201239543 六、發明說明 【發明所屬之技術領域】 本發明係關於爲了使遮罩上所描繪的電路圖案於基板 上曝光之曝光方法及其裝置。 【先前技術】 如習知之曝光裝置，係使用超高壓水銀燈當作光源。 因此’藉由從該超高壓水銀燈照射之光對被固定在曝光台 之基板進行電路圖案之曝光。 但是’超高壓水銀燈一般而言壽命短。爲此，使用者 不得不頻繁的進行交換作業及伴隨交換作業而來之光量調 整作業’會有耗費時間的問題發生。又，超高壓水銀燈在 開啓電源後’因爲等待照射穩定光量之光而費時，裝置起 動後不能馬上開始曝光動作。再者，超高壓水銀燈爲能夠 持續照射穩定光量之光，必須長時間點亮，無論如何會產 生電力消費大量增加的問題。 再者’爲了對基板曝光面進行高精細電路圖案之曝 光’曝光裝置係期望可以在曝光台全部無間隙且接近均一 之總曝光量曝光。所以，習知的曝光裝置係在定期點檢時 等等’檢測出光源照射的光量，使光量成爲所定容許範圍 內而進行光量的調整。但是，在定期點檢中，不可避免的 基板生產線要全部停止，被認爲效率低下。再者，該調整 對於點檢時檢測出的光量變化的調整是可能，但是針對實 際的曝光工程中之光量變化’例如，光源經過時間而劣化 -5- 201239543 伴隨之光量損失等無法進行檢測而加以適切的補償之問題 點存在。 此課題之解決方法，例如特開2003-98678號公報 (專利文獻1 )所記載，利用複數的LED以二維方式配置 而成之光源的曝光裝置用光源系統，透過光罩對塗布有感 光劑的基板進行近接式曝光（proximity exposure)。 再者，特開2005- 1 5 0 774號公報（專利文獻2 )所記 載，以複數的LED作爲光源之照明裝置，藉由未滿100% 之工作比對L E D進行驅動，而增加散熱效果提高發光效 率〇 在專利文獻.1所記載以LED作爲光源之曝光裝置用 光源系統，光源藉由使用昔知的燈件之方式改變成將複數 的LED以二維方式配列而構成：可以實現簡素而低價的 裝置，但是，針對降低光源的消費電力、光源光量之變動 之對策並未考量。 再者，專利文獻2所記載之以複數的LED作爲光源 的照明裝置，係揭示藉由未滿1 00%之工作比來驅動L E D，而增加散熱效果提高發光效率。即使如此，關於曝光 裝置所必要的，在提高該發光效率之狀態下，在1曝光時 間內確保必要的曝光量之事並未記載。 【發明內容】 [發明所欲解決之課題] 本發明，係有鑑於上述習知技術的問題點，提供可以 -6- 201239543 減輕使用者的負擔、降低光源的消費電 迅速調整成爲最佳光量的光進行基板之 低成本之曝光方法及裝置。 [用以解決課題之手段] 爲解決上述課題，本發明之曝光裝 光源手段’用於發出曝光光；及平台手 有感光劑的曝光用基板，可於平面移動 於控制平台手段和曝光用光源手段所構 段’係具備有：將複數發光元件以二維 源部；控制手段，當藉由曝光用光源手 載置塗上感光劑之曝光用基板在所定的 曝光總光量進行曝光時，係控制光源部 變化照射條件而發出複數的脈衝光之同 上所塗布之感光劑進行曝光所構成。 再者，爲解決上述課題，本發明之 曝光用光源手段，用於發出曝光光；及 置已塗有感光劑的曝光用基板，可於平 段，用於控制平台手段和曝光用光源手 光源手段，係具備有：將複數發光元件 成的光源部；控制手段，當藉由曝光用 手段所載置塗上感光劑之曝光用基板在 所定的曝光總光量進行曝光時，係控制 部的脈衝光藉由1次的照射，對曝光用 力、使用隨時可以 曝光，而且小型、 置，係具備曝光用 段，用於載置已塗 :及控制手段，用 成。曝光用光源手 方式配列而成的光 段，將平台手段所 時間內、以所定的 ，使該光源部依序 時，對曝光用基板 曝光裝置，係具備 平台手段，用於載 面移動；及控制手 段所構成。曝光用 以二維方式配列而 光源手段，將平台 所定的時間內、以 光源部，使該光源 基板上所塗布之感 201239543 光劑在所定的曝光總光量進行曝光所構成。 再者’爲解決上述課題，本發明係使複數發光元件以 二維方式配列而成的光源部所發光之曝光光，透過遮罩照 射至已塗布感光劑的曝光用基板，使該曝光用基板的表面 所塗布之感光劑在所定的時間內、以所定的曝光總光量進 行曝光之曝光方法；使複數發光元件以二維方式配列而成 的光源部，依序變化照射條件而發出複數的脈衝光之同 時，介由遮罩照射至曝光用基板，抑制光源部之溫度上昇 之同時，使曝光用基板所塗布之感光劑在所定的時間內、 以所定的曝光總光量進行曝光》 再者，爲解決上述課題，本發明係複數發光元件以二 維方式配列而成的光源部所發光之曝光光，透過遮罩照射 至曝光用基板，而對該曝光用基板的表面所塗布之感光劑 在所定的時間內、以所定的曝光總光量進行曝光之曝光方 法； 使複數發光元件以二維方式配列而成的光源部發出1 次的脈衝光，透過遮罩照射至曝光用基板，抑制光源部之 溫度上昇，而使曝光用基板的表面所塗布之感光劑在所定 的時間內、以所定的曝光總光量進行曝光。 根據本發明，藉由採用同時確保曝光總光量且可以抑 制光源的溫度之上昇的LED曝光光源，可以提供能減輕 使用者的負擔、降低消費電力、可以使用能迅速調整成爲 最佳光量的光進行基板之曝光，而且小型、低成本之曝光 4*fc 裝置。 -8 - 201239543 【實施方式】 以下，使用圖面詳細說明本發明之實施形態。 [實施例1 ] 圖1係本發明之第1之實施形態的曝光裝置之模式 圖。又’於以下說明：將和被曝光體的玻璃基板感光面呈 平行的互相直交2方向定義爲X軸及γ軸，將曝光光束 以垂直入射玻璃基板的方向定義爲Ζ軸。又，關於X 軸、Υ軸、Ζ軸個別以圖1中之箭頭方向爲正的方向。 本實施形態之曝光裝置1具有：光源塊2、曝光台 8 ' L E D點燈手段1 2、平台驅動手段1 8、基板插拔單位 控制手段19、控制器1 0、記憶體丨i。 光源塊2 ’係具有：使紫外線L E D 2 1在X Y平面上隔 開規定間隔，以二維方式配列而成、全體作爲面光源機能 的LED光源22 ;將LED光源22所產生的熱散熱之放熱 部23 ;及與測定LED光源22之溫度的溫度感測器24所 構成。 LED光源22具備有LED21與聚光透鏡25及LED配 線基板26。 構成光源塊2之以二維方式配列而成之紫外線LED2 1 係個別可以單獨點燈/消燈（開/關）。控制器1 0係針 對LED點燈手段1 2設定各LED21的點燈之有無、點燈時 間和點燈亮度。L E D點燈手段1 2係可以任意控制各 201239543 LED21的亮度，針對從進行開/關控制之光源塊2透過遮 罩4照射至玻璃基板3的光束之光量和照射時間，可以 任意予以設定。又，LED點燈手段1 2由控制器1 0進行點 燈控制。 曝光台8係與光源塊2並列設置於Z軸方向，用於安 裝玻璃基板3的曝光面8a係與XY平面呈平行。又’曝 光台8係由平台驅動手段18驅動於X軸及Y軸方向。藉 由使曝光台8的位置之移動，針對光源塊2可以變更曝光 台8的相對位置。 又，曝光裝置1係具備有基板插拔單元（Handling robot搬運機器人）9，藉由基板插拔單元控制手段19之 控制而使曝光台8處於遠離光源塊2之退避狀態時，係由 未圖示之基板倉儲裝置取出玻璃基板3設置在曝光台8之 曝光面8a之上，或是將載置在曝光台8a上之玻璃基板3 取出，可以收納在未圖示之基板倉儲裝置。 再者，進行曝光的玻璃基板3的光源塊2側之面，係 構成爲塗布有感光劑的感光面。又，於該玻璃基板3的感 光面藉由形成有所定圖案的遮罩4夾著0.05mm至1mm的 空氣層而被保持於曝光裝置1。藉由透過該遮罩4對玻璃 基板3照射從光源塊2而來之光束對感光面進行曝光，將 遮罩4上形成的圖案轉印至玻璃基板3的感光面（近接式 曝光）。 對於遮罩4的尺寸，玻璃基板3的尺寸大時，因爲以 1次的曝光無法將塗布感光劑之玻璃基板3全面曝光，所 -10- 201239543 以’以平台驅動手段18驅動曝光台8，藉由步進方式使 塗布感光劑之玻璃基板3之曝光領域移動並依序曝光，塗 布感光劑之玻璃基板3在全面曝光之後，可使遮罩4的圖 案轉印至玻璃基板3的感光面。 再者，在本實施形態中，雖然遮罩4與玻璃基板3是 分離而構成的，但是，本發明並不限定該構成，遮罩4密 著於玻璃基板3的感光面之構成亦可。此時，坡璃基板3 的感光面被實施密著曝光之後，遮罩4的圖案轉印至感光 面。 再者’藉由將遮罩4與玻璃基板3的間隙擴大，在遮 罩4與玻璃基板3之間插入縮小投影透鏡，可以將遮罩4 所形成的圖案縮小投影曝光在玻璃基板3的感光面。 控制器1 〇，係分別控制光源塊2、LED點燈手段 12、平台驅動手段18、基板插拔單元控制手段19之同 時，讀出記憶體1 1所記錄之點亮條件、控制構成光源塊 2之複數的紫外線LED2 1的每一點亮時間、亮度。記憶體 1 1中記憶各紫外線L E D 2 1的點亮條件。 再者，關於圖1所表示的構成，係說明固定光源塊2 使曝光台8沿著χ-γ方進行步進移動，而依序曝光玻璃 基板3的全面之構成，但是，固定曝光台8，使光源塊2 沿X-Y方向步進移動，依序曝光玻璃基板3的全面之構 成也可以。 使用如上述所構成之本實施形態的曝光裝置1，使用 圖2說明曝光程序。201239543 VI. Description of the Invention [Technical Field] The present invention relates to an exposure method and apparatus for exposing a circuit pattern drawn on a mask to a substrate. [Prior Art] As a conventional exposure apparatus, an ultrahigh pressure mercury lamp is used as a light source. Therefore, the substrate pattern fixed to the exposure stage is exposed by the light irradiated from the ultrahigh pressure mercury lamp. However, ultra high pressure mercury lamps generally have a short life span. For this reason, the user has to perform the exchange operation frequently and the light amount adjustment operation accompanying the exchange operation, which causes a problem of time consuming. Moreover, after the ultra-high pressure mercury lamp is turned on, it is time consuming to wait for the light of a steady amount of light to be irradiated, and the exposure operation cannot be started immediately after the device is started. Furthermore, the ultra-high pressure mercury lamp is a light that can continuously illuminate a stable amount of light, and must be lit for a long time, which in any case causes a problem that the power consumption is greatly increased. Further, in order to perform exposure of a high-definition circuit pattern on the exposed surface of the substrate, it is desirable to expose the entire exposure amount without gaps and uniformity in the exposure stage. Therefore, the conventional exposure apparatus adjusts the amount of light by detecting the amount of light irradiated by the light source at the time of periodic inspection or the like, and making the amount of light within a predetermined allowable range. However, in the periodic inspection, the inevitable substrate production line is all stopped, and it is considered to be inefficient. Furthermore, this adjustment is possible to adjust the change in the amount of light detected during the inspection, but it is impossible to detect the change in the amount of light in the actual exposure process, for example, the deterioration of the light source over time -5 - 201239543 The problem of appropriate compensation is there. In the light source system for an exposure apparatus in which a plurality of LEDs are two-dimensionally arranged, the light-shielding layer is coated with a sensitizer, as described in Japanese Laid-Open Patent Publication No. 2003-98678 (Patent Document 1). The substrate is subjected to proximity exposure. In the illuminating device using a plurality of LEDs as a light source, the LED is driven by less than 100% of the operation ratio, and the heat radiation effect is improved. Luminous efficiency is a light source system for an exposure apparatus using an LED as a light source as described in Patent Document 1. The light source is changed to a plurality of LEDs in a two-dimensional manner by using a known lamp member: A low-cost device, however, measures against the fluctuation of the power consumption of the light source and the amount of light from the light source are not considered. Further, in the illumination device using a plurality of LEDs as a light source described in Patent Document 2, it is revealed that L E D is driven by an operation ratio of less than 100%, and the heat dissipation effect is increased to improve the luminous efficiency. Even in this case, it is not necessary to ensure the necessary exposure amount in one exposure time in the state in which the luminous efficiency is improved as necessary for the exposure apparatus. SUMMARY OF THE INVENTION [Problems to be Solved by the Invention] The present invention has been made in view of the above-described problems of the prior art, and it is possible to reduce the burden on the user and reduce the power consumption of the light source to be optimally adjusted to the optimum amount of light. Light-based exposure method and apparatus for substrates. [Means for Solving the Problem] In order to solve the above problems, the exposure light source means of the present invention is used for emitting exposure light; and the exposure substrate having a sensitizer on the platform hand is movable in a plane on the control platform means and the exposure light source The means for constructing the device includes: a plurality of light-emitting elements as a two-dimensional source portion; and a control means for exposing the exposure substrate coated with the sensitizer by the exposure light source to a predetermined total amount of exposure light The light source unit is controlled to change the irradiation condition, and a plurality of pulsed light is emitted to expose the photosensitive agent applied thereto to perform exposure. Further, in order to solve the above problems, the exposure light source means of the present invention is for emitting exposure light; and the exposure substrate coated with the sensitizer is used for controlling the platform means and the light source for exposure light in a flat section. The means includes: a light source unit in which a plurality of light-emitting elements are formed; and a control means for pulsing the control unit when the exposure substrate on which the photosensitive agent is applied by the exposure means is exposed to a predetermined total amount of exposure light The light is exposed to light for one exposure, and can be exposed at any time for use, and is small, and has an exposure section for placing the coated and control means. a light segment in which the light source is arranged by the light source, and when the light source portion is sequentially set in the time of the platform means, the exposure substrate exposure device is provided with a platform means for moving the surface; and Control means. The exposure is performed by two-dimensionally arranging the light source means to expose the sensitized 201239543 light agent applied on the light source substrate to a predetermined total amount of exposure light for a predetermined period of time. In order to solve the problem, the present invention is to expose the exposure light emitted from the light source unit in which the plurality of light-emitting elements are arranged in two dimensions to the exposure substrate to which the photosensitive agent has been applied, and to expose the exposure substrate. An exposure method in which a sensitizer coated on a surface is exposed to a predetermined total amount of exposure light for a predetermined period of time; a light source portion in which a plurality of illuminating elements are arranged in two dimensions, sequentially emits a plurality of pulses by changing irradiation conditions At the same time, the mask is irradiated onto the substrate for exposure, and the temperature rise of the light source portion is suppressed, and the sensitizer applied to the substrate for exposure is exposed for a predetermined total amount of exposure for a predetermined period of time. In order to solve the above-described problems, the present invention is an exposure light that is emitted from a light source unit in which a plurality of light-emitting elements are two-dimensionally arranged, and is irradiated onto an exposure substrate through a mask, and the photosensitive agent applied to the surface of the exposure substrate is Exposure method for performing exposure at a predetermined total amount of exposure for a predetermined period of time; forming a plurality of light-emitting elements in two dimensions The source portion emits the pulse light once, and the substrate is irradiated to the exposure substrate through the mask to suppress the temperature rise of the light source portion, and the photosensitive agent applied on the surface of the exposure substrate is subjected to the predetermined total amount of exposure for a predetermined period of time. exposure. According to the present invention, by using an LED exposure light source that simultaneously ensures the total amount of light to be exposed and can suppress an increase in the temperature of the light source, it is possible to reduce the burden on the user, reduce the power consumption, and use light that can be quickly adjusted to an optimum amount of light. Substrate exposure, and small, low-cost exposure 4*fc device. -8 - 201239543 [Embodiment] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. [First Embodiment] Fig. 1 is a schematic view showing an exposure apparatus according to a first embodiment of the present invention. Further, the following description will be made: the two directions orthogonal to each other in parallel with the photosensitive surface of the glass substrate of the object to be exposed are defined as the X-axis and the γ-axis, and the direction in which the exposure light beam is perpendicularly incident on the glass substrate is defined as the x-axis. Further, the X-axis, the Υ-axis, and the Ζ-axis are each a direction in which the direction of the arrow in Fig. 1 is positive. The exposure apparatus 1 of the present embodiment includes a light source block 2, an exposure stage 8' L E D lighting means 1 2, a stage driving means 18, a substrate insertion/removal unit control means 19, a controller 10, and a memory 丨i. The light source block 2' has an LED light source 22 that is arranged in a two-dimensional manner at a predetermined interval on the XY plane, and is used as a surface light source function. The heat generated by the LED light source 22 is dissipated. a portion 23; and a temperature sensor 24 for measuring the temperature of the LED light source 22. The LED light source 22 is provided with an LED 21, a collecting lens 25, and an LED wiring board 26. The ultraviolet LEDs 2 1 which are arranged in a two-dimensional manner constituting the light source block 2 can be individually turned on/off (on/off). Controller 10 0-pin The LED lighting means 1 2 sets the presence or absence of lighting of each LED 21, the lighting time, and the lighting brightness. The L E D lighting means 1 2 can arbitrarily control the brightness of each of the 201239543 LEDs 21, and can arbitrarily set the amount of light and the irradiation time of the light beam that is transmitted from the light source block 2 that performs the on/off control to the glass substrate 3 through the mask 4. Further, the LED lighting means 1 2 is controlled by the controller 10 for lighting. The exposure stage 8 is disposed in parallel with the light source block 2 in the Z-axis direction, and the exposure surface 8a for mounting the glass substrate 3 is parallel to the XY plane. Further, the exposure stage 8 is driven by the stage driving means 18 in the X-axis and Y-axis directions. By moving the position of the exposure stage 8, the relative position of the exposure stage 8 can be changed for the light source block 2. Further, the exposure apparatus 1 includes a substrate insertion/removal unit (Handling robot transport robot) 9. When the exposure stage 8 is in a retracted state away from the light source block 2 by the control of the substrate insertion/ejection unit control means 19, it is not shown. The substrate storage device shown in the substrate storage device 3 is disposed on the exposure surface 8a of the exposure table 8, or the glass substrate 3 placed on the exposure table 8a is taken out, and can be housed in a substrate storage device (not shown). Further, the surface of the glass substrate 3 on which the exposure is performed on the side of the light source block 2 is configured as a photosensitive surface to which a photosensitive agent is applied. Further, the photosensitive surface of the glass substrate 3 is held by the exposure apparatus 1 by a mask 4 having a predetermined pattern sandwiching an air layer of 0.05 mm to 1 mm. The glass substrate 3 is irradiated with light from the light source block 2 through the mask 4 to expose the photosensitive surface, and the pattern formed on the mask 4 is transferred to the photosensitive surface of the glass substrate 3 (proximity exposure). When the size of the mask 4 is large and the size of the glass substrate 3 is large, since the glass substrate 3 to which the sensitizer is applied cannot be fully exposed by one exposure, the exposure stage 8 is driven by the platform driving means 18 in -10-201239543. The exposure field of the glass substrate 3 coated with the sensitizer is moved and sequentially exposed by a stepwise manner, and the glass substrate 3 coated with the sensitizer can be transferred to the photosensitive surface of the glass substrate 3 after the overall exposure. . In the present embodiment, the mask 4 and the glass substrate 3 are separated from each other. However, the present invention is not limited to this configuration, and the mask 4 may be adhered to the photosensitive surface of the glass substrate 3. At this time, after the photosensitive surface of the glass substrate 3 is subjected to the close exposure, the pattern of the mask 4 is transferred to the photosensitive surface. Furthermore, by enlarging the gap between the mask 4 and the glass substrate 3, a reduced projection lens is inserted between the mask 4 and the glass substrate 3, and the pattern formed by the mask 4 can be reduced in projection and exposure on the glass substrate 3. surface. The controller 1 is configured to control the light source block 2, the LED lighting means 12, the platform driving means 18, and the substrate plugging unit control means 19, and simultaneously read the lighting conditions recorded by the memory 1 and control the light source blocks. 2 of each of the ultraviolet LEDs 2 1 each lighting time, brightness. The memory 1 1 stores the lighting conditions of the respective ultraviolet rays L E D 2 1 . In the configuration shown in Fig. 1, the fixed light source block 2 is described in which the exposure stage 8 is stepwise moved along the χ-γ side, and the entire structure of the glass substrate 3 is sequentially exposed. However, the fixed exposure stage 8 is fixed. The light source block 2 is stepwise moved in the XY direction, and the overall configuration of the glass substrate 3 may be sequentially exposed. The exposure apparatus 1 of the present embodiment configured as described above is used to explain the exposure program using Fig. 2 .
S -11 - 201239543 圖2係表示使用本實施形態的曝光裝置！，在玻璃基 板3的感光面上對形成於遮罩4的圖案進行曝光、進行轉 印處理的流程之流程圖。打開曝光裝置1的電源，最初是 於步驟S101 ’打開各紫外線LED21的電源，使用未圖示 之光量感測器測定各紫外線LED2 1之光量，進行因爲故 障而以正常光量無法點亮之不良LED之確認，或曝光台8 的退避等等的各種初期設定。其次，進入步驟S1 02。 在步驟S1 02中’判定待執行曝光之基板3是否存在 於未圖示之基板倉儲裝置。亦即，須進行曝光之基板3仍 留在基板倉儲裝置（S102 :是）則進入步驟S103，待曝 光之基板3未留在基板倉儲裝置（S102:否）的話，則該 子程式終了。 在步驟S 1 0 3中，係從記憶體11叫出事先記錄的曝光 條件’針對構成光源塊2的複數紫外線L E D 2 1之中，以 哪一個條件點亮哪一個LED等之條件進行設定。 其次，進入步驟S 1 04。在步驟S 1 04中，控制器1 〇 係藉由基板插拔單元控制手段1 9控制基板插拔單元9， 由未圖示之基板倉儲裝置取出玻璃基板3安裝在曝光台8 之曝光面8a之上。其次，進入步驟S105。 在步驟S1 05中，控制器1 0係控制平台驅動手段 18’移動曝光台8以便使基板3應曝光的區域位於步驟 S 所決定的、LED點亮區域之下方。其次，進入步驟 S 1 06 ° 在步驟S106中，LED點燈手段12係控制步驟S1 03 -12- 201239543 所決定的LED2 1使於所定時間、所定光量進行點燈、消 燈，透過遮罩4對塗布感光劑之玻璃基板3進行曝光（近 接式曝光 proximity exposure ) 〇 其次，進入步驟S 1 07。步驟S 1 07係將記憶體1 1所 記憶之各LED21的累計點亮時間加算步驟S106中的LED 點亮時間，進行各LED2 1的每一累計點亮時間之資料的 更新。 其次，進入步驟S108。於步驟S108，控制器10係控 制平台驅動手段1 8使曝光台8從光源塊2退避，基板插 拔單元9從曝光台8取出玻璃基板3。 其次，進入步驟S109。在步驟S109中，控制器10 藉由基板插拔單元控制手段1 9控制基板插拔單元9，曝 光完了之玻璃基板3由曝光台8取出，而收納在未圖示之 基板倉儲裝置。其次，回到步驟S1 02，在未圖示之基板 倉儲裝置內乃有其他應該曝光的玻璃基板時，步驟sios-siop 的處理 被繼續 進行。 圖3係表示圖2之步驟S 1 03之曝光條件。 照射在塗布有感光劑之玻璃基板3的被曝光體之曝光 光量，係將一次的曝光時間T0分割成四個脈衝狀的曝光 光的照射，以各脈衝狀的曝光光之曝光時間Ti ( i = 1， 2···)和各脈衝狀的曝光光的曝光強度Ai ( i = 1，2…）的 乘積來表示，曝光總光量係使用各脈衝狀的曝光光的光量 的和來表示。因此，圖3中所示一次的曝光時間TO之曝 光總光量 S 成爲 S=AlxTl+A2xT2+A3xT3+A4xT4。 -13- 201239543 在此，各脈衝狀的曝光時間Ti係從〇.ls至2〇s程度 的時間。脈衝狀的曝光時間Ti和次一脈衝狀曝光時間Ti + 1之間的非曝光時間UTi係0.1s至20s程度的時間。在 曝光裝置1中，LED光源22因爲是透過與LED光源22 接續的放熱部23以水冷或空冷進行強制冷卻，所以比起 放熱部23不進行強制冷卻的狀況’更可以抑制LED光源 22的溫度上昇。 再者，LED光源22之溫度係由配線基板26背面所設 置之複數個溫度感測器24來監視。 關於曝光強度Ai，係和LED光源22對各LED21之 投入電力呈比例，因此可以藉由控制電流、控制投入電 力，而對其進行控制。 LED2 1是固態半導體元件，對各LED21之投入電力 中發光所使用能量的比例（發光效率）是50%以下，剩 餘的能量變成熱。又’因爲固態半導體元件有隨著溫度上 昇而發光效率低下之特性，L E D 2 1如果可以低溫驅動的 話，高發光效率驅動是可能的。藉此，LED光源22可以 減低投入電力、抑制溫度上昇。 藉由一邊週期性重複LED的ΟΝ/OFF —邊進行曝 光’抑制LED的溫度上昇是可以期待的，爲了確認該效 果，調查關於LED21的ΟΝ/OFF頻率設爲50Hz和iHz 時。該結果在圖4表示。圖4的圖表係工作比〇.5，曝光 時間4秒間，曝光總光量在一定條件下，將L E D 2 1的Ο N / OFF頻率設爲50Hz時’將溫度感測器24檢出之溫度變 -14 - 201239543 化用點線表示，LED21的ΟΝ/OFF頻率設爲1Hz時溫度 感測器24檢出之溫度變化用實線表示。相較於LED21的 ON/ OFF時間週期設爲50Hz之情況，設爲1Hz時其OFF 時可以看見溫度的減低效果 > 和ON / OFF的時間週期爲 5 0Hz時比較，LED光源22的溫度上昇大約減少30%。 有此一實驗可知LED21的ΟΝ/OFF頻率和溫度抑制 效果的關係，係伴隨著LED21的ON/ OFF頻率上昇而效 果降低’但是’在1 0Hz以下的頻率可以顯現溫度抑制效 果。 再者’圖4中係將曝光強度Ai、曝光時間Ti設爲一 定’但是，如圖5所表示’即使使之漸漸減低曝光強度而 變化’亦可提升LED光源22的溫度上昇之抑制效果。 再者’圖3表示重複點燈和消燈的例子，但是，未設 置消燈時間U T i，而如圖6 A所表示，亦可設爲使曝光光 量呈階段狀減低之變化之曝光條件。 再者’如圖6B所表示，亦可將圖3說明的對應於各 脈衝狀的每一照射來變化照射時間，以及圖5說明的對應 於各脈衝狀的每一照射來變化曝光強度予以組合，於最初 的脈衝狀的照射中’將照射時間T 6 1縮短且照射強烈曝光 強度的曝光光，依序對應於脈衝狀的每一照射而將照射時 間漸漸增長爲T62’ T63..T65的同時，漸漸變低曝光強 度而進行曝光’藉由採用達到1曝光時間TO內的曝光總 光量S的照明方式，也能抑制L E D光源2 2的溫度上昇。 亦即’只要是在所定的時間內能滿足曝光總光量s之 -15- 201239543 曝光條件，則點燈和消燈之重複進行上並無限制。 根據以上之本實施形態的曝光條件，因爲L E D的溫 度上昇能夠抑制，所以能夠使光源的放熱部2 3的構造簡 略化。 再者，將溫度感測器2 4的溫度上昇資料和曝光條件 發送到記憶體，藉由運算降低溫度上昇的曝光條件，將該 結果適用於由控制器進行步驟S 1 0 3之曝光條件的回饋運 算，藉由該回饋運算使LED光源22之溫度調節能夠自動 化。 本實施例中，係以使溫度條件成爲一定而實施曝光條 件之回饋，但是，藉由測定被曝光體的曝光特性、傳送至 記憶體、變化步驟S 1 03的曝光條件而進行回饋運算，則 可使塗布感光劑之玻璃基板3、亦即被曝光體之曝光特性 保持一定之狀態下，使LED光源的曝光條件自動化成爲 可能。 再者，對應於各LED之每一個來設定曝光條件，則 可以針對塗布感光劑之玻璃基板3、亦即被曝光體之每一 區域，進行不同曝光條件之曝光。 藉此，因爲配合被曝光體之特性可以調整曝光光量， 即使具有不同特性之被曝光體的感光劑被塗布於面內之玻 璃基板，在一次的曝光中亦可以同時處理。 [實施例2] 說明關於本發明的實施例2之曝光裝置。在本實施例 -16- 201239543 中曝光裝置的構成係與實施例1之說明圖1所表示 是同樣的。 再者，本實施例之曝光裝置之動作流程係與圖 載之實施例1中說明過的流程同樣的。圖7表示動 之步驟S103之曝光條件。圖8係表示在圖7所表 條件時，在LED光源22點亮時，溫度感測器24 的溫度變化。 圖7表示之圖表，係針對步驟S103之曝光以 進行爲例。以1脈衝的通電時間瞬間點亮，因爲曝 大，總曝光光量係滿足塗布感光劑之玻璃基板3、 曝光體所必要的曝光光量。圖7之圖表中說明1脈 射時間爲0.8秒，但是，在無損壞塗布於玻璃基板 光劑之範圍內，設定比這更短的時間亦可。另一方 圖8中LED光源的溫度上昇未達上限溫度。依此 短時間的1脈衝曝光可以短縮曝光時間。 再者，在不增長曝光時間之情況下，LED光源 LED21之總數亦可削減。 藉由LED的數量削減，可使搭載LED的基板 面積變小，因此可以使光源小型化。而且因爲可 LED的部品材料費，低成本化是可能。 以上，依據實施例具體說明本發明者所作之發 是，本發明並不只限定在上述實施例，當然在不偏 旨之範圍內，各種變更是可能的。 的構成 2所記 作流程 示曝光 測定出 1脈衝 光強度 亦即被 衝的照 3的感 面，從 ，藉由 22的 之安裝 以減少 明，但 離該要 -17- 201239543 【圖式簡單說明】 [圖 1A] 表示與本發明之第〗及第2之實施例有關之曝光裝置 之槪略構成方塊圖。 [圖 1B] 表示與本發明之第1及第2之實施例有關之曝光裝置 之光源塊與遮罩、玻璃基板及曝光台之槪略構成側面圖。 [圖2 ] 表示與本發明之第1及第2之實施例有關之曝光裝置 之操作流程之流程圖。 [圖3] 表示與本發明之第1之實施例有關曝光裝置的曝光光 量之條件之圖表。 [圖4] 表示與本發明之第1之實施例有關之曝光裝置曝光時 LED光源之溫度變化表示圖。 [圖5] 表示與本發明之第1之實施例有關曝光裝置在曝光時 的1曝光時間內，脈衝光的曝光強度之變化之圖表。 [圖 6A] 表示與本發明之第1之實施例有關曝光裝置在曝光時 的1曝光時間內，曝光強度變化的變形例之圖表。 [圖 6B] 表示與本發明之第1之實施例有關曝光裝置在曝光時 -18- 201239543 的1曝光時間內，脈衝光的曝光強度之變化之圖表。 [圖7] 表示與本發明之第2之實施例有關曝光裝置的曝光光 量之條件之圖表。 [圖8] 表示與本發明之第2之實施例有關曝光裝置的溫度變 化之圖表。 【主要元件符號說明】 1 :曝光裝置 2 :光源塊 3:玻璃基板、被曝光體 8 :曝光台 8a :曝光面 9 :基板插拔單元 I 〇 :控制器 II :記憶體 12 : LED點燈手段 1 8 :平台驅動手段 1 9 :基板插拔單元控制手段S -11 - 201239543 Fig. 2 shows the use of the exposure apparatus of this embodiment! A flow chart for the process of exposing the pattern formed on the mask 4 to the transfer surface of the glass substrate 3 and performing a transfer process. When the power of the exposure apparatus 1 is turned on, the power of each of the ultraviolet LEDs 21 is turned on in the first step S101, and the amount of light of each of the ultraviolet LEDs 21 is measured by a light amount sensor (not shown), and the defective LEDs that cannot be lit with normal light amount due to a failure are performed. Various initial settings such as confirmation, or retraction of the exposure stage 8. Next, the process proceeds to step S102. In step S102, it is determined whether or not the substrate 3 to be subjected to exposure is present in a substrate storage device (not shown). That is, if the substrate 3 to be exposed remains in the substrate storage device (S102: YES), the process proceeds to step S103, and the substrate 3 to be exposed is not left in the substrate storage device (S102: NO), and the subroutine is terminated. In the step S1 0 3, the exposure condition "recorded in advance" from the memory 11 is set for the condition of which of the plurality of ultraviolet rays L E D 2 1 constituting the light source block 2 is turned on. Next, the process proceeds to step S104. In step S104, the controller 1 controls the substrate insertion and removal unit 9 by the substrate insertion/ejection unit control means 19, and the glass substrate 3 is taken out from the substrate storage device (not shown) and mounted on the exposure surface 8a of the exposure stage 8. Above. Next, the process proceeds to step S105. In step S105, the controller 10 controls the stage driving means 18' to move the exposure stage 8 so that the area to which the substrate 3 should be exposed is located below the LED lighting area determined in step S. Next, the process proceeds to step S 1 06 °. In step S106, the LED lighting means 12 controls the LED 2 1 determined in steps S1 03 -12-201239543 to light up and cancel the light for a predetermined time and a predetermined amount of light, and pass through the mask 4 The glass substrate 3 to which the sensitizer is applied is subjected to exposure (proximity exposure). Next, the process proceeds to step S107. In step S1 07, the accumulated lighting time of each of the LEDs 21 stored in the memory 1 is added to the LED lighting time in step S106, and the data of each accumulated lighting time of each LED 2 1 is updated. Next, the process proceeds to step S108. In step S108, the controller 10 controls the platform driving means 18 to retract the exposure stage 8 from the light source block 2, and the substrate insertion unit 9 takes out the glass substrate 3 from the exposure stage 8. Next, the process proceeds to step S109. In step S109, the controller 10 controls the substrate insertion/removal unit 9 by the substrate insertion/ejection unit control means 19, and the exposed glass substrate 3 is taken out by the exposure stage 8, and is housed in a substrate storage device (not shown). Next, returning to step S102, when there is another glass substrate to be exposed in the substrate storage device (not shown), the processing of the step sios-siop is continued. Fig. 3 is a view showing the exposure conditions of the step S1 03 of Fig. 2. The amount of exposure light to be irradiated onto the exposed object of the glass substrate 3 coated with the sensitizer is divided into one pulse exposure light by one exposure time T0, and the exposure time Ti (i) of each pulsed exposure light. = 1, 2···) is expressed by the product of the exposure intensity Ai (i = 1, 2...) of each pulsed exposure light, and the total exposure light amount is expressed by the sum of the amounts of the respective pulse-shaped exposure lights. Therefore, the total exposure amount S of the exposure time TO shown in Fig. 3 becomes S = AlxTl + A2xT2 + A3xT3 + A4xT4. -13- 201239543 Here, each pulse-shaped exposure time Ti is a time from 〇.ls to 2〇s. The non-exposure time UTi between the pulsed exposure time Ti and the next pulsed exposure time Ti + 1 is a time of about 0.1 s to 20 s. In the exposure apparatus 1, since the LED light source 22 is forcedly cooled by water cooling or air cooling through the heat radiation portion 23 connected to the LED light source 22, the temperature of the LED light source 22 can be suppressed more than the case where the heat radiation portion 23 does not perform forced cooling. rise. Further, the temperature of the LED light source 22 is monitored by a plurality of temperature sensors 24 provided on the back surface of the wiring substrate 26. The exposure intensity Ai is proportional to the input power of each of the LEDs 21 by the LED light source 22, so that it can be controlled by controlling the current and controlling the input power. The LED 2 1 is a solid-state semiconductor element, and the ratio (luminous efficiency) of the energy used for light emission to the input power of each of the LEDs 21 is 50% or less, and the remaining energy becomes heat. Further, since the solid-state semiconductor element has a characteristic that the luminous efficiency is lowered as the temperature rises, it is possible to drive the high luminous efficiency if the L E D 2 1 can be driven at a low temperature. Thereby, the LED light source 22 can reduce the input power and suppress the temperature rise. It is expected to suppress the temperature rise of the LED by periodically repeating the ΟΝ/OFF of the LED. To confirm this effect, it is investigated that the ΟΝ/OFF frequency of the LED 21 is set to 50 Hz and iHz. This result is shown in FIG. The graph of Fig. 4 is the operating ratio 〇.5, the exposure time is 4 seconds, and the total amount of exposure light is under certain conditions. When the Ο N /OFF frequency of the LED 2 1 is set to 50 Hz, the temperature detected by the temperature sensor 24 is changed. -14 - 201239543 The dotted line indicates that the temperature change detected by the temperature sensor 24 when the ΟΝ/OFF frequency of the LED 21 is set to 1 Hz is indicated by a solid line. Compared with the case where the ON/OFF time period of the LED 21 is 50 Hz, the temperature reduction effect can be seen when it is OFF at 1 Hz> and the temperature of the LED light source 22 is increased when the ON/OFF time period is 50 Hz. Approximately 30% reduction. In this experiment, the relationship between the ΟΝ/OFF frequency of the LED 21 and the temperature suppression effect is lowered as the ON/OFF frequency of the LED 21 rises. However, the temperature suppression effect can be exhibited at a frequency of 10 Hz or less. Further, in Fig. 4, the exposure intensity Ai and the exposure time Ti are set to be ', but the effect of suppressing the temperature rise of the LED light source 22 can be improved by changing the exposure intensity by gradually decreasing as shown in Fig. 5 . Further, Fig. 3 shows an example in which the lighting and the erasing are repeated. However, the erasing time U T i is not set, and as shown in Fig. 6A, the exposure condition in which the amount of exposure light is changed in a stepwise manner may be used. Further, as shown in FIG. 6B, the irradiation time may be changed for each irradiation corresponding to each pulse shape illustrated in FIG. 3, and the exposure intensity may be changed for each irradiation corresponding to each pulse shape illustrated in FIG. 5. In the initial pulse-like illumination, the exposure light that shortens the irradiation time T 6 1 and irradiates the intense exposure intensity gradually increases the irradiation time to T62' T63..T65 in response to each of the pulse-like illuminations. At the same time, the exposure is gradually lowered with a low exposure intensity. By using an illumination method that achieves the total exposure amount S in the exposure time TO, the temperature rise of the LED light source 22 can also be suppressed. That is, as long as the exposure time -15 - 201239543 exposure conditions can be satisfied within the specified time, there is no limit to the repetition of lighting and lamp elimination. According to the exposure conditions of the present embodiment described above, since the temperature rise of L E D can be suppressed, the structure of the heat radiation portion 23 of the light source can be simplified. Furthermore, the temperature rise data and the exposure condition of the temperature sensor 24 are sent to the memory, and the exposure condition for lowering the temperature rise is calculated by the operation, and the result is applied to the exposure condition of the step S130 by the controller. The feedback operation, by which the temperature adjustment of the LED light source 22 can be automated. In the present embodiment, the feedback condition is performed while the temperature condition is constant. However, by performing the feedback calculation by measuring the exposure characteristics of the object to be exposed, transferring to the memory, and changing the exposure conditions of step S103, The exposure conditions of the LED light source can be automated in a state where the exposure characteristics of the glass substrate 3 to which the sensitizer is applied, that is, the exposed object, can be kept constant. Further, by setting exposure conditions for each of the LEDs, it is possible to perform exposure under different exposure conditions for each of the glass substrate 3 to which the sensitizer is applied, that is, each region of the object to be exposed. Thereby, the amount of exposure light can be adjusted in accordance with the characteristics of the object to be exposed, and even if the sensitizer of the object to be exposed having different characteristics is applied to the glass substrate in the plane, it can be simultaneously processed in one exposure. [Embodiment 2] An exposure apparatus according to Embodiment 2 of the present invention will be described. The configuration of the exposure apparatus in the present embodiment -16-201239543 is the same as that shown in Fig. 1 of the first embodiment. Further, the operation flow of the exposure apparatus of this embodiment is the same as that described in the first embodiment of the drawing. Fig. 7 shows the exposure conditions of the step S103. Fig. 8 is a view showing the temperature change of the temperature sensor 24 when the LED light source 22 is turned on in the condition shown in Fig. 7. Fig. 7 shows a graph for taking the exposure of step S103 as an example. The energization time of one pulse is instantaneously lit. Because of the exposure, the total amount of exposure light satisfies the amount of exposure light necessary for coating the glass substrate 3 of the sensitizer and the exposed body. In the graph of Fig. 7, the pulse time is 0.8 seconds, but it is set to be shorter than this in the range of no application of the glass substrate to the photocatalyst. On the other hand, the temperature rise of the LED light source in Fig. 8 does not reach the upper limit temperature. According to this, a short-time 1 pulse exposure can shorten the exposure time. Furthermore, the total number of LED light sources LED21 can be reduced without increasing the exposure time. By reducing the number of LEDs, the area of the substrate on which the LEDs are mounted can be made small, so that the light source can be miniaturized. Moreover, because of the cost of the parts of the LED, it is possible to reduce the cost. The present invention has been described with reference to the embodiments. The present invention is not limited to the above embodiments, and various modifications are possible without departing from the scope of the invention. The structure of the structure 2 is shown as a process of measuring the intensity of the 1 pulse light, that is, the surface of the illuminated 3, from the installation of 22 to reduce the brightness, but from the -17-201239543 [simple figure [Fig. 1A] Fig. 1A is a schematic block diagram showing an exposure apparatus relating to the first and second embodiments of the present invention. Fig. 1B is a schematic side view showing the light source block and the mask, the glass substrate, and the exposure stage of the exposure apparatus according to the first and second embodiments of the present invention. Fig. 2 is a flow chart showing the operational flow of the exposure apparatus relating to the first and second embodiments of the present invention. Fig. 3 is a graph showing the conditions of the exposure light amount of the exposure apparatus according to the first embodiment of the present invention. Fig. 4 is a view showing a temperature change of an LED light source when an exposure apparatus according to a first embodiment of the present invention is exposed. Fig. 5 is a graph showing changes in exposure intensity of pulsed light in an exposure time of an exposure apparatus during exposure in the first embodiment of the present invention. Fig. 6A is a graph showing a modification of the exposure intensity change in the exposure time of the exposure apparatus at the time of exposure in the first embodiment of the present invention. Fig. 6B is a graph showing changes in the exposure intensity of the pulsed light in the exposure time of the exposure apparatus -18 - 201239543 in the first embodiment of the present invention. Fig. 7 is a graph showing the conditions of the exposure light amount of the exposure apparatus according to the second embodiment of the present invention. Fig. 8 is a graph showing changes in temperature of an exposure apparatus in accordance with a second embodiment of the present invention. [Explanation of main component symbols] 1 : Exposure device 2 : Light source block 3 : Glass substrate, exposed object 8 : Exposure table 8a : Exposure surface 9 : Substrate plug unit I 〇 : Controller II : Memory 12 : LED lighting Means 1 8 : Platform driving means 1 9 : Substrate plugging unit control means
21 :紫外線LED 22 : LED光源 23 :散熱部 24 :溫度感測器 -19 - 201239543 2 5 :聚光透鏡 26 : LED配線基板21 : UV LED 22 : LED light source 23 : Heat sink 24 : Temperature sensor -19 - 201239543 2 5 : Condenser lens 26 : LED wiring board