JP2021162612A - Light source device, luminaire, and exposure device - Google Patents

Abstract

To prevent an optical output from lowering in a light source device having an LED as a light source.SOLUTION: A light source device 1 includes: an LED array having a circuit including a substrate 2 and a chip array in which a plurality of LED chips 3 arranged on the substrate 2 are electrically connected in series; and a cooler 4 in which a coolant for cooling the LED array flows. The light source device irradiates a lighting surface with light from the LED array. A direction in which the coolant inside the cooler 4 flows is a direction including a component vertical to an alignment direction of the LED chips in the chip array.SELECTED DRAWING: Figure 1

Description

The present invention relates to a light source device, a lighting device, and an exposure device.

Exposure devices are used in the manufacturing process of semiconductor devices and flat panel displays (FPDs). In the lithography process, the exposure apparatus transfers the pattern of the original reticle or mask to a photosensitive substrate (for example, a wafer or glass plate having a resist layer formed on the surface) via a projection optical system.

For example, a mercury lamp is used as a light source of an exposure apparatus, but in recent years, it is expected to replace the mercury lamp with an energy-saving light emitting diode (LED: Light Emitting Diode). An LED has a long life because it takes a short time from when a current is passed through a substrate circuit that controls light emission until the light output stabilizes, and it is not necessary to constantly emit light unlike a mercury lamp.

However, the light output per LED chip is extremely small. Therefore, when an LED is used as a light source instead of a mercury lamp, the total output of light can be increased by using an LED array in which a plurality of LED chips (for example, about 1000) are arranged on a substrate, or an LED that generates heat can be used. Technology for efficiently cooling the chip is required. Generally, the lighting time of the LED chip differs depending on the cooling force for cooling the generated LED chip.

Further, if even one of the plurality of LED chips connected in series is turned off due to the life or failure, the current will not flow to the other LED chips. As a result, all of the plurality of LED chips connected in series are turned off. Patent Document 1 discloses a technique for preventing the other LED chips from being turned off by providing a circuit that bypasses the current even if one of the LED chips is turned off.

Japanese Patent No. 4908709

However, when a circuit for bypassing the current is provided, the maximum number of LED chips that can be arranged decreases, and the light output of the LED array as a whole decreases.

Therefore, an object of the present invention is to provide an advantageous technique for suppressing a decrease in light output in a light source device using an LED as a light source.

In order to achieve the above object, the light source device as one aspect of the present invention includes an LED array including a substrate and a chip array in which a plurality of LED chips arranged on the substrate are connected in series. A light source device that has a cooler that cools the LED array using a refrigerant and illuminates the illumination surface with light from the LED array, and the direction in which the refrigerant flows is the arrangement of the LED chips in the chip row. It is characterized by containing a component perpendicular to the direction.

According to the present invention, for example, in a light source device using an LED as a light source, it is possible to provide an advantageous technique for suppressing a decrease in light output.

It is a top view of the light source apparatus in 1st Embodiment. It is a figure which shows the internal structure of a cooler. It is a figure which shows the modification in 1st Embodiment. It is a figure which shows the comparative example. It is a top view of the light source apparatus in 2nd Embodiment. It is a top view of the light source device in 3rd Embodiment. It is a top view of the light source apparatus in 4th Embodiment. It is a figure which shows the internal structure of the cooler in 4th Embodiment. It is a schematic diagram of an illumination optical system. It is a schematic cross-sectional view of a light emitting part. It is the schematic of the exposure apparatus.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

<First Embodiment>
The light source device 1 will be described with reference to FIG. FIG. 1 is a plan view of the light source device 1 of the present embodiment. The light source device 1 includes an electric board 2, an LED chip 3, a cooler 4, and a control unit 5. A plurality of LED chips 3 are arranged on the electric substrate 2, and these are collectively referred to as an LED array below. Copper wiring is connected and mounted on the LED chip 3 on the electric board 2, and a circuit for driving the LED chip 3 is formed. By passing a current through the circuit, light having a predetermined wavelength is output from the LED chip 3.

The LED array in this embodiment forms a chip array in which a plurality of LED chips 3 are electrically arranged in series in the X-axis direction. An LED array may be formed by including a plurality of chip rows as in the chip rows 7a to 7l shown in FIG. 1, and the chip rows 7a to 7l are connected to the control unit 5 via connectors 6a and 6b. If even one LED chip in the chip row is turned off due to a failure or life, the other LED chips in the chip row are also connected in series and therefore turned off. That is, when even one LED chip 3 is turned off, the entire chip array to which the LED chip 3 belongs is turned off.

The control unit 5 includes a power supply, controls the current flowing through the LED chip 3 and the voltage applied to the power supply, and controls the amount of light output from the LED chip 3. The control unit 5 may control the current flowing through the LED chip 3 and the voltage applied to the power supply so that the target illuminance is achieved on the illumination surface illuminated by the optical device 1. In the control unit 5, one control unit may be connected to a plurality of chip rows, or as a modification, as shown in FIG. 3, a plurality of control units are connected to each group of chip rows, and the control units 5a to 5a to The current flowing through the LED chip and the voltage applied to the power supply may be controlled every 5f.

The cooler 4 is connected to the refrigerator 8, and the refrigerant (not shown) flows in the Y-axis direction from the refrigerant inlet 9 side of the cooler 4 toward the refrigerant outlet 10. The cooler 4 is in contact with the surface of the electric board 2 opposite to the surface on which the LED chip 3 is arranged, and takes heat from the electric board 2 to cool the LED array. The refrigerant after heat exchange circulates from the cooler outlet 10 to the refrigerator 8 to cool the LED array again.

In order to increase the efficiency of heat exchange, it is preferable to use a material having good thermal conductivity for the electric substrate 2 and the cooler 4. As the base material of the electric substrate 2, for example, aluminum nitride having high thermal conductivity may be used. As the material of the cooler 4, for example, copper or aluminum may be used.

FIG. 2 is a diagram showing the internal structure of the cooler 4. In order to improve the cooling force defined by the amount of heat that the refrigerant can remove from the LED array per unit time, a plurality of partitions 11 along the Y-axis direction, which is the direction from the refrigerant inlet 9 side to the refrigerant outlet 10 side of the cooler 4. Is postponed. As a result, a flow path for delivering the refrigerant to the entire cooler 4 is formed. The refrigerant flows between the partitions 11 and takes heat from the electric board 2 by heat exchange to cool the LED array. As the refrigerant, for example, a liquid containing water as a main component having excellent cooling power or a liquid containing oil having excellent electrical insulation as a main component is used.

(Life of LED chip)
Next, the relationship between the heat exchange between the light source device 1 and the refrigerant described above and the life of the LED chip 3 will be described. The temperature of the light emitting surface of the LED chip is called the junction temperature. The life of the LED chip 3 can be predicted by the formula (1) using the Arrhenius equation. L is the lifetime, A is the constant, E is the activation energy, K is the Boltzmann constant, and T is the junction temperature.

L = A × exp (E / KT) ・ ・ ・ (1)
From the formula (1), when the activation energy (current in the present embodiment) is the same, the lower the junction temperature, the longer the life of the LED chip 3. Therefore, in the region where the cooling power of the cooler 4 is high, the life of the LED chip 3 is longer than in the region where the cooling power is low. In the present embodiment, the region having a high cooling power is a region near the refrigerant inlet 9, and the region having a low cooling power is a region near the refrigerant outlet 10. The junction temperature of the LED chips forming the chip row 7a arranged near the refrigerant inlet 9 is, for example, around 40 ° C. On the other hand, the junction temperature of the LED chips forming the chip row 7l arranged near the refrigerant outlet 10 is, for example, around 90 ° C. Further, the LED chips in the chip rows 7a to 7l of the present embodiment are arranged along the isothermal portion based on the temperature distribution of the cooler 4. The difference in the junction temperature of the LED chips 3 in each chip row is, for example, about 1 ° C.

Further, when there is an LED chip 3 that has been turned off due to a failure or life, the electric board 1 can be replaced. When a certain number of LED chips 3 are turned off and do not meet the standard of the amount of light required for the LED array and the standard of illuminance unevenness, it is desirable to replace the electric board 1 with an electric board on which a new LED chip is arranged. As for the replacement time of the electric board 1, for example, it is desirable to replace the LED chip 3 when the LED chip 3 is not lit by 25% or more of the whole.

(Comparison example)
The direction of the flow path of the refrigerant in the present embodiment is the Y-axis direction, and the LED chips in the chip row are arranged perpendicular to the X-axis direction in which the LED chips are arranged. Here, as a comparative example of this embodiment, consider a case where both the direction of the flow path of the refrigerant and the arrangement direction of the LED chips in the chip row are in the X-axis direction. FIG. 4A is a schematic view of the light source device 1 in the comparative example, and FIG. 4B is a diagram showing the internal structure of the cooler 4 in the comparative example. In the cooler 4 in the comparative example, the refrigerant flows in the X-axis direction from the refrigerant inlet 9 side of the cooler 4 toward the refrigerant outlet 10. Since the refrigerant travels in the direction of the refrigerant outlet 10 side of the cooler 4 while taking heat from the LED array, there are a region where the cooling power is high and a region where the cooling power is low as described above.

Further, the closer the cooling power of the cooler 4 is to the refrigerant outlet 10 side, the higher the junction temperature of the LED chip 3, so that the life of the LED chip 3 is shorter than that of the equation (1). In the comparative example, since the temperature distribution in the X direction in the cooler 4 is different, the timing at which the LED chips are not lit is different even in the same chip row.

Further, in the LED array as a whole, the LED chips closest to the refrigerant outlet 10 side of the respective chip rows 7a to 7l are turned off at about the same time. If even one of the LED chips connected in series in the chip rows 7a to 7l is turned off, the entire chip row to which the turned off LED chips belong is turned off. In the comparative example, in each of the chip rows 7a to 7l, the LED chips 3 in the region near the refrigerant outlet 10 side are not lit at about the same time, so that all the chip rows 7a to 7l are not lit at about the same time. turn into.

(Life of chip row in this embodiment)
In the present embodiment, an example has been described in which the direction in which the refrigerant for cooling the LED array flows is arranged so as to be perpendicular to the arrangement direction of the LED chips in the chip rows 7a to 7l. In addition to this, the present embodiment may be arranged so that the direction in which the refrigerant for cooling the LED array flows includes a component perpendicular to the arrangement direction of the LED chips in the chip rows 7a to 7l. The temperature of the refrigerant flowing through the cooler 4 increases in the Y direction, which is the direction from the refrigerant inlet 9 side to the refrigerant outlet 10. Therefore, the LED chip of the chip row 7l located in the region where the cooling power is the lowest is turned off earliest.

Since the LED chips in each chip row of the present embodiment are arranged along the isothermal portion based on the temperature distribution of the cooler 4, the junction temperature of the LED chips is almost the same temperature (for example, the maximum temperature). The difference is within 1 ° C). That is, the LED chips in the chip row are turned off at substantially the same timing. Therefore, since almost all LED chips are used without waste, it is possible to improve the utilization efficiency of the LED chips as compared with the comparative example.

Further, in the present embodiment, the life of the LED array as a whole can be extended without providing a circuit between the chip rows. Further, since the LED array is not provided with unnecessary circuits, it is possible to arrange more LED chips as compared with the case where the above circuits are provided, which contributes to the improvement of the illuminance of the LED array as a whole. ..

In the present embodiment, the LED chip 3 is directly mounted on the electric board 1, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3 in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows 7a to 7l may be either equal intervals or unequal intervals.

<Second Embodiment>
In the first embodiment, the case where the current flowing through the chip rows 7a to 7l is in the X direction has been described. On the other hand, in the present embodiment, the case where the current flowing in the chip rows 9a to 9l does not flow in the X direction will be described. FIG. 5 is a diagram showing a light source device according to the present embodiment. The basic configuration other than the circuit is the same as that of the first embodiment.

The arrangement of the LED chips 3 greatly contributes to the life of the LED chips 3. On the other hand, the path of the circuit in which the LED chips 3 are connected in series has a small contribution to the life of the LED chips 3. Therefore, the circuit path may be a path along the X direction as shown in FIG. 1 or a complicated path as shown in FIG.

In the present embodiment, the LED chip 3 is directly mounted on the electric board 1, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3 in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows 7a to 7l may be either equal intervals or unequal intervals.

<Third Embodiment>
In the first embodiment and the second embodiment, the case where one electric board 2 is provided for one LED array has been described. On the other hand, in the present embodiment, the case where there are a plurality of electric boards 2a to 2l for one LED array will be described. FIG. 6 is a diagram showing a light source device according to the present embodiment. The basic configuration other than the electric board 2 is the same as that of the first embodiment.

Chip rows 7a to 7l are arranged on the electric substrates 2a to 2l in the present embodiment, respectively. In order to replace the LED chip 3, it is necessary to replace the corresponding electric board. In the present embodiment, since the chip rows 7a to 7l are arranged on the corresponding electric boards 2a to 2l, only the electric boards corresponding to the chip rows that need to be replaced need to be replaced. For example, when the chip row 7l is not lit, only the electric board 2l needs to be replaced. In the present embodiment, since the other chip rows 7a to 7j that are not turned off can be used without being replaced, the LED chip 3 can be used efficiently.

In the present embodiment, an example in which one chip row is arranged on one electric board has been described, but two or more chip rows may be arranged on one electric board. Further, although the description is given in the form in which the LED chip 3 is directly mounted on the electric boards 2a to 2l, an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3 in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows 7a to 7l may be either equal intervals or unequal intervals.

<Fourth Embodiment>
In this embodiment, an example of predicting the life of the LED chip 3 will be described. A case where the recording unit 12 is configured in the light source device 1 will be described with reference to FIG. 7. FIG. 7 is a diagram showing a light source device according to the present embodiment. The basic configuration other than the recording unit 12 is the same as that of the first embodiment. The recording unit 12 is connected to the control unit 5, and the recording unit 12 stores accumulated data related to the LED chip 3 such as the current supplied to the chip rows 7a to 7l by the control unit 5, the lighting time, and the voltage applied to the power supply. It is recordable.

FIG. 8 is a diagram showing an internal structure of the cooler 4 in the present embodiment. The basic configurations other than the recording unit 12 and the measuring unit 13 are the same as those in the first embodiment. The cooler 4 is provided with a measuring unit 13, and the measuring unit 13 is connected to the recording unit 12. The measuring unit 13 can measure the temperature of the refrigerant. Further, the measuring unit 13 may be provided corresponding to the chip rows 7a to 7l and may measure the temperature of the refrigerant corresponding to the chip rows 7a to 7l.

Further, the life of the LED chip 3 can be predicted from the junction temperature of the LED chip 3. However, it is difficult to directly measure the junction temperature, which is the temperature of the light emitting surface of the LED chip 3. Therefore, in the present embodiment, the junction temperature of the LED chip 3 is estimated based on other design values and measured values. Since the LED chip 3 is connected to the refrigerant via various resistors, the junction temperature of the LED chip 3 can be estimated based on the measurement result of the temperature of the refrigerant. Various resistances include, for example, a resistance between the LED chip 3 and the electric board 2, a resistance between the electric board 2 and the cooler 4, and a resistance between the cooler 4 and the refrigerant. In this embodiment, the LED chip is based on the resistance value of the above-mentioned resistor measured or designed in advance, the electric power supplied from the control unit 5 to the LED chip 3, and the temperature of the refrigerant measured by the measurement unit 13. Estimate the junction temperature of 3.

From the estimated junction temperature of the LED chip 3, the life of the LED chip 3 can be predicted from the equation (1). This makes it possible to grasp in advance the timing at which the LED chip is not lit in the present embodiment.

In the present embodiment, the LED chip 3 is directly mounted on the electric board 1, but an LED package that can be easily connected to the circuit may be used. Further, the arrangement of the LED chips 3 in the same chip row may be either equal intervals or unequal intervals, and the arrangement between the chip rows 7a to 7l may be either equal intervals or unequal intervals.

<Illumination Optical System Embodiment>
Next, an example of the illumination optical system will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of the illumination optical system. The illumination optical system 50 includes a light source unit 51, a condenser lens 52, an integrator optical system 53, and a condenser lens 54. The luminous flux emitted from the light source unit 51 passes through the condenser lens 52 and reaches the integrator optical system 53. The condenser lens 52 is designed so that the position of the emission surface of the light source unit 51 and the position of the incident surface of the integrator optical system 53 optically become a Fourier conjugate surface. Such a lighting system is called Koehler illumination. Although the condenser lens 52 depicts one plano-convex lens in FIG. 9, it is often composed of a plurality of lens groups in reality. By using the integrator optical system 53, a plurality of secondary light source images conjugate to the emission surface of the light source unit 51 are formed at the injection surface position of the integrator optical system 53. The light emitted from the emission surface of the integrator optical system 53 reaches the illumination surface 55 via the condenser lens 54.

The light source unit 51 will be described with reference to FIG. FIG. 10 is a schematic view of the light source unit 51. The light source unit 51 includes a light source device 1, a condenser lens 56, and a condenser lens 57. In FIG. 10, the electric board 2 and the LED chip 3 are shown as a part of the light source device 1. The condenser lenses 56 and 57 are lens arrays having each lens provided corresponding to each LED chip 3. Each lens of the condenser lens 56 is provided on each LED chip 3. The lens may be a plano-convex lens as shown in FIG. 10, or may have a shape having other power. As the lens array, a lens array in which lenses are continuously formed by etching, cutting, or the like, or a lens array in which individual lenses are joined can be used. The light emitted from the LED chip 3 has a spread of about 50 ° to 70 ° in half-width, but they are converted to about 30 ° or less by the condenser lenses 56 and 57. The condenser lens 56 may be provided at a predetermined distance from the LED chip and may be integrally fixed together with the electric substrate 2.

Returning to the description of FIG. The integrator optical system 53 has a function of making the light intensity distribution uniform. An optical integrator lens or a rod lens is used for the integrator optical system 53 to improve the illuminance uniformity of the irradiation surface 55.

The condenser lens 54 is designed so that the emission surface of the integrator optical system 53 and the illumination surface 55 optically form a Fourier conjugate surface, and the emission surface of the integrator optical system 53 or its conjugate surface is the pupil surface of the illumination optical system. It becomes. As a result, a substantially uniform light intensity distribution can be created on the illuminated surface 55.

In the present invention, since the timing at which the chip rows 7a to 7l of the light source device 1 are turned off is different, the illuminance on the entire surface of the LED array becomes non-uniform when one or more chip rows are turned off. Further, since the illuminance of the LED chip 3 depends on the junction temperature of the LED chip 3, the illuminance on the entire surface of the LED array becomes non-uniform due to the difference in the temperature distribution of the refrigerant. However, since the illumination optical system 50 is provided with the integrator optical system 53 that equalizes the light intensity distribution described above, the non-uniform light emitted from the light source device 1 has a uniform illuminance on the illumination surface 55. Obtainable.

The light source device 1 and the illumination optical system 50 can be applied to various lighting devices, and can also be used as a device for illuminating a photocurable resin, a device for illuminating and inspecting an object, a lithography device, and the like. For example, it can be applied to an exposure apparatus that exposes a mask pattern to a substrate, a maskless exposure apparatus, an imprint apparatus that forms a pattern on a substrate using a mold, or a flat layer forming apparatus.

<Embodiment of exposure apparatus>
In the present embodiment, the case where the light source device 1 and the illumination optical system 50 are applied to the exposure device will be described. FIG. 11 is a schematic view showing the configuration of the exposure apparatus 100. The exposure apparatus 100 is a lithography apparatus used in a lithography process, which is a manufacturing process of a semiconductor element or a liquid crystal display element, to form a pattern on a substrate. The exposure apparatus 100 exposes the substrate through the mask and transfers the mask pattern to the substrate. In the present embodiment, the exposure apparatus 100 is a step-and-scan exposure apparatus, that is, a so-called scanning exposure apparatus, but a step-and-repeat exposure apparatus or another exposure apparatus may be adopted.

The exposure apparatus 100 includes an illumination optical system 50 that illuminates the mask 101, and a projection optical system 103 that projects the pattern of the mask 101 onto the substrate 102. The projection optical system 103 may be a projection lens composed of a lens or a reflection type projection system using a mirror.

The illumination optical system 50 is an optical system that illuminates the mask 101 with the light from the light source device 1. A pattern corresponding to the pattern to be formed on the substrate 102 is formed on the mask 101. The mask 101 is held by the mask stage 104, and the substrate 102 is held by the substrate stage 105.

The mask 101 and the substrate 102 are arranged at positions substantially conjugate with each other via the projection optical system 103. The projection optical system 103 is an optical system that projects an object onto an image plane. A reflection system, a refraction system, and a reflection / refraction system can be applied to the projection optical system 103. In the present embodiment, the projection optical system 103 has a predetermined projection magnification and projects the pattern formed on the mask 101 onto the substrate 102. Then, the mask stage 104 and the substrate stage 105 are scanned in a direction parallel to the object surface of the projection optical system 103 at a speed ratio corresponding to the projection magnification of the projection optical system 103. As a result, the pattern formed on the mask 101 can be transferred to the substrate 102.

The exposure apparatus 100 has a display unit 106. The display unit 106 and the light source device 1 are connected to a main control unit 107 that controls the entire exposure device. The display unit 106 displays information indicating the replacement time of the chip row or the LED array and information prompting the user to replace the chip row or the LED array before the chip row is turned off. As a result, in the present embodiment, it is possible to grasp the replacement timing of the electric board 2 before the chip row is turned off, and the performance, quality, productivity, and production cost of the article are higher than those of the conventional method. It is advantageous in at least one.

<Embodiment of manufacturing method of article>
In this embodiment, a method of manufacturing an article using the above-mentioned exposure apparatus will be described. The article is, for example, a flat panel display (FPD). The method for manufacturing an article includes a step of forming a latent image pattern on a photosensitive agent applied on the substrate using the above-mentioned exposure apparatus (a step of exposing the substrate) and a substrate on which the latent image pattern is formed in such a step. Includes a step of developing. Further, such a manufacturing method includes other well-known steps (oxidation, film formation, vapor deposition, doping, flattening, etching, resist peeling, dicing, bonding, packaging, etc.). The method for producing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article as compared with the conventional method.

1 Light source device 2 Electric board 3 LED chip 4 Cooler 7a to 7l Chip row

Claims (16)

An LED array including a substrate and a chip array in which a plurality of LED chips arranged on the substrate are connected in series.
It has a cooler that cools the LED array with a refrigerant.
A light source device that illuminates the illumination surface with light from the LED array.
A light source device characterized in that the direction in which the refrigerant flows includes a component perpendicular to the arrangement direction of the LED chips in the chip row. The light source device according to claim 1, wherein the LED chips in the chip row are arranged based on the temperature distribution of the refrigerant. The circuit includes a plurality of the chip rows.
The light source device according to claim 1 or 2, wherein the number of LED chips included in the chip row is equal to each other. The light source device according to any one of claims 1 to 3, wherein the cooler is arranged in contact with a surface of the substrate opposite to the surface on which the plurality of LED chips are arranged. .. The cooler further has a partition for forming the flow path.
The light source device according to any one of claims 1 to 4, wherein the partition extends in a direction including a component perpendicular to the arrangement direction of the LED chips in the chip row. It also has a control unit that includes a power supply
One of claims 1 to 5, wherein the control unit controls at least one of a current flowing through the chip row and a voltage applied to the power supply so that the illumination surface has a target illuminance. The light source device according to. The light source device according to claim 6, wherein the control unit can record at least one stored data of a current flowing through the chip row, a voltage applied to the power supply, and a lighting time of the chip row. .. Further including a measuring unit for measuring the temperature of the refrigerant,
The light source device according to claim 7, wherein the control unit estimates the junction temperature of the LED chip based on the measurement result of the measurement unit. The light source device according to claim 8, wherein the control unit predicts a timing at which the chip row is turned off based on the accumulated data and the junction temperature. The light source device according to any one of claims 1 to 9, wherein the refrigerant is mainly composed of oil. The light source device according to any one of claims 1 to 9, wherein the refrigerant is mainly water. It ’s a lighting device,
The light source device according to any one of claims 1 to 11.
With a condenser lens
Has an optical integrator and
A lighting device characterized in that light intensity distributions from each of a plurality of LED chips of the light source device are superposed on an incident surface of the optical integrator via the condenser lens. The lighting device according to claim 12, wherein the optical integrator has a lens group. An exposure device that exposes a substrate
A lighting device that illuminates a mask, and the lighting device according to claim 12 or 13.
An exposure apparatus comprising an exposure means for exposing the mask pattern to a substrate. It also has a display
The timing at which the chip row arranged in the LED array is turned off is predicted, and before the chip row is turned off, information indicating the replacement time of the chip row or the LED array is displayed on the display unit, and information indicating the replacement time of the chip row or the LED array is displayed. The exposure apparatus according to claim 14, wherein at least one of the information prompting the user to replace the chip row or the LED array is displayed. It is a manufacturing method of goods
A step of exposing a substrate using the exposure apparatus according to claim 14 or 15.
It has a process of developing the exposed substrate and
A method for producing an article, which comprises producing an article from a developed substrate.

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