KR20120082805A - Exposure method and exposure apparatus - Google Patents

Abstract

PURPOSE: An exposing apparatus and an exposing method are provided to expose a substrate based on the optimal amount of light and to miniaturize the apparatus. CONSTITUTION: An exposing apparatus(1) includes an exposing light source unit, a table, and a controlling unit. The table loads a substrate(3) to be exposed on which a photo-sensitive agent is applied. The table horizontally moves. The exposing light source unit includes a light source part in which a plurality of light emitting elements is two dimensionally arrayed. The controlling unit controls the light source part when the photo-sensitive agent on the substrate is exposed based on the exposing light source unit. The photo-sensitive agent on the substrate is exposed by emitting a plurality of pulse light from the light source part with various emitting conditions.

Description

Exposure method and apparatus therefor {EXPOSURE METHOD AND EXPOSURE APPARATUS}

The present invention relates to an exposure method and an apparatus used for exposing a circuit pattern drawn on a mask to a substrate.

Conventionally, the exposure apparatus used the ultrahigh pressure mercury lamp as a light source. And the circuit pattern was exposed to the board | substrate fixed to the exposure band by the light irradiated from the said ultra-high pressure mercury lamp.

However, ultra-high pressure mercury lamps generally have a short lifespan. For this reason, the user has to perform frequently the replacement work and the light quantity adjustment work accompanying the exchange, which causes trouble. In addition, since the ultra-high pressure mercury lamp takes a long time after the power is turned on to be irradiated with a stable amount of light, the exposure operation cannot be started immediately after the device is started. In addition, since the ultra-high pressure mercury lamp needs to be constantly lit so that light of a stable amount of light continues to be irradiated, there is also a problem that power consumption is necessarily increased.

In addition, in order to expose a high-precision circuit pattern to a board | substrate exposure surface, it is preferable that an exposure apparatus can expose the whole exposure stage with a substantially uniform integrated exposure amount without gap. Therefore, in the conventional exposure apparatus, the quantity of light irradiated from a light source is detected at the time of periodical inspection, etc., and light quantity adjustment was performed so that the said quantity of light might be in a predetermined allowable range. However, it has been pointed out that during regular inspections, the entire substrate production line must be stopped, resulting in poor efficiency. In addition, in the said adjustment, although the adjustment with respect to the light quantity change detected at the time of inspection is possible, the change of the light quantity in an actual exposure process, for example, the light quantity loss resulting from time-lapse deterioration of a light source, etc. is detected and appropriately compensated. There was a problem that cannot be done.

As a method of solving this problem, for example, a light source system for an exposure apparatus using a light source in which a plurality of LEDs are arranged two-dimensionally as described in Japanese Patent Laid-Open No. 2003-98678 (Patent Document 1) is used. Thus, proximity exposure of a substrate to which a photosensitive agent has been applied is described through a photomask.

In addition, Japanese Patent Application Laid-Open No. 2005-150774 (Patent Document 2) discloses a lighting device having a plurality of LEDs as a light source, which improves the heat dissipation effect by driving the LEDs at a duty ratio of less than 100% to increase the luminous efficiency. It is.

In the light source system for an exposure apparatus using the LED described in Patent Document 1 as a light source, a simple and inexpensive device can be realized by changing the light source into a configuration in which a plurality of LEDs are two-dimensionally arranged by a method using a conventional lamp. However, it is not considered about suppressing the power consumption of a light source and responding to the fluctuation of the light quantity of a light source.

Moreover, in the illuminating device which uses the several LED described in patent document 2 as a light source, even if it is described to improve a heat radiation effect and to raise luminous efficiency by driving LED with a duty ratio of less than 100%, It is not described about securing the necessary exposure amount within one exposure time in the state which raised this luminous efficiency.

In view of the above-mentioned problems of the prior art, the present invention can reduce the burden on the user, suppress power consumption, and immediately expose the substrate using light adjusted to the optimum amount of light at any time, and furthermore, The invention provides an inexpensive exposure method and an apparatus thereof.

MEANS TO SOLVE THE PROBLEM In order to solve the said subject, in this invention, the exposure apparatus is equipped with the exposure light source means which emits exposure light, the table means which mounts the exposure substrate to which the photosensitive agent was apply | coated, and is movable in a plane, the table means, and the light source means for exposure. And a light source unit for exposing the plurality of light emitting elements in two dimensions, and the control means includes a photosensitive agent applied to the exposure substrate mounted on the table means as the light source means for exposure. When exposing with the predetermined exposure total light amount within a predetermined time, the light source unit was controlled to emit light while changing a plurality of pulsed light from the light source unit in order to expose the photosensitive agent applied to the exposure substrate.

Moreover, in order to solve the said subject, in this invention, the exposure apparatus is equipped with the exposure light source means which emits exposure light, the table means which mounts the exposure substrate to which the photosensitizer was apply | coated, and is movable in a plane, table means, and exposure It comprises a control means for controlling a light source means, The exposure light source means is equipped with the light source part which arranged the several light emitting element in two dimensions, The control means is the exposure light source means for exposure to which the photosensitive agent mounted in the table means was apply | coated. When exposing a board | substrate to predetermined | prescribed total exposure amount, the light source part was controlled and the pulsed light is irradiated from the light source part to the exposure substrate to which the photosensitive agent was apply | coated once, and it was comprised so that the photosensitive agent apply | coated to the exposure substrate by the predetermined | prescribed total exposure amount may be comprised.

Moreover, in order to solve the said subject, in this invention, the exposure light emitted from the light source part which arranged the several light emitting element in two dimensions was irradiated to the exposure substrate to which the photosensitive agent was apply | coated through the mask, and apply | coated to the surface of this exposure substrate. In an exposure method of exposing a predetermined photosensitive agent within a predetermined time to a predetermined total exposure amount of light, a plurality of light emitting elements are emitted from a light source unit having two-dimensionally arranged two-dimensionally to emit light while changing sequential irradiation conditions to a substrate for exposure through a mask. By irradiating, the photosensitive agent apply | coated to the board | substrate for exposure was exposed to predetermined | prescribed total exposure amount within predetermined time, suppressing the temperature rise of a light source part.

Moreover, in order to solve the said subject, in this invention, the exposure substrate which light-emitted from the light source part which arranged the several light emitting element in two dimensions was irradiated to the exposure substrate through a mask, and the photosensitive agent apply | coated to the surface of this exposure substrate was prescribed | regulated. An exposure method for exposing a predetermined amount of total light within a predetermined time period, comprising: emitting pulsed light once from a light source unit in which a plurality of light emitting elements are arranged in two dimensions, and irradiating the substrate for exposure through a mask to suppress the temperature rise of the light source unit; It was made to expose the photosensitive agent apply | coated to the board | substrate for exposure in a predetermined exposure total light quantity within predetermined time.

According to the present invention, by adopting the LED exposure light source that can suppress the temperature rise of the light source while ensuring the total exposure light amount, it reduces the burden on the user, suppresses the power consumption, and at any time immediately adjust the light It became possible to provide the exposure of a board | substrate, and also to provide a compact and inexpensive exposure apparatus.

1A is a block diagram showing a schematic configuration of an exposure apparatus according to the first and second embodiments of the present invention.
1B is a side view showing a schematic configuration of a light source block and a mask, a glass substrate, and an exposure table of the exposure apparatus according to the first and second embodiments of the present invention.
Fig. 2 is a flowchart showing the operational flow of the exposure apparatus according to the first and second embodiments of the present invention.
3 is a graph showing the conditions of the exposure light amount of the exposure apparatus according to the first embodiment of the present invention.
4 is a view showing a temperature change of the LED light source when exposed with the exposure apparatus according to the first embodiment of the present invention.
5 is a graph showing a change in exposure intensity of pulsed light within one exposure time when the exposure apparatus according to the first embodiment of the present invention is exposed.
6A is a graph showing a modification of exposure intensity change within one exposure time when exposure is performed with the exposure apparatus according to the first embodiment of the present invention.
6B is a graph showing a change in exposure intensity of pulsed light within one exposure time when the exposure apparatus according to the first embodiment of the present invention is exposed.
7 is a graph showing the conditions of the exposure light amount in the exposure apparatus according to the second embodiment of the present invention.
8 is a graph showing a temperature change in the exposure apparatus according to the second embodiment of the present invention.

EMBODIMENT OF THE INVENTION Below, embodiment of this invention is described in detail using drawing.

Example 1

1 schematically shows an exposure apparatus according to a first embodiment of the present invention. On the other hand, in the following description, the X-axis and Y-axis, and the direction in which the exposure light beam enters the glass substrate perpendicularly to the Z-axis are two directions orthogonal to each other, parallel to the photosensitive surface of the glass substrate as the object to be exposed. It is defined. In addition, about the X-axis, Y-axis, and Z-axis, the direction shown by the arrow in FIG. 1 is respectively positive.

The exposure apparatus 1 of this embodiment includes the light source block 2, the exposure table 8, the LED lighting means 12, the table driving means 18, the substrate insertion unit control means 19, It has a controller 10 and a memory 11.

The light source block 2 arranges the ultraviolet-ray LED 21 in two dimensions at predetermined intervals on the XY plane and serves as a whole as a surface light source and heat generated by the LED light source 22. The heat dissipation part 23 which radiates heat, and the temperature sensor 24 which measures the temperature of the LED light source 22 are comprised.

The LED light source 22 is comprised including the LED 21, the condenser lens 25, and the LED wiring board 26. As shown in FIG.

Each of the ultraviolet LEDs 21 arranged in two dimensions constituting the light source block 2 can be turned on / off separately, and the controller 10 can control the lighting of each LED 21 with respect to the LED lighting means 12. Set presence and absence, lighting time and lighting brightness. The LED lighting means 12 performs brightness control and on / off control of each LED 21, and arbitrarily selects the amount of light and the irradiation time of the light beam irradiated from the light source block 2 to the glass substrate 3 through the mask 4 from the light source block 2. Can be set. On the other hand, the lighting control of the LED lighting means 12 is performed by the controller 10.

The exposure table 8 is provided in parallel to the light source block 2 in the Z-axis direction, and the exposure surface 8a on which the glass substrate 3 is provided is parallel to the XY plane. In addition, the exposure table 8 is driven in the X-axis and Y-axis directions by the table driving means 18. By moving the position of the exposure table 8, the relative position of the exposure table 8 with respect to the light source block 2 can be changed.

Moreover, the exposure apparatus 1 is provided with the board | substrate insertion unit (handling robot) 9, and is controlled by the board | substrate insertion unit control means 19, and the exposure stand 8 is moved away from the light source block 2 ( Iii) when the glass substrate 3 is removed from a substrate stocker (not shown) and installed on the exposure surface 8a of the exposure table 8 or mounted on the exposure surface 8a. The glass substrate 3 can be taken out and accommodated in the board | substrate stocker which is not shown in figure.

Moreover, it is comprised as the photosensitive surface in which the photosensitive agent was apply | coated to the surface by the light source block 2 side of the glass substrate 3 to which exposure is performed. Moreover, on the photosensitive surface of this glass substrate 3, the mask 4 in which the predetermined | prescribed pattern was formed is hold | maintained in the exposure apparatus 1 through the air layer of 0.05 mm-1 mm. The pattern formed in the mask 4 is transferred to the photosensitive surface of the glass substrate 3 by irradiating the photosensitive surface by irradiating the light beam from the light source block 2 to the glass substrate 3 through this mask 4 ( Proximity exposure).

Regarding the size of the mask 4 When the size of the glass substrate 3 is large, the entire surface of the glass substrate 3 to which the photosensitive agent is applied cannot be exposed by one exposure. By driving the clown 8 to move the exposure area of the glass substrate 3 to which the photosensitive agent is applied by step feeding and sequentially exposing, the entire surface of the glass substrate 3 to which the photosensitive agent is applied is exposed to expose the pattern of the mask 4. The photosensitive surface of the substrate 3 can be transferred.

In addition, in this embodiment, although the mask 4 and the glass substrate 3 fall in the structure, this invention is not limited to this structure, The mask 4 adheres to the photosensitive surface of the glass substrate 3 closely. It is good also as a structure. In this case, the photosensitive surface of the glass substrate 3 is closely exposed and the pattern of the mask 4 is transferred to the photosensitive surface.

Further, the pattern formed on the mask 4 is formed by widening the gap between the mask 4 and the glass substrate 3 and interposing the reduced projection lens between the mask 4 and the glass substrate 3 to form the glass substrate 3. Reduced-projection exposure can be performed to the photosensitive surface of ().

The controller 10 controls each of the light source block 2, the LED lighting means 12, the table driving means 18, and the substrate insertion unit control means 19, and the lighting condition recorded in the memory 11. Is read, and the lighting time and the brightness for each of the plurality of ultraviolet LEDs 21 constituting the light source block 2 are controlled. The lighting condition of each ultraviolet LED 21 is stored in the memory 11.

In addition, in the structure shown in FIG. 1, although the light source block 2 was fixed, the exposure table 8 was moved in the XY direction, it demonstrated by the structure which exposes the front surface of the glass substrate 3 one by one, but the exposure table 8 was demonstrated. ), The light source block 2 may be moved stepwise in the XY direction, and the front surface of the glass substrate 3 may be sequentially exposed.

The exposure procedure using the exposure apparatus 1 of this embodiment comprised as mentioned above is demonstrated using FIG.

FIG. 2 is a flowchart showing a flow of a process of exposing and transferring a pattern formed on the mask 4 to the photosensitive surface of the glass substrate 3 using the exposure apparatus 1 of the present embodiment. When the power supply of the exposure apparatus 1 is turned on, in step S101, power is first supplied to each ultraviolet LED 21 and the light quantity of each ultraviolet LED 21 is measured using a light quantity sensor (not shown), and a failure is detected. Thereby, various initial settings, such as confirmation of the faulty LED which did not light with normal light quantity, retraction of the exposure stand 8, are performed. Next, the flow advances to step S102.

In step S102, a determination is made as to whether or not the substrate 3 to be exposed is in a substrate stocker (not shown). In other words, if the substrate 3 to be exposed remains in the substrate stocker (S102: YES), the process proceeds to step S103, and if there is no substrate 3 to be exposed (S102: No), the routine is terminated.

In step S103, the exposure condition recorded in advance is called from the memory 11, and the condition setting of which LED to light on under which condition among the some ultraviolet LED 21 which comprises the light source block 2 is performed.

Next, the flow advances to step S104. In step S104, the controller 10 controls the substrate insertion unit 9 with the substrate insertion unit control means 19 to take out the glass substrate 3 from a substrate stocker (not shown) and expose the exposure surface of the exposure table 8. (8a) Install on. Next, the flow advances to step S105.

In step S105, the controller 10 controls the table driving means 18 to move the exposure table 8 so that the area to be exposed of the substrate 3 is directly under the LED lighting area determined in step S103. Next, the flow advances to step S106.

In Step S106, the LED lighting means 12 controls the LED 21 determined in Step S103 to turn on and off for a predetermined time and for a predetermined amount of light, and to expose the glass substrate 3 coated with the photosensitive agent through the mask 4. (Proximity exposure) is performed.

Next, the flow advances to step S107. In step S107, the LED lighting time in step S106 is added to the cumulative lighting time of each LED 21 stored in the memory 11, and the cumulative lighting time data for each LED 21 is updated.

Next, the flow advances to step S108. In step S108, the controller 10 controls the table driving means 18 to retract the exposure table 8 from the light source block 2, so that the substrate insertion unit 9 moves the glass substrate 3 to the exposure table 8. I take it out).

Next, the process proceeds to step S109. In step S109, the controller 10 controls the substrate insertion unit 9 with the substrate insertion unit control means 19 to take out the glass substrate 3 from which the exposure has been completed from the exposure table 8 and not illustrated. I store it in a beaker. Next, returning to step S102, if there is another glass substrate to be exposed in the substrate stocker (not shown), the processing of steps S103 to S109 is continued.

FIG. 3 shows exposure conditions in step S103 of FIG. 2. The exposure light quantity irradiated to the glass substrate 3 to which the photosensitive agent which is a to-be-exposed body is irradiated divides one exposure time T0 by irradiation of four pulse-shaped exposure light, and exposure time Ti (i ==) by exposure pulse of each pulse shape is given. 1, 2 ...) and the exposure intensity Ai (i = 1, 2 ...) of the exposure light of each pulse shape, and the exposure total light amount is represented by the sum of the light amounts of exposure light of each pulse shape. Lose. Therefore, exposure total light quantity S in one exposure time T0 shown in FIG. 3 becomes S = A1 * T1 + A2 * T2 + A3 * T3 + A4 * T4.

Here, the exposure time Ti of each pulse shape is time of about 0.1s to about 20s. The non-exposure time UTi between the pulse exposure time Ti and the next pulse exposure time Ti + 1 is about 0.1 s to 20 s. In the exposure apparatus 1, since the LED light source 22 performs forced cooling by water cooling or air cooling through the heat radiating part 23 connected to the LED light source 22, the temperature rise of the LED light source 22 radiates heat. By the part 23, it is possible to suppress compared with the case where forced cooling is not performed.

In addition, the temperature of the LED light source 22 is monitored by the some temperature sensor 24 provided in the back surface of the wiring board 26.

Since the exposure intensity Ai is proportional to the power input to each LED 21 of the LED light source 22, it is controlled by controlling the current to control the power input.

LED21 is a solid-state semiconductor element, and the ratio (luminescence efficiency) of energy used for light emission among the electric power input to each LED21 is 50% or less, and remaining energy becomes heat. In addition, since the solid-state semiconductor element has a characteristic in which the luminous efficiency decreases with temperature rise, if the LED 21 can be driven at a low temperature, it becomes possible to operate at a high luminous efficiency. Thereby, the LED light source 22 can reduce input electric power, and can also suppress temperature rise.

It is expected to suppress the temperature rise of the LED by performing exposure while repeating the LED ON / OFF periodically, but in order to confirm this effect, the frequency of the ON / OFF of the LED 21 is set to 50 Hz and 1 Hz. We investigated about case. The result is shown in FIG. The graph of FIG. 4 shows a duty ratio of 0.5 and is detected by the temperature sensor 24 when the frequency of the ON / OFF of the LED 21 is 50 Hz under the condition that the total exposure light amount is constant for 4 seconds of exposure time. One temperature change is shown by the dotted line, and when the frequency of ON / OFF of the LED 21 is set to 1 Hz, the change in temperature detected by the temperature sensor 24 is shown by the solid line. Compared to the case where the ON / OFF time cycle of the LED 21 is set to 50 ms, the temperature reduction effect is seen at the time of OFF when it is set to 1 ms, and the LED is compared with the case where the ON / OFF time cycle is set to 50 ms. It has been shown that the temperature rise of the light source 22 can be reduced by about 30%. The relationship between the frequency of the ON / OFF of the LED 21 and the temperature suppression effect from the previous experiment is that the frequency of the ON / OFF of the LED 21 increases and the effect decreases, but the temperature is suppressed at a frequency of 10 Hz or less. It was confirmed that the effect appeared.

In addition, although exposure intensity Ai and exposure time Ti are made constant in FIG. 4, even if it changes so that exposure intensity may be reduced gradually as shown in FIG. 5, the effect of suppressing the temperature rise of the LED light source 22 will be improved. Can be.

In addition, although the example which repeats lighting and extinction was shown in FIG. 3, exposure condition by changing so that exposure amount may be reduced to step shape as shown in FIG. 6A without providing an extinction time UTi may be sufficient.

In addition, as shown in FIG. 6B, the irradiation time of each pulse shape described in FIG. 3 is changed, and the exposure intensity is changed for each irradiation of the pulse shape described in FIG. By shortening time T61 and irradiating exposure light of strong exposure intensity, gradually increasing irradiation time to T62 and T63 ?? T65 for every pulse shape irradiation, and gradually lowering exposure intensity and exposing in one exposure time T0. It is also possible to suppress the temperature rise of the LED light source 22 by adopting an illumination system that satisfies the light amount S.

That is, as long as it is exposure conditions which satisfy | fills exposure total light amount S within predetermined time, there is no restriction | limiting in repetition of lighting and turning off.

As mentioned above, according to the exposure conditions of this embodiment, since the temperature rise of LED is suppressed, the structure of the heat radiation part 23 of a light source can be simplified.

In addition, the temperature rise data of the temperature sensor 24 and the exposure conditions are transferred to the memory, and the exposure conditions for lowering the temperature rise are calculated to add a feedback operation that applies the result to the exposure conditions in step S103 by the controller. Automation of the temperature control of the LED light source 22 becomes possible.

In the present embodiment, the exposure conditions are fed back so as to make the temperature conditions constant. However, the photosensitive agent, which is the exposed object, is applied by measuring the exposure characteristics of the exposed object, transferring it to a memory, and performing a feedback operation to change the exposure conditions in step S103. It becomes possible to automate exposure conditions of the LED light source which made the exposure characteristic of the glass substrate 3 which was made constant.

In addition, by setting exposure conditions for each LED, exposure under different exposure conditions becomes possible for each area of the glass substrate 3 to which the photosensitive agent which is a to-be-exposed body is apply | coated.

Thereby, since the exposure light quantity can be adjusted according to the characteristic of a to-be-exposed object, even if it is a glass substrate in which the photosensitive agent of the to-be-exposed object which has a different characteristic is apply | coated in-plane, it becomes possible to process simultaneously in one exposure.

[Example 2]

The exposure apparatus by Example 2 of this invention is demonstrated. The configuration of the exposure apparatus in this embodiment is the same as the configuration shown in FIG. 1 described in the first embodiment.

In addition, the operation flow of the exposure apparatus in this embodiment is the same as the flow demonstrated in Embodiment 1 described in FIG. 7 shows exposure conditions in step S103 of the operation flow. FIG. 8 shows a change in temperature measured by the temperature sensor 24 when the LED light source 22 is turned on under the exposure conditions shown in FIG. 7.

The graph shown in FIG. 7 is an example which performed the exposure in step S103 in 1 pulse. By setting the energization time of one pulse instantaneously, since the exposure intensity is large, the total exposure light amount reaches the amount of exposure light required for the glass substrate 3 to which the photosensitive agent which is a to-be-exposed body was applied. Although the irradiation time of one pulse is demonstrated at 0.8 second in the graph of FIG. 7, you may set it to time shorter than this in the range which does not damage the photosensitive agent apply | coated to the glass substrate 3. On the other hand, the temperature rise of an LED light source does not reach the upper limit temperature from FIG. Thereby, exposure time can be shortened by 1 pulse exposure in a short time.

Alternatively, the exposure time is not lengthened, and the total number of LEDs 21 of the LED light source 22 can be reduced.

By reducing the number of LEDs, the mounting area of the substrate on which the LEDs are mounted is reduced, so that the size of the light source can be reduced and the cost of the LEDs can be reduced, thereby reducing the cost.

As mentioned above, although the invention made by this inventor was demonstrated concretely based on the Example, it cannot be overemphasized that this invention is not limited to the said Example and various changes are possible in the range which does not deviate from the summary.

1 ??? exposure device 2 ???? light block
3 ??? glass substrate, exposed object 8 ???? exposure stand
8a ??? Exposure surface 9 substrate insertion unit
10 Controller 11 Memory
12 ??? LED lighting means 18 ??? table driving means
19 substrate insertion unit control means 21 UV LED
22 ??? LED light source 23 ???? heat radiator
24 temperature sensor 25 concentration lens
26 ??? LED Wiring Board

Claims (13)

Exposure light source means for emitting exposure light;
Table means which mounts the exposure board | substrate with which the photosensitizer was apply | coated, and is movable in a plane,
An exposure apparatus comprising control means for controlling the table means and the light source means for exposure,
The light source unit for exposure includes a light source unit in which a plurality of light emitting elements are arranged in two dimensions,
The control means controls the light source part when exposing the photosensitive agent applied to the exposure substrate mounted on the table means by the exposure light source means to a predetermined total exposure light amount within a predetermined time, thereby controlling a plurality of pulsed light from the light source part. To emit light while changing the irradiation conditions sequentially to expose the photosensitive agent applied to the exposure substrate. The method of claim 1,
The plurality of light emitting elements have a lighting time and a lighting luminance which are variable together, and the control means causes the plurality of light emitting elements to emit light while changing the irradiation conditions of the plurality of pulse lights in an arbitrary lighting pattern. Device. The method according to claim 1 or 2,
And a plurality of light emitting elements of the light source unit are either ultraviolet LEDs or ultraviolet LDs. The method according to claim 1 or 2,
And the control means switches the plurality of light emitting elements and switches the lighting luminance at a frequency of 10 Hz or less. Exposure light source means for emitting exposure light;
Table means which mounts the exposure board | substrate with which the photosensitizer was apply | coated, and is movable in a plane,
An exposure apparatus comprising control means for controlling the table means and the light source means for exposure,
The light source unit for exposure includes a light source unit in which a plurality of light emitting elements are arranged in two dimensions,
The control means controls the light source unit when exposing the photosensitive agent applied to the exposure substrate mounted on the table means by the exposure light source means to a predetermined exposure total light amount, thereby applying pulse light from the light source unit to the photosensitive agent. The exposure apparatus which exposes the photosensitive agent apply | coated to the said exposure substrate by the said predetermined exposure total light quantity by irradiating once to an exposure substrate. The method of claim 5, wherein
And a plurality of light emitting elements of the light source unit are either ultraviolet LEDs or ultraviolet LDs. An exposure method in which exposure light emitted from a light source unit in which a plurality of light emitting elements are arranged in two dimensions is irradiated to a substrate for exposure through a mask to expose a photosensitive agent applied to a surface of the substrate for exposure at a predetermined exposure total light amount within a predetermined time. ,
The pulsed light is emitted from the light source unit in which the plurality of light emitting elements are arranged in two dimensions while changing the irradiation conditions, and irradiated to the exposure substrate through the mask to suppress the temperature rise of the light source unit within the predetermined time. The exposure method characterized by exposing the photosensitive agent apply | coated to the said board | substrate for exposure with exposure total light quantity. The method of claim 7, wherein
Exposure by irradiating the exposure substrate with the exposure light emitted from the light source unit in which the plurality of light emitting elements are arranged in two dimensions to the exposure substrate, and performing exposure exposure of the photosensitive agent applied to the surface of the exposure substrate; Way. 9. The method according to claim 7 or 8,
And sequentially changing the irradiation conditions of the plurality of pulsed lights by sequentially changing at least one of the lighting time and the lighting luminance of the plurality of light emitting elements. 9. The method according to claim 7 or 8,
The exposure method is characterized in that the exposure light is ultraviolet light. 9. The method according to claim 7 or 8,
The exposure method of changing the irradiation conditions of the said some pulsed light sequentially is performed at the switching frequency of 10 Hz or less. An exposure method in which exposure light emitted from a light source unit in which a plurality of light emitting elements are arranged in two dimensions is irradiated to a substrate for exposure through a mask to expose a photosensitive agent applied to a surface of the substrate for exposure at a predetermined exposure total light amount within a predetermined time. ,
By emitting pulsed light once from a light source unit having a plurality of light emitting elements arranged in two dimensions and irradiating the exposure substrate through the mask, the temperature rise of the light source unit is suppressed and the exposure total light amount is determined within the predetermined time. An exposure method characterized by exposing a photosensitive agent applied to an exposure substrate. The method of claim 12,
The exposure method is characterized in that the exposure light is ultraviolet light.

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