JP2021153184A - Component mounting line and production management system - Google Patents

Component mounting line and production management system Download PDF

Info

Publication number
JP2021153184A
JP2021153184A JP2021058876A JP2021058876A JP2021153184A JP 2021153184 A JP2021153184 A JP 2021153184A JP 2021058876 A JP2021058876 A JP 2021058876A JP 2021058876 A JP2021058876 A JP 2021058876A JP 2021153184 A JP2021153184 A JP 2021153184A
Authority
JP
Japan
Prior art keywords
component
mounting
image
state
machine
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021058876A
Other languages
Japanese (ja)
Other versions
JP7093605B2 (en
JP2021153184A5 (en
Inventor
健二 杉山
Kenji Sugiyama
健二 杉山
秀一郎 鬼頭
Shuichiro Kito
秀一郎 鬼頭
博史 大池
Hiroshi Oike
博史 大池
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Corp
Original Assignee
Fuji Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Corp filed Critical Fuji Corp
Priority to JP2021058876A priority Critical patent/JP7093605B2/en
Publication of JP2021153184A publication Critical patent/JP2021153184A/en
Publication of JP2021153184A5 publication Critical patent/JP2021153184A5/ja
Application granted granted Critical
Publication of JP7093605B2 publication Critical patent/JP7093605B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Supply And Installment Of Electrical Components (AREA)
  • General Factory Administration (AREA)

Abstract

To facilitate an inspection work when a mounting defect occurs.SOLUTION: A component mounting machine 12 captures a suction state of a component sucked by a suction nozzle with a component imaging camera 18 to recognize an image of the suction state of the component, associates the image of the suction state of the component with production information on the component, and stores the image and the production information in storage devices 20 and 33. An inspection machine 14 captures the mounting state of each component of a substrate 11 carried out from the component mounting machine 12 with an inspection camera 28 to recognize an image of the mounting state of each component, and inspects presence or absence of a mounting defect of each component on the basis of a recognition result. Then, when any component is determined to be defective in mounting by the inspection machine 14, the image obtained by capturing the suction state of the component determined to be defective in mounting among the stored images of the storage devices 20 and 33 on the basis of inspection information and the production information related to the component is searched for, and the image of the mounting state of the component determined to be defective in mounting and the image of the suction state of the searched component are compared and displayed on any of display monitors 25 to 27.SELECTED DRAWING: Figure 1

Description

本明細書は、部品実装機と検査機とを備えた部品実装ラインの生産管理システムに関する技術を開示したものである。 This specification discloses a technique relating to a production control system of a component mounting line including a component mounting machine and an inspection machine.

部品実装基板を生産する部品実装ラインでは、特許文献１（国際公開ＷＯ２０１４／０６８６６４号公報）に記載されているように、複数台の部品実装機を配列した部品実装ラインの途中や最下流に、各部品実装機で基板に実装した部品の実装状態（部品の実装位置のずれや欠品）を検査する検査機を配置するようにしている。一般に、検査機は、部品実装機から搬出された基板の各部品の実装状態を検査用カメラで撮像してその画像を処理して各部品の実装状態を認識し、その認識結果に基づいて各部品の実装不良の有無（検査合格／不合格）を検査するようにしている。 In the component mounting line that produces the component mounting board, as described in Patent Document 1 (International Publication WO2014 / 068664), in the middle or the most downstream of the component mounting line in which a plurality of component mounting machines are arranged, Each component mounting machine is equipped with an inspection machine that inspects the mounting state of the components mounted on the board (misalignment of component mounting position or missing parts). Generally, the inspection machine captures the mounting state of each component of the board carried out from the component mounting machine with an inspection camera, processes the image, recognizes the mounting state of each component, and based on the recognition result, each We try to inspect the parts for mounting defects (pass / fail inspection).

一方、部品実装機は、吸着ノズルに吸着した部品の吸着状態をその下方から部品撮像用カメラで撮像してその画像を処理して当該部品の吸着位置・角度のずれを計測して、その吸着位置・角度のずれを補正して基板に実装すると共に、実装不良等のエラー発生時の原因調査のために、部品撮像用カメラで撮像した部品の吸着状態の画像を当該部品に関する生産情報（当該部品を実装した部品実装機、実装時刻、実装位置、基板識別情報等のトレーサビリティ情報）と関連付けて記憶装置に保存するようにしている。 On the other hand, the component mounting machine captures the suction state of the component adsorbed on the suction nozzle from below with a component imaging camera, processes the image, measures the deviation of the suction position / angle of the component, and sucks the component. In addition to correcting the deviation of the position and angle and mounting it on the board, in order to investigate the cause when an error such as mounting failure occurs, the image of the suction state of the component captured by the component imaging camera is used as the production information about the component (the relevant). It is stored in the storage device in association with the component mounting machine on which the component is mounted, the mounting time, the mounting position, traceability information such as board identification information).

国際公開ＷＯ２０１４／０６８６６４号公報International Publication WO2014 / 0686664

検査機で基板上のいずれかの部品の実装不良が検出された場合、その原因を調査するために、作業者は、検査機で撮像した部品の実装状態の画像を検査機の表示モニタで見て、検査結果に誤認識等の問題がないか否かを確認し、検査結果に誤認識等の問題がない場合は、部品実装機側に実装不良の原因があると思われるため、部品実装機側で撮像した部品の吸着状態の画像を部品実装機の表示モニタで見て、認識結果に誤認識等の問題がないか否かを確認することが一般的に行われている。この際、部品実装機側で撮像した部品の吸着状態の画像を確認する場合には、作業者は、検査機で実装不良と判定された部品に関する検査情報（検査結果、部品種、検査時刻、実装位置、基板識別情報等）を検査機から取得して、前記記憶装置に保存されている部品の吸着状態の画像の中から、前記実装不良と判定された部品の吸着状態を撮像した画像を当該部品に関する検査情報と生産情報に基づいて選び出して、その画像を部品実装機の表示モニタに表示して、前記実装不良と判定された部品の吸着状態を確認するようにしている。 When the inspection machine detects a mounting defect of any part on the board, the operator views the image of the mounting state of the part taken by the inspection machine on the display monitor of the inspection machine in order to investigate the cause. Then, check whether there are any problems such as misrecognition in the inspection results, and if there are no problems such as misrecognition in the inspection results, it is considered that there is a cause of mounting failure on the component mounting machine side, so component mounting It is common practice to check the recognition result for problems such as erroneous recognition by viewing the image of the suction state of the parts captured on the machine side on the display monitor of the parts mounting machine. At this time, when confirming the image of the suction state of the component captured by the component mounting machine, the operator can check the inspection information (inspection result, component type, inspection time, etc.) regarding the component determined to be mounting failure by the inspection machine. The mounting position, board identification information, etc.) are acquired from the inspection machine, and from the images of the suction state of the parts stored in the storage device, an image of the suction state of the component determined to be mounting failure is captured. It is selected based on the inspection information and the production information about the component, and the image is displayed on the display monitor of the component mounting machine to confirm the suction state of the component determined to be mounting failure.

このように、検査機で基板上のいずれかの部品の実装不良が検出された場合には、作業者は、検査機側で部品の実装状態の画像を見て検査結果に誤認識等の問題がないことを確認した上で、部品実装機側で部品の吸着状態の画像を見て認識結果に誤認識等の問題がないか否かを確認する必要があり、両画像の確認作業に手間がかかる。また、検査機で基板上のいずれかの部品の実装不良が検出された場合、検査機と部品実装機のどちらかが部品の状態を誤認識している可能性があるが、部品の実装状態の画像と部品の吸着状態の画像とを別々に確認すると、検査機と部品実装機のどちらが部品の状態を誤認識しているのか分かりにくい場合がある。 In this way, when the inspection machine detects a mounting defect of any part on the board, the operator sees an image of the mounting state of the part on the inspection machine side and has a problem such as erroneous recognition in the inspection result. It is necessary to confirm that there is no problem such as erroneous recognition in the recognition result by looking at the image of the suction state of the part on the component mounting machine side, and it is troublesome to confirm both images. It takes. Also, if the inspection machine detects a mounting defect of any part on the board, there is a possibility that either the inspection machine or the part mounting machine misrecognizes the state of the part, but the mounting state of the part If you check the image of the part and the image of the suction state of the part separately, it may be difficult to understand which of the inspection machine and the part mounting machine misrecognizes the state of the part.

上記課題を解決するために、表示装置を備え、部品を基板上に実装する部品実装機と、 前記部品実装機から搬出された前記基板の各部品の実装状態を撮像して実装状態画像を取得する検査用カメラを備えた検査機と、
を備えた部品実装ラインの生産管理システムであって、
前記表示装置は、前記検査用カメラにより取得された実装状態画像を表示するようにしたものである。 In order to solve the above problems, a component mounting machine equipped with a display device and mounting components on a board and a mounting state image of each component of the board carried out from the component mounting machine are imaged to acquire a mounting state image. An inspection machine equipped with an inspection camera
It is a production control system of the component mounting line equipped with
The display device is designed to display a mounting state image acquired by the inspection camera.

或は、部品を吸着し吸着した前記部品を前記基板上に実装する吸着ノズルと、
前記吸着ノズルに吸着された前記部品の吸着状態を撮像して吸着状態画像を取得する部品撮像用カメラと、
を備えた部品実装機と、
表示装置を備え、前記部品実装機から搬出された前記基板の各部品の実装状態を検査する検査機と、
を備えた部品実装ラインの生産管理システムであって、
前記表示装置は、前記部品撮像用カメラにより取得された吸着状態画像を表示するようにしても良い。 Alternatively, a suction nozzle that sucks the component and mounts the suctioned component on the substrate,
A component imaging camera that captures the suction state of the component sucked by the suction nozzle and acquires a suction state image.
With a component mounting machine equipped with
An inspection machine equipped with a display device and inspecting the mounting state of each component of the board carried out from the component mounting machine.
It is a production control system of the component mounting line equipped with
The display device may display the suction state image acquired by the component imaging camera.

図１は一実施例における部品実装ラインの生産管理システムの構成を概略的に示すブロック図である。FIG. 1 is a block diagram schematically showing a configuration of a production control system for a component mounting line in one embodiment. 図２は部品実装機の表示モニタに表示した部品（Ａ）の吸着状態の画像を示す図である。FIG. 2 is a diagram showing an image of a suction state of the component (A) displayed on the display monitor of the component mounting machine. 図３は検査機の表示モニタに表示した部品（Ａ）の実装状態の画像を示す図である。FIG. 3 is a diagram showing an image of the mounted state of the component (A) displayed on the display monitor of the inspection machine. 図４は部品（Ａ）の吸着状態の画像と部品（Ａ）の実装状態の画像とを左右に並べて比較表示する２画像表示を示す図である。FIG. 4 is a diagram showing a two-image display in which an image of the suction state of the component (A) and an image of the mounting state of the component (A) are displayed side by side for comparison. 図５は部品（Ａ）の吸着状態の画像と部品（Ａ）の実装状態の画像とを重ねて比較表示するオーバーレイ表示を示す図である。FIG. 5 is a diagram showing an overlay display in which an image of the suction state of the component (A) and an image of the mounting state of the component (A) are superimposed and displayed for comparison. 図６は部品実装機の表示モニタに表示した部品（Ｂ）の吸着状態の画像を示す図である。FIG. 6 is a diagram showing an image of the suction state of the component (B) displayed on the display monitor of the component mounting machine. 図７は検査機の表示モニタに表示した部品（Ｂ）の実装状態の画像を示す図である。FIG. 7 is a diagram showing an image of the mounted state of the component (B) displayed on the display monitor of the inspection machine. 図８は部品（Ｂ）の吸着状態の画像と部品（Ｂ）の実装状態の画像とを左右に並べて比較表示する２画像表示を示す図である。FIG. 8 is a diagram showing a two-image display in which an image of the suction state of the component (B) and an image of the mounting state of the component (B) are displayed side by side for comparison. 図９は部品（Ｂ）の吸着状態の画像と部品（Ｂ）の実装状態の画像とを重ねて比較表示するオーバーレイ表示を示す図である。FIG. 9 is a diagram showing an overlay display in which an image of the suction state of the component (B) and an image of the mounting state of the component (B) are superimposed and displayed for comparison. 図１０は生産管理プログラムの処理の流れを示すフローチャートである。FIG. 10 is a flowchart showing a processing flow of the production control program.

以下、一実施例を図面を参照して説明する。
まず、図１に基づいて部品実装ライン１０の構成を説明する。 Hereinafter, an embodiment will be described with reference to the drawings.
First, the configuration of the component mounting line 10 will be described with reference to FIG.

部品実装ライン１０は、基板１１の搬送方向に沿って、１台又は複数台の部品実装機１２と、半田印刷機１３やフラックス塗布装置（図示せず）等の実装関連機と、基板１１に実装した各部品の実装状態の良否を検査する検査機１４とを配列して構成されている。尚、部品実装ライン１０に設置する検査機１４の台数は、１台に限定されず、複数台であっても良く、その一部の検査機が部品実装ライン１０の途中の部品実装機１２の間に設置されていても良い。 The component mounting line 10 is provided on the board 11 with one or more component mounting machines 12 and mounting related machines such as a solder printing machine 13 and a flux coating device (not shown) along the transport direction of the board 11. It is configured by arranging an inspection machine 14 for inspecting the quality of the mounted state of each mounted component. The number of inspection machines 14 installed on the component mounting line 10 is not limited to one, and may be a plurality of inspection machines, and some of the inspection machines are the component mounting machines 12 in the middle of the component mounting line 10. It may be installed between them.

部品実装ライン１０の各部品実装機１２、半田印刷機１３及び検査機１４は、ネットワーク１６を介して生産管理用コンピュータ２１と相互に通信可能に接続され、この生産管理用コンピュータ２１によって部品実装ライン１０の生産が管理される。 Each component mounting machine 12, solder printing machine 13, and inspection machine 14 of the component mounting line 10 are connected to each other via a network 16 so as to be communicable with the production control computer 21, and the component mounting line is connected by the production control computer 21. 10 productions are controlled.

また、基板１１の上面のうちの部品実装領域の外側に、基板識別情報（以下「基板ＩＤ」と表記する）を記録又は記憶した基板ＩＤ記録部３１（基板識別情報記録部）が設けられている。この基板ＩＤ記録部３１は、バーコード、２次元コード等のコードを記録したものでも良いし、電子的に記憶する電子タグ（ＲＦタグ、無線タグ、ＩＣタグ、電波タグ等とも呼ばれる）や、磁気的に記録する磁気テープ等を用いても良い。 Further, a board ID recording unit 31 (board identification information recording unit) that records or stores board identification information (hereinafter referred to as “board ID”) is provided outside the component mounting area on the upper surface of the board 11. There is. The board ID recording unit 31 may record a code such as a bar code or a two-dimensional code, or may include an electronic tag (also called an RF tag, a wireless tag, an IC tag, a radio wave tag, etc.) that is electronically stored. A magnetic tape or the like for magnetically recording may be used.

一方、部品実装ライン１０の基板搬入側には、基板ＩＤ記録部３１に記録又は記憶された基板ＩＤを読み取る基板識別情報読取り装置としてリーダ３２が設けられている。 On the other hand, on the board carry-in side of the component mounting line 10, a reader 32 is provided as a board identification information reading device for reading the board ID recorded or stored in the board ID recording unit 31.

部品実装ライン１０の生産を管理する生産管理用コンピュータ２１は、部品実装ライン１０の基板搬入側に配置したリーダ３２で、部品実装ライン１０に搬入された基板１１の基板ＩＤ記録部３１から基板ＩＤを読み取り、その基板ＩＤを各部品実装機１２と検査機１４へ送信して、搬送する基板１１の基板ＩＤを各部品実装機１２と検査機１４に知らせる。これにより、各部品実装機１２の制御装置１７と検査機１４の制御装置２３は、搬入される基板１１の順序とリーダ３２で読み取った基板ＩＤの順序を１枚目の基板１１から対応させることで、各部品実装機１２と検査機１４に搬入された基板１１の基板ＩＤを認識する。 The production management computer 21 that manages the production of the component mounting line 10 is a reader 32 arranged on the board loading side of the component mounting line 10, and is a board ID from the board ID recording unit 31 of the board 11 carried into the component mounting line 10. Is read, the board ID is transmitted to each component mounting machine 12 and the inspection machine 14, and the board ID of the board 11 to be conveyed is notified to each component mounting machine 12 and the inspection machine 14. As a result, the control device 17 of each component mounting machine 12 and the control device 23 of the inspection machine 14 make the order of the boards 11 to be carried in and the order of the board IDs read by the reader 32 correspond to each other from the first board 11. Then, the board ID of the board 11 carried into each component mounting machine 12 and the inspection machine 14 is recognized.

或は、各部品実装機１２で部品を実装した基板１１をその下流側の部品実装機１２や検査機１４へ搬送する際に、各部品実装機１２から当該基板１１の基板ＩＤを当該下流側の部品実装機１２や検査機１４へ送信することで、各部品実装機１２や検査機１４に搬入された基板１１の基板ＩＤを認識するようにしても良い。 Alternatively, when the board 11 on which the parts are mounted by each component mounting machine 12 is transported to the component mounting machine 12 or the inspection machine 14 on the downstream side thereof, the board ID of the board 11 is transferred from each component mounting machine 12 to the downstream side. By transmitting to the component mounting machine 12 and the inspection machine 14, the board ID of the board 11 carried into each component mounting machine 12 and the inspection machine 14 may be recognized.

各部品実装機１２の制御装置１７は、生産管理用コンピュータ２１から送信されてくる生産ジョブに従って、実装ヘッド（図示せず）を部品吸着位置→部品撮像位置→部品実装位置の経路で移動させて、フィーダ１９から供給される部品を実装ヘッドの吸着ノズル（図示せず）に吸着して当該部品を部品撮像用カメラ１８で撮像して、その撮像画像を制御装置１７の画像処理機能によって処理して当該部品の吸着状態（位置Ｘ，Ｙと角度θ）を認識し、当該部品の位置Ｘ，Ｙや角度θのずれを補正して当該部品を基板１１に実装するという動作を繰り返して、当該基板１１に所定数の部品を実装する。 The control device 17 of each component mounting machine 12 moves the mounting head (not shown) in the route of component suction position → component imaging position → component mounting position according to the production job transmitted from the production management computer 21. , The component supplied from the feeder 19 is attracted to the suction nozzle (not shown) of the mounting head, the component is imaged by the component imaging camera 18, and the captured image is processed by the image processing function of the control device 17. The operation of recognizing the suction state (positions X and Y and the angle θ) of the component, correcting the deviation of the positions X and Y and the angle θ of the component, and mounting the component on the substrate 11 is repeated. A predetermined number of components are mounted on the board 11.

更に、各部品実装機１２の制御装置１７は、部品撮像用カメラ１８で撮像した部品の吸着状態の画像を、当該部品に関する生産情報（当該部品を実装した部品実装機１２、部品種、実装時刻、実装位置、基板ＩＤ等のトレーサビリティ情報）と関連付けて記憶装置２０に保存する。この記憶装置２０は、部品実装機１２の異常発生時の原因調査に必要な数の画像を保存できる記憶容量を持ち、電源オフ状態でも記憶データを保持する書き換え可能な不揮発性の記憶媒体（例えばハードディスク装置等）によって構成されている。この記憶装置２０の保存画像数は、予め決められた所定数又は所定メモリ容量を超えると、最古の保存画像が自動削除されて、最新の画像が保存される。 Further, the control device 17 of each component mounting machine 12 displays an image of the suction state of the component captured by the component imaging camera 18 as production information about the component (component mounting machine 12 on which the component is mounted, component type, mounting time). , Mounting position, traceability information such as board ID), and stored in the storage device 20. The storage device 20 has a storage capacity capable of storing a number of images necessary for investigating the cause when an abnormality occurs in the component mounting machine 12, and is a rewritable non-volatile storage medium (for example,) that retains the storage data even when the power is off. It is composed of a hard disk device, etc.). When the number of stored images in the storage device 20 exceeds a predetermined number or a predetermined memory capacity, the oldest stored image is automatically deleted and the latest image is stored.

尚、部品実装機１２の制御装置１７から、部品撮像用カメラ１８で撮像した部品の吸着状態の画像を当該部品に関する生産情報と関連付けて生産管理用コンピュータ２１へ送信して、これらのデータを生産管理用コンピュータ２１の記憶装置３３に部品実装機１２毎に分類して保存するようにしても良い。或は、部品実装ライン１０のネットワーク１６に接続した画像保存用サーバ等の外部ストレージ（図示せず）に、部品の吸着状態の画像を当該部品に関する生産情報と関連付けて部品実装機１２毎に分類して保存するようにしても良い。 The control device 17 of the component mounting machine 12 transmits an image of the suction state of the component captured by the component imaging camera 18 to the production management computer 21 in association with the production information related to the component, and produces these data. The storage device 33 of the management computer 21 may be used to classify and store each component mounting machine 12. Alternatively, in an external storage (not shown) such as an image storage server connected to the network 16 of the component mounting line 10, an image of the suction state of the component is associated with the production information related to the component and classified by the component mounting machine 12. You may save it.

部品実装ライン１０の各部品実装機１２を順番に通過して生産された部品実装基板は、検査機１４に搬入される。この検査機１４の制御装置２３は、画像処理機能を搭載し、搬入された基板１１の各部品の実装状態を検査用カメラ２８で撮像して、その撮像画像を処理して、基板１１上の各部品の実装状態を認識してその認識結果に基づいて各部品の実装不良（検査不合格）の有無を検査する。 The component mounting board produced by sequentially passing through each component mounting machine 12 of the component mounting line 10 is carried into the inspection machine 14. The control device 23 of the inspection machine 14 is equipped with an image processing function, captures the mounting state of each component of the carried-in board 11 with the inspection camera 28, processes the captured image, and processes the captured image on the board 11. The mounting state of each component is recognized, and based on the recognition result, the presence or absence of mounting defects (inspection failure) of each component is inspected.

更に、検査機１４の制御装置２３は、検査用カメラ２８で撮像した部品の実装状態の画像を、当該部品に関する検査情報（部品種、検査時刻、実装位置、基板ＩＤ等）と関連付けて記憶装置２４（検査情報記憶部）に保存する。この記憶装置２４は、部品実装機１２の異常発生時の原因調査に必要な数の画像を保存できる記憶容量を持ち、電源オフ状態でも記憶データを保持する書き換え可能な不揮発性の記憶媒体（例えばハードディスク装置等）によって構成されている。この記憶装置２４の保存画像数は、予め決められた所定数又は所定メモリ容量を超えると、最古の保存画像が自動削除されて、最新の画像が保存される。 Further, the control device 23 of the inspection machine 14 associates the image of the mounting state of the component captured by the inspection camera 28 with the inspection information (part type, inspection time, mounting position, board ID, etc.) related to the component and stores the image. It is stored in 24 (inspection information storage unit). The storage device 24 has a storage capacity capable of storing a number of images necessary for investigating the cause when an abnormality occurs in the component mounting machine 12, and is a rewritable non-volatile storage medium (for example,) that retains the storage data even when the power is off. It is composed of a hard disk device, etc.). When the number of stored images in the storage device 24 exceeds a predetermined number or a predetermined memory capacity, the oldest stored image is automatically deleted and the latest image is stored.

尚、検査機１４の制御装置２３から、検査した部品の実装状態の画像を当該部品に関する検査情報と関連付けて生産管理用コンピュータ２１へ送信して、これらのデータを生産管理用コンピュータ２１の記憶装置３３に保存するようにしても良い。或は、部品実装ライン１０のネットワーク１６に接続された画像保存用サーバ等の外部ストレージ（図示せず）に、部品の実装状態の画像を当該部品に関する検査情報と関連付けて保存するようにしても良い。 The control device 23 of the inspection machine 14 transmits an image of the mounted state of the inspected component to the production control computer 21 in association with the inspection information related to the component, and stores these data in the storage device of the production control computer 21. It may be saved in 33. Alternatively, the image of the mounting state of the component may be saved in association with the inspection information related to the component in an external storage (not shown) such as an image storage server connected to the network 16 of the component mounting line 10. good.

各部品実装機１２には、それぞれ表示モニタ２５（表示装置）が設けられ、検査機１４にも表示モニタ２６（表示装置）が設けられている。また、生産管理用コンピュータ２１にも表示モニタ２７（表示装置）が設けられている。 Each component mounting machine 12 is provided with a display monitor 25 (display device), and the inspection machine 14 is also provided with a display monitor 26 (display device). The production control computer 21 is also provided with a display monitor 27 (display device).

各部品実装機１２の制御装置１７は、部品撮像用カメラ１８で撮像した部品の吸着状態の画像を、当該部品に関する生産情報（当該部品を実装した部品実装機１２、部品種、実装時刻、実装位置、基板ＩＤ等のトレーサビリティ情報）と関連付けて記憶装置２０に保存する際に、当該部品に関する生産情報を生産管理用コンピュータ２１及び／又は検査機１４に送信する。また、検査機１４の制御装置２３は、検査機１４で基板１１上のいずれかの部品の実装不良を検出したときに、当該部品に関する検査情報（検査結果、部品種、検査時刻、実装位置、基板ＩＤ等）を生産管理用コンピュータ２１に送信する。これにより、生産管理用コンピュータ２１は、検査機１４から受信した検査情報を各部品実装機１２から受信した生産情報と照合することで、実装不良と判定された部品を実装した部品実装機１２を特定して、特定した部品実装機１２の記憶装置２０の保存画像の中から前記実装不良と判定された部品の吸着状態を撮像した画像を検索して取得するようになっている。同様に、検査機１４の制御装置２３も、実装不良と判定された部品に関する検査情報を各部品実装機１２から受信した生産情報と照合することで、実装不良と判定された部品を実装した部品実装機１２を特定して、特定した部品実装機１２の記憶装置２０の保存画像の中から前記実装不良と判定された部品の吸着状態を撮像した画像を検索して取得するようにしても良い。 The control device 17 of each component mounting machine 12 uses the image of the suction state of the component captured by the component imaging camera 18 as the production information about the component (component mounting machine 12 on which the component is mounted, component type, mounting time, mounting). When the traceability information such as the position and the board ID) is stored in the storage device 20, the production information related to the parts is transmitted to the production management computer 21 and / or the inspection machine 14. Further, when the control device 23 of the inspection machine 14 detects a mounting defect of any part on the substrate 11 by the inspection machine 14, inspection information (inspection result, part type, inspection time, mounting position, etc.) regarding the part is used. The board ID, etc.) is transmitted to the production control computer 21. As a result, the production management computer 21 collates the inspection information received from the inspection machine 14 with the production information received from each component mounting machine 12, so that the component mounting machine 12 on which the component determined to be mounting defect is mounted is mounted. From the stored images of the storage device 20 of the specified component mounting machine 12, an image of the suction state of the component determined to be mounting failure is searched for and acquired. Similarly, the control device 23 of the inspection machine 14 also collates the inspection information regarding the parts determined to be mounting defects with the production information received from each component mounting machine 12, and thereby the parts on which the parts determined to be mounting defects are mounted. The mounting machine 12 may be specified, and an image of the suction state of the component determined to be mounting failure may be searched and acquired from the stored images of the storage device 20 of the specified component mounting machine 12. ..

生産管理用コンピュータ２１又は検査機１４の制御装置２３は、後述する図１０の生産管理プログラムを実行することで、検査機１４が基板１１上のいずれかの部品の実装不良を検出したときに、実装不良と判定された部品に関する検査情報を、各部品実装機１２から受信した生産情報と照合することで、実装不良と判定された部品を実装した部品実装機１２を特定して、特定した部品実装機１２の記憶装置２０の保存画像の中から前記実装不良と判定された部品の吸着状態を撮像した画像を検索する「画像検索部」として機能し、実装不良と判定された部品の実装状態の画像と検索した当該部品の吸着状態の画像とを生産管理用コンピュータ２１の表示モニタ２７又は検査機１４の表示モニタ２６に比較表示する。或は、実装不良と判定された部品を実装した部品実装機１２の表示モニタ２５に両画像を比較表示するようにしても良い。 When the inspection machine 14 detects a mounting defect of any component on the substrate 11 by executing the production control program of FIG. 10 described later, the production control computer 21 or the control device 23 of the inspection machine 14 By collating the inspection information about the parts determined to be mounting defects with the production information received from each component mounting machine 12, the component mounting machine 12 on which the components determined to be mounting defects are mounted is specified, and the specified components are identified. It functions as an "image search unit" that searches for an image of the adsorption state of the component determined to be mounting defect from the stored images of the storage device 20 of the mounting machine 12, and the mounting state of the component determined to be mounting defect. The image of the above and the searched image of the suction state of the component are compared and displayed on the display monitor 27 of the production control computer 21 or the display monitor 26 of the inspection machine 14. Alternatively, both images may be compared and displayed on the display monitor 25 of the component mounting machine 12 on which the component determined to be defective is mounted.

本実施例では、記憶装置２０に保存する部品の吸着状態の画像のデータには、画像処理の認識結果が含められ、表示モニタ２５〜２７のいずれかに表示する部品の吸着状態の画像には、図２、図４〜図６、図８、図９に示すように、画像処理で認識した部品の輪郭線（外形線）を表示するようにしている。このように、部品の吸着状態の画像に、画像処理で認識した部品の輪郭線を表示すれば、部品実装機１２の画像処理の認識結果が誤認識であるか否かを作業者が容易に判断することができる。尚、図２〜図５は、同じ部品（Ａ）の画像の表示例であり、図６〜図９は、同じ部品（Ｂ）の画像の表示例である。 In this embodiment, the image data of the suction state of the component stored in the storage device 20 includes the recognition result of the image processing, and the image of the suction state of the component displayed on any of the display monitors 25 to 27 includes the image of the suction state of the component. As shown in FIGS. 2, 4 to 6, 8 and 9, the contour lines (outer lines) of the parts recognized by the image processing are displayed. By displaying the outline of the component recognized by the image processing on the image of the suction state of the component in this way, the operator can easily determine whether or not the recognition result of the image processing of the component mounting machine 12 is erroneous recognition. You can judge. 2 to 5 are display examples of images of the same component (A), and FIGS. 6 to 9 are display examples of images of the same component (B).

また、表示モニタ２５〜２７のいずれかに表示する部品の実装状態の画像には、図３〜図５、図７〜図９に示すように、正しい実装状態の部品の輪郭線を表示するようにしている。このようにすれば、部品の実装状態の画像に表示した正しい実装状態の部品の輪郭線によって、検査機１４の検査結果が誤認識であるか否かを作業者が容易に判断することができる。 Further, as shown in FIGS. 3 to 5 and 7 to 9, the contour line of the component in the correct mounted state is displayed on the image of the mounted state of the component displayed on any of the display monitors 25 to 27. I have to. In this way, the operator can easily determine whether or not the inspection result of the inspection machine 14 is erroneous recognition based on the contour line of the component in the correct mounting state displayed in the image of the mounting state of the component. ..

更に、表示モニタ２５〜２７のいずれかに比較表示する部品の吸着状態の画像と部品の実装状態の画像は、部品表示倍率（部品の表示サイズ）を一致させて比較表示するようにしている。 Further, the image of the suction state of the component and the image of the mounting state of the component to be comparatively displayed on any of the display monitors 25 to 27 are compared and displayed by matching the component display magnification (display size of the component).

ここで、両画像の比較表示の態様としては、図４、図８に示すように、部品の実装状態の画像と部品の吸着状態の画像とを左右又は上下に並べて比較表示するようにしても良いし、或は、図５、図９に示すように、部品の実装状態の画像と部品の吸着状態の画像とを重ねて比較表示するようにしても良い。 Here, as a mode of comparative display of both images, as shown in FIGS. 4 and 8, even if the image of the mounted state of the component and the image of the suction state of the component are displayed side by side side by side or vertically. Alternatively, as shown in FIGS. 5 and 9, the image of the mounting state of the component and the image of the suction state of the component may be superimposed and displayed for comparison.

更に、本実施例では、部品の実装状態の画像と部品の吸着状態の画像とを左右又は上下に並べて比較表示する２画像表示と、部品の実装状態の画像と部品の吸着状態の画像とを重ねて比較表示するオーバーレイ表示とを作業者が切り換えることができるように構成されている。 Further, in this embodiment, a two-image display in which an image of a component mounting state and an image of a component suction state are arranged side by side or vertically for comparison and display, and an image of the component mounting state and an image of the component suction state are displayed. It is configured so that the operator can switch between the overlay display and the overlay display for overlapping comparison display.

ところで、部品実装機１２の部品撮像用カメラ１８は、吸着ノズルに吸着した部品の吸着状態をその下方から撮像するため、部品撮像用カメラ１８で撮像した部品の吸着状態の画像は、部品の下面側から見た画像となる（図２、図６参照）。一方、検査機１４の検査用カメラ２８は、基板１１の各部品の実装状態をその上方から撮像するため、検査用カメラ２８で撮像した部品の実装状態の画像は、部品の上面側から見た画像となる（図３、図７参照）。そのため、部品の実装状態の画像と部品の吸着状態の画像は、ＸＹ方向が異なる。 By the way, since the component imaging camera 18 of the component mounting machine 12 captures the suction state of the component sucked on the suction nozzle from below, the image of the component suction state captured by the component imaging camera 18 is the lower surface of the component. The image is viewed from the side (see FIGS. 2 and 6). On the other hand, since the inspection camera 28 of the inspection machine 14 captures the mounting state of each component of the substrate 11 from above, the image of the mounting state of the component captured by the inspection camera 28 is viewed from the upper surface side of the component. It becomes an image (see FIGS. 3 and 7). Therefore, the image of the mounted state of the component and the image of the suction state of the component have different XY directions.

そこで、本実施例では、図４、図５に示すように、部品実装機１２のＸＹ座標系を基準にして部品の実装状態の画像のＸＹ方向と部品の吸着状態の画像のＸＹ方向とを一致させるようにどちらか片方の画像を表裏反転及び回転させて両画像を比較表示するようにしている。図４、図５の表示例では、部品の吸着状態の画像を表裏反転させている。 Therefore, in this embodiment, as shown in FIGS. 4 and 5, the XY direction of the image of the component mounting state and the XY direction of the image of the component suction state are set with reference to the XY coordinate system of the component mounting machine 12. One of the images is flipped and rotated so that the two images are compared and displayed. In the display examples of FIGS. 4 and 5, the images of the suction state of the parts are inverted.

一般に、部品実装機１２は、部品の吸着状態の画像を処理して認識した当該部品の認識角度と当該部品の正しい実装角度とが異なる場合には、両者の角度差分だけ吸着ノズルに吸着した部品の角度を回転補正して基板１１に実装するようにしている。 In general, when the recognition angle of the component recognized by processing the image of the suction state of the component and the correct mounting angle of the component are different, the component mounting machine 12 attracts the component to the suction nozzle by the difference between the angles. The angle of is corrected by rotation and mounted on the substrate 11.

この点を考慮して、本実施例では、部品の吸着状態の画像を処理して認識した当該部品の認識角度と当該部品の正しい実装角度とが異なる場合には、図８、図９に示すように、部品の実装状態の画像中の部品の正しい実装角度と部品の吸着状態の画像中の部品の認識角度とを一致させるようにどちらか片方の画像を表裏反転及び回転させて両画像を比較表示するようにしている。このようにすれば、吸着ノズルに吸着した部品の角度を回転補正して基板１１に実装した場合でも、両画像の比較が一層容易になる。図８、図９の表示例では、部品の吸着状態の画像を表裏反転させている。 In consideration of this point, in this embodiment, when the recognition angle of the component recognized by processing the image of the suction state of the component is different from the correct mounting angle of the component, it is shown in FIGS. 8 and 9. In this way, either image is flipped and rotated so that the correct mounting angle of the component in the image of the mounted state of the component and the recognition angle of the component in the image of the suction state of the component match. It is designed to be compared and displayed. In this way, even when the angle of the component sucked on the suction nozzle is rotationally corrected and mounted on the substrate 11, it becomes easier to compare both images. In the display examples of FIGS. 8 and 9, the images of the suction state of the parts are inverted.

更に、本実施例では、生産管理用コンピュータ２１の記憶装置３３又は検査機１４の記憶装置２４等に保存された部品の実装状態の画像の中から表示モニタ２５〜２７のいずれかに表示する部品の実装状態の画像を作業者が選択できるように構成され、生産管理用コンピュータ２１又は検査機１４の制御装置２３又は部品実装機１２の制御装置１７は、作業者が表示モニタ２５〜２７のいずれかに表示する部品の実装状態の画像を選択したときに当該部品に関する前記検査情報と前記生産情報に基づいて記憶装置２０又は３３等の保存画像の中から作業者が選択した部品の吸着状態を撮像した画像を検索し、作業者が選択した部品の実装状態の画像と検索した当該部品の吸着状態の画像とを表示モニタ２５〜２７のいずれかに比較表示するようにしている。このようにすれば、表示モニタ２５〜２７のいずれかに表示する画像を作業者が自由に選択することができ、実装不良の原因をより詳しく調査することができる。 Further, in this embodiment, a component to be displayed on any of the display monitors 25 to 27 from the image of the mounted state of the component stored in the storage device 33 of the production control computer 21 or the storage device 24 of the inspection machine 14. The image of the mounting state of the above is configured so that the worker can select the image of the mounting state, and the control device 23 of the production management computer 21 or the inspection machine 14 or the control device 17 of the component mounting machine 12 can be selected by the worker from any of the display monitors 25 to 27. When the image of the mounted state of the component to be displayed is selected, the suction state of the component selected by the operator from the stored images of the storage device 20 or 33 based on the inspection information and the production information regarding the component is displayed. The captured image is searched, and the image of the mounted state of the component selected by the operator and the searched image of the suction state of the component are compared and displayed on any of the display monitors 25 to 27. In this way, the operator can freely select the image to be displayed on any of the display monitors 25 to 27, and the cause of the mounting defect can be investigated in more detail.

次に、生産管理用コンピュータ２１又は検査機１４の制御装置２３が実行する図１０の生産管理プログラムの処理内容を説明する。図１０の生産管理プログラムは、生産中に実行される。本プログラムが起動されると、まず、ステップ１０１で、検査機１４が基板１１上のいずれかの部品の実装不良を検出したか否かを判定し、いずれかの部品の実装不良が検出されるまで待機する。その後、いずれかの部品の実装不良が検出された時点で、ステップ１０２に進み、実装不良と判定された部品に関する検査情報を取得する。 Next, the processing contents of the production control program of FIG. 10 executed by the production control computer 21 or the control device 23 of the inspection machine 14 will be described. The production control program of FIG. 10 is executed during production. When this program is started, first, in step 101, it is determined whether or not the inspection machine 14 has detected a mounting defect of any component on the substrate 11, and a mounting defect of any component is detected. Wait until. After that, when a mounting defect of any of the components is detected, the process proceeds to step 102 to acquire inspection information regarding the component determined to be a mounting defect.

この後、ステップ１０３に進み、実装不良と判定された部品に関する検査情報を、各部品実装機１２から受信した生産情報と照合することで、実装不良と判定された部品を実装した部品実装機１２を特定する。そして、次のステップ１０４で、特定した部品実装機１２の記憶装置２０等の保存画像の中から前記実装不良と判定された部品の吸着状態を撮像した画像を検索する。これらステップ１０２〜１０４の処理が「画像検索部」としての役割を果たす。 After that, the process proceeds to step 103, and the inspection information regarding the parts determined to be mounting defects is collated with the production information received from each component mounting machine 12, so that the component mounting machine 12 on which the components determined to be mounting defects are mounted is collated. To identify. Then, in the next step 104, the image obtained by capturing the suction state of the component determined to be mounting defect is searched from the stored images of the storage device 20 and the like of the specified component mounting machine 12. The processes of steps 102 to 104 serve as an "image search unit".

この後、ステップ１０５に進み、図４、図５に示すように、部品実装機１２のＸＹ座標系を基準にして部品の実装状態の画像のＸＹ方向と部品の吸着状態の画像のＸＹ方向とを一致させるように、どちらか片方の画像、例えば、部品の吸着状態の画像を表裏反転及び回転させる。この際、部品の吸着状態の画像を処理して認識した当該部品の認識角度と当該部品の正しい実装角度とが異なる場合には、図８、図９に示すように、部品の実装状態の画像中の部品の正しい実装角度と部品の吸着状態の画像中の部品の認識角度とを一致させるように、どちらか片方の画像、例えば、部品の吸着状態の画像を表裏反転及び回転させる。 After that, the process proceeds to step 105, and as shown in FIGS. 4 and 5, the XY direction of the image of the component mounting state and the XY direction of the image of the component suction state with reference to the XY coordinate system of the component mounting machine 12. One of the images, for example, the image of the suction state of the component, is flipped and rotated so as to match. At this time, if the recognition angle of the component recognized by processing the image of the suction state of the component is different from the correct mounting angle of the component, as shown in FIGS. One of the images, for example, the image of the suction state of the component, is flipped and rotated so that the correct mounting angle of the component inside and the recognition angle of the component in the image of the suction state of the component match.

そして、次のステップ１０６で、実装不良と判定された部品の実装状態の画像と部品の吸着状態の画像とを生産管理用コンピュータ２１の表示モニタ２７又は検査機１４の表示モニタ２６に比較表示する。或は、実装不良と判定された部品を実装した部品実装機１２の表示モニタ２５に両画像を比較表示するようにしても良い。この比較表示は、図４、図８に示すように、部品の実装状態の画像と部品の吸着状態の画像とを左右又は上下に並べて比較表示する２画像表示、又は、図５、図９に示すように、部品の実装状態の画像と部品の吸着状態の画像とを重ねて比較表示するオーバーレイ表示のいずれであっても良い。 Then, in the next step 106, the image of the mounting state of the component determined to be improperly mounted and the image of the suction state of the component are compared and displayed on the display monitor 27 of the production control computer 21 or the display monitor 26 of the inspection machine 14. .. Alternatively, both images may be compared and displayed on the display monitor 25 of the component mounting machine 12 on which the component determined to be defective is mounted. As shown in FIGS. 4 and 8, the comparative display is a two-image display in which an image of the mounted state of the component and an image of the suction state of the component are displayed side by side side by side or vertically, or in FIGS. 5 and 9. As shown, any of the overlay display in which the image of the mounted state of the component and the image of the suction state of the component are superimposed and compared and displayed may be used.

以上説明した本実施例によれば、検査機１４で基板１１上のいずれかの部品が実装不良と判定されたときに、当該部品に関する生産情報に基づいて記憶装置２０又は３３等の保存画像の中から前記実装不良と判定された部品の吸着状態を撮像した画像を検索して、前記検査機１４で実装不良と判定された部品の実装状態の画像と検索した当該部品の吸着状態の画像とを表示モニタ２５〜２７のいずれかに比較表示するようにしたので、検査機１４で基板１１上のいずれかの部品が実装不良と判定されたときに、実装不良と判定された部品の吸着状態の画像を多数の保存画像の中から選び出す作業を作業者が行わずに済むと共に、実装不良と判定された部品の実装状態の画像と当該部品の吸着状態の画像とを表示モニタ２５〜２７のいずれかに自動的に比較表示できて、これら２つの画像の比較表示を作業者が見ることで、検査機１４の検査結果の確認と部品実装機１２の認識結果の確認とを能率良く行うことができる。 According to the present embodiment described above, when any part on the substrate 11 is determined to be improperly mounted by the inspection machine 14, the stored image of the storage device 20 or 33 or the like is stored based on the production information about the part. An image of the suction state of the component determined to be mounting defect is searched from among them, and an image of the mounting state of the component determined to be mounting failure by the inspection machine 14 and an image of the suction state of the searched component are obtained. Is displayed in comparison with any of the display monitors 25 to 27. Therefore, when any component on the substrate 11 is determined to be defective in mounting by the inspection machine 14, the suction state of the component determined to be defective in mounting is displayed. It is not necessary for the operator to select the image of The comparison display can be automatically performed on either of them, and the operator can efficiently check the inspection result of the inspection machine 14 and the recognition result of the component mounting machine 12 by viewing the comparison display of these two images. Can be done.

しかも、検査機１４と部品実装機１２のどちらかが部品の状態を誤認識している場合に、実装不良と判定された部品の実装状態の画像と当該部品の吸着状態の画像とを比較表示することで、検査機１４と部品実装機１２のどちらが部品の状態を誤認識しているかが分かりやすくなる利点もある。 Moreover, when either the inspection machine 14 or the component mounting machine 12 misrecognizes the state of the component, the image of the mounted state of the component determined to be mounting failure and the image of the suction state of the component are compared and displayed. By doing so, there is an advantage that it becomes easy to understand which of the inspection machine 14 and the component mounting machine 12 misrecognizes the state of the component.

尚、本発明は、上記実施例に限定されず、例えば、部品実装ライン１０の構成を変更しても良い等、要旨を逸脱しない範囲内で種々変更して実施できることは言うまでもない。 Needless to say, the present invention is not limited to the above embodiment, and can be variously modified without departing from the gist, for example, the configuration of the component mounting line 10 may be modified.

１０…部品実装ライン、１１…基板、１２…部品実装機、１４…検査機、１７…部品実装機の制御装置、１８…部品撮像用カメラ、２０…記憶装置、２１…生産管理用コンピュータ（画像検索部）、２３…検査機の制御装置（画像検索部）、２４…記憶装置、２５〜２７…表示モニタ（表示装置）、２８…検査用カメラ、３１…基板ＩＤ記録部（基板識別情報記録部）、３２…リーダ（基板識別情報読取り装置）、３３…記憶装置 10 ... Parts mounting line, 11 ... Board, 12 ... Parts mounting machine, 14 ... Inspection machine, 17 ... Parts mounting machine control device, 18 ... Parts imaging camera, 20 ... Storage device, 21 ... Production management computer (image) Search unit), 23 ... Inspection machine control device (image search unit), 24 ... Storage device, 25-27 ... Display monitor (display device), 28 ... Inspection camera, 31 ... Board ID recording unit (board identification information recording) Part), 32 ... Reader (board identification information reader), 33 ... Storage device

Claims (2)

表示装置を備え、部品を基板上に実装する部品実装機と、
前記部品実装機から搬出された前記基板の各部品の実装状態を撮像して実装状態画像を取得する検査用カメラを備えた検査機と、
を備えた部品実装ラインの生産管理システムであって、
前記表示装置は、前記検査用カメラにより取得された実装状態画像を表示する、生産管理システム。 A component mounting machine equipped with a display device and mounting components on a board,
An inspection machine equipped with an inspection camera that captures the mounting state of each component of the board carried out from the component mounting machine and acquires a mounting state image.
It is a production control system of the component mounting line equipped with
The display device is a production control system that displays a mounting state image acquired by the inspection camera. 部品を吸着し吸着した前記部品を前記基板上に実装する吸着ノズルと、
前記吸着ノズルに吸着された前記部品の吸着状態を撮像して吸着状態画像を取得する部品撮像用カメラと、
を備えた部品実装機と、
表示装置を備え、前記部品実装機から搬出された前記基板の各部品の実装状態を検査する検査機と、
を備えた部品実装ラインの生産管理システムであって、
前記表示装置は、前記部品撮像用カメラにより取得された吸着状態画像を表示する、生産管理システム。 A suction nozzle that sucks the parts and mounts the sucked parts on the substrate,
A component imaging camera that captures the suction state of the component sucked by the suction nozzle and acquires a suction state image.
With a component mounting machine equipped with
An inspection machine equipped with a display device and inspecting the mounting state of each component of the board carried out from the component mounting machine.
It is a production control system of the component mounting line equipped with
The display device is a production control system that displays a suction state image acquired by the component imaging camera.
JP2021058876A 2020-06-19 2021-03-30 Production control system for component mounting line Active JP7093605B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2021058876A JP7093605B2 (en) 2020-06-19 2021-03-30 Production control system for component mounting line

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020106520A JP6991277B2 (en) 2020-06-19 2020-06-19 Production control method and production control system
JP2021058876A JP7093605B2 (en) 2020-06-19 2021-03-30 Production control system for component mounting line

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2020106520A Division JP6991277B2 (en) 2020-06-19 2020-06-19 Production control method and production control system

Publications (3)

Publication Number Publication Date
JP2021153184A true JP2021153184A (en) 2021-09-30
JP2021153184A5 JP2021153184A5 (en) 2021-12-16
JP7093605B2 JP7093605B2 (en) 2022-06-30

Family

ID=72831749

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2020106520A Active JP6991277B2 (en) 2020-06-19 2020-06-19 Production control method and production control system
JP2021058876A Active JP7093605B2 (en) 2020-06-19 2021-03-30 Production control system for component mounting line

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2020106520A Active JP6991277B2 (en) 2020-06-19 2020-06-19 Production control method and production control system

Country Status (1)

Country Link
JP (2) JP6991277B2 (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339244A (en) * 2005-05-31 2006-12-14 Yamaha Motor Co Ltd Mounting line
JP2007081080A (en) * 2005-09-14 2007-03-29 Omron Corp Substrate inspection system
JP2012099792A (en) * 2010-11-02 2012-05-24 Samsung Techwin Co Ltd Component suction/inspection device and method

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5238730B2 (en) * 2010-01-19 2013-07-17 パナソニック株式会社 Component mounting machine, component detection apparatus, and component mounting method
JP6154120B2 (en) * 2012-12-03 2017-06-28 Juki株式会社 Management system
WO2016117016A1 (en) * 2015-01-20 2016-07-28 富士機械製造株式会社 Inspection support device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006339244A (en) * 2005-05-31 2006-12-14 Yamaha Motor Co Ltd Mounting line
JP2007081080A (en) * 2005-09-14 2007-03-29 Omron Corp Substrate inspection system
JP2012099792A (en) * 2010-11-02 2012-05-24 Samsung Techwin Co Ltd Component suction/inspection device and method

Also Published As

Publication number Publication date
JP2020174184A (en) 2020-10-22
JP6991277B2 (en) 2022-01-12
JP7093605B2 (en) 2022-06-30

Similar Documents

Publication Publication Date Title
JP6725686B2 (en) Production control system for component mounting line
US8849442B2 (en) Component mounting line and component mounting method
JP6108413B2 (en) Production monitoring system for component mounting lines
JPWO2015001599A1 (en) Feeder adjustment device
JP2012209300A (en) Production management apparatus and production management method for component mounting line
JP2022000926A (en) Trace method
US20080243438A1 (en) Maintenance information managing apparatus for component mounting machine
JP6427757B2 (en) Collation method and collation system for component exposure mechanism
JP2008021946A (en) Packaging machine
JP6991277B2 (en) Production control method and production control system
JP2006013120A (en) Defect cause investigating system
JP2012151231A (en) Recovery component selection support device and component mounting device
JP4520324B2 (en) Inspection result notification device and mounting system
JP4735613B2 (en) Electronic component mounting system and electronic component mounting method
JP5096787B2 (en) Work support system, work management system, and work management method
CN101595772B (en) Identification of electronic components by means of different component descriptions
US20230217637A1 (en) Component mounting system
JP2008277527A (en) Method and apparatus for inspecting mounted component, and method and apparatus for creating mounting substrate image data
JP4148365B2 (en) Printed circuit board inspection equipment
JP6975880B2 (en) Parts mounting device and parts mounting method
JP7142463B2 (en) Production system, mounting equipment, production method
JP4984819B2 (en) Board shipping box identification system
JP2007292488A (en) Visual inspection device and inspection method of printed wiring board using the same
JP2015225906A (en) Mounting pwb manufacturing system
JP2015225907A (en) Mounting pwb manufacturing system

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20210330

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211105

A871 Explanation of circumstances concerning accelerated examination

Free format text: JAPANESE INTERMEDIATE CODE: A871

Effective date: 20211105

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20211202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220126

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220204

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20220315

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220523

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20220523

C876 Explanation why request for accelerated appeal examination is justified

Free format text: JAPANESE INTERMEDIATE CODE: C876

Effective date: 20220523

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20220530

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20220531

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20220617

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20220617

R150 Certificate of patent or registration of utility model

Ref document number: 7093605

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150