 4.

本実施形態では、１つのチップ列に同一のランクのＬＥＤチップが構成される。冷却力が高い冷媒入口８付近の領域には、低いランクであるＬＥＤチップ３ａで構成されるチップ列が配置される。また、冷却力が低い冷媒入口８付近の領域には、高いランクであるＬＥＤチップ３ｃで構成されるチップ列が配置される。 In the present embodiment, LED chips of the same rank are configured in one chip row. In the region near the refrigerant inlet 8 having a high cooling power, a chip row composed of LED chips 3a having a low rank is arranged. Further, in the region near the refrigerant inlet 8 having a low cooling power, a chip row composed of LED chips 3c having a high rank is arranged.

第１実施形態の説明でも述べたように、低いランクであるＬＥＤチップ３ａは、ＬＥＤチップ３ｂや３ｃと比較してＬＥＤチップの発熱量が大きいため、冷却力が高い基板領域に配置している。冷却力が高い基板領域にＬＥＤチップ３ａを配置する理由は、冷却力が低い基板領域にＬＥＤチップ３ａを配置する場合に比べて、電流を大きくすることが可能となるためである。即ち、発光力が低いＬＥＤチップ３ａにおいても、光出力を大きくすることができる。 As described in the description of the first embodiment, the low rank LED chip 3a is arranged in the substrate region having high cooling power because the LED chip generates a large amount of heat as compared with the LED chips 3b and 3c. .. The reason why the LED chip 3a is arranged in the substrate region where the cooling power is high is that the current can be increased as compared with the case where the LED chip 3a is arranged in the substrate region where the cooling power is low. That is, even in the LED chip 3a having a low light emitting power, the light output can be increased.

また、冷却力が低い冷媒出口９付近の領域には、高いランクであるＬＥＤチップ３ｃを配置している。ＬＥＤチップ３ｃは、ＬＥＤチップ３ａや３ｂと比較してＬＥＤチップの発熱量が小さいため、冷却力が低い基板領域に配置している。冷却力が低い基板領域にＬＥＤチップ３ｃを配置することにより、ＬＥＤチップ３ｃより発光効率が低いＬＥＤチップ３ａや３ｂを冷却力が高い基板領域に配置できるため、ＬＥＤチップが不点灯とならない範囲で最大の電流を流すことができる。そのため、ＬＥＤアレイ全体としては光出力を向上させることができる。 Further, the LED chip 3c having a high rank is arranged in the region near the refrigerant outlet 9 having a low cooling power. Since the LED chip 3c generates a smaller amount of heat than the LED chips 3a and 3b, it is arranged in a substrate region where the cooling power is low. By arranging the LED chip 3c in the substrate region where the cooling power is low, the LED chips 3a and 3b having lower luminous efficiency than the LED chip 3c can be arranged in the substrate region where the cooling power is high, so that the LED chip does not turn off. Maximum current can flow. Therefore, the light output of the LED array as a whole can be improved.

本実施形態では、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向と垂直である形態について説明したが、完全に垂直でなくても良い。例えば、冷却器４の冷媒が流れる方向が、チップ列におけるＬＥＤチップの配列方向に対して、垂直な成分を含むような配置であれば良い。 In the present embodiment, the direction in which the refrigerant of the cooler 4 flows is perpendicular to the arrangement direction of the LED chips in the chip row, but it does not have to be completely vertical. For example, the arrangement may be such that the direction in which the refrigerant of the cooler 4 flows includes a component perpendicular to the arrangement direction of the LED chips in the chip row.

本実施形態では、１つのチップ列に対して３つのＬＥＤチップ３ａ〜３ｃで構成されているが、これに限らず３つ以外の個数のＬＥＤチップで構成されても良い。また、ＬＥＤアレイは６つのチップ列で構成されているが、これに限らず６つ以外のチップ列で構成されても良い。また、違うチップ列に同じランクのＬＥＤチップが配置されても良く、冷媒入口側から冷媒出口側に向かって発光効率が高くなるようにＬＥＤチップを配置してもよい。また、ＬＥＤチップのランクが３段階である場合について説明したが、２段階でも良いし４段階以上のランクに分類しても良い。 In the present embodiment, one chip row is composed of three LED chips 3a to 3c, but the present invention is not limited to this, and may be composed of a number of LED chips other than three. Further, the LED array is composed of six chip rows, but the LED array is not limited to this and may be composed of a chip row other than six. Further, LED chips of the same rank may be arranged in different chip rows, and LED chips may be arranged so that the luminous efficiency increases from the refrigerant inlet side to the refrigerant outlet side. Further, although the case where the rank of the LED chip has three stages has been described, it may be classified into two stages or four or more stages.

本実施形態では、電気基板２にＬＥＤチップ３ａ〜３ｃを直接実装した形態で説明しているが、回路への接続が容易であるＬＥＤパッケージを使用してもよい。また、同一チップ列内のＬＥＤチップ３ａ〜３ｃの配置は等間隔と不等間隔のどちらでも良いし、チップ列間の配置も等間隔と不等間隔のどちらでも良い。 In the present embodiment, the LED chips 3a to 3c are directly mounted on the electric board 2, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3a to 3c in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows may be either equal intervals or unequal intervals.

＜第３実施形態＞
第１実施形態と第２実施形態では、冷媒の流路が１方向である場合について説明した。本実施形態では、冷媒の流路が複数方向存在するものについて説明する。図７（ａ）、図７（ｂ）は、２つの冷媒入口８ａ、８ｂと、２つの冷媒出口９ａ、９ｂを有する光源装置１の図である。冷媒の流路は、冷媒入口８ａ側から冷媒出口９ａ側の方向と、冷媒入口８ｂ側から冷媒出口９ｂ側の方向の２つの流路が形成される。 <Third Embodiment>
In the first embodiment and the second embodiment, the case where the flow path of the refrigerant is in one direction has been described. In the present embodiment, a refrigerant flow path existing in a plurality of directions will be described. 7 (a) and 7 (b) are views of the light source device 1 having two refrigerant inlets 8a and 8b and two refrigerant outlets 9a and 9b. Two flow paths of the refrigerant are formed, one is from the refrigerant inlet 8a side to the refrigerant outlet 9a side, and the other is from the refrigerant inlet 8b side to the refrigerant outlet 9b side.

図７（ａ）、図７（ｂ）では、２つの電気基板２ａ、２ｂに複数のＬＥＤチップ３ａ〜３ｃが配置されており、２つのＬＥＤアレイによって光源装置１が構成されている。それぞれのＬＥＤアレイには、電源を含む制御部５ａ、５ｂが独立して接続されており、ＬＥＤチップ３ａ〜３ｃに流れる電流や電源に印加する電圧を制御し、ＬＥＤチップ３ａ〜３ｃから出力される光量を制御する。制御部５ａ、５ｂは、光学装置１で照明する照明面で目標照度となるようにそれぞれのＬＥＤアレイを独立して制御できる。 In FIGS. 7A and 7B, a plurality of LED chips 3a to 3c are arranged on the two electric boards 2a and 2b, and the light source device 1 is composed of the two LED arrays. Control units 5a and 5b including a power supply are independently connected to each LED array to control the current flowing through the LED chips 3a to 3c and the voltage applied to the power supply, and are output from the LED chips 3a to 3c. Control the amount of light. The control units 5a and 5b can independently control each LED array so that the target illuminance is obtained on the illumination surface illuminated by the optical device 1.

本実施形態では、冷却力が高い冷媒入口８ａ、８ｂ付近の領域には、低いランクのＬＥＤチップ３ａが配置される。また、冷却力が低い冷媒出口９ａ、９ｂ付近の領域には、高いランクのＬＥＤチップ３ｃが配置される。 In the present embodiment, the low rank LED chip 3a is arranged in the region near the refrigerant inlets 8a and 8b having high cooling power. Further, a high-rank LED chip 3c is arranged in a region near the refrigerant outlets 9a and 9b having a low cooling power.

第１実施形態の説明でも述べたように、低いランクであるＬＥＤチップ３ａは、ＬＥＤチップ３ｂや３ｃと比較してＬＥＤチップの発熱量が大きいため、冷却力が高い冷媒入口８ａ、８ｂ付近の領域に配置している。冷却力が高い基板領域にＬＥＤチップ３ａを配置する理由は、冷却力が低い基板領域にＬＥＤチップ３ａを配置する場合に比べて、電流を大きくすることが可能となるためである。即ち、発光効率が低いＬＥＤチップ３ａにおいても、光出力を大きくすることができる。 As described in the description of the first embodiment, the LED chip 3a having a lower rank has a larger calorific value than the LED chips 3b and 3c, so that the cooling power is high in the vicinity of the refrigerant inlets 8a and 8b. It is placed in the area. The reason why the LED chip 3a is arranged in the substrate region where the cooling power is high is that the current can be increased as compared with the case where the LED chip 3a is arranged in the substrate region where the cooling power is low. That is, even in the LED chip 3a having low luminous efficiency, the light output can be increased.

また、冷却力が低い冷媒出口９ａ、９ｂ付近の領域には発光効率が高いランクのＬＥＤチップ３ｃを配置している。ＬＥＤチップ３ｃは、ＬＥＤチップ３ａや３ｂと比較してＬＥＤチップの発熱量が小さいため、冷却力が低い基板領域に配置している。冷却力が低い基板領域にＬＥＤチップ３ｃを配置することにより、ＬＥＤチップ３ｃより発光効率が低いＬＥＤチップ３ａや３ｂを冷却力が高い基板領域に配置できるため、ＬＥＤチップが不点灯とならない範囲で最大の電流を流すことができる。そのため、ＬＥＤアレイ全体としては光出力を向上させることができる。 Further, LED chips 3c having a high luminous efficiency are arranged in the regions near the refrigerant outlets 9a and 9b having low cooling power. Since the LED chip 3c generates a smaller amount of heat than the LED chips 3a and 3b, it is arranged in a substrate region where the cooling power is low. By arranging the LED chip 3c in the substrate region where the cooling power is low, the LED chips 3a and 3b having lower luminous efficiency than the LED chip 3c can be arranged in the substrate region where the cooling power is high, so that the LED chip does not turn off. Maximum current can flow. Therefore, the light output of the LED array as a whole can be improved.

本実施形態では、冷媒の流路が反対方向に２つである場合について説明したが、これに限らない。冷媒の流路が３つ以上形成されても良いし、流路の方向が本実施形態と異なるものでも良い。 In the present embodiment, the case where the refrigerant has two flow paths in opposite directions has been described, but the present invention is not limited to this. Three or more flow paths of the refrigerant may be formed, or the directions of the flow paths may be different from those of the present embodiment.

本実施形態では、１つのチップ列に対して６つのＬＥＤチップ３ａ〜３ｃで構成されているが、これに限らず６つ以外の個数のＬＥＤチップで構成されても良い。また、１つのチップ列に３つ以上のＬＥＤチップを使用する場合、冷媒入口側から冷媒出口側に向かって発光効率の低いＬＥＤチップから順番に配置してもよい。また、ＬＥＤチップのランクが３段階である場合について説明したが、２段階でも良いし４段階以上のランクに分類しても良い。 In the present embodiment, one chip row is composed of six LED chips 3a to 3c, but the present invention is not limited to this, and may be composed of a number of LED chips other than six. Further, when three or more LED chips are used in one chip row, the LED chips having the lowest luminous efficiency may be arranged in order from the refrigerant inlet side to the refrigerant outlet side. Further, although the case where the rank of the LED chip has three stages has been described, it may be classified into two stages or four or more stages.

本実施形態では、電気基板２ａ、２ｂにＬＥＤチップ３ａ〜３ｃを直接実装した形態で説明しているが、回路への接続が容易であるＬＥＤパッケージを使用してもよい。また、同一チップ列内のＬＥＤチップ３ａ〜３ｃの配置は等間隔と不等間隔のどちらでも良いし、チップ列間の配置も等間隔と不等間隔のどちらでも良い。 In the present embodiment, the LED chips 3a to 3c are directly mounted on the electric boards 2a and 2b, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3a to 3c in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows may be either equal intervals or unequal intervals.

＜照明光学系の実施形態＞
次に、図８を用いて照明光学系の例を説明する。図８は照明光学系の概略断面図である。照明光学系５０は、光源部５１、コンデンサレンズ５２、インテグレータ光学系５３、コンデンサレンズ５４を有する。光源部５１から出た光束は、コンデンサレンズ５２を通過して、インテグレータ光学系５３に至る。コンデンサレンズ５２は、光源部５１の射出面位置とインテグレータ光学系５３の入射面位置が、光学的にフーリエ共役面になるように設計されている。このような照明系をケーラー照明とよぶ。コンデンサレンズ５２は、図８では平凸レンズ１枚を描いているが、実際は複数のレンズ群で構成されることが多い。インテグレータ光学系５３を用いることにより、インテグレータ光学系５３の射出面位置には、光源部５１の射出面と共役な複数の二次光源像が形成される。インテグレータ光学系５３の射出面から射出された光は、コンデンサレンズ５４を介して照明面５５に至る。 <Illumination Optical System Embodiment>
Next, an example of the illumination optical system will be described with reference to FIG. FIG. 8 is a schematic cross-sectional view of the illumination optical system. The illumination optical system 50 includes a light source unit 51, a condenser lens 52, an integrator optical system 53, and a condenser lens 54. The luminous flux emitted from the light source unit 51 passes through the condenser lens 52 and reaches the integrator optical system 53. The condenser lens 52 is designed so that the position of the emission surface of the light source unit 51 and the position of the incident surface of the integrator optical system 53 optically become a Fourier conjugate surface. Such a lighting system is called Koehler illumination. Although the condenser lens 52 depicts one plano-convex lens in FIG. 8, it is often composed of a plurality of lens groups in reality. By using the integrator optical system 53, a plurality of secondary light source images conjugate to the emission surface of the light source unit 51 are formed at the injection surface position of the integrator optical system 53. The light emitted from the emission surface of the integrator optical system 53 reaches the illumination surface 55 via the condenser lens 54.

図９を用いて光源部５１を説明する。図９は、光源部５１の概略図である。光源部５１は、光源装置１、集光レンズ５６、集光レンズ５７を有する。図９では光源装置１の一部として、電気基板２、ＬＥＤチップ３を図示している。集光レンズ５６、５７は、各ＬＥＤチップ３に対応して設けられた各レンズを有するレンズアレイである。集光レンズ５６の各レンズは各ＬＥＤチップ３上に設けられている。レンズは、図９のような平凸レンズであっても良いし、その他のパワーがついた形状をとっても良い。レンズアレイとしては、エッチングや切削等で連続的にレンズを形成したレンズアレイや、個々のレンズを接合したレンズアレイを用いることができる。ＬＥＤチップ３から出た光は、半角で５０°〜７０°程度の広がりを持っているが、集光レンズ５６、５７によって、それらは３０°以下程度に変換される。集光レンズ５６はＬＥＤチップから所定の間隔だけ離されて設けられ、電気基板２とともに一体的に固定されていてもよい。 The light source unit 51 will be described with reference to FIG. FIG. 9 is a schematic view of the light source unit 51. The light source unit 51 includes a light source device 1, a condenser lens 56, and a condenser lens 57. In FIG. 9, the electric board 2 and the LED chip 3 are shown as a part of the light source device 1. The condenser lenses 56 and 57 are lens arrays having each lens provided corresponding to each LED chip 3. Each lens of the condenser lens 56 is provided on each LED chip 3. The lens may be a plano-convex lens as shown in FIG. 9, or may have a shape with other power. As the lens array, a lens array in which lenses are continuously formed by etching, cutting, or the like, or a lens array in which individual lenses are joined can be used. The light emitted from the LED chip 3 has a spread of about 50 ° to 70 ° in half-width, but they are converted to about 30 ° or less by the condenser lenses 56 and 57. The condenser lens 56 may be provided at a predetermined distance from the LED chip and may be integrally fixed together with the electric substrate 2.

図８の説明に戻る。インテグレータ光学系５３は、光強度分布を均一化させる機能を有する。インテグレータ光学系５３には、オプティカルインテグレータレンズやロッドレンズが用いられ、照射面５５の照度均一度を改善する。 Returning to the description of FIG. The integrator optical system 53 has a function of making the light intensity distribution uniform. An optical integrator lens or a rod lens is used for the integrator optical system 53 to improve the illuminance uniformity of the irradiation surface 55.

コンデンサレンズ５４は、インテグレータ光学系５３の射出面と照明面５５が光学的にフーリエ共役面になるように設計されており、インテグレータ光学系５３の射出面またはその共役面は照明光学系の瞳面となる。その結果、照明面５５において、ほぼ均一な光強度分布を作成することができる。 The condenser lens 54 is designed so that the emission surface of the integrator optical system 53 and the illumination surface 55 optically form a Fourier conjugate surface, and the emission surface of the integrator optical system 53 or its conjugate surface is the pupil surface of the illumination optical system. It becomes. As a result, a substantially uniform light intensity distribution can be created on the illuminated surface 55.

本発明において、光源装置１におけるＬＥＤチップ３の発光効率が異なるため、ＬＥＤアレイ全面での照度は不均一となる。しかしながら、照明光学系５０には、上述した光強度分布を均一化させるインテグレータ光学系５３が備えられているため、光源装置１から出射された不均一な光は、照明面５５において均一な照度を得ることができる。 In the present invention, since the luminous efficiency of the LED chip 3 in the light source device 1 is different, the illuminance on the entire surface of the LED array becomes non-uniform. However, since the illumination optical system 50 is provided with the integrator optical system 53 that equalizes the light intensity distribution described above, the non-uniform light emitted from the light source device 1 has a uniform illuminance on the illumination surface 55. Obtainable.

上記の光源装置１や照明光学系５０は各種照明装置に適用でき、光硬化性樹脂を照明する装置、被検物を照明して検査する装置、リソグラフィ装置などにも用いることができる。例えば、マスクのパターンを基板に露光する露光装置、マスクレス露光装置、型を用いて基板にパターンを形成するインプリント装置、又は、平坦層形成装置に適用することできる。 The light source device 1 and the illumination optical system 50 can be applied to various lighting devices, and can also be used as a device for illuminating a photocurable resin, a device for illuminating and inspecting an object, a lithography device, and the like. For example, it can be applied to an exposure apparatus that exposes a mask pattern to a substrate, a maskless exposure apparatus, an imprint apparatus that forms a pattern on a substrate using a mold, or a flat layer forming apparatus.

＜露光装置の実施形態＞
本実施形態では、上記の光源装置１や照明光学系５０を露光装置に適用した場合について説明する。図１０は、露光装置１００の構成を示す概略図である。露光装置１００は、半導体素子や液晶表示素子の製造工程であるリソグラフィ工程に採用され、基板上にパターンを形成するリソグラフィ装置である。露光装置１００は、マスクを介して基板を露光して、マスクのパターンを基板に転写する。露光装置１００は、本実施形態では、ステップ・アンド・スキャン方式の露光装置、所謂、走査型露光装置であるが、ステップ・アンド・リピート方式やその他の露光方式を採用してもよい。 <Embodiment of exposure apparatus>
In the present embodiment, the case where the light source device 1 and the illumination optical system 50 are applied to the exposure device will be described. FIG. 10 is a schematic view showing the configuration of the exposure apparatus 100. The exposure apparatus 100 is a lithography apparatus used in a lithography process, which is a manufacturing process of a semiconductor element or a liquid crystal display element, to form a pattern on a substrate. The exposure apparatus 100 exposes the substrate through the mask and transfers the mask pattern to the substrate. In the present embodiment, the exposure apparatus 100 is a step-and-scan exposure apparatus, that is, a so-called scanning exposure apparatus, but a step-and-repeat exposure apparatus or another exposure apparatus may be adopted.

露光装置１００は、マスク１０１を照明する照明光学系５０、マスク１０１のパターンを基板１０２上に投影する投影光学系１０３を有する。投影光学系１０３はレンズからなる投影レンズや、ミラーを用いた反射型投影系でもよい。 The exposure apparatus 100 includes an illumination optical system 50 that illuminates the mask 101, and a projection optical system 103 that projects the pattern of the mask 101 onto the substrate 102. The projection optical system 103 may be a projection lens composed of a lens or a reflection type projection system using a mirror.

照明光学系５０は、光源装置１からの光をマスク１０１に照明する光学系である。マスク１０１には、基板１０２に形成すべきパターンに対応するパターンが形成されている。マスク１０１は、マスクステージ１０４に保持されており、基板１０２は、基板ステージ１０５に保持されている。 The illumination optical system 50 is an optical system that illuminates the mask 101 with the light from the light source device 1. A pattern corresponding to the pattern to be formed on the substrate 102 is formed on the mask 101. The mask 101 is held by the mask stage 104, and the substrate 102 is held by the substrate stage 105.

マスク１０１と基板１０２とは、投影光学系１０３を介して、光学的にほぼ共役な位置に配置されている。投影光学系１０３は、物体を像面に投影する光学系である。投影光学系１０３には、反射系、屈折系、反射屈折系を適用することができる。投影光学系１０３は、本実施形態では、所定の投影倍率を有し、マスク１０１に形成されたパターンを基板１０２に投影する。そして、マスクステージ１０４及び基板ステージ１０５を、投影光学系１０３の物体面と平行な方向に、投影光学系１０３の投影倍率に応じた速度比で走査する。これにより、マスク１０１に形成されたパターンを基板１０２に転写することができる。 The mask 101 and the substrate 102 are arranged at positions substantially conjugate with each other via the projection optical system 103. The projection optical system 103 is an optical system that projects an object onto an image plane. A reflection system, a refraction system, and a reflection / refraction system can be applied to the projection optical system 103. In the present embodiment, the projection optical system 103 has a predetermined projection magnification and projects the pattern formed on the mask 101 onto the substrate 102. Then, the mask stage 104 and the substrate stage 105 are scanned in a direction parallel to the object surface of the projection optical system 103 at a speed ratio corresponding to the projection magnification of the projection optical system 103. As a result, the pattern formed on the mask 101 can be transferred to the substrate 102.

＜物品の製造方法の実施形態＞
本実施形態では、上記の露光装置を利用した物品の製造方法について説明する。物品とは、例えば、フラットパネルディスプレイ（ＦＰＤ）である。物品の製造方法は、基板上に塗布された感光剤に上記の露光装置を用いて潜像パターンを形成する工程（基板を露光する工程）と、かかる工程で潜像パターンが形成された基板を現像する工程とを含む。更に、かかる製造方法は、他の周知の工程（酸化、成膜、蒸着、ドーピング、平坦化、エッチング、レジスト剥離、ダイシング、ボンディング、パッケージング等）を含む。本実施形態の物品の製造方法は、従来の方法に比べて、物品の性能・品質・生産性・生産コストの少なくとも１つにおいて有利である。 <Embodiment of manufacturing method of article>
In this embodiment, a method of manufacturing an article using the above-mentioned exposure apparatus will be described. The article is, for example, a flat panel display (FPD). The method for manufacturing an article includes a step of forming a latent image pattern on a photosensitive agent applied on the substrate using the above-mentioned exposure apparatus (a step of exposing the substrate) and a substrate on which the latent image pattern is formed in such a step. Includes a step of developing. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for producing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

１ 光源装置
２ 電気基板
３ ＬＥＤチップ
４ 冷却器
８ 冷媒入口
９ 冷媒出口

1 Light source device 2 Electric board 3 LED chip 4 Cooler 8 Refrigerant inlet 9 Refrigerant outlet

Claims (20)

基板と、前記基板上に配置された発光効率が異なる複数のＬＥＤチップを含む回路を備えたＬＥＤアレイと、
冷媒入口から冷媒出口に向かって流れる冷媒により、前記ＬＥＤアレイを冷却するための冷却器を有し、
前記ＬＥＤアレイからの光を照明面に照明する光源装置において、
前記冷却器の冷却力と前記ＬＥＤチップの発光効率を示す情報に基づいて、前記基板上に前記複数のＬＥＤチップが配置されていることを特徴とする光源装置。 A substrate, an LED array having a circuit including a plurality of LED chips having different luminous efficiencies arranged on the substrate, and the like.
It has a cooler for cooling the LED array by the refrigerant flowing from the refrigerant inlet to the refrigerant outlet.
In the light source device that illuminates the illumination surface with the light from the LED array.
A light source device characterized in that a plurality of LED chips are arranged on the substrate based on information indicating the cooling power of the cooler and the luminous efficiency of the LED chips. 前記冷却器は、前記基板における前記複数のＬＥＤチップが配置された面とは反対側の面に接して配置され、前記基板の領域に応じて前記冷却器の冷却力が異なることを特徴とする請求項１に記載の光源装置。 The cooler is arranged in contact with a surface of the substrate opposite to the surface on which the plurality of LED chips are arranged, and the cooling force of the cooler differs depending on the region of the substrate. The light source device according to claim 1. 前記複数のＬＥＤチップは、第１のＬＥＤチップと前記第１のＬＥＤチップより発光効率が高い第２のＬＥＤチップを含み、
前記第１のＬＥＤチップは、第１基板領域に配置され、
前記第２のＬＥＤチップは、前記第１基板領域より前記冷却器で冷却されにくい第２基板領域に配置されていることを特徴とする請求項２に記載の光源装置。 The plurality of LED chips include a first LED chip and a second LED chip having higher luminous efficiency than the first LED chip.
The first LED chip is arranged in the first substrate region and
The light source device according to claim 2, wherein the second LED chip is arranged in a second substrate region which is harder to be cooled by the cooler than the first substrate region. 前記複数のＬＥＤチップは、発光効率が高いほどランクが高くなるように、少なくとも２つのランクに分類され、
前記発光効率を示す情報は、前記ＬＥＤチップのランクであることを特徴とする請求項１乃至３のいずれか１項に記載の光源装置。 The plurality of LED chips are classified into at least two ranks so that the higher the luminous efficiency, the higher the rank.
The light source device according to any one of claims 1 to 3, wherein the information indicating the luminous efficiency is the rank of the LED chip. 前記複数のＬＥＤチップは、第１のランクのＬＥＤチップと、前記第１のランクより高いランクである第２のランクのＬＥＤチップを含み、
前記第１のランクのＬＥＤチップは、第３基板領域に配置され、
前記第２のランクのＬＥＤチップは、前記第３基板領域より前記冷却器で冷却されにくい第４基板領域に配置されていることを特徴とする請求項４に記載の光源装置。 The plurality of LED chips include a first rank LED chip and a second rank LED chip having a rank higher than the first rank.
The first rank LED chip is arranged in the third substrate region.
The light source device according to claim 4, wherein the LED chip of the second rank is arranged in a fourth substrate region which is harder to be cooled by the cooler than the third substrate region. 基板と、前記基板上に配置された発光効率が異なる複数のＬＥＤチップを含む回路を備えたＬＥＤアレイと、
冷媒入口から冷媒出口に向かって流れる冷媒により、前記ＬＥＤアレイを冷却するための冷却器を有し、
前記ＬＥＤアレイからの光を照明面に照明する光源装置において、
前記冷媒入口側から前記冷媒出口側に向かって発光効率が高くなるように、前記基板上に前記複数のＬＥＤチップが配置されていることを特徴とする光源装置。 A substrate, an LED array having a circuit including a plurality of LED chips having different luminous efficiencies arranged on the substrate, and the like.
It has a cooler for cooling the LED array by the refrigerant flowing from the refrigerant inlet to the refrigerant outlet.
In the light source device that illuminates the illumination surface with the light from the LED array.
A light source device characterized in that the plurality of LED chips are arranged on the substrate so that the luminous efficiency increases from the refrigerant inlet side to the refrigerant outlet side. 前記複数のＬＥＤチップは、第１のＬＥＤチップと前記第１のＬＥＤチップより発光効率が高い第２のＬＥＤチップを含み、
前記第１のＬＥＤチップは、前記第２のＬＥＤチップよりも前記冷却器の冷媒入口側に配置されていることを特徴とする請求項６に記載の光源装置。 The plurality of LED chips include a first LED chip and a second LED chip having higher luminous efficiency than the first LED chip.
The light source device according to claim 6, wherein the first LED chip is arranged closer to the refrigerant inlet side of the cooler than the second LED chip. 前記複数のＬＥＤチップは、発光効率が高くなるにつれて高いランクとなるように、少なくとも２つのランクに分類され、
前記複数のＬＥＤチップは、前記ＬＥＤチップのランクが低いほど、前記冷却器の冷媒入口側に配置されていることを特徴とする請求項６又は７に記載の光源装置。 The plurality of LED chips are classified into at least two ranks so that the higher the luminous efficiency, the higher the rank.
The light source device according to claim 6 or 7, wherein the plurality of LED chips are arranged on the refrigerant inlet side of the cooler as the rank of the LED chips decreases. 前記複数のＬＥＤチップは、第１のランクのＬＥＤチップと、前記第１のランクより高いランクである第２のランクのＬＥＤチップを含み、
前記第１のランクのＬＥＤチップは、前記第２のランクのＬＥＤチップよりも前記冷却器の冷媒入口側に配置されていることを特徴とする請求項８に記載の光源装置。 The plurality of LED chips include a first rank LED chip and a second rank LED chip having a rank higher than the first rank.
The light source device according to claim 8, wherein the LED chip of the first rank is arranged closer to the refrigerant inlet side of the cooler than the LED chip of the second rank. 前記冷媒入口側から前記冷媒出口側に向かって、ランクが高くなるように前記基板上に前記複数のＬＥＤチップが配置されていることを特徴とする請求項８又は９に記載の光源装置。 The light source device according to claim 8 or 9, wherein the plurality of LED chips are arranged on the substrate so that the rank increases from the refrigerant inlet side to the refrigerant outlet side. 前記ＬＥＤアレイは、前記ＬＥＤチップが直列に接続されたチップ列を複数含み、
前記冷媒が流れる方向は、前記チップ列におけるＬＥＤチップの配列方向に対して、水平な成分を含むことを特徴とする請求項１乃至１０のいずれか１項に記載の光源装置。 The LED array includes a plurality of chip rows in which the LED chips are connected in series.
The light source device according to any one of claims 1 to 10, wherein the direction in which the refrigerant flows includes a component horizontal to the arrangement direction of the LED chips in the chip row. 前記ＬＥＤアレイは、前記ＬＥＤチップが直列に接続されたチップ列を複数含み、
前記冷媒が流れる方向は、前記チップ列におけるＬＥＤチップの配列方向に対して、垂直な成分を含むことを特徴とする請求項１乃至１０のいずれか１項に記載の光源装置。 The LED array includes a plurality of chip rows in which the LED chips are connected in series.
The light source device according to any one of claims 1 to 10, wherein the direction in which the refrigerant flows includes a component perpendicular to the arrangement direction of the LED chips in the chip row. 前記複数のＬＥＤチップは、発光効率が高いほどランクが高くなるように、少なくとも２つのランクに分類され、
前記チップ列には同じランクのＬＥＤチップが配置されていることを特徴とする請求項１２に記載の光源装置。 The plurality of LED chips are classified into at least two ranks so that the higher the luminous efficiency, the higher the rank.
The light source device according to claim 12, wherein LED chips of the same rank are arranged in the chip row. 電源を含む制御部を更に有し、
前記制御部は、前記照明面が目標照度になるよう前記ＬＥＤチップに流れる電流、及び電源に印加する電圧の少なくとも一方を制御することを特徴とする請求項１乃至１３のいずれか１項に記載の光源装置。 It also has a control unit that includes a power supply
The control unit according to any one of claims 1 to 13, wherein the control unit controls at least one of a current flowing through the LED chip and a voltage applied to a power source so that the illumination surface reaches a target illuminance. Light source device. 前記冷媒は、主成分がオイルであることを特徴とする請求項１乃至１４のいずれか１項に記載の光源装置。 The light source device according to any one of claims 1 to 14, wherein the refrigerant is mainly composed of oil. 前記冷媒は、主成分が水であることを特徴とする請求項１乃至１４のいずれか１項に記載の光源装置。 The light source device according to any one of claims 1 to 14, wherein the refrigerant is mainly water. 照明装置であって、
請求項１乃至１６のいずれか１項に記載の光源装置と、
コンデンサレンズと、
オプティカルインテグレータを有し、
前記光源装置の複数のＬＥＤチップのそれぞれからの光強度分布を、前記コンデンサレンズを介して、前記オプティカルインテグレータの入射面において重ね合わせることを特徴とする照明装置。 It ’s a lighting device,
The light source device according to any one of claims 1 to 16.
With a condenser lens
Has an optical integrator and
A lighting device characterized in that light intensity distributions from each of a plurality of LED chips of the light source device are superposed on an incident surface of the optical integrator via the condenser lens. 前記オプティカルインテグレータはレンズ群を有することを特徴とする請求項１７に記載の照明装置。 The lighting device according to claim 17, wherein the optical integrator has a lens group. 基板を露光する露光装置であって、
マスクを照明する照明装置であり、請求項１７又は１８に記載された照明装置と、
前記マスクのパターンを基板に露光する露光手段を有することを特徴とする露光装置。 An exposure device that exposes a substrate
A lighting device that illuminates a mask, and the lighting device according to claim 17 or 18.
An exposure apparatus comprising an exposure means for exposing the mask pattern to a substrate. 物品の製造方法であって、
請求項１９に記載の露光装置を用いて基板を露光する工程と、
露光された基板を現像する工程と、を有し、
現像された基板から物品を製造することを特徴とする物品の製造方法。

It is a manufacturing method of goods
A step of exposing a substrate using the exposure apparatus according to claim 19.
It has a process of developing the exposed substrate and
A method for producing an article, which comprises producing an article from a developed substrate.
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