JP2004207343A - Illumination light source, illumination apparatus, aligner, and exposing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illumination light source improved in the power of emanating light. <P>SOLUTION: The illumination light source is a pseudo-surface light source including a plurality of unit solid-state light sources disposed in an array. The light source comprises a first pseudo-surface light source 2 including a plurality of unit solid-state light sources disposed in an array, and a second pseudo-surface light source 3 disposed separately away by a predetermined distance from the first pseudo-surface light source in the emanating direction of light from the first pseudo-surface light source. When the area of the pseudo-surface light source is assumed as SA, and the total area of the unit solid-state light sources as S1, the condition, 0.5<S1/SA<0.8 is satisfied. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an illumination light source of an exposure device used in a manufacturing process of a semiconductor device, a liquid crystal display device, an imaging device, a thin film magnetic head, and other micro devices, an illumination device using the illumination light source, and an exposure using the illumination device. The present invention relates to an apparatus and an exposure method.
[0002]
[Prior art]
A liquid crystal display device, which is one of the micro devices, is usually formed by patterning a transparent thin-film electrode on a glass substrate (plate) into a desired shape by a photolithography method, and using a switching element such as a TFT (Thin Film Transistor) and an electrode. It is manufactured by forming wiring. In a manufacturing process using this photolithography method, a projection exposure apparatus that projects and exposes an original pattern formed on a mask onto a plate coated with a photosensitive agent such as a photoresist through a projection optical system is used. Used.
[0003]
Conventionally, after performing relative positioning between a mask and a plate, a pattern formed on the mask is collectively transferred to one shot area set on the plate, and the plate is step-moved after the transfer. A step-and-repeat type projection exposure apparatus (a so-called stepper) for performing exposure of another shot area by using the exposure apparatus is often used.
[0004]
In recent years, a liquid crystal display element has been required to have a large area, and accordingly, a projection exposure apparatus used in a photolithography process has been desired to have an enlarged exposure area. In order to enlarge the exposure area of the projection exposure apparatus, it is necessary to increase the size of the projection optical system. However, it becomes costly to design and manufacture a large projection optical system in which residual aberration is reduced as much as possible. Therefore, in order to minimize the size of the projection optical system, a slit-like illumination light whose length in the longitudinal direction is set to be substantially the same as the effective diameter of the projection optical system on the object plane side (mask side) of the projection optical system. Irradiates the mask, and while the slit-shaped light passing through the mask is irradiating the plate via the projection optical system, the mask and the plate are moved relative to the projection optical system and scanned, A so-called step-and-scan method in which a part of the pattern formed on the mask is sequentially transferred to one shot set on the plate, and after the transfer, the plate is step-moved and the other shot areas are similarly exposed. Projection exposure apparatus has been devised.
[0005]
In recent years, in order to further expand the exposure area, instead of using one large projection optical system, a small partial projection optical system is placed at a predetermined interval in a direction orthogonal to the scanning direction (non-scanning direction). A projection including a so-called multi-lens type projection optical system in which a plurality of first arrays and a second array in which a partial optical system is arranged between the partial projection optical systems are arranged in the scanning direction. An exposure apparatus has been devised (for example, see Patent Document 1).
[0006]
[Patent Document 1]
JP-A-7-57986
[0007]
[Problems to be solved by the invention]
As a light source of the above-described projection exposure apparatus, a mercury lamp or the like is mainly used in an ultraviolet region having a wavelength of about 360 nm. Since the life of the mercury lamp is about 500 to 1000 hours, the lamp needs to be periodically replaced, which is a heavy burden on the exposure apparatus user. In addition, high power is required to ensure high illuminance, and accompanying heat generation measures are required.Therefore, there was a risk of high running costs and rupture due to factors such as deterioration over time. .
[0008]
On the other hand, a solid-state light source such as a light-emitting diode has higher luminous efficiency than a mercury lamp or the like, and therefore has features of power saving and small heat generation, and can realize a significant reduction in running cost. In addition, since there is a life of about 3000 hours, the burden of replacement is small and there is no danger of explosion due to factors such as deterioration with time. More recently, UV-LEDs and the like that have achieved a high light output of about 100 mw at a wavelength of 365 nm have been developed.
[0009]
In the production of the above-described liquid crystal display element, a photoresist is applied on a plate, a pattern formed on a mask is transferred to the plate using any of the above-described projection exposure apparatuses, development of the photoresist, etching, and By repeating steps such as peeling of the photoresist, an element substrate on which switching elements such as TFTs and electrode wirings are formed is formed. Then, the liquid crystal display element is manufactured by laminating the element substrate and a counter substrate provided with a color filter manufactured in a separate process, and sandwiching a liquid crystal therebetween.
[0010]
By the way, the conventional liquid crystal display device has been manufactured by separately forming and bonding an element substrate on which a TFT is formed and a counter substrate provided with a color filter as described above. As a result, a liquid crystal display device having a structure in which a color filter is formed on a substrate on which a TFT is formed has been devised. In the manufacturing process of a liquid crystal display element having such a structure, a resin resist in which a colored pigment is dispersed is applied to a substrate on which a TFT is formed, and the resin resist is exposed and developed using a projection exposure apparatus. Forming a color filter.
[0011]
Here, the sensitivity of a photoresist used when forming a TFT or the like is 15 to 30 mJ / cm. ^Two On the other hand, the sensitivity of the resin resist is 50 to 100 mJ / cm. ^Two And the energy required for exposing the resin resist may be several times to several tens times that of a normal photoresist. Therefore, even when a solid-state light source is used as the light source of the projection exposure apparatus, the power of the light emitted from the solid-state light source is increased and the illuminance of the illuminating light illuminated on the substrate is adjusted so that the sensitivity of the resin resist can be accommodated. Need to be higher.
[0012]
SUMMARY OF THE INVENTION An object of the present invention is to provide an illumination light source having an improved power of emitted light, an illumination device having the illumination light source, an exposure device having the illumination device, and an exposure method using the exposure device.
[0013]
[Means for Solving the Problems]
The illumination light source according to claim 1, comprising a pseudo surface light source including a plurality of unit solid-state light sources arranged in an array, wherein the first pseudo light source includes a plurality of unit solid-state light sources arranged in an array. A second light source including a surface light source and a plurality of unit solid-state light sources arranged in an array and arranged at a predetermined distance from the first pseudo surface light source along a light emission direction of the pseudo surface light source; When the area of the pseudo surface light source is SA and the total area of the unit solid light sources is S1,
0.5 <S1 / SA <0.8
The following condition is satisfied.
[0014]
The illumination light source according to claim 2, wherein an average interval between the plurality of unit solid light sources included in the first pseudo surface light source and an average of the plurality of unit solid light sources included in the second pseudo surface light source. It is characterized in that the intervals are substantially equal.
[0015]
According to the illumination light source according to the first and second aspects, the light output per unit area of the pseudo surface light source including the first pseudo surface light source and the second pseudo surface light source is increased. Therefore, the image plane illuminance can be increased.
[0016]
The illumination light source according to claim 3, wherein the predetermined distance is d, and an average interval of the unit solid light sources included in the first pseudo surface light source is p.
0 <d / p <5
The following condition is satisfied.
[0017]
According to the illumination light source according to the third aspect, since the distance between the first pseudo surface light source and the second pseudo surface light source is reduced, the unit solid light source included in the second pseudo surface light source is low. Directional unit solid-state light sources can also be used.
[0018]
The illumination light source according to claim 4, wherein the second pseudo surface light source is disposed closer to the light emission side than the first pseudo surface light source, the predetermined distance is d, and the first pseudo surface light source is An average interval between the plurality of unit solid-state light sources included is p, and a light beam having a radiation intensity that is half of a light beam having the highest radiation intensity among light beams emitted from the unit solid-state light sources included in the first pseudo surface light source. And the angle between the light having the highest radiation intensity and θ (rad),
0.2 ≦ (2 · tan θ) / (p / d) ≦ 4
The following condition is satisfied.
[0019]
According to the illumination light source of the fourth aspect, the luminous flux emitted from the unit solid-state light source included in the first pseudo surface light source is 0.2 ≦ (2 · tan θ) / (p / d) ≦ 4, Is satisfied, the luminous flux emitted from the unit solid-state light source included in the first pseudo surface light source is efficiently emitted from the light emitting portion of the illumination light source.
[0020]
The illumination light source according to claim 5, wherein the pseudo surface light source has an image plane illuminance value of 20 mW / cm. ² As described above, the unit solid-state light sources are arranged in an array. According to the illumination light source of the fifth aspect, the image plane illuminance required for practical exposure can be secured.
[0021]
The illumination light source according to claim 6 is characterized in that the unit solid-state light source has an output of at least 5 mW / unit. According to the illumination light source of the sixth aspect, since the output of each unit solid-state light source is large, the output per unit area of the light emitting portion of the illumination light source can be increased.
[0022]
The illumination light source according to claim 7 is characterized in that the unit solid-state light source emits light having a wavelength of 300 to 500 nm.
[0023]
An illumination light source according to claim 8 is characterized in that the half-width of the wavelength of the emission spectrum of the unit solid-state light source is ± 20 nm or less.
[0024]
Further, in the illumination light source according to the ninth aspect, the unit solid-state light source has an average radiance of 500 mW / (cm) within a range of ± 1 ° around a light beam having the highest radiation intensity among light beams emitted. ^Two Sr) or more.
[0025]
According to the illuminating light source of the ninth aspect, the average radiance is 500 mW / (cm) within the range of ± 1 ° from the light beam having the highest radiation intensity among the emitted light beams. ^Two Since a unit solid light source of sr) or more is provided, a large amount of light can be irradiated onto the photosensitive substrate via the projection optical system, and the throughput of the exposure apparatus can be improved. Here, the average radiance is the average value of the luminance at all angles within ± 1 °.
[0026]
An illumination device according to a tenth aspect includes the illumination light source according to any one of the first to ninth aspects, and a condensing optical system that condenses a light beam from the illumination light source. An illumination device that illuminates a surface to be illuminated or a surface optically conjugate with the surface to be illuminated using light condensed by an optical optical system, wherein the illumination light source is a front-side focal position of the light-converging optical system or It is arranged at a position in the vicinity thereof, a position optically conjugate with the front focal position or a position in the vicinity thereof.
[0027]
According to an eleventh aspect of the present invention, there is provided an exposure apparatus for transferring a pattern of a mask onto a photosensitive substrate, comprising the illumination device according to the tenth aspect for illuminating the mask.
[0028]
An exposure apparatus according to claim 12, wherein the pattern of a mask is transferred onto a photosensitive substrate based on illumination light from an illumination light source, wherein the illumination light source is a plurality of units arranged in an array. When a pseudo surface light source including a solid light source is provided, the area of the pseudo surface light source is SA, and the total area of the unit solid light sources is S1,
S1 / SA> 0.7
The following condition is satisfied.
[0029]
An exposure apparatus according to claim 13 is characterized in that the unit solid-state light source includes a substantially circular light emitting portion.
[0030]
An exposure apparatus according to claim 14 is characterized in that the unit solid-state light source includes a substantially regular hexagonal light emitting portion.
[0031]
Further, the exposure apparatus according to claim 15, wherein the diameter of the unit solid-state light source is D, and the average interval between the unit solid-state light sources is p,
1 ≦ p / D ≦ 1.4
The following condition is satisfied.
[0032]
According to the exposure apparatus according to the twelfth to fifteenth aspects, the light output per unit area of the light emitting portion of the illumination light source can be increased, so that the image plane illuminance can be increased.
[0033]
The exposure apparatus according to claim 16 further comprises a projection optical system for forming a pattern image of the mask on the photosensitive substrate.
[0034]
The exposure apparatus according to claim 17 forms an angle between a light beam having a half radiation intensity with respect to a light beam having the highest radiation intensity and a light beam having the highest radiation intensity among light beams having the highest radiation intensity among the light beams emitted from the illumination device. θ (rad), the magnification of the projection optical system is β, and the numerical aperture of the projection optical system is N.D. A. And when
0.2 ≦ (| sin θ | / | β |) / N. A. ≦ 5
The following condition is satisfied.
[0035]
According to the exposure apparatus of the seventeenth aspect, the light beam emitted from the illumination device is
0.2 ≦ (| sin θ | / | β |) / N. A. ≤ 5
Is satisfied, a large amount of light can be irradiated onto the photosensitive substrate via the projection optical system, and the throughput of the exposure apparatus can be improved.
[0036]
An exposure method according to an eighteenth aspect of the present invention is the exposure method using the exposure apparatus according to any one of the eleventh to seventeenth aspects, wherein the mask is illuminated using a light beam emitted from the illumination light source. An illumination step and a transfer step of transferring the pattern of the mask onto a photosensitive substrate are included.
[0037]
According to the exposure method of the present invention, since the exposure is performed using the exposure device that secures the value of the image plane illuminance required for the practical exposure, the throughput as a practical exposure method can be secured. Can be.
[0038]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an exposure apparatus according to an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an overall schematic configuration of an exposure apparatus according to a first embodiment of the present invention. In the first embodiment, the liquid crystal formed on the mask M while the mask M and the plate (substrate) P are relatively moved with respect to a projection optical system including a plurality of catadioptric projection optical units. An example in which the present invention is applied to a step-and-scan type exposure apparatus that transfers an image of a display element pattern DP (pattern) onto a plate P serving as a photosensitive substrate coated with a photosensitive material (resist). explain. In the following description, the XYZ rectangular coordinate system shown in FIG. 1 is set, and the positional relationship of each member will be described with reference to the XYZ rectangular coordinate system. In the XYZ orthogonal coordinate system, the X axis and the Y axis are set to be parallel to the plate P, and the Z axis is set to a direction orthogonal to the plate P. In the XYZ coordinate system in the figure, the XY plane is actually set to a plane parallel to the horizontal plane, and the Z axis is set vertically upward. In this embodiment, the direction (scanning direction) for moving the mask M and the plate P is set in the X-axis direction.
[0039]
The exposure apparatus according to this embodiment is for uniformly illuminating a mask M supported in parallel to an XY plane via a mask holder (not shown) on a mask stage (not shown in FIG. 1) MS. An illumination optical system IL is provided. FIG. 2 is a side view of the illumination optical system IL, and the same members as those shown in FIG. 1 are denoted by the same reference numerals. The illumination optical system IL has an illumination light source 1 including a pseudo-surface light source including a plurality of unit solid-state light sources arranged in an array.
[0040]
FIG. 3A is a plan view of the illumination light source 1, and FIG. 3B is a side view of the illumination light source 1. As shown in this figure, the illumination light source 1 includes a first pseudo surface light source 2 including a plurality of unit solid state light sources 1a arranged in an array and a second pseudo light source 2 including a plurality of unit solid state light sources 1a arranged in an array. And the second pseudo surface light source 3 is arranged at a predetermined distance from the first pseudo surface light source 2 along the light emission direction of the first pseudo surface light source 2. Have been.
[0041]
Here, as for the illumination light source 1, when the area of the pseudo surface light source is SA and the total area of the unit solid light sources 1a is S1,
0.5 <S1 / SA <0.8
Is configured to satisfy the following condition. The area of the unit solid-state light source 1a does not refer to the area of the light-emitting portion of the unit solid-state light source 1a, but is defined by the external shape when the unit solid-state light source 1a is viewed from the light emitting direction of the unit solid-state light source 1a. The total area S1 is the total area of the unit solid-state light sources 1a.
[0042]
Further, the unit solid-state light sources are arranged such that the average interval between the plurality of unit solid-state light sources 1a included in the first pseudo surface light source 2 and the average interval between the plurality of unit solid-state light sources 1a included in the second pseudo surface light source 3 are substantially equal. The light source 1a is arranged.
[0043]
Further, as shown in FIG. 4, the distance between the first pseudo surface light source 2 and the second pseudo surface light source 3 is d, and the average distance between the unit solid light sources 1a included in the first pseudo surface light source 2 is When p
0 <d / p <5
The unit solid-state light source 1a is arranged so as to satisfy the following condition.
[0044]
As shown in FIG. 4, the unit solid-state light source 1 a has a distance d between the first pseudo surface light source 2 and the second pseudo surface light source 3, and a plurality of units included in the first pseudo surface light source 2. The average interval between the unit solid-state light sources 1a is defined as p, and the light beam having the radiation intensity half that of the light beam having the highest radiation intensity among the light beams emitted from the unit solid-state light source 1a included in the first pseudo surface light source 2 and the most radiant intensity When the angle between the light and the strong ray is θ (rad),
0.2 ≦ (2 · tan θ) / (p / d) ≦ 4
Satisfies the condition.
[0045]
Further, the first pseudo surface light source 2 and the second pseudo surface light source 3 have an image plane illuminance value of 20 mW / cm. ² The unit solid-state light sources 1a are arranged in an array as described above. The unit solid-state light source 1a has an output of at least 5 mW / unit and emits light having a wavelength of 300 to 500 nm. Further, the half width of the wavelength of the emission spectrum of the unit solid light source 1a is ± 20 nm or less.
[0046]
In addition, the unit solid-state light source 1a has an average radiance of 500 mW / (cm) within a range of a luminous flux of ± 1 ° with respect to a light beam having the highest radiation intensity among luminous fluxes emitted. ^Two -Sr) or more.
[0047]
Returning to FIG. 2, the light beam emitted from the illumination light source 1 is converted into a substantially parallel light beam by the condenser lens 5, and is condensed via the condenser lens 6. The light condensed by the condenser lens 6 is incident on an incident end 7a of a light guide 7 arranged in the vicinity thereof. The light guide 7 is, for example, a random light guide fiber configured by randomly bundling a large number of fiber strands, and has the same number of incident ends 7a as the number of light source units 1 (one in FIG. 1) and projection optics It has the same number of emission ends (five in FIG. 1) as the number of projection optical units (five in FIG. 1) (only the emission end 7b is shown in FIG. 2). Thus, the light that has entered the incident end 7a of the light guide 7 propagates through the inside thereof, and is split and emitted from the five emission ends (the emission end 7b and the other four emission ends).
[0048]
A collimating lens 8b, a fly-eye integrator 9b, an aperture stop 10b, a half mirror 11b, and a condenser lens system 12b are arranged in this order between the exit end 7b of the light guide 7 and the mask M. Similarly, a collimating lens, a fly-eye integrator, an aperture stop, a half mirror, and a condenser lens system are provided between each emission end (the four emission ends other than the emission ends 7b and 7b) of the light guide 7 and the mask M. Each is arranged in order. Here, for the sake of simplicity, the configuration of the optical member provided between the emission end of the light guide 7 (four emission ends other than the emission end 7b) and the mask M will be described with reference to the emission end 7b of the light guide 7. The following description will be made exemplifying a collimating lens 8b, a fly-eye integrator 9b, an aperture stop 10b, a half mirror 11b, and a condenser lens system 12b provided between the lens and the mask M.
[0049]
The divergent light beam emitted from the emission end 7b of the light guide 7 is converted into a substantially parallel light beam by the collimator lens 8b, and then enters the fly-eye integrator (optical integrator) 9b. The fly-eye integrator 9b is configured by arranging a large number of positive lens elements vertically and horizontally and densely so that the central axis thereof extends along the optical axis AX2. Therefore, the light beam incident on the fly-eye integrator 9b is split into wavefronts by a large number of lens elements, and a secondary light source comprising the same number of light source images as the number of lens elements is provided on the rear focal plane (ie, near the exit plane). Form. That is, a substantial surface light source is formed on the rear focal plane of the fly-eye integrator 9b.
[0050]
The luminous flux from a number of secondary light sources formed on the rear focal plane of the fly-eye integrator 9b is restricted by an aperture stop 10b disposed near the rear focal plane of the fly-eye integrator 9b, and then becomes half. The light enters the mirror 11b. The light beam reflected by the half mirror 11b enters the illuminance sensor 14b via the lens 13b. The illuminance sensor 14b is a sensor for measuring the illuminance at a position optically conjugate with the plate (irradiation surface) P. The illuminance sensor 14b allows the illuminance sensor 14b to measure the illuminance on the plate P without reducing the throughput even during exposure. Illuminance can be measured. The illuminance sensor 14b measures the illuminance of light, and the measured value is input to the main control system 15.
[0051]
On the other hand, the light beam transmitted through the half mirror 11b enters the condenser lens system 12b. The aperture stop 10b is arranged at a position optically substantially conjugate with the pupil plane of the corresponding projection optical unit PL1, and has an opening for defining a range of a secondary light source that contributes to illumination. The aperture of the aperture stop 10b may have a fixed aperture diameter or a variable aperture diameter. Here, the description will be made on the assumption that the aperture of the aperture stop 10b is variable. By changing the aperture diameter of the variable aperture, the aperture stop 10b determines the σ value (the pupil plane relative to the aperture diameter of the pupil plane of each of the projection optical units PL1 to PL5 constituting the projection optical system PL). Is set to a desired value.
[0052]
The light beam passing through the condenser lens system 12b illuminates the mask M on which the pattern DP is formed, which is arranged at a position optically conjugate with the surface to be irradiated, in a superimposed manner. Similarly, the divergent light beams emitted from the other four emission ends of the light guide 7 illuminate the mask M in a superimposed manner via the collimator lens, the fly-eye integrator, the aperture stop, the half mirror, and the condenser lens system in that order. . That is, the illumination optical system IL illuminates a plurality (five in FIG. 1 in total) of trapezoidal regions arranged in the Y-axis direction on the mask M. The light emitted from the other four light-emitting ends of the light guide 7 is also measured by the illuminance sensor, and the illuminance of each light is input to the main controller 15.
[0053]
The light from each illumination area on the mask M is projected by a plurality of (five in FIG. 1) projection optical units PL1 to PL5 arranged along the Y-axis direction so as to correspond to each illumination area. The light enters the system PL. Here, the configuration of each of the projection optical units PL1 to PL5 is the same as each other. In this manner, light passing through the projection optical system PL including the plurality of projection optical units PL1 to PL5 is transmitted to the plate P supported in parallel to the XY plane via a plate holder (not shown) on a plate stage (not shown). An image of the pattern DP is formed thereon.
[0054]
A storage device 17 such as a hard disk is connected to the main control system 15, and an exposure data file is stored in the storage device 17. The exposure data file stores the processes required for performing exposure of the plate P and the order of the processes. For each of the processes, information on the resist applied on the plate P (for example, resist spectral information) Characteristics), the required resolution, the mask M to be used, the solid light source to be used, the correction amount of the illumination optical system IL, the correction amount of the projection optical system PL, and information on the flatness of the substrate (so-called recipe data). Have been.
[0055]
It is preferable that the above-mentioned recipe data (exposure data file) can be updated or added by means such as communication. More specifically, the exposure apparatus of this embodiment is connected to a management system in a device manufacturing factory where the exposure apparatus is installed by a local area network (LAN), and the recipe data of the exposure apparatus is updated from the management system. Alternatively, an additional configuration is adopted. This management system includes a local area network (LAN) with manufacturing equipment for various processes other than an exposure apparatus, for example, a post-processing apparatus such as a resist processing apparatus, an etching apparatus, a film forming apparatus, etc., an assembling apparatus, and an inspection apparatus. ). Therefore, in this management system, since it is possible to manage which rod is flowing to which apparatus, recipe data suitable for the rod is transmitted to the exposure apparatus, and the exposure apparatus transmits the recipe data. Control based on data can be performed.
[0056]
Referring back to FIG. 1, the above-described mask stage MS is provided with a scanning drive system (not shown) having a long stroke for moving the mask stage MS along the X-axis direction which is the scanning direction. Further, a pair of alignment drive systems (not shown) for moving the mask stage MS by a minute amount along the Y-axis direction which is a scanning orthogonal direction and rotating the mask stage MS by a minute amount around the Z-axis are provided. The position coordinates of the mask stage MS are measured by a laser interferometer (not shown) using the movable mirror 18 and the position is controlled.
[0057]
A similar drive system is provided on the plate stage. That is, a scanning drive system (not shown) having a long stroke for moving the plate stage along the X-axis direction which is the scanning direction, and moving the plate stage by a very small amount along the Y-axis direction which is the scanning orthogonal direction. And a pair of alignment drive systems (not shown) for rotating by a very small amount around the Z axis. The position coordinates of the plate stage are measured by a laser interferometer (not shown) using the movable mirror 19 and the position is controlled. Further, a pair of alignment systems 20a and 20b are arranged above the mask M as means for relatively positioning the mask M and the plate P along the XY plane. Further, an illuminance sensor 21 for measuring the illuminance of the illumination light on the plate P is provided on the plate stage, and the measured value is input to the main control system 15 of the illumination optical system IL.
[0058]
In this manner, the mask M and the plate P are integrally made identical to the projection optical system PL including the plurality of projection optical units PL1 to PL5 by the operation of the scan drive system on the mask stage MS side and the scan drive system on the plate stage side. By moving in the direction (X-axis direction), the entire pattern area on the mask M is transferred (scanned and exposed) to the entire exposure area on the plate P.
[0059]
Here, as described above, in this embodiment, light is emitted from the illumination light source 1 by the illuminance sensor 14b and the illuminance sensor that measures the illuminance of light emitted from the other four emission ends other than the emission end 7b. The illuminance of light is measured, and the measured value is input to the main control system 15. The illuminance of the illumination light on the plate P is measured by the illuminance sensor 21, and the measured value is also input to the main control system 15. The main control system 15 adjusts the illuminance of light emitted from the illumination light source 1 based on the spectral characteristics of the resist applied to the plate P stored in the storage device 17 to an optimum and constant value corresponding to the spectral characteristics of the resist. The power supply amount to the illumination light source 1 is controlled via the power supply device 16 so that the value becomes a value.
[0060]
Further, the main controller 15 can also independently control the power supplied to each of the unit solid-state light sources 1a constituting the first pseudo surface light source 2 and the second pseudo surface light source 3. Therefore, by individually adjusting the output of the light emitted from each of the unit solid-state light sources 1a constituting the first pseudo surface light source 2 and the second pseudo surface light source 3, the light output from the illumination light source 1 is adjusted. Power can be controlled with higher precision.
[0061]
According to the exposure apparatus of the first embodiment, by using a so-called solid-state light source such as a light emitting diode or a laser diode having advantages such as low running cost, there is a low running cost, a long life and a risk of rupture. It is possible to provide a projection exposure apparatus having no light source.
[0062]
Also, since the illumination light is emitted from each of the first pseudo surface light source and the second pseudo surface light source of the illumination light source, a pseudo surface including the first pseudo surface light source and the second pseudo surface light source Since the light output per unit area of the light source can be increased, the illuminance on the image plane can be increased. Further, since the separation distance between the first pseudo surface light source and the second pseudo surface light source is reduced, a low directivity unit solid light source can be used as a unit solid light source included in the second pseudo surface light source. . Furthermore, since the light flux emitted from the unit solid light source included in the first pseudo surface light source is efficiently emitted from the light emitting unit of the illumination light source, the light beam is emitted from the unit solid light source included in the first pseudo surface light source. The luminous flux can be used effectively.
[0063]
Further, according to the illumination light source of this projection exposure apparatus, since the output of each unit solid-state light source is large, the output per unit area of the light emitting portion of the illumination light source can be increased, and the image necessary for practical exposure can be obtained. Surface illuminance can be ensured.
[0064]
Further, since the power of light emitted from the unit solid-state light sources constituting the first pseudo surface light source and the second pseudo surface light source can be controlled, the illuminance of light emitted from the light source unit can be controlled by the resist. Sensitivity, for example, photoresist (sensitivity: 20 mJ / cm ^Two ) Or resin resist (sensitivity: 60 mJ / cm) ^Two The control can be performed with high accuracy so that the illuminance is suitable for the sensitivity of (3).
[0065]
The illumination light source according to the first embodiment has the first pseudo surface light source 2 and the second pseudo surface light source 3, but may have three or more pseudo surface light sources.
[0066]
In the illumination light source according to the first embodiment, a unit solid-state light source that emits light of the same wavelength is used as a unit solid-state light source constituting the first pseudo-surface light source and the second pseudo-surface light source. However, a unit solid-state light source that emits light of different wavelengths may be used as the unit solid-state light source that forms the first pseudo-surface light source and the unit solid-state light source that forms the second pseudo-surface light source. For example, a unit solid-state light source that emits light in a wavelength range including light with a wavelength of 365 nm is used as a unit solid-state light source that constitutes the first pseudo surface light source, and a wavelength that is a unit solid-state light source that constitutes the second pseudo surface light source. A unit solid-state light source that emits light in a wavelength range including 385 nm light may be used.
[0067]
In this case, the light emitted from the illumination light source 1 is controlled by controlling the power supplied to the unit solid-state light source constituting the first pseudo-surface light source and the unit solid-state light source constituting the second pseudo-surface light source. Can be selected. That is, when the power of the light emitted from the unit solid-state light source constituting the second pseudo surface light source is set to zero while the power of the light emitted from the unit solid-state light source constituting the first pseudo surface light source is maintained. The wavelength of light emitted from the illumination light source 1 is a wavelength range including light of 365 nm. When the power of light emitted from the unit solid-state light source constituting the first pseudo surface light source is set to zero while maintaining the power of light emitted from the unit solid-state light source constituting the second pseudo surface light source, The wavelength of light emitted from the illumination light source is a wavelength range including light of 385 nm. In this way, by setting the power of light emitted from the unit solid-state light source constituting one pseudo surface light source to zero, light in a required wavelength range can be emitted.
[0068]
Further, when a unit solid-state light source that emits light of different wavelengths is used between a unit solid-state light source that forms the first pseudo-surface light source and a unit solid-state light source that forms the second pseudo-surface light source, It is also possible to adjust the power of light emitted from each of the unit solid-state light source constituting the surface light source and the unit solid-state light source constituting the second pseudo surface light source. For example, the power of light emitted from the unit solid-state light source constituting the first pseudo surface light source is increased, and the power of light emitted from the unit solid-state light source constituting the second pseudo surface light source is decreased. Alternatively, control such as increasing the power of light emitted from the unit solid-state light source constituting the second pseudo surface light source and decreasing the power of light emitted from the unit solid-state light source constituting the first pseudo surface light source is performed. It can be performed. In this way, the spectral characteristics of the light emitted from the illumination light source can be adjusted.
[0069]
In the illumination light source according to the first embodiment, a unit solid-state light source that emits light of the same wavelength is used as a unit solid-state light source constituting the first pseudo-surface light source and the second pseudo-surface light source. However, a plurality of types of unit solid-state light sources that emit light of different wavelengths are used as unit solid-state light sources constituting the first pseudo surface light source, and different wavelengths are used as unit solid-state light sources constituting the second pseudo surface light source. A plurality of types of unit solid-state light sources that emit light may be used. Further, the divergence angle of the unit solid-state light source constituting the first pseudo surface light source may be different from the divergence angle of the unit solid-state light source constituting the second pseudo surface light source.
[0070]
Next, an exposure apparatus according to a second embodiment of the present invention will be described with reference to the drawings. In the description of the second embodiment, the same members as those of the exposure apparatus according to the first embodiment are denoted by the same reference numerals as those used in the description of the first embodiment. A description will be given with reference to FIG. The exposure apparatus according to the second embodiment of the present invention is obtained by changing the illumination light source 1 to the illumination light source shown in FIG. 5, and the other parts are the same as those of the exposure apparatus according to the first embodiment. It has the same configuration.
[0071]
As shown in FIG. 5, the illumination light source 22 is configured such that unit solid-state light sources 23b are arranged in a two-dimensional array on a substrate 23a. Here, the unit solid light source 23b has a circular outer shape when viewed from the light emitting direction of the unit solid light source 23b, and includes a substantially circular light emitting portion. The unit solid-state light sources 23b are arranged closest to the substrate 23a.
[0072]
Here, as for the illumination light source 22, when the area of the pseudo-surface light source of the illumination light source is SA and the total area of the unit solid-state light sources 22b is S1,
S1 / SA> 0.7
Is configured to satisfy the following condition. Note that the area of the unit solid light source 23b does not refer to the area of the light emitting portion of the unit solid light source 23b, but is defined by the external shape when the unit solid light source 23b is viewed from the light emitting direction of the unit solid light source 23b. The total area S1 is the sum of the areas of the unit solid-state light sources 23b.
[0073]
When the illumination light source 22 has a diameter D of the unit solid light source 23b and an average interval p of the unit solid light sources 23b,
1 ≦ p / D ≦ 1.4
Satisfies the condition.
[0074]
The light beam emitted from the illumination light source 22 is converted by the condenser lens 5 into a substantially parallel light beam. The other points are the same as those of the first embodiment, and the description is omitted.
[0075]
Here, also in the second embodiment, the illuminance of the light emitted from the illumination light source 22 by the illuminance sensor that measures the illuminance of the light emitted from the four emission ends other than the illuminance sensor 14b and the emission end 7b. Is measured, and the measured value is input to the main control system 15. The illuminance of the illumination light on the plate P is measured by the illuminance sensor 21, and the measured value is also input to the main control system 15. The main control system 15 adjusts the illuminance of light emitted from the illumination light source 22 to an optimum and constant value corresponding to the sensitivity of the resist, based on the sensitivity of the resist applied to the plate P stored in the storage device 17. Thus, the amount of power supply to the illumination light source 22 is controlled via the power supply device 16.
[0076]
Further, the main control unit 15 can independently control the power supplied to each of the unit solid-state light sources 23b included in the illumination light source 22. Therefore, the power of the light emitted from the illumination light source 22 can be controlled with higher precision by individually adjusting the output of the light emitted from each of the unit solid light sources 23b constituting the illumination light source 22.
[0077]
According to the exposure apparatus according to the second embodiment, by using a so-called solid-state light source such as a light emitting diode or a laser diode having advantages such as low running cost, low exposure cost, long life and risk of explosion are achieved. It is possible to provide a projection exposure apparatus having no light source.
[0078]
Further, since the light output per unit area of the pseudo surface light source of the illumination light source 22 can be increased, the image plane illuminance can be increased. Further, according to the illumination light source of this projection exposure apparatus, since the output of each unit solid-state light source is large, the output per unit area of the light emitting portion of the illumination light source can be increased, and the image necessary for practical exposure can be obtained. Surface illuminance can be ensured.
[0079]
Next, an exposure apparatus according to a third embodiment of the present invention will be described with reference to the drawings. In the description of the third embodiment, the same members as those of the exposure apparatus according to the first embodiment are denoted by the same reference numerals as those used in the description of the first embodiment. A description will be given with reference to FIG. The exposure apparatus according to the third embodiment of the present invention is obtained by changing the illumination light source 1 to the illumination light source shown in FIG. 6, and the other parts are the same as those of the exposure apparatus according to the first embodiment. It has the same configuration.
[0080]
As shown in FIG. 6, the illumination light source 24 has a configuration in which unit solid-state light sources 25b are arranged in a two-dimensional array on a substrate 25a. Here, the unit solid-state light source 25b has a regular hexagonal outer shape when the unit solid-state light source 25b is viewed from the light emitting direction of the unit solid-state light source 25b, and includes a substantially regular hexagonal light emitting portion. The unit solid-state light sources 25b are arranged closest on the substrate 25a.
[0081]
Here, when the illumination light source 24 has an area of the pseudo-surface light source of the illumination light source as SA and the total area of the unit solid light sources 25b as S1,
S1 / SA> 0.7
Is configured to satisfy the following condition. The area of the unit solid-state light source 25b does not refer to the area of the light emitting portion of the unit solid-state light source 25b, but is defined by the external shape when the unit solid-state light source 25b is viewed from the light emitting direction of the unit solid-state light source 25b. The total area S1 is the sum of the areas of the unit solid light sources 25b.
[0082]
Further, when the illumination light source 24 has a diameter D of the unit solid light source 25b and an average interval p of the unit solid light sources 25b,
1 ≦ p / D ≦ 1.4
Satisfies the condition.
[0083]
The light beam emitted from the illumination light source 24 is converted by the condenser lens 5 into a substantially parallel light beam. The other points are the same as those of the first embodiment, and the description is omitted.
[0084]
Here, also in the third embodiment, the illuminance of the light emitted from the illumination light source 24 by the illuminance sensor that measures the illuminance of the light emitted from the four emission ends other than the illuminance sensor 14b and the emission end 7b. Is measured, and the measured value is input to the main control system 15. The illuminance of the illumination light on the plate P is measured by the illuminance sensor 21, and the measured value is also input to the main control system 15. The main control system 15 adjusts the illuminance of light emitted from the illumination light source 24 to an optimal and constant value corresponding to the sensitivity of the resist based on the sensitivity of the resist applied to the plate P stored in the storage device 17. Thus, the amount of power supply to the illumination light source 24 is controlled via the power supply device 16.
[0085]
Further, the main control unit 15 can also independently control the power supplied to each of the unit solid-state light sources 25b included in the illumination light source 24. Therefore, the power of the light emitted from the illumination light source 24 can be controlled with higher precision by individually adjusting the output of the light emitted from each of the unit solid light sources 25b constituting the illumination light source 24.
[0086]
According to the exposure apparatus of the third embodiment, by using a so-called solid-state light source such as a light emitting diode or a laser diode having advantages such as low running cost, there is a low running cost, a long life and a risk of rupture. It is possible to provide a projection exposure apparatus having no light source.
[0087]
Further, since the light output per unit area of the pseudo surface light source of the illumination light source 24 can be increased, the image plane illuminance can be increased. Further, according to the illumination light source of this projection exposure apparatus, since the output of each unit solid-state light source is large, the output per unit area of the light emitting portion of the illumination light source can be increased, and the image necessary for practical exposure can be obtained. Surface illuminance can be ensured.
[0088]
The illumination light sources according to the second embodiment and the third embodiment described above use unit solid light sources that emit light of the same wavelength as unit solid light sources that constitute a pseudo surface light source. However, a plurality of types of unit solid-state light sources that emit light of different wavelengths may be used. In this case, the wavelength of the light emitted from the illumination light source can be selected by controlling the power supplied to each unit solid-state light source constituting the pseudo surface light source. That is, for example, when the pseudo-surface light source is configured by a unit solid-state light source that emits light in a wavelength range including light of 365 nm and a unit solid-state light source that emits light in a wavelength range including light of 385 nm, the wavelength of 365 nm By supplying power only to a unit solid-state light source that emits light in a wavelength range including light or a unit solid-state light source that emits light in a wavelength range including 385 nm, light in a necessary wavelength range can be emitted. it can.
[0089]
When the pseudo surface light source is configured using a plurality of types of unit solid light sources that emit light of different wavelengths, the light is emitted from the illumination light source by controlling the amount of power supplied to each unit solid light source. The spectral characteristics of light can also be adjusted.
[0090]
Next, an exposure apparatus according to a fourth embodiment of the present invention will be described with reference to the drawings. FIG. 7 is a side view of the illumination optical system IL according to the fourth embodiment. In the description of the fourth embodiment, the same members as those of the exposure apparatus according to the first embodiment are denoted by the same reference numerals as those used in the description of the first embodiment. A description will be given with reference to FIG. The exposure apparatus according to the fourth embodiment includes three illumination light sources 51a in an illumination optical system IL. ₁ , 51a ₂ , 51a ₃ And divides the illumination light from the three illumination light sources into five illumination light via the light guide 7 having good randomness. The XYZ rectangular coordinate system shown in FIG. 7 is the same as the XYZ rectangular coordinate system used in the first embodiment.
[0091]
Here, the illumination light source 51a ₁ , 51a ₂ , 51a ₃ Has the same configuration as the illumination light source 1 of the exposure apparatus according to the first embodiment. Illumination light source 51a ₁ Is emitted from the condenser lens 5a. ₁ Is converted into a substantially parallel light beam by the condenser lens 6a. ₁ And the light is condensed by the incident end 7a of the light guide 7. ₁ Incident on. Similarly, the illumination light source 51a ₂ , 51a ₃ Is emitted from the condenser lens 5a. ₂ , 5a ₃ Is converted into a substantially parallel light beam by the condenser lens 6a. ₂ , 6a ₃ And the light is condensed by the incident end 7a of the light guide 7. ₂ , 7a ₃ Incident on.
[0092]
The light guide 7 shown in FIG. 7 is, for example, a random light guide fiber configured by randomly bundling a large number of fiber wires, and has the same number of incident ends 7a as the number of light source units. ₁ , 7a ₂ , 7a ₃ And the same number of exit ends as the number of projection optical units constituting the projection optical system PL (only the exit end 7b is shown in FIG. 7). Incident end 7a of light guide 7 ₁ , 7a ₂ , 7a ₃ After the light that has entered the inside has propagated through the inside, the light is split from the five emission ends (the emission end 7b and the other four emission ends) and emitted.
[0093]
This light guide 7 preferably has a plurality of optical fiber bundles. That is, in this case, the incident end 7a ₁ And the exit end 7b optically connected to the entrance end 7a ₁ Optical fiber bundle that guides a part of the light incident from the ₂ And the exit end 7b optically connected to the entrance end 7a ₂ Optical fiber bundle that guides a part of the light incident from the ₃ And the exit end 7b optically connected to the entrance end 7a ₃ And a bundle of optical fibers for guiding a part of the light incident from the light source to the emission end 7b. Similarly, the incident end 7a ₁ , Incident end 7a ₂ , Incident end 7a ₃ And the other four exit ends are optically connected, and the entrance end 7a ₁ , Incident end 7a ₂ , Incident end 7a ₃ The optical fiber bundle guides a part of the light incident from the other to the other four exit ends.
[0094]
The divergent light beam emitted from the emission end 7b of the light guide 7 passes through the half mirror 11b through the collimator lens 8b, the fly-eye integrator 9b, and the aperture stop 10b in this order, and passes through the mask M via the condenser lens system 12b. Lighting is performed in a superimposed manner. The divergent light beams emitted from the other four emission ends also pass through the half mirror via the collimator lens, the fly-eye integrator and the aperture stop in that order, and illuminate the mask M in a superimposed manner via the condenser lens. That is, the illumination optical system IL illuminates a plurality (five in FIG. 1 in total) of trapezoidal regions arranged in the Y-axis direction on the mask M.
[0095]
The light beam reflected by the half mirror 11b enters the illuminance sensor 14b via the lens 13b. The illuminance sensor 14b detects the illuminance of light, and the detected value is input to the main control system 15. The illuminance of the light emitted from the other four emission ends is also detected by the illuminance sensor and input to the main control unit 15.
[0096]
The main control system 15 includes an illumination light source 51a. ₁ ~ 51a ₃ The illumination light source 51a so that the illuminance of the light emitted from the light source becomes an optimal and constant value corresponding to the sensitivity of the resist. ₁ ~ 51a ₃ To control the amount of power supplied to each of them.
[0097]
According to the exposure apparatus of the fourth embodiment, by using a so-called solid-state light source such as a light emitting diode or a laser diode having advantages such as low running cost, low running cost, long life and risk of explosion are achieved. It is possible to provide a projection exposure apparatus having no light source.
[0098]
In addition, each illumination light source 51a ₁ ~ 51a ₃ Since the light output per unit area of the pseudo surface light source can be increased, the image plane illuminance can be increased. Furthermore, three illumination light sources 51a ₁ ~ 51a ₃ , The image plane illuminance can be further increased. Therefore, the image plane illuminance required for practical exposure can be secured, and the mask pattern can be exposed on the plate with high throughput.
[0099]
In each of the above-described embodiments, the step-and-scan type projection exposure apparatus including a projection optical system including a plurality of projection optical units has been described as an example. The present invention may be applied to a step-and-repeat type projection exposure apparatus. The present invention may be applied to a proximity type exposure apparatus. In this case, since there is no projection optical system, the image plane illuminance can be increased. In each of the above embodiments, the mask is illuminated by Koehler illumination. However, the mask may be illuminated by critical illumination.
[0100]
Next, a method for manufacturing a micro device using the exposure apparatus according to the embodiment of the present invention in a lithography process will be described. FIG. 8 is a flowchart of a method for obtaining a semiconductor device as a micro device. First, in step S40 of FIG. 8, a metal film is deposited on one lot of wafers. In the next step S42, a photoresist is applied on the metal film on the wafer of the one lot. Thereafter, in step S44, using the exposure apparatus according to the embodiment of the present invention, the image of the pattern on the mask M is transferred to each shot on the wafer of the lot through the projection optical system (projection optical unit). It is sequentially exposed and transferred to the area. That is, the mask M is illuminated using the illuminating device, and the image of the pattern on the mask M is projected onto the substrate using the projection optical system, and is exposed and transferred.
[0101]
Thereafter, in step S46, the photoresist on the one lot of wafers is developed, and in step S48, etching is performed on the one lot of wafers using the resist pattern as a mask, thereby forming a pattern on the mask. A corresponding circuit pattern is formed in each shot area on each wafer. Thereafter, a device such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer and the like. According to the above-described semiconductor device manufacturing method, a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput. In the exposure apparatus according to the embodiment of the present invention, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). . Hereinafter, an example of the technique at this time will be described with reference to the flowchart of FIG. FIG. 9 is a flowchart for explaining a method of manufacturing a liquid crystal display element as a micro device by forming a predetermined pattern on a plate using the exposure apparatus of this embodiment.
[0102]
In the pattern forming step S50 of FIG. 9, a so-called photolithography step of transferring and exposing a mask pattern to a photosensitive substrate (a glass substrate coated with a resist) using the exposure apparatus of this embodiment is executed. By this photolithography step, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate is subjected to a development process, an etching process, a reticle peeling process, and other processes to form a predetermined pattern on the substrate, and the process proceeds to the next color filter forming process S52.
[0103]
Next, in a color filter forming step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three R, G, B Are formed in a horizontal scanning line direction to form a color filter. Then, after the color filter forming step S52, a cell assembling step S54 is performed. In the cell assembling step S54, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step S50, the color filters obtained in the color filter forming step S52, and the like.
[0104]
In the cell assembling step S54, for example, a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S50 and the color filter obtained in the color filter forming step S52, and a liquid crystal panel (liquid crystal cell) is formed. ) To manufacture. Thereafter, in a module assembling step S56, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display device, a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.
[0105]
【The invention's effect】
According to the illumination light source and the illumination device of the present invention, the light output per unit area of the pseudo surface light source including the first pseudo surface light source and the second pseudo surface light source can be increased. Surface illuminance can be increased.
[0106]
According to the exposure apparatus of the present invention, the light output per unit area of the light emitting portion of the illumination light source can be increased, so that the image plane illuminance can be increased.
[0107]
ADVANTAGE OF THE INVENTION According to the exposure method of this invention, since the pattern image of a mask is exposed by the light of the illuminance suitable for the photosensitive material applied to the photosensitive substrate, the pattern of the mask can be satisfactorily transferred to the photosensitive substrate. .
[Brief description of the drawings]
FIG. 1 is a perspective view showing an overall schematic configuration of an exposure apparatus according to a first embodiment of the present invention.
FIG. 2 is a side view of an illumination optical system of the exposure apparatus according to the first embodiment of the present invention.
FIG. 3 is a plan view and a side view of the illumination light source according to the first embodiment of the present invention.
FIG. 4 is a diagram for explaining an illumination light source according to the first embodiment of the present invention.
FIG. 5 is a configuration diagram of an illumination light source according to a second embodiment of the present invention.
FIG. 6 is a configuration diagram of an illumination light source according to a third embodiment of the present invention.
FIG. 7 is a side view of an illumination optical system of an exposure apparatus according to a fourth embodiment of the present invention.
FIG. 8 is a flowchart of a method for manufacturing a semiconductor device as a micro device according to an embodiment of the present invention.
FIG. 9 is a flowchart of a method for manufacturing a liquid crystal display element as a micro device according to an embodiment of the present invention.
[Explanation of symbols]
1, 22, 24: light source unit, 7: light guide, 8b: collimating lens, 9b: fly-eye integrator, 10b: aperture stop, 11b: half mirror, 12b: condenser lens system, 14b, 21: illuminance sensor, 15 .. Main control system, 16 power supply device, 17 storage device, DP pattern, M mask, P plate, IL illumination light system, PL projection optical system, PL1 to PL5 projection optical unit, MS mask stage.

Claims (18)

An illumination light source including a pseudo surface light source including a plurality of unit solid-state light sources arranged in an array,
A first pseudo-surface light source including a plurality of unit solid-state light sources arranged in an array,
A second pseudo surface light source including a plurality of unit solid-state light sources that are arranged at a predetermined distance from the first pseudo surface light source along a light emission direction of the pseudo surface light source and are arranged in an array; Including
When the area of the pseudo surface light source is SA and the total area of the unit solid-state light sources is S1, the following conditions are satisfied.
0.5 <S1 / SA <0.8 The average interval between the plurality of unit solid-state light sources included in the first pseudo surface light source and the average interval between the plurality of unit solid-state light sources included in the second pseudo surface light source are substantially equal. Item 2. The illumination light source according to item 1. 3. The following condition is satisfied when the predetermined distance is d and the average interval between the unit solid-state light sources included in the first pseudo surface light source is p. Illumination light source.
0 <d / p <5 The second pseudo surface light source is disposed closer to the light emission side than the first pseudo surface light source,
The predetermined distance is d, the average interval between the plurality of unit solid-state light sources included in the first pseudo surface light source is p, and the light flux emitted from the unit solid-state light source included in the first pseudo surface light source is p. 2. The following condition is satisfied when an angle between a light beam having half the radiation intensity of the light beam having the highest radiation intensity and the light beam having the highest radiation intensity is θ (rad). The illumination light source according to claim 3.
0.2 ≦ (2 · tan θ) / (p / d) ≦ 4 5. The pseudo surface light source according to claim 1, wherein the unit solid-state light sources are arranged in an array such that the value of image plane illuminance is 20 mW / cm ² or more. 6. Illumination light source. The illumination light source according to any one of claims 1 to 5, wherein the unit solid-state light source has an output of at least 5 mW / unit or more. The illumination light source according to any one of claims 1 to 6, wherein the unit solid light source emits light having a wavelength of 300 to 500 nm. The illumination light source according to any one of claims 1 to 7, wherein a half width of a wavelength of an emission spectrum of the unit solid light source is ± 20 nm or less. The unit solid-state light source has an average radiance of 500 mW / (cm ² · sr) or more in a range of ± 1 ° around a light beam having the highest radiation intensity among emitted light beams. The illumination light source according to claim 1. An illumination light source according to any one of claims 1 to 9, and a light-collecting optical system that collects a light beam from the illumination light source, wherein light collected by the light-collecting optical system is used. An illumination device that illuminates a surface to be irradiated or a surface optically conjugate with the surface to be irradiated,
An illumination device, wherein the illumination light source is arranged at a front focal position of the condensing optical system or at a position near the front focal position, or at a position optically conjugate to the front focal position or at a position near the front focal position. In an exposure apparatus that transfers a pattern of a mask onto a photosensitive substrate,
An exposure apparatus comprising the illumination device according to claim 10 for illuminating the mask. In an exposure apparatus that transfers a pattern of a mask onto a photosensitive substrate based on illumination light from an illumination light source,
The illumination light source includes a pseudo surface light source including a plurality of unit solid-state light sources arranged in an array,
An exposure apparatus, wherein the following conditions are satisfied, where SA is the area of the pseudo surface light source and S1 is the total area of the unit solid light sources.
S1 / SA> 0.7 13. The exposure apparatus according to claim 12, wherein the unit solid light source includes a substantially circular light emitting unit. 13. The exposure apparatus according to claim 12, wherein the unit solid light source includes a substantially regular hexagonal light emitting unit. The exposure according to any one of claims 12 to 14, wherein when the diameter of the unit solid-state light source is D and the average interval between the unit solid-state light sources is p, the following condition is satisfied. apparatus.
1 ≦ p / D ≦ 1.4 The exposure apparatus according to any one of claims 11 to 15, further comprising a projection optical system for forming a pattern image of the mask on the photosensitive substrate. The angle between the light beam having half the radiation intensity of the light beam having the highest radiation intensity and the light beam having the highest radiation intensity among the light beams emitted from the illumination device is defined as θ (rad), and the angle of the projection optical system is The magnification is β, and the numerical aperture of the projection optical system is N.V. A. The exposure apparatus according to claim 16, wherein the following condition is satisfied.
0.2 ≦ (| sin θ | / | β |) / N. A. ≦ 5 An exposure method using the exposure apparatus according to any one of claims 11 to 17,
An illumination step of illuminating a mask using a light beam emitted from the illumination light source,
A transfer step of transferring the pattern of the mask onto a photosensitive substrate,
An exposure method comprising:

Images