JP2004253758A - Illuminating light source unit, aligner, and exposure method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an illuminating light source unit capable of cooling a solid light source at a low cost. <P>SOLUTION: The solid light source unit 1 comprises a solid light source array 1b having a plurality of solid light sources aligned in an array; and a solid light source housing 1a for accommodating the solid light source array. The solid light source housing 1a comprises a medium supply port 1d for cooling that supplies a medium for cooling for cooling the solid light source array 1b into the solid light source housing 1a; a medium discharge port 1e for cooling that discharges the medium for cooling from the solid light source housing; and a power supply connector 1f for supplying power to the solid light source array. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to an illumination light source unit provided in an exposure apparatus used in a manufacturing process of a semiconductor element, a liquid crystal display element, an imaging element, a thin film magnetic head, and other micro devices, an exposure apparatus including the illumination light source unit, and the exposure apparatus. It relates to the exposure method used.
[0002]
[Prior art]
2. Description of the Related Art A liquid crystal display element, which is one of micro devices, is usually formed by patterning a transparent thin-film electrode on a glass substrate (plate) into a desired shape by a photolithography method, and switching elements such as a TFT (Thin Film Transistor) and an electrode. It is manufactured by forming wiring. In a manufacturing process using this photolithography method, a projection exposure apparatus that projects and exposes an original pattern formed on a mask onto a plate coated with a photosensitive agent such as a photoresist through a projection optical system is used. Used.
[0003]
Conventionally, after performing relative positioning between a mask and a plate, a pattern formed on the mask is collectively transferred to one shot area set on the plate, and the plate is step-moved after the transfer. A step-and-repeat type projection exposure apparatus (a so-called stepper) for performing exposure of another shot area by using the exposure apparatus is often used.
[0004]
In recent years, a liquid crystal display element has been required to have a large area, and accordingly, a projection exposure apparatus used in a photolithography process has been desired to have an enlarged exposure area. In order to enlarge the exposure area of the projection exposure apparatus, it is necessary to increase the size of the projection optical system. However, it becomes costly to design and manufacture a large projection optical system in which residual aberration is reduced as much as possible. Therefore, in order to minimize the size of the projection optical system, a slit-like illumination light whose length in the longitudinal direction is set to be substantially the same as the effective diameter of the projection optical system on the object plane side (mask side) of the projection optical system. Irradiates the mask, and while the slit-shaped light passing through the mask is irradiating the plate via the projection optical system, the mask and the plate are moved relative to the projection optical system and scanned, A so-called step-and-scan method in which a part of the pattern formed on the mask is sequentially transferred to one shot set on the plate, and after the transfer, the plate is step-moved and the other shot areas are similarly exposed. Projection exposure apparatus has been devised.
[0005]
In recent years, in order to further expand the exposure area, instead of using one large projection optical system, a small partial projection optical system is placed at a predetermined interval in a direction orthogonal to the scanning direction (non-scanning direction). A projection including a so-called multi-lens type projection optical system in which a plurality of first arrays and a second array in which a partial optical system is arranged between the partial projection optical systems are arranged in the scanning direction. An exposure apparatus has been devised.
[0006]
As a light source of the above-described projection exposure apparatus, a mercury lamp or the like is mainly used in an ultraviolet region having a wavelength of about 360 nm. Since the amount of heat generated by the mercury lamp is extremely large, it is essential to provide a cooling device, and a cooling device using air has conventionally been employed (for example, see Patent Document 1).
[0007]
[Patent Document 1]
JP 2001-250765 A
[0008]
[Problems to be solved by the invention]
In the cooling device as described above, so-called clean air in which the concentration of organic substances contained is reduced through a chemical filter or the like is used as air for cooling the mercury lamp. However, development and maintenance of an air purifying device for producing clean air requires a great deal of expense.
[0009]
By the way, the life of a mercury lamp used as a light source of a projection exposure apparatus is about 500 hours to 1000 hours. Therefore, the lamp needs to be periodically replaced, which has been a heavy burden on the exposure apparatus user. In addition, high power is required to ensure high illuminance, and accompanying heat generation measures are required.Therefore, there was a risk of high running costs and rupture due to factors such as deterioration over time. . On the other hand, light-emitting diodes have higher luminous efficiency than mercury lamps and the like, so they have the features of power saving and small heat generation, can realize a significant reduction in running costs, and have a life of about 3000 hours. The burden on replacement is small, and there is no danger of explosion due to factors such as aging. More recently, UV-LEDs and the like that have achieved a high light output of about 100 mw at a wavelength of 365 nm have been developed. Therefore, the possibility of using a solid-state light source as the light source of the projection exposure apparatus has been studied. However, even when a solid-state light source is used as the light source, cooling of the solid-state light source is indispensable.
[0010]
An object of the present invention is to provide an illumination light source unit capable of cooling a solid-state light source at low cost, an exposure apparatus having the illumination light source unit, and an exposure method using the exposure apparatus.
[0011]
[Means for Solving the Problems]
The solid-state light source unit according to claim 1, wherein the solid-state light source unit includes a solid-state light source array having a plurality of solid-state light sources arranged in an array, and a solid-state light source housing that accommodates the solid-state light source array. A cooling medium supply port for supplying a cooling medium for cooling the solid state light source array into the solid state light source housing, a cooling medium discharge port for discharging the cooling medium from inside the solid state light source housing, A power supply connector for supplying power to the solid state light source array.
[0012]
Further, the illumination light source unit according to claim 2 is characterized in that the solid-state light source housing further includes a light transmissive member disposed on an emission side of a light beam emitted from the solid-state light source array.
[0013]
According to a third aspect of the present invention, in the illumination light source unit, the light transmitting member includes a light transmitting partition.
[0014]
According to the illumination light source unit according to any one of the first to third aspects, the solid-state light source housing in which the solid-state light source array is housed is provided with the cooling medium supply port, the cooling medium discharge port, and the power supply connector. Thus, when the cooling medium causes fogging or the like on the lens surface of the solid-state light source array, it can be easily replaced with a new illumination light source unit, and supply of the cooling medium and power to the replaced illumination light source unit. It can be performed.
[0015]
The illumination light source unit according to claim 4 is characterized in that the light transmitting member is configured to be detachable. According to the illumination light source unit of the fourth aspect, when fogging or the like occurs on the lens surface of the solid light source array due to the cooling medium, only the solid light source array can be easily replaced by removing the partition. .
[0016]
The illumination light source unit according to claim 5 further includes a relay optical member disposed on a light emission side of the solid-state light source array. According to the illumination light source unit of the fifth aspect, it is possible to increase the degree of freedom in the arrangement of the plurality of solid state light sources constituting the solid state light source array.
[0017]
In the illumination light source unit according to a sixth aspect, the illumination light source unit is attached to and detached from an illumination system housing that houses an illumination optical system in which the solid light source housing guides a light beam emitted from the solid light source array to a mask. And a detachment mechanism for the same.
[0018]
The illumination light source unit according to claim 7 is characterized in that the solid-state light source housing further includes a reference surface having a predetermined relationship with a reference axis of the solid-state light source array.
[0019]
According to the illumination light source unit according to the sixth and seventh aspects, the illumination light source unit can be accurately attached to the illumination system housing.
[0020]
The illumination light source unit according to claim 8 further includes a driver for driving the solid-state light source array.
[0021]
Further, in the illumination light source unit according to claim 9, the cooling medium has a gas, and the cooling medium supply port and the cooling medium discharge port have a cooling gas path through which the cooling gas passes. , Formed around the solid-state light source array.
[0022]
According to the illuminating light source unit of the ninth aspect, since the cooling gas path through which the cooling gas passes is formed around the solid light source array, the solid light source array can be efficiently cooled. .
[0023]
An illumination light source unit according to a tenth aspect is characterized in that the gas includes air. According to the illumination light source unit of the tenth aspect, since the solid-state light source array is cooled using air instead of using clean air, the solid-state light source array can be cooled at low cost.
[0024]
According to an eleventh aspect of the present invention, in an exposure apparatus, a light beam emitted from the illumination light source unit according to any one of the first to tenth aspects is applied to a mask by an illumination optical system housed in an illumination system housing. Guiding and transferring the pattern of the mask onto a photosensitive substrate.
[0025]
According to the exposure apparatus of the eleventh aspect, since the solid-state light source array of the illumination light source unit can be cooled at low cost, it is possible to perform low-cost and stable exposure processing using illumination light.
[0026]
An exposure apparatus according to a twelfth aspect is characterized in that the illumination system housing has a partition for transmitting a light beam emitted from the illumination light source unit.
[0027]
According to the exposure apparatus of the twelfth aspect, the illumination optical system is housed in the illumination system housing and guides the light emitted from the illumination light source array to the illumination optical system via the partition provided in the illumination system housing. The cooling medium for cooling the solid-state light source array of the light source unit does not lower the cleanliness of the gas in the illumination system housing.
[0028]
The exposure apparatus according to claim 13 further includes a cooling device that supplies a cooling medium for cooling the solid-state light source array to the illumination light source unit.
[0029]
The exposure apparatus according to claim 14, wherein the light beam emitted from the illumination light source unit is guided to a mask by an illumination optical system, and the pattern of the mask is transferred onto a photosensitive substrate. The unit includes a solid-state light source array having a plurality of solid-state light sources arranged in an array, and a solid-state light source housing that houses the solid-state light source array, and includes a position of the solid-state light source array and a position of the illumination light source unit. At least one of the illumination optical systems is provided so as to be adjustable, and the illumination optical system includes an optical element provided so as to be adjustable so as to change illumination characteristics of the mask.
[0030]
According to the exposure apparatus of the fourteenth aspect, the adjustment stroke is adjusted by using the adjustment of the attitude of the solid-state light source array or the attitude of the illumination light source unit and the adjustment by an optical element provided so as to be adjustable in the illumination optical system. And high-precision adjustment can be achieved at the same time.
[0031]
The exposure apparatus according to claim 15 further includes a relay optical member disposed on a light emission side of the solid-state light source array. According to the exposure apparatus of the fifteenth aspect, it is possible to increase the degree of freedom in the arrangement of the plurality of solid-state light sources constituting the solid-state light source array.
[0032]
The exposure apparatus according to claim 16 further includes an illumination system housing that houses the illumination optical system, and the solid-state light source housing includes an attachment / detachment mechanism for attaching / detaching the illumination light source unit to / from the illumination system housing. It is characterized by having.
[0033]
Further, the exposure apparatus according to claim 17 is characterized in that, when the solid-state light source housing is mounted, the illumination characteristics are adjusted using the adjustable optical element in the illumination optical system. .
[0034]
The exposure apparatus according to claim 18, wherein the coarse adjustment of the illumination characteristics is performed using at least one of the attitude of the solid-state light source array and the attitude of the illumination light source unit, and the fine adjustment of the illumination characteristics is performed. The adjustment is performed by the optical element provided in the illumination optical system so as to be adjustable.
[0035]
20. The exposure apparatus according to claim 19, wherein the light beam emitted from the illumination light source unit is guided to a mask by an illumination optical system, and the pattern of the mask is transferred onto a photosensitive substrate. An illumination system housing for housing the system, wherein the illumination light source unit comprises a solid state light source array having a plurality of solid state light sources arranged in an array, and a solid state light source housing for housing the solid state light source array; The housing includes an attachment / detachment mechanism for attaching / detaching the illumination light source unit to / from the illumination system housing, and the illumination optical system includes an optical element provided so as to be adjustable to change illumination characteristics of the mask. When the solid-state light source housing is mounted, the illumination characteristic is adjusted using the adjustable optical element in the illumination optical system. And wherein the Ukoto. According to this exposure apparatus, the mechanism of the illumination light source unit can be simplified.
[0036]
The exposure apparatus according to claim 20 further includes a relay optical member disposed on the light emission side of the solid-state light source array. According to the exposure apparatus of the twentieth aspect, it is possible to increase the degree of freedom in the arrangement of the plurality of solid-state light sources constituting the solid-state light source array.
[0037]
Further, the exposure apparatus according to claim 21 further includes a first adjustment mechanism for adjusting the attitude of the illumination light source unit. According to the exposure apparatus of the twenty-first aspect, the posture of the illumination light source unit, for example, the optical axis direction with respect to the optical axis of the illumination optical system, the position in the direction orthogonal to the optical axis of the illumination optical system, the light of the illumination optical system, By adjusting the inclination with respect to the axis, it is possible to correct magnification telecentricity, inclined telecentricity, and unevenness of illumination light.
[0038]
An exposure apparatus according to a twenty-second aspect is provided with a second adjustment mechanism for adjusting the attitude of the solid-state light source array. According to the exposure apparatus of the present invention, the attitude of the solid-state light source array of the illumination light source unit, for example, the optical axis direction with respect to the optical axis of the illumination optical system, the position in the direction orthogonal to the optical axis of the illumination optical system, the illumination optical system By adjusting the inclination of the system with respect to the optical axis, it is possible to correct magnification telecentricity, inclined telecentricity, and unevenness of illumination light.
[0039]
The exposure apparatus according to claim 23 further includes a projection optical system for forming a pattern image of the mask on the photosensitive substrate.
[0040]
In an exposure method according to a twenty-fourth aspect, in the exposure method using the exposure apparatus according to any one of the eleventh to twenty-third aspects, a mask is formed using a light beam emitted from the illumination light source unit. An illumination step of illuminating and a transfer step of transferring the pattern of the mask onto a photosensitive substrate are provided.
[0041]
According to the exposure method of the twenty-fourth aspect, since the exposure apparatus that can cool the solid-state light source array of the illumination light source unit at a low cost is used, the exposure processing using the illumination light that is stable at a low cost can be performed. It can be carried out.
[0042]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a schematic configuration of a projection exposure apparatus according to an embodiment.
The projection exposure apparatus shown in FIG. 1 includes an illumination light source unit 1. As shown in FIG. 2, the illumination light source unit 1 has a solid light source housing 1a, and a solid light source array 1b in which light-emitting diodes (solid light sources) are arranged in an array is arranged in the solid light source housing 1a. .
[0043]
The solid-state light source housing 1a has a partition wall 1c formed of a light transmitting member for emitting a light beam emitted from the solid-state light source array 1b to the outside of the solid-state light source housing 1a on a wall surface facing the light emission side of the solid-state light source array 1b. Have. Further, a cooling medium supply port 1d for supplying a cooling medium having air as a gas for cooling the solid light source array 1b by a cooling device to be described later into the solid light source housing 1a, and a cooling medium supply port from inside the solid light source housing 1a. And a cooling medium discharge port 1e for discharging the medium. Further, the solid-state light source housing 1a includes a power supply connector 1f for supplying electric power to the solid-state light source array 1b, and a driver 1g for driving the solid-state light source array 1b.
[0044]
The solid-state light source housing 1a includes an attachment / detachment mechanism 1h for attaching and detaching the illumination light source unit 1 to / from an illumination system housing 3 that houses an illumination optical system that guides a light beam emitted from the solid-state light source array 1b to the mask M. I have. Further, the solid-state light source housing 1a includes a reference surface 1j having a predetermined relationship with the reference axis 1i of the solid-state light source array 1b.
[0045]
A cooling device 2 is connected to the illumination light source unit 1. That is, the cooling medium supply pipe 2a of the cooling device 2 is connected to the cooling medium supply port 1d of the illumination light source unit 1, and the cooling medium discharge pipe 2b is connected to the cooling medium discharge port 1e of the illumination light source unit 1. Have been. The cooling device 2 supplies a cooling medium for cooling the solid light source array 1b to the illumination light source unit 1 and discharges the cooling medium in the solid light source housing 1a.
[0046]
The solid-state light source array 1b of the illumination light source unit 1 is positioned at a position optically conjugate with a front focal position (light source focal position) of a condenser optical system 8 described later. The position where the solid-state light source array 1b is arranged may be near a position optically conjugate with the front focal position (light source focal position) of the condenser optical system 8. The light emitting diodes constituting the solid-state light source array 1b each have an output of 10 mW or more, and preferably have an output wavelength of 450 nm or less.
[0047]
The light beam emitted from the solid-state light source array 1b is guided to the mask M by the illumination optical system housed in the illumination system housing 3, which is a closed space. That is, the light beam emitted from the solid-state light source array 1b passes through the partition wall 1c provided in the solid-state light source housing 1a and the partition wall 3a provided in the illumination system housing 3, and enters the collimating lens 4 in the illumination system housing 3. I do. The light incident on the collimating lens 4 is converted into a substantially parallel light beam by the collimating lens 4 and then incident on a fly-eye lens 5 as an optical integrator.
[0048]
The fly-eye lens 5 is configured by arranging a number of lens elements having a positive refractive power vertically and horizontally and densely so that their optical axes are parallel to the reference optical axis AX. Each lens element constituting the fly-eye lens 5 has a rectangular cross section similar to the shape of the illumination field to be formed on the mask M (and, consequently, the shape of the exposure area to be formed on the plate P). In addition, the surface on the incident side of each lens element constituting the fly-eye lens 5 is formed in a spherical shape with the convex surface facing the incident side, and the surface on the exit side is formed in a spherical shape with the convex surface facing the exit side. .
[0049]
Therefore, the light beam incident on the fly-eye lens 5 is split into wavefronts by a number of lens elements, and one light source image is formed on the rear focal plane of each lens element. That is, on the rear focal plane of the fly's eye lens 5, a substantial surface light source, that is, a secondary light source composed of a large number of light source images is formed. The luminous flux from the secondary light source formed on the rear focal plane of the fly-eye lens 5 enters the σ stop 6 disposed in the vicinity thereof. The σ stop 6 is arranged at a position optically substantially conjugate with an entrance pupil plane of the projection optical system PL, which will be described later, and has a variable aperture for defining a range contributing to illumination of the secondary light source. The σ stop 6 changes the aperture diameter of the variable aperture to determine the illumination condition (the ratio of the aperture of the secondary light source image on the pupil plane to the aperture diameter of the pupil plane of the projection optical system). Is set to the desired value.
[0050]
The light from the secondary light source via the σ stop 6 is condensed by the condenser optical system 8 via the mirror 7 and then uniformly illuminates the mask M on which a predetermined pattern is formed. The luminous flux transmitted through the pattern of the mask M passes through the projection optical system PL housed in the projection system housing 20 which is a closed space, and is projected onto the plate P, which is a photosensitive substrate, mounted on the substrate stage PS. Form an image of the pattern. Note that the substrate stage PS and the plate P are arranged in the substrate chamber 22 which is a closed space.
[0051]
The solid-state light source array 1b composed of the plurality of light-emitting diodes (solid-state light sources) allows the plate P (the surface to be irradiated) to have an intensity of 30 mW / cm. ² The above illuminance can be obtained. In addition, illuminance unevenness on the plate P (surface to be irradiated) can be suppressed to within ± 10%. Here, the illuminance non-uniformity I (%) of the illuminance on the plate P with respect to the reference value is represented by Imax (W / cm) of the average value of the illuminance on the plate P in the scanning direction (X-axis direction). ² ), The minimum value of the average value of the illuminance on the plate P in the scanning direction (X-axis direction) is defined as Imin (W / cm ² ) Is defined by Equation 1.
(Equation 1)
I = {(Imax−Imin) / (Imax + Imin)} × 100 (%)
Then, by performing collective exposure or scan exposure while driving and controlling the plate P two-dimensionally in a plane orthogonal to the optical axis of the projection optical system PL, the pattern of the mask M is sequentially exposed in each exposure region of the plate P. Exposed.
[0052]
Further, an uneven illuminance sensor 9 is arranged on the plate stage PS. Further, a beam splitter 10 is disposed in an optical path between the fly-eye lens 5 and the mirror 7, and light reflected by the beam splitter 10 enters the integrator sensor 11. The detection signal from the integrator sensor 11 is output to the control unit 12. Further, a detection signal from the uneven illuminance sensor 9 is also output to the control unit 12.
[0053]
Here, the relationship between the detection signal of the integrator sensor 11 and the illuminance of the exposure light on the plate P is measured with high precision in advance and stored in a memory in the control unit 12. The control unit 12 is configured to monitor indirectly the illuminance (average value) of the exposure light to the plate P and its integral value (average value of the integrated exposure amount) from the detection signal of the integrator sensor 11. Then, during the exposure, the control unit 12 detects the light from the illumination light source unit 1 by the integrator sensor 11 and calculates the integrated value of the illuminance of the exposure light on the plate P. The control unit 12 sequentially calculates the integrated value of the illuminance, controls the power supply device 13 so that an appropriate exposure amount is obtained on the plate P according to the result, and controls the power supply connector 1 f of the illumination light source unit 1. And supplies the controlled power to the solid-state light source array 1b to control the output of the illumination light source unit 1.
[0054]
In this exposure apparatus, the solid-state light source housing 1a, the illumination system housing 3, the projection system housing 20, and the substrate chamber 22 are joined to each other without any gap. Each of these chambers is connected to the gas replacement device 14 via a supply tube and an exhaust tube (not shown). The gas replacement device 14 includes a gas supply pump and a gas exhaust fan (not shown), and replaces air in each room with a clean inert gas through each pipe under the control of the control unit 12. An illumination system cooling device 15 is connected to the illumination system housing 3, and the illumination optical system is cooled independently of the cooling device 2 under the control of the control unit 12.
[0055]
In this exposure apparatus, the solid-state light source array 1b of the illumination light source unit 1 is cooled by the cooling device 2 connected to the illumination light source unit 1. That is, the cooling medium is supplied into the solid-state light source housing 1a from the cooling medium supply pipe 2a of the cooling device 2 through the cooling medium supply port 1d of the illumination light source unit 1, while the cooling medium of the illumination light source unit 1 is cooled. The solid-state light source array 1b is cooled by discharging the cooling medium in the solid-state light source housing 1a from the medium discharge port 1e through the cooling medium discharge pipe 2b.
[0056]
In this case, the cooling medium supply port 1d and the cooling medium discharge port 1e provided in the solid light source housing 1a form a cooling gas path through which a gas as a cooling medium passes, around the solid light source array 1b. , The solid-state light source array 1b can be efficiently cooled. Further, since the solid-state light source array 1b is cooled using air instead of clean air, the solid-state light source array 1b can be cooled at low cost.
[0057]
In this exposure apparatus, since the cooling medium having air is used for cooling the solid light source array 1b of the illumination light source unit 1, the exposure apparatus is operated for a long time, so that the solid surface of the lens of the solid light source array 1b is operated. If the lens surface of the solid-state light source array 1b becomes fogged due to attachment of an organic substance or the like, the illumination light source unit 1 is replaced.
[0058]
FIG. 3 is a diagram for explaining replacement of the illumination light source unit 1. When replacing the illumination light source unit 1, first, the illumination light source unit 1 is removed from the illumination system housing 3 and the cooling device 2. That is, the illumination light source unit 1 is detached from the illumination system housing 3 by the attachment / detachment mechanism 1h provided in the illumination light source unit 1. Further, the cooling medium supply pipe 2a and the cooling medium discharge pipe 2b of the cooling device 2 are removed from the cooling medium supply port 1d and the cooling medium discharge port 1e provided in the solid light source housing 1a. Further, the power supply line is detached from the power supply connector 1f.
[0059]
Next, a new illumination light source unit 1 ′ is attached to the illumination system housing 3 and the cooling device 2. That is, the illumination light source unit 1 is attached to the illumination system housing 3 by the attachment / detachment mechanism 1h provided in the illumination light source unit 1 '. Further, a cooling medium supply pipe 2a and a cooling medium discharge pipe 2b of the cooling device 2 are attached to a cooling medium supply port 1d and a cooling medium discharge port 1e provided in the solid light source housing 1a. Further, a power supply line is attached to the power supply connector 1f. In this case, since the solid light source housing 1a is provided with the reference surface 1j having a predetermined relationship with the reference axis 1i of the solid light source array 1b, the illumination light source unit 1 can be attached to the illumination system housing 3 with high accuracy. it can.
[0060]
Further, since the solid light source housing 1a of the illumination light source unit 1 and the illumination system housing 3 are spatially separated by the partition wall 1c and the partition wall 3a, a cooling medium for cooling the solid light source array 1b of the illumination light source unit 1 is provided. Accordingly, the cleanliness of the gas in the illumination system housing 3 is not reduced. Further, the illumination system housing 3 is provided with a partition wall 3a for transmitting the light flux emitted from the illumination light source unit 1, and the interior of the illumination system housing 3 is a closed space. The cleanliness of the gas in the lighting system housing is not reduced.
[0061]
FIG. 4 is a diagram for explaining replacement of the solid-state light source array 1b of the illumination light source unit 1. When replacing the solid light source array 1b of the illumination light source unit 1, first, the illumination light source unit 1 is removed from the illumination system housing 3. That is, the illumination light source unit 1 is detached from the illumination system housing 3 by the attachment / detachment mechanism 1h provided in the illumination light source unit 1.
[0062]
Next, the partition 1c provided in the solid-state light source housing 1a is removed, a new solid-state light source array 1b 'is arranged at a predetermined position in the solid-state light source housing 1a, and the partition 1c is attached to the solid-state light source housing 1a. Next, the illumination light source unit 1 is attached to the illumination system housing 3 by the attachment / detachment mechanism 1h provided in the illumination light source unit 1. In this case, since the solid light source housing 1a is provided with the reference surface 1j having a predetermined relationship with the reference axis 1i of the solid light source array 1b, the illumination light source unit 1 can be attached to the illumination system housing 3 with high accuracy. it can.
[0063]
Further, the illumination system housing 3 is provided with a partition wall 3a for transmitting the light flux emitted from the illumination light source unit 1, and the interior of the illumination system housing 3 is a closed space. The cleanliness of the gas in the lighting system housing is not reduced.
[0064]
When only the solid light source array 1b is replaced, the solid light source array 1b can be reused by washing. Further, since the partition 1c can be removed, the partition 1c can be cleaned.
[0065]
In the exposure apparatus according to this embodiment, the partition wall 3a is provided in the illumination system housing 3. However, when the replacement of the illumination light source unit 1 is completed in a short time, the gas in the illumination system housing 3 is removed. Since the decrease in cleanliness is small, it is not necessary to provide the partition wall 3a in the illumination system housing 3.
[0066]
In the exposure apparatus according to this embodiment, a driver 1g for driving the solid-state light source array 1b is provided in the solid-state light source housing 1a. 1g, the solid-state light source array 1b and the driver 1g are mounted when the solid-state light source array 1b is mounted on the illumination system housing 3 so that the light beam emitted from the solid-state light source array 1b is incident on the partition wall 3a of the illumination system housing 3. You may make it connected.
[0067]
In this exposure device, the illumination light source unit 1 can be used to correct magnification telecentricity, inclined telecentricity, and unevenness of illumination light. In this case, a mechanism for adjusting the posture of the illumination light source unit 1, for example, the optical axis direction with respect to the optical axis of the illumination optical system, the position in the direction orthogonal to the optical axis of the illumination optical system, and the inclination of the illumination optical system with respect to the optical axis. Having.
[0068]
The correction of the telecentricity on the mask M or the plate P is performed by detecting an image forming position while moving a positioning sensor (not shown) provided below the plate P in the direction of the optical axis of the projection optical system PL. Perform based on. Here, the correction of the telecentricity on the mask M or the plate P includes the correction of the tilt telecentricity and the correction of the magnification telecentricity.
[0069]
As shown in FIG. 5, the correction of the magnification telecentricity is performed by integrally moving the illumination light source unit having the solid light source array 1b in the direction of the reference axis 1i of the solid light source array 1b (the direction of the optical axis of the illumination optical system). Can be performed. As shown in FIG. 6, the correction of the tilt telecentricity is performed by shifting the reference axis 1i of the solid-state light source array 1b with respect to the optical axis of the illumination optical system by integrating the illumination light source unit having the solid-state light source array 1b. It can be done by doing.
[0070]
As shown in FIG. 7, the inclination unevenness of the illumination light is corrected by integrating the illumination light source unit having the solid light source array 1b and inclining the reference axis 1i of the solid light source array 1b with respect to the optical axis of the illumination optical system. It can be carried out.
[0071]
Further, using the solid-state light source array 1b, it is possible to correct magnification telecentricity, inclined telecentricity, and unevenness of illumination light. In this case, a mechanism for adjusting the attitude of the solid-state light source array 1b, for example, the optical axis direction with respect to the optical axis of the illumination optical system, the position in the direction orthogonal to the optical axis of the illumination optical system, and the inclination of the illumination optical system with respect to the optical axis. Is provided.
[0072]
The correction of the magnification telecentricity can be performed by moving the solid-state light source array 1b in the direction of the reference axis 1i of the solid-state light source array 1b (the direction of the optical axis of the illumination optical system), as shown in FIG. it can. Further, the correction of the tilt telecentricity can be performed by shifting the solid-state light source array 1b with respect to the optical axis of the illumination optical system as shown in FIG.
[0073]
Further, the correction of the inclination unevenness of the illumination light can be performed by inclining the reference axis 1i of the solid-state light source array 1b with respect to the optical axis of the illumination optical system, as shown in FIG.
[0074]
Note that, in this embodiment, the magnification telecentricity, tilt telecentricity, and tilt unevenness of the illumination light are corrected by adjusting the attitude of the illumination light source unit 1 or the solid-state light source array 1b. By adjusting the attitude of the solid-state light source array 1b, coarse adjustment of magnification telecentricity, tilt telecentricity, and unevenness of illumination light is performed, and fine adjustment is performed on the illumination optical system side (for example, the attitude of the fly-eye lens 5 or the condenser optical system). 8 is adjusted). Further, the adjustment of the magnification telecentricity, the inclined telecentricity, and the unevenness of the illumination light when the illumination light source unit 1 is replaced or the like is performed only by the illumination optical system (for example, the attitude of the fly-eye lens 5 and the condenser optical system 8). The posture may be adjusted.) In the above embodiment, a light emitting diode, a laser diode, or the like can be used as the solid-state light source.
[0075]
Further, in this embodiment, as a plurality of solid light sources, a solid light source chip having a plurality of light emitting points, a solid light source chip array in which a plurality of chips are arranged in an array, and a plurality of light emitting points are formed on one substrate. An embedded type may be used. The solid-state light source element may be inorganic or organic.
[0076]
Further, in this embodiment, as the light source, a fiber light source combining a plurality of solid light sources and a plurality of light guides such as optical fibers provided corresponding to the respective solid light sources may be used. In this case, the solid-state light source array 1b is changed to a fiber light source. FIG. 11 is a diagram showing a fiber light source 69 in which a plurality of solid light sources 71 and a plurality of optical fibers 72 provided corresponding to each solid light source 71 are bundled. In the fiber light source 69 shown in FIG. 11, light emitted from the solid-state light source 71 enters the incident end of the optical fiber 72 and exits from the exit end of the optical fiber 72. That is, each incident end of the optical fiber 72 is optically connected to the solid-state light source 71. The light beam emitted from the emission end of the optical fiber 72 is guided to the partition 1c.
[0077]
FIG. 12 is a diagram showing a solid state light source 71 and a fiber light source 70 in which a plurality of lenses 73 and optical fibers 72 provided corresponding to each solid state light source 71 are bundled. In the fiber light source 70 shown in FIG. 12, light emitted from the solid-state light source 71 enters the lens 73, is condensed by the lens 73, enters the incidence end of the optical fiber 72, and exits the optical fiber 72. Inject from That is, each incident end of the optical fiber 72 is optically connected to the solid-state light source 71. The light beam emitted from the emission end of the optical fiber 72 is guided to the partition 1c.
[0078]
In the fiber light source 69 shown in FIG. 11 and the fiber light source 70 shown in FIG. 12, by using the optical fiber 72 having an appropriate numerical aperture, the beam profile 75 of the solid light source 71 which is usually elliptical (FIG. 13A) 13) can be shaped into a circular beam profile 76 (see FIGS. 13 (b) and 13 (c)).
[0079]
Also, by bundling the emission end portions of the plurality of optical fibers into an arbitrary shape, it is possible to shape the shape of the emission end of the light source (arrangement shape of the emission end) into an optimal shape. For example, it can be formed into a rectangular shape as shown in FIG. 14A, or into a shape as shown in FIG. 14B. Further, as shown in FIG. 15, a plurality of light sources are arranged such that the shape of the bundle of the optical fiber emission ends of the fiber light sources 69 and 70 and the shape of one element 81 of the fly-eye integrator 80 are similar. It is also very easy to shape the shape of the fiber exit end.
[0080]
Here, FIG. 16 is a diagram showing one solid-state light source 71 of the fiber light source 70 shown in FIG. 12, a lens (condensing optical system) 73 and an optical fiber 72 provided corresponding thereto. In the fiber light source 70 shown in FIG. 12, the numerical aperture of the light having the maximum emission angle (sine (sin) of the maximum emission angle (half angle) of the divergent light of the solid-state light source 71, hereinafter referred to as the maximum numerical aperture). NA), the maximum value of the size (diameter) of the light-emitting portion of the solid-state light source 71 is φ, and the sine of the angle range (half angle) within which the optical fiber 72 can take in light, a so-called optical fiber When the numerical aperture of the optical fiber 72 is NA2 and the core diameter of the incident end of the optical fiber 72 is D, the condition NA2 ≧ φ / D × NA1 is satisfied. By satisfying this condition, light emitted from the solid-state light source 71 can be taken into the optical fiber 72 without waste, and the amount of light emitted from the solid-state light source 71 is maintained, and Can be injected.
[0081]
When a quartz fiber is used as the optical fiber, the maximum numerical aperture of the solid-state light source 71 is NA1, the maximum value of the size (diameter) of the light emitting portion of the solid-state light source 71 is φ, and the core diameter of the incident end of the quartz fiber is D. Then, the condition of 0.3 ≧ φ / D × NA1 is satisfied. By satisfying this condition, light emitted from the solid-state light source can be taken into the quartz fiber without waste, and the amount of light emitted from the solid-state light source can be maintained and emitted from the emission end of the optical fiber 72. Can be.
[0082]
FIG. 17 is a diagram showing the configuration from the emission ends of the fiber light sources 69 and 70 to the fly-eye integrator 80, FIG. 18 is a diagram showing the shape of the incident surface of one element 81 of the fly-eye integrator 80, and FIG. FIG. 7 is a view showing the shape of the emission end 83 of the fiber light sources 69 and 70. Here, one length of the incident surface of the element 81 of the fly-eye integrator 80 is a, the other length is b, and one of the lengths in the shape of the exit end 83 in which the plurality of optical fibers 72 are bundled. A, B is the other length, f1 is the focal length of the collimating lens 82 located between the optical fiber 72 and the fly-eye integrator 80, and f2 is the focal length of the fly-eye integrator 80. / F1 ≦ a and B × f2 / f1 ≦ b hold.
[0083]
When the fiber light source is composed of m sets of optical fiber light sources 69 and 70 (m is a natural number), the total amount of light output from the m sets of optical fibers 72 is W, and the core at the exit end of the optical fiber 72 is W. When the diameter is d [m × {d (f1 / f2)} ² It is preferable to satisfy the condition of π / (4 × a × b)] × W ≧ 30 (mW). By satisfying this condition, the filling rate of the light source image with respect to one element 81 of the fly-eye integrator 80 can be made optimal, and practical illuminance as an exposure apparatus can be obtained. In this case, it is desirable that the shape of the bundle of the emitting ends of the optical fibers 72 and the shape of the element 81 of the fly-eye integrator 80 be similar.
[0084]
In the fiber light source 69 shown in FIG. 11 and the fiber light source 70 shown in FIG. 12, when the maximum value of the time-varying light amount at the exit end of the optical fiber 72 is Pmax and the minimum value is Pmin, the optical fiber The average ripple width ΔP of the light amount at the 72 emission ends is calculated by ΔP = (Pmax−Pmin) / (Pmax + Pmin). Here, assuming that the ripple width of the amount of light required at the incident end of the fly-eye integrator 80 is ΔW, the number n of the solid-state light sources 71 is n ≧ (ΔP / ΔW) ² It is desirable to satisfy the following conditions.
[0085]
By satisfying this condition, the dispersion of the light output emitted from the emission ends of the fiber light sources 69 and 70 can be reduced by the number n of the solid-state light sources 71 (ΔP / ΔW). ² By increasing the number, the fiber light sources 69 and 70 can be provided which are averaged and have a stable optical output due to the averaging effect.
[0086]
In the fiber light source 69 shown in FIG. 11 and the fiber light source 70 shown in FIG. 12, when the output characteristics such as the wavelength and light amount of each solid light source 71 vary, a plurality of solid light sources 71 having different output characteristics are used. Is used as the light source of the fiber light source, the dispersion of the output characteristics at the emission ends of the fiber light sources 69 and 70 is averaged. The light averaged at the emission ends of the fiber light sources 69 and 70 is further averaged by the fly-eye integrator 80. FIG. 20 is a graph showing a state in which variations in output characteristics of each solid-state light source 71 are averaged. AVE is a graph obtained by averaging the solid light sources 71 having different output characteristics. As described above, when a combination of a plurality of solid-state light sources 71 having different output characteristics is used for the fiber light sources 69 and 70, illumination light having a stable light output can be obtained by the averaging effect.
[0087]
When the exposure apparatus is a scanning exposure apparatus, a synchronization blind may be provided. FIG. 21 is a configuration diagram of a scanning exposure apparatus. This exposure apparatus is a scanning exposure apparatus that transfers a mask pattern onto a plate while moving a mask stage and a substrate stage with respect to a projection optical system, and has a synchronous blind (movable blind mechanism) 90. In other respects, it has the same configuration as the exposure apparatus according to this embodiment.
[0088]
As shown in FIG. 22, near the mask M, a fixed blind BL0 and a movable blind mechanism 90 are arranged. As shown in FIG. 23, the movable blind mechanism includes four movable blades BL1, It consists of BL2, BL3 and BL4. The width of the opening AP in the scanning exposure direction is determined by the edges of the movable blades BL1 and BL2, and the length of the opening AP in the non-scanning direction is determined by the edges of the movable blades BL3 and BL4. The shape of the opening AP defined by each edge of the four movable blades BL1 to BL4 is determined so as to be included in the circular image field IF of the projection lens PL.
[0089]
The illumination light passing through the opening of the fixed blind BL0 and the opening AP of the movable brand mechanism 90 irradiates the mask M. That is, illumination of the mask M is performed only in a region where the opening AP formed by the movable blades BL1 to BL4 and the opening of the fixed blind overlap each other. In the normal exposure state, an image of the opening of the fixed blind BL0 is formed on the pattern surface of the mask M. However, when exposure around the specific scanning exposure area on the mask M, that is, the area near the light-shielding portion is performed. The four movable blades BL1 to BL4 prevent illumination light from entering the outside of the light-shielding portion. That is, at the time of scanning of the mask stage, information on the relative position between the light beam emitted from the illumination optical system and the mask M is monitored. Based on this monitoring information, when it is determined that exposure starts in the vicinity of the light-shielding portion at the start of exposure or at the end of exposure of the specific scanning exposure area on the mask M, the edge positions of the movable blades BL1 and BL2 are moved. The width of the opening AP in the scanning exposure direction is controlled. This can prevent unnecessary patterns and the like from being transferred to the plate. In this exposure apparatus, the movable blind mechanism 90 is provided in the vicinity of the mask M. However, the movable blind mechanism may be provided in another position as long as the movable conjugate mechanism is located at a position conjugate with or near the mask M.
[0090]
Further, an antistatic means may be provided in the exposure apparatus. In this case, a housing accommodating the light source and a housing accommodating the exposure apparatus body such as the illumination optical system and the projection optical system are separately provided, and the housing accommodating the light source and the illumination optical system and the projection optical system are provided. Is electrically connected to a housing for accommodating the exposure apparatus main body, and is further grounded. That is, the housing for housing the light source and the housing for housing the exposure apparatus main body such as the illumination optical system and the projection optical system are kept at the same potential. Further, a power supply unit for supplying power to the light source and a power supply unit for supplying power to the exposure apparatus main body are separately provided, and grounded. Therefore, it is possible to prevent static electricity from being charged in the light source of the exposure apparatus and the exposure apparatus main body, and to prevent damage to the solid light source due to the static electricity.
[0091]
Further, instead of the mask in each of the above-described embodiments, a variable pattern generation device that generates a pattern to be projected may be used. Such a variable pattern generation device is roughly classified into a self-luminous image display device and a non-luminous image display device. Examples of the self-luminous image display device include a cathode ray tube (CRT), an inorganic EL display, an organic EL display (OLED: Organic Light Emitting diode), an LED display, an LD display, a field emission display (FED: field emission display), and a plasma. A display (PDP: Plasma Display Panel) is an example. The non-emission type image display element is also called a spatial light modulator (hereinafter, abbreviated as SLM), and is an element that spatially modulates the amplitude, phase or polarization state of light, and is a transmission type. It is divided into a spatial light modulator and a reflective spatial light modulator. Examples of the transmissive spatial light modulator include a transmissive liquid crystal display (LCD) and an electrochromic display (ECD). The reflective spatial light modulator includes a DMD (Deformable Micro-mirror). Device or Digital Micro-mirror Device), reflective mirror array, reflective liquid crystal display element, electrophoretic display (EPD: Electrophoretic Display), electronic paper (or electronic ink), optical diffraction light valve (Grating Light Valve), etc. An example is given.
[0092]
Next, a method for manufacturing a micro device using the exposure apparatus according to the embodiment of the present invention in a lithography process will be described. FIG. 23 is a flowchart of a method for obtaining a semiconductor device as a micro device. First, in step S40 of FIG. 23, a metal film is deposited on one lot of wafers. In the next step S42, a photoresist is applied on the metal film on the wafer of the one lot. Then, in step S44, using the exposure apparatus according to the embodiment of the present invention, the image of the pattern on the mask is transferred to each shot area on the wafer of the lot through the projection optical system (projection optical unit). Are sequentially exposed and transferred. That is, the mask is illuminated using the illuminating device, and the image of the pattern on the mask is projected onto the substrate using the projection optical system and is exposed and transferred.
[0093]
Thereafter, in step S46, the photoresist on the one lot of wafers is developed, and in step S48, etching is performed on the one lot of wafers using the resist pattern as a mask, thereby forming a pattern on the mask. A corresponding circuit pattern is formed in each shot area on each wafer. Thereafter, a device such as a semiconductor element is manufactured by forming a circuit pattern of an upper layer and the like. According to the above-described semiconductor device manufacturing method, a semiconductor device having an extremely fine circuit pattern can be obtained with high throughput.
[0094]
In the exposure apparatus according to the embodiment of the present invention, a liquid crystal display element as a micro device can be obtained by forming a predetermined pattern (circuit pattern, electrode pattern, etc.) on a plate (glass substrate). . Hereinafter, an example of the technique at this time will be described with reference to the flowchart in FIG. FIG. 24 is a flowchart for explaining a method of manufacturing a liquid crystal display element as a micro device by forming a predetermined pattern on a plate using the exposure apparatus of this embodiment.
[0095]
In the pattern forming step S50 of FIG. 24, a so-called optical lithography step of transferring and exposing a mask pattern onto a photosensitive substrate (a glass substrate coated with a resist or the like) using the exposure apparatus of this embodiment is executed. By this photolithography step, a predetermined pattern including a large number of electrodes and the like is formed on the photosensitive substrate. Thereafter, the exposed substrate undergoes each of a developing process, an etching process, a resist stripping process, and the like, whereby a predetermined pattern is formed on the substrate, and the process proceeds to a next color filter forming process S52.
[0096]
Next, in a color filter forming step S52, a large number of sets of three dots corresponding to R (Red), G (Green), and B (Blue) are arranged in a matrix, or three R, G, B Are formed in a horizontal scanning line direction to form a color filter. Then, after the color filter forming step S52, a cell assembling step S54 is performed. In the cell assembling step S54, a liquid crystal panel (liquid crystal cell) is assembled using the substrate having the predetermined pattern obtained in the pattern forming step S50, the color filters obtained in the color filter forming step S52, and the like.
[0097]
In the cell assembling step S54, for example, a liquid crystal is injected between the substrate having the predetermined pattern obtained in the pattern forming step S50 and the color filter obtained in the color filter forming step S52, and a liquid crystal panel (liquid crystal cell) is formed. ) To manufacture. Thereafter, in a module assembling step S56, components such as an electric circuit and a backlight for performing a display operation of the assembled liquid crystal panel (liquid crystal cell) are attached to complete a liquid crystal display element. According to the above-described method for manufacturing a liquid crystal display device, a liquid crystal display device having an extremely fine circuit pattern can be obtained with high throughput.
[0098]
【The invention's effect】
According to the illumination light source unit of the present invention, the solid-state light source housing accommodating the solid-state light source array is provided with the cooling medium supply port, the cooling medium discharge port, and the power supply connector. When fogging or the like occurs on the lens surface of the light source array, it can be easily replaced with a new illumination light source unit.
[0099]
In addition, when the partition is configured to be detachable, when the cooling medium causes fogging or the like on the lens surface of the solid-state light source array, it is possible to easily replace only the solid-state light source array by removing the partition. it can. Further, since the solid-state light source array is cooled using air instead of clean air, the solid-state light source array can be cooled at low cost.
[0100]
Further, according to the exposure apparatus of the present invention, since the solid-state light source array of the illumination light source unit can be cooled at low cost, it is possible to perform low-cost and stable exposure processing using illumination light. Further, when the illumination system housing has a partition for transmitting the light flux emitted from the illumination light source unit, the illumination system housing becomes a closed space, and therefore, a cooling medium for cooling the solid light source array of the illumination light source unit is used. The cleanliness of the gas in the lighting system housing is not reduced. Further, by adjusting the attitude of the illumination light source unit or the attitude of the solid-state light source array, it is possible to correct magnification telecentricity, tilt telecentricity, and tilt unevenness of the illumination light.
[0101]
Further, according to the exposure method of the present invention, since the exposure apparatus that can cool the solid-state light source array of the illumination light source unit at low cost is used, it is possible to perform exposure processing using illumination light at low cost and stable. Can be.
[Brief description of the drawings]
FIG. 1 is a view showing an overall schematic configuration of an exposure apparatus according to an embodiment of the present invention.
FIG. 2 is a configuration diagram of an illumination light source unit according to the embodiment of the present invention.
FIG. 3 is a diagram for explaining replacement of the illumination light source unit according to the embodiment of the present invention.
FIG. 4 is a diagram for explaining replacement of the solid-state light source array of the illumination light source unit according to the embodiment of the present invention.
FIG. 5 is a diagram for explaining magnification telecentricity correction by the illumination light source unit according to the embodiment of the present invention.
FIG. 6 is a diagram for explaining correction of tilt telecentricity by the illumination light source unit according to the embodiment of the present invention.
FIG. 7 is a diagram for explaining correction of tilt unevenness by the illumination light source unit according to the embodiment of the present invention.
FIG. 8 is a diagram for explaining correction of magnification telecentricity by the solid-state light source array of the illumination light source unit according to the embodiment of the present invention.
FIG. 9 is a diagram for explaining correction of tilt telecentricity by the solid-state light source array of the illumination light source unit according to the embodiment of the present invention.
FIG. 10 is a diagram for explaining correction of tilt unevenness by the solid-state light source array of the illumination light source unit according to the embodiment of the present invention.
FIG. 11 is a diagram showing a configuration of a fiber light source according to an embodiment of the present invention.
FIG. 12 is a diagram showing a configuration of another fiber light source according to the embodiment of the present invention.
FIG. 13 is a diagram for explaining a shape of a beam profile emitted from the light source according to the embodiment of the present invention.
FIG. 14 is a diagram showing a shape of an emission end of the fiber light source according to the embodiment of the present invention.
FIG. 15 is a diagram showing that the shape of the exit end of the fiber light source according to the embodiment of the present invention is similar to the shape of the element of the fly-eye integrator.
FIG. 16 is a diagram for explaining conditions for taking light emitted from a solid-state light source into an optical fiber without waste in the fiber light source according to the embodiment of the present invention.
FIG. 17 is a diagram showing a configuration from the exit end of the fiber light source to the fly-eye integrator according to the embodiment of the present invention.
FIG. 18 is a diagram showing a shape of one element of the fly-eye integrator according to the embodiment of the present invention.
FIG. 19 is a diagram showing a shape of an emission end of the fiber light source according to the embodiment of the present invention.
FIG. 20 is a graph showing a state in which variations in output characteristics of the solid-state light source according to the embodiment of the present invention are averaged.
FIG. 21 is a diagram showing a configuration of a scanning exposure apparatus according to an embodiment of the present invention.
FIG. 22 is a diagram showing four movable blades provided in the scanning exposure apparatus according to the embodiment of the present invention.
FIG. 23 is a flowchart of a method for manufacturing a semiconductor device as a micro device according to an embodiment of the present invention.
FIG. 24 is a flowchart of a method for manufacturing a liquid crystal display element as a micro device according to an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Illumination light source unit, 1a ... Solid light source housing, 1b ... Solid light source array, 1c ... Partition wall, 1d ... Cooling medium supply port, 1e ... Cooling medium discharge port, 1f ... Power supply connector, 1h ... Detachment mechanism, 1i Reference axis, 1j Reference plane, 2 Cooling device, 3 Illumination system housing, 3a Partition wall, 4 Collimating lens, 5 Fly eye lens, 6 Sigma stop, 8 Condenser optical system, 9 Illuminance unevenness Sensor, 11: Integrator sensor, 12: Control unit, 15: Cooling device for illumination system, M: Mask, P: Plate, PL: Projection optical system.

Claims (24)

A solid-state light source array having a plurality of solid-state light sources arranged in an array,
A solid-state light source unit comprising a solid-state light source housing that houses the solid-state light source array,
The solid-state light source housing,
A cooling medium supply port for supplying a cooling medium for cooling the solid state light source array into the solid state light source housing,
A cooling medium outlet for discharging the cooling medium from inside the solid state light source housing;
A power supply connector for supplying power to the solid-state light source array. The illumination light source unit according to claim 1, wherein the solid state light source housing further includes a light transmissive member disposed on an emission side of a light beam emitted from the solid state light source array. The illumination light source unit according to claim 2, wherein the light transmitting member includes a light transmitting partition. The illumination light source unit according to claim 2, wherein the light transmitting member is configured to be detachable. The illumination light source unit according to claim 1, further comprising a relay optical member disposed on a light emission side of the solid-state light source array. The solid-state light source housing further includes a detachable mechanism for detaching the illumination light source unit from an illumination system housing that houses an illumination optical system that guides a light beam emitted from the solid-state light source array to a mask. The illumination light source unit according to claim 1. The illumination light source unit according to claim 1, wherein the solid-state light source housing further includes a reference surface having a predetermined relationship with a reference axis of the solid-state light source array. The solid-state light source unit according to any one of claims 1 to 7, further comprising a driver for driving the solid-state light source array. The cooling medium has a gas,
The cooling medium supply port and the cooling medium discharge port form a cooling gas path through which a cooling gas passes, around the solid-state light source array. The illumination light source unit according to claim 1. The illumination light source unit according to claim 9, wherein the gas includes air. A light flux emitted from the illumination light source unit according to claim 1 is guided to a mask by an illumination optical system housed in an illumination system housing, and a pattern of the mask is formed on a photosensitive substrate. An exposure apparatus for transferring. 12. The exposure apparatus according to claim 11, wherein the illumination system housing has a partition for transmitting a light beam emitted from the illumination light source unit. 13. The exposure apparatus according to claim 11, further comprising a cooling device that supplies a cooling medium for cooling the solid-state light source array to the illumination light source unit. In an exposure apparatus for guiding a light beam emitted from an illumination light source unit to a mask by an illumination optical system and transferring a pattern of the mask onto a photosensitive substrate,
The illumination light source unit includes a solid state light source array having a plurality of solid state light sources arranged in an array, and a solid state light source housing that houses the solid state light source array,
At least one of the attitude of the solid-state light source array and the attitude of the illumination light source unit is provided so as to be adjustable,
The exposure apparatus according to claim 1, wherein the illumination optical system includes an optical element provided to be adjustable to change illumination characteristics of the mask. The exposure apparatus according to claim 14, further comprising a relay optical member disposed on a light emission side of the solid-state light source array. An illumination system housing that houses the illumination optical system,
16. The exposure apparatus according to claim 14, wherein the solid-state light source housing includes an attachment / detachment mechanism for attaching / detaching the illumination light source unit to / from the illumination system housing. 17. The exposure apparatus according to claim 16, wherein when the solid-state light source housing is mounted, the illumination characteristics are adjusted using the adjustable optical element in the illumination optical system. Perform coarse adjustment of the illumination characteristics using at least one of the attitude of the solid-state light source array and the attitude of the illumination light source unit,
17. The exposure apparatus according to claim 14, wherein fine adjustment of the illumination characteristics is performed by the optical element provided in the illumination optical system so as to be adjustable. In an exposure apparatus for guiding a light beam emitted from an illumination light source unit to a mask by an illumination optical system and transferring a pattern of the mask onto a photosensitive substrate,
An illumination system housing that houses the illumination optical system,
The illumination light source unit includes a solid state light source array having a plurality of solid state light sources arranged in an array, and a solid state light source housing that houses the solid state light source array,
The solid-state light source housing includes an attachment / detachment mechanism for attaching / detaching the illumination light source unit to / from the illumination system housing,
The illumination optical system includes an optical element that is provided so as to be adjustable to change illumination characteristics of the mask,
An exposure apparatus, wherein when the solid-state light source housing is mounted, the illumination characteristics are adjusted using the adjustable optical element in the illumination optical system. 20. The exposure apparatus according to claim 19, further comprising a relay optical member arranged on a light emission side of the solid-state light source array. 21. The exposure apparatus according to claim 11, further comprising a first adjustment mechanism that adjusts a posture of the illumination light source unit. 21. The exposure apparatus according to claim 11, further comprising a second adjustment mechanism that adjusts a posture of the solid-state light source array. 23. The exposure apparatus according to claim 11, further comprising a projection optical system for forming a pattern image of the mask on the photosensitive substrate. An exposure method using the exposure apparatus according to any one of claims 11 to 23,
An illumination step of illuminating a mask using a light beam emitted from the illumination light source unit,
A transfer step of transferring the pattern of the mask onto a photosensitive substrate,
An exposure method comprising:

Images