JP4148365B2 - Printed circuit board inspection equipment - Google Patents

Description

The present invention relates to a manufacturing process of the printed circuit board, in particular, it belongs to technical fields including a useful test equipment in the case or to an inspection.

  Conventionally, there is a technique for attaching a barcode to a printed circuit board (see, for example, Patent Document 1). The bar code is obtained by coding an identification symbol such as a line name or a serial number. In this technique, a barcode is attached to the substrate in advance during the manufacturing process of the printed circuit board. Then, at the time of inspection with various inspection machines provided in the manufacturing process of the printed circuit board, the identification code of the substrate is read by a bar code reader. After the inspection is completed, the inspection data and the identification symbol of the board are stored in the data management unit.

In such a technique, when it is recognized as a defective product, an operation such as correction is performed based on reading out from the data management section what kind of defect has occurred for the corresponding serial number.
JP-A-5-7100

  However, there is a limit to the information that can be mounted on the bar code, and the actual situation is that the serial number can only be encoded at best. And when correcting a board certified as defective, even if it is read with a broken bar code reader, only the serial number is known, so if you do not access the data management section one by one, where and how should you correct it? I can't figure out. After all, since only the number can be printed on the substrate, the significance in manufacturing and inspection was not recognized at all. Moreover, since it must be managed using the barcode as a key, a very large-scale system was required.

  In addition, since the bar code has a relatively large area and takes place, there is a risk that the design of the printed circuit board may be hindered.

The present invention has been made in view of the above circumstances, in the manufacturing process of the printed circuit board, in the case or to an inspection, the inspection equipment capable of realizing not significant inspection is ever One of the main purposes is to provide it.

  In the following, each means suitable for solving the above-mentioned purpose will be described in terms of items. In addition, the effect etc. peculiar to the means to respond | correspond as needed are added.

  Means 1. In a processing apparatus for performing predetermined processing in manufacturing a printed circuit board, a storage means capable of reading / writing predetermined information is arranged on the substrate, and the storage means is used for manufacturing the printed circuit board. An apparatus for processing a printed circuit board, comprising: a reading unit in which necessary data is written and the data written in the storage unit is read for the predetermined processing.

  As the “storage means”, for example, a wireless tag in which an IC chip typified by an RFID (Radio Frequency IDentification) tag and an antenna are paired can be given as a representative example. Also, “data necessary for manufacturing” is not limited to data directly related to manufacturing, but should be interpreted in a broad sense, such as information on workers and information on inspection (for example, As described in the means 18 and the like).

  According to the means 1, the predetermined processing is performed in the processing apparatus when the printed circuit board is manufactured. Prior to the processing, the substrate is provided with storage means capable of reading / writing predetermined information, and data necessary for manufacturing the printed circuit board is written in the storage means. At the time of the predetermined processing, the data written in the storage means is read for the predetermined processing by the reading means. Therefore, the predetermined processing may be performed by reading the data written in the storage means without reading the data for the predetermined processing in the data management unit one by one. Therefore, the effect that the situation that a manufacturing system will become a large-scale thing can be avoided is produced.

  More specific effects will be described. First, when a predetermined machining program is prepared (stored) in the machining apparatus, the data management unit, or the like in advance, information on the substrate type or the like is read from the storage means. Thus, it can be confirmed whether or not the prepared processing program corresponds to the substrate to be processed. Therefore, even when different varieties are mixed, it can be accurately detected. Second, when a processing program is stored in the storage unit itself and the stored processing program is read out, the processing apparatus can immediately execute processing suitable for the substrate based on the processing program. it can. In this case, since the substrate and the machining program correspond one-to-one, it is not necessary to manage a complicated machining program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like. Thirdly, in the case where a processing program is created on the processing apparatus side (that is, provided with a processing program creation means) based on information on the type of substrate read from the storage means, Since there is no need to prepare and store a wide variety of machining programs, it is possible to flexibly establish machining programs according to many varieties, and to respond flexibly depending on the occasion. .

  Mean 2. 2. The printed circuit board processing apparatus according to claim 1, wherein the predetermined processing is cream solder printing, mounting of an electronic component, or solder reflow.

  According to the means 2, the above-mentioned effects are exhibited in processing such as cream solder printing, mounting of electronic components, or solder reflow.

  Means 3. In an inspection apparatus for performing a predetermined inspection in manufacturing a printed circuit board, a storage unit capable of reading / writing predetermined information is disposed on the substrate, and the storage unit is used for manufacturing the printed circuit board. An inspection apparatus for printed circuit boards, comprising: a reading unit in which necessary data is written and the data written in the storage unit is read for the predetermined inspection.

  According to the means 3, when manufacturing a printed circuit board, a predetermined inspection is executed in the inspection apparatus. Prior to the inspection, the substrate is provided with storage means capable of reading / writing predetermined information, and data necessary for manufacturing the printed circuit board is written in the storage means. In the predetermined inspection, the data written in the storage means is read out for the predetermined inspection by the reading means. Therefore, the predetermined inspection may be performed by reading the data written in the storage means without reading the data for the predetermined inspection in the data management unit one by one. For this reason, there is an effect that it is possible to avoid such a situation that the inspection system becomes large.

  More specific effects will be described. First, when a predetermined inspection program is prepared (stored) in the inspection apparatus, the data management unit, etc., information on the type of the substrate is read from the storage means. Thus, it is possible to confirm whether or not the prepared inspection program corresponds to the substrate to be inspected. Therefore, even when different varieties are mixed, it can be accurately detected. Second, when an inspection program is stored in the storage unit itself and the stored inspection program is read, the inspection apparatus can immediately perform an inspection suitable for the substrate based on the inspection program. it can. In this case, since the board and the inspection program correspond one-to-one, it is not necessary to manage a complicated inspection program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like. Thirdly, when an inspection program is created on the inspection apparatus side (that is, provided with an inspection program creation means) based on information on the type of substrate read from the storage means, etc. Since it is not necessary to prepare or store a new inspection program, it is possible to flexibly establish an inspection program corresponding to many varieties, and to respond flexibly according to the occasion.

  Means 4. The print according to claim 3, wherein the predetermined inspection is an inspection of a printed state of cream solder, an inspection of an electronic component mounting state, an inspection with solder after solder reflow, or an electrical continuity check inspection. Board inspection equipment.

  According to the means 4, the above-mentioned effects can be achieved in the inspection such as the inspection of the printed state of the cream solder, the inspection of the mounting state of the electronic component, the soldering inspection after the solder reflow, or the electrical continuity confirmation inspection.

  Means 5. The printed circuit board inspection apparatus according to claim 3 or 4, further comprising a program creation means for creating an inspection program based on the data read for the predetermined inspection.

  According to the means 5, based on the data read from the storage means, the program creating means creates an inspection program. For this reason, it is not necessary to prepare and store a wide variety of inspection programs in advance, so it is possible to flexibly establish inspection programs for many varieties. Can respond.

  Means 6. 6. The printed circuit board inspection apparatus according to claim 3, wherein the data written by the writing means includes an inspection program necessary for a predetermined inspection.

  According to the means 6, an inspection program necessary for a predetermined inspection is written by the writing means, and the inspection program is read out at the time of inspection. For this reason, the inspection apparatus can immediately execute an inspection suitable for the substrate based on the inspection program. In this case, since the board and the inspection program correspond one-to-one, it is not necessary to manage a complicated inspection program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like.

  Mean 7 7. The printed circuit board inspection apparatus according to claim 3, further comprising inspection result writing means for writing the inspection result of the predetermined inspection into the storage means.

  According to the means 7, the inspection result of the predetermined inspection is further written into the storage means by the inspection result writing means. Here, for example, when a board determined to be defective in inspection is used for repair, information on the defect, which is the inspection result, is stored in the storage means itself on the board. Unlike the prior art in which it has not been possible to know how to correct the error, it can be directly and accurately confirmed, and correction or the like can be performed. Moreover, it is not necessary to manage defect information only for collating defect information with individual substrates. As a result, the system can be dramatically simplified without requiring a large-scale system and management.

  Means 8. The predetermined inspection is performed based on image data obtained by imaging the substrate by an imaging unit, and the inspection result of the predetermined inspection written by the inspection result writing unit includes the image data or 8. The printed circuit board inspection apparatus according to claim 7, wherein image data obtained by processing the image data is included.

  In general, since it is necessary to discharge defects more reliably, it is desirable that inspection standards in inspection equipment are set strictly. However, if it is too strict, even those that do not need to be corrected are defective. There may be cases where it is judged. In this respect, since the image data is included in the means 8 to be written, the image data is recognized when correction or the like is performed even if there is such an “incorrect determination” in the inspection apparatus. It is possible to grasp at a glance that there is no need for correction. Therefore, the inspection conditions in the inspection apparatus can be set even more strictly, and as a result, the inspection accuracy can be dramatically improved.

  Means 9. The predetermined inspection is performed based on image data obtained by imaging the substrate by an imaging unit, and the inspection result of the predetermined inspection written by the inspection result writing unit includes the image data or 8. The printed circuit board inspection apparatus according to claim 7, wherein image data obtained by processing the image data and an inspection program are included.

  According to the means 9, image data and an inspection program are included as the inspection result to be written. For this reason, when making corrections or the like, it is possible to verify and confirm the determination process by checking and examining the image data and the inspection program. For example, it is possible to grasp under what circumstances an erroneous determination has occurred. As a result, it is possible to help improve the reliability of the inspection apparatus.

Means 10. In a printed circuit board manufacturing system comprising cream solder printing means for printing cream solder on a substrate body, mounting means for mounting electronic components on the printed cream solder, and solder reflow means for reflowing solder after mounting,
At least in the pre-stage of the cream solder printing, the disposing means for disposing the storage means capable of reading / writing predetermined information on the substrate body, and the data necessary for manufacturing the printed circuit board are disposed. Writing means for writing to the storage means, and at least one of the cream solder printing means, the mounting means, and the solder reflow means, the data written to the storage means for the step A printed circuit board manufacturing system comprising a reading means for reading.

  According to the means 10, the cream solder is printed on the substrate body by the cream solder printing means. In the mounting means, an electronic component is mounted on the printed cream solder. Further, in the reflow means, the solder after mounting is reflowed to realize solder bonding. In such a printed circuit board manufacturing system, at least before the cream solder printing, in the disposing means, storage means capable of reading / writing predetermined information is disposed on the substrate body. In the writing means, data necessary for manufacturing the printed circuit board is written into the arranged storage means. Then, the data written in the storage means is read for the process by the reading means provided in at least one of the cream solder printing means, the mounting means, and the solder reflow means. Therefore, the predetermined processing may be performed by reading the data written in the storage means without reading the data for the predetermined processing in the data management unit one by one. Therefore, the effect that the situation that a manufacturing system will become a large-scale thing can be avoided is produced.

  A more specific effect will be described. First, when a predetermined printing program, mounting program, reflow program, etc. are prepared (stored) in the corresponding units, data management units, etc., the board is stored from the storage unit. It is possible to check whether each prepared program corresponds to the board by reading out information on the type of the program. Therefore, even when different varieties are mixed, it can be accurately detected. Second, each program is stored in the storage means itself, and when the stored program is read out, each corresponding device immediately prints, mounts, reflows, etc. suitable for the board based on the program. Can be executed. In this case, since the board and the program correspond one-to-one, it is not necessary to manage a complicated program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like. Thirdly, when a configuration is made such that a program is created on the side of each means (that is, the program creation means is provided) based on information on the type of substrate read from the storage means, etc. Since it is not necessary to prepare or store a new program, it is possible to flexibly establish a program corresponding to many varieties, and to respond flexibly according to the occasion.

  Means 11. At least one of the cream solder printing unit, the mounting unit, and the solder reflow unit further includes a program creating unit that creates a predetermined processing program based on the data read by the reading unit. The printed circuit board manufacturing system according to claim 10, wherein:

  According to the means 11, a predetermined machining program is created in the program creation means based on the data read from the storage means. For this reason, it is not necessary to prepare and store a wide variety of programs in advance, so it is possible to flexibly establish programs according to many varieties, and respond flexibly depending on the occasion. be able to.

  Means 12. The data written by the writing unit is configured to include a processing program necessary for predetermined processing, and at least one of the cream solder printing unit, the mounting unit, and the solder reflow unit includes 12. The printed circuit board manufacturing system according to claim 10 or 11, wherein predetermined processing is executed based on the processing program read by the reading means.

  According to the means 12, the machining program necessary for the predetermined machining is written by the writing means, and the corresponding machining program is read at the time of printing, mounting, reflowing and the like. Therefore, each means can immediately realize processing suitable for the substrate based on the processing program. In this case, since the board and the program correspond one-to-one, it is not necessary to manage a complicated program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like.

Means 13. Printed state inspection means for inspecting the printed state of cream solder printed on the substrate body and provided in the printed circuit board manufacturing process, mounting state inspection means for inspecting the mounted state of electronic components mounted on the cream solder, and solder A printed circuit board comprising at least one of a soldered state inspection unit for inspecting a soldered state after reflow and an electrical conduction state confirmation inspecting unit for confirming and inspecting the electrical conduction state of the soldered printed circuit board In the inspection system of
At least prior to the inspection of the printed state, an arrangement means for arranging a storage means capable of reading / writing predetermined information on the substrate body and data necessary for the inspection of the printed circuit board are provided in the arrangement. And at least one of the printing state inspection unit, the mounting state inspection unit, the soldered state inspection unit, and the electrical conduction state confirmation inspection unit. A printed circuit board inspection system comprising reading means for reading out the data written in the data for the inspection.

  According to the means 13, the printing state of the cream solder printed on the substrate body is inspected by the printing state inspection means. Further, the mounting state inspection means inspects the mounting state of the electronic component mounted on the cream solder. Further, the soldered state inspection means inspects the soldered state after the solder reflow, and the electrical conduction state confirmation inspection means confirms and inspects the electrical conduction state of the soldered printed circuit board. A printed circuit board inspection system comprising at least one of these inspection means, wherein a storage means capable of reading / writing predetermined information by the disposing means is provided at least prior to the inspection of the printed state. Arranged in the body. Further, the data required for the inspection of the printed circuit board is written into the storage means arranged by the writing means. And the data written in the storage means by the reading means provided in at least one of the printing state inspection means, the mounting state inspection means, the soldered state inspection means, and the electrical continuity state confirmation inspection means, Read for this test. Therefore, the predetermined inspection may be performed by reading the data written in the storage means without reading the data for the predetermined inspection in the data management unit one by one. For this reason, there is an effect that it is possible to avoid such a situation that the inspection system becomes large.

  More specific effects will be described. First, when a predetermined inspection program is prepared (stored) in advance in the inspection means, the data management section, etc., information on the type of the substrate is read from the storage means. Thus, it is possible to confirm whether or not the prepared inspection program corresponds to the substrate to be inspected. Therefore, even when different varieties are mixed, it can be accurately detected. Second, when an inspection program is stored in the storage unit itself and the stored inspection program is read, the corresponding inspection unit immediately executes an inspection suitable for the substrate based on the inspection program. be able to. In this case, since the board and the inspection program correspond one-to-one, it is not necessary to manage a complicated inspection program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like. Thirdly, in the case where an inspection program is created on the inspection means side (that is, the inspection program creation means is provided) based on information on the type of substrate read from the storage means, etc., there are various types in advance. Since it is not necessary to prepare or store a new inspection program, it is possible to flexibly establish an inspection program corresponding to many varieties, and to respond flexibly according to the occasion.

  Means 14. At least one of the printing state inspection unit, the mounting state inspection unit, the soldered state inspection unit, and the electrical conduction state confirmation inspection unit further creates an inspection program based on the data read by the reading unit The printed circuit board inspection system according to claim 13, further comprising: a program creation means for performing

  According to the means 14, it is read out by the reading means by the program creation means provided in at least one of the printing state inspection means, the mounting state inspection means, the soldered state inspection means, and the electrical continuity state inspection inspection means. Based on the collected data, an inspection program is created. For this reason, it is not necessary to prepare and store a wide variety of inspection programs in advance, so it is possible to flexibly establish inspection programs for many varieties. Can respond.

  Means 15. The data written by the writing means includes an inspection program necessary for the corresponding inspection, and the printing state inspection means, the mounting state inspection means, the soldered state inspection means, and the electrical continuity 15. The printed circuit board inspection system according to claim 13 or 14, wherein at least one of the state confirmation inspection units is configured to execute a corresponding inspection based on the inspection program read by the reading unit.

  According to the means 15, the inspection program necessary for the predetermined inspection is written by the writing means, and the printing state inspection means, the mounting state inspection means, the soldered state inspection means, and the electrical conduction state confirmation inspection means At least one of them executes the corresponding inspection based on the inspection program read by the reading means. For this reason, the inspection apparatus can immediately execute an inspection suitable for the substrate based on the inspection program. In this case, since the board and the inspection program correspond one-to-one, it is not necessary to manage a complicated inspection program in the data management unit or the like. As a result, it is possible to reduce the burden on the management unit and the like.

  Means 16. At least one of the print state inspection unit, the mounting state inspection unit, the soldered state inspection unit, and the electrical conduction state confirmation inspection unit, the inspection result of further writing the inspection result of the corresponding inspection to the storage unit 16. The printed circuit board inspection system according to any one of means 13 to 15, wherein a writing means is provided.

  According to the means 16, the corresponding inspection is performed by the inspection result writing means provided in at least one of the printing state inspection means, the mounting state inspection means, the soldered state inspection means, and the electrical conduction state confirmation inspection means. The inspection result is further written in the storage means. Here, for example, when a board determined to be defective in inspection is used for repair, information on the defect, which is the inspection result, is stored in the storage means itself on the board. Unlike the prior art in which it has not been possible to know how to correct the error, it can be directly and accurately confirmed, and correction or the like can be performed. Moreover, it is not necessary to manage defect information only for collating defect information with individual substrates. As a result, the system can be dramatically simplified without requiring a large-scale system and management.

  The invention described in any one of the above means 10 to 12 and the invention described in any one of the means 13 to 16 may be combined and embodied in a printed circuit board manufacturing / inspection system.

  Means 17. In any one of means 1 to 16, the storage means can read / write predetermined information in a non-contact manner.

  According to the means 17, predetermined information can be read and written without contact. Therefore, it is not necessary to provide a complicated electrical joining means for reading and writing, the apparatus and system can be simplified, and a flexible response is possible.

  Means 18. In any one of the means 1 to 17, the data includes the line configuration (including the type of each means and the manufacturer name), the production lot information (including the lot number, the substrate size, and the manufacturing date and time), the type, and the CAD / CAM. It includes at least one of design information (including data, circuit diagrams, etc.), worker information, program data relating to manufacturing (processing), program data relating to inspection, production line name, production factory name, and serial number.

  Hereinafter, an embodiment will be described with reference to the drawings.

  FIG. 1 is a schematic diagram showing a transfer line corresponding to a manufacturing system for manufacturing a printed circuit board. As shown in the figure, along the transfer line, a cream solder printing device 11, a component mounting device 12, and a reflow device 13 are installed in that order from the start end side (left side in the drawing). The cream solder printing device 11 is for printing a predetermined amount of cream solder on a predetermined portion (for example, on a land) of the substrate body, and the component mounting device 12 is a predetermined electronic component (on the printed cream solder). Chip etc.). The reflow device 13 is for melting and melting the cream solder to solder the lands to the electrodes and leads of the mounted components. Since the basic configuration of each of these devices 11 to 13 is known, further detailed description thereof will be omitted here.

  Further, on the downstream side of the cream solder printing apparatus 11, a printing state inspection apparatus 21 for inspecting the printing position, height, amount, and the like of the cream solder on which printing has been performed is provided. A branch device 31 is provided between the printing state inspection device 21 and the component mounting device 12. The board determined to be non-defective by the printing state inspection apparatus 21 is guided to the component mounting apparatus 12 on the downstream side, and the board determined to be defective is guided to the defective product storage unit 41. .

  A mounting state inspection device 22 for inspecting the state of the mounted electronic component is provided on the downstream side of the component mounting device 12. A branch device 32 is also provided between the mounting state inspection device 22 and the reflow device 13. The board determined to be non-defective by the mounting state inspection apparatus 22 is guided to the reflow apparatus 13 on the downstream side, and the board determined to be defective is guided to the defective product storage unit 42.

  Furthermore, on the downstream side of the reflow device 13, a soldering state inspection device 23 for inspecting whether or not the soldering state is properly made, and whether or not electrical continuity after soldering is appropriately secured. An electrical continuity test device 24 is provided for inspecting this. Branch devices 33 and 34 are also provided on the downstream sides of the soldering state inspection device 23 and the electrical continuity inspection device 24. Then, the substrates determined to be non-defective by the inspection devices 33 and 34 are guided to the non-defective product take-out unit 14 on the downstream side, and the substrates determined to be defective are guided to the non-defective product storage units 43 and 44. It has become.

  In the present embodiment, RFID (Radio Frequency IDentification) (hereinafter referred to as “IC tag”) 15 capable of reading / writing predetermined information on the upstream side of the cream solder printing apparatus 11 (refer to FIG. 2). ) Is disposed on the board body 16 and the IC tag placement / write device 10 capable of writing data (information) necessary for manufacturing the printed circuit board is provided on the IC tag 15. Yes.

  More specifically, the IC tag 15 in the present embodiment is a tag that can store information and can write and read information using electromagnetic waves and the like in a non-contact manner, and is fixed information that stores read-only information that cannot be rewritten. The integrated circuit includes a circuit and a variation information circuit capable of rewriting stored information, an antenna, and the like. The IC tag 15 is formed by sticking these components to the substrate body as a seal body or a chip body. Of course, a configuration in which an IC tag is attached by printing can also be adopted. In the case of printing, for example, a conductive polymer made of a predetermined organic material is used as the ink.

  Also, information stored in the IC tag 15 at this time includes the line configuration (including the model of each device 11 to 13, 21 to 24, and the manufacturer name), and the production (including the lot number, the board size, and the manufacturing date and time). Examples include lot information, product type, design information (including CAD / CAM data, circuit diagrams, etc.), worker information, program data relating to manufacturing (processing), program data relating to inspection, and serial numbers.

  Further, in the present embodiment, in correspondence with each of the above-described inspection apparatuses 21 to 24, reading / writing that can read out information stored in the IC tag 15 and newly write the inspection result. Insertion means 51, 52, 53 and 54 are provided respectively.

  FIG. 2 is a schematic diagram showing a schematic configuration of the printing state inspection apparatus 21 provided with the reading / writing means 51 so as to show one example. The printing state inspection device 21 includes a transfer unit 61, an inspection unit 62, and the reading / writing unit 51. The transfer means 61 includes a table conveyor 63 and a motor 64, and includes a transfer mechanism 65 capable of moving the substrate body 16 on which the cream solder is printed, and a position control means 66 for controlling the transfer mechanism 65. . Further, the inspection unit 62 performs an image processing based on the illuminating device (not shown), the image capturing device 67, and the captured image data, and calculates the quality of the cream solder and the like, and then performs a pass / fail determination. 68. Further, the reading / writing means 51 reads / writes information on the IC tag 15 installed on the substrate body 16 in a non-contact manner and writes inspection results on the IC tag 15 in a non-contact manner. A head 69 and a read / write control means 70 capable of executing control for reading and writing information via the head 69 are provided.

  Here, the read / write unit 51 is described as a representative example, but the basic configurations of the read / write units 52, 53, and 54 corresponding to the other inspection apparatuses 22 to 24 are similar. It is. That is, each of the reading / writing means 52 to 54 reads the information of the IC tag 15 installed on the substrate body 16 and writes the inspection result to the IC tag 15; Read / write control means capable of executing control for reading and writing information via the head is provided.

  As shown in FIG. 1, the IC tag arrangement / writing device 10 and the reading / writing means 51, 52, 53, 54 are connected to a server (data management unit) 72 via a network 71. Has been. The non-defective product take-out unit 14 is also provided with a reading / writing unit 55, and the reading / writing unit 55 is also connected to a server (data management unit) 72 via a network 71. The non-defective product take-out unit 14 is provided with IC tag removal / deletion means 73, and the means 73 is used to remove the IC tag 15 and erase data. When the IC tag 15 is formed of a chip body or the like, it can be reused after removal and data erasure.

  The IC tag arrangement / writing device 10 corresponds to the arrangement means and storage means referred to as means 10 or the like. The printing state inspection device 21, the mounting state inspection device 22, the soldering state inspection device 23, and the electrical continuity inspection device 24 correspond to inspection devices for performing predetermined inspections. These correspond to reading means and inspection result writing means.

  Here, a schematic configuration of a correction device for correcting a defective portion of the substrate main body determined to be defective and guided to the defective product storage units 41 to 44 will be described. FIG. 3 is a diagram for explaining an outline of the correction device 81 for correcting manually. As shown in the figure, the correction device 81 includes an input means 82 such as a keyboard, a read / write head 83, a control means 84, a display means 85 such as a monitor, and the like. As shown in the figure, the read / write head 83 reads the information of the IC tag 15 installed on the substrate body 16 in a non-contact manner or writes the inspection result in the IC tag 15 in a non-contact manner. Can be done. The control unit 84 of the correction device 81 is also connected to a server (data management unit) 72 via a network 71 (not shown).

  Next, operational effects exhibited by the manufacturing system (inspection system) according to the present embodiment having the above-described configuration will be described together with procedures such as inspection and correction.

  First, when the board body 16 (or printed circuit board) is carried into the various inspection apparatuses 21 to 24, the reading / writing means 51 to 54 provided corresponding to the inspection apparatuses 21 to 24 are provided as necessary. The information stored in the IC tag 15 is read out.

  Here, first, when an inspection program is prepared (stored) in each inspection device 21 to 24 or server 72 in advance, information on the type of the substrate body 16 (or printed circuit board) from the IC tag 15 (for example, By reading the lot number or the like, it is possible to confirm whether or not the inspection program prepared in the inspection devices 21 to 24 or the server 72 corresponds to the substrate body 16 (or printed circuit board) to be inspected. . Therefore, even when different varieties are mixed, it can be accurately detected. Further, more information can be stored in the IC tag 15.

  Second, when an inspection program is stored in the IC tag 15 itself and the stored inspection program is read, each inspection apparatus 21 to 24 immediately inspects an inspection suitable for the board based on the inspection program. It can be performed. In this case, since the board and the inspection program correspond one-to-one, it is not necessary to manage a complicated inspection program in the server (data management unit) 72. As a result, the burden on the server 72 can be reduced.

  Third, when an inspection program is created on the inspection apparatus 21 to 24 side based on information (for example, lot number) on the type of the substrate body 16 (or printed circuit board) read from the IC tag 15 Since it is not necessary to store a wide variety of inspection programs in advance, it is possible to flexibly establish inspection programs according to many varieties, and to respond flexibly depending on the occasion. In this case, information necessary for establishing the inspection program may be read from the server 72 or the like.

  Now, after various inspections are performed in each of the inspection devices 21 to 24, the reading / writing means 51 to 54 provided corresponding to the inspection devices 21 to 24 are connected to the IC tag 15 as necessary. Information about good / bad, information about the type of defect, information about the position of the defect, image of the defective part (which may be image-processed or raw image data), and the like are written (stored). In addition to this, the various types of information may be output to the server 72 via the network 71.

  Here, the substrates determined to be defective are led out to the defective product storage units 41 to 44 through the branching devices 31 to 34, but the substrates collected here are transferred to the correction device 81 and the like described above. It is carried here and subjected to correction. The correction device 81 is embodied in a type that is manually corrected, but may be corrected by an automatic correction device. In the correction device 81, as described above, the information of the IC tag 15 installed on the substrate body 16 is read out in a non-contact manner via the read / write head 83. Information on the type of failure is displayed on the display means 85 and the like, and the operator (repair operator) can proceed with the correction work while recognizing the display content of the display means 85.

  In this way, since the information regarding the defect is stored in the IC tag 15 itself on the board, unlike the conventional technique in which it is impossible to grasp where and how to correct it without accessing the data management unit one by one, Confirmation and correction can be easily performed without going through the server 72. Moreover, it is not necessary to manage defect information only for collating defect information with individual substrates. As a result, the system can be dramatically simplified without requiring a large-scale system and management.

  Moreover, since it is necessary to discharge defects more reliably, the inspection standards in the inspection apparatuses 21 to 24 are generally set strictly. Until the inspection apparatuses 21 to 24 do not determine that the products are non-defective. In some cases, it is possible to determine that a product that does not need to be corrected is defective. In this regard, in the present embodiment, since the image data is stored, even if there is such an “erroneous determination” in the inspection apparatuses 21 to 24, there is no need for correction. I can grasp it. Therefore, the inspection conditions in the inspection devices 21 to 24 can be set more strictly, and as a result, the inspection accuracy can be dramatically improved.

  Further, in addition to this, when the configuration in which the inspection program is stored in the IC tag 15 is adopted (as described in the section “Second,” above), the image data is compared with the inspection program. By confirming and reviewing, it is possible to verify and confirm the circumstances that led to the determination. For example, it is possible to grasp under what circumstances an erroneous determination has occurred. As a result, it is possible to help improve the reliability of the inspection devices 21 to 24.

  After the correction is completed, the defect information before the correction can be newly rewritten, input again, deleted, or the correction information can be additionally written via the input unit 82. Of course, the corrected substrate may be placed on the corresponding inspection apparatuses 21 to 24 and used for inspection again.

  The printed circuit board guided to the non-defective product take-out unit 14 is then processed as a non-defective product, and the output processing to the server 72 is performed by the reading / writing means 51-54 corresponding to the inspection devices 21-24. If not, inspection, history information, etc. are output from the read / write means 55 provided in the non-defective product take-out unit 14 to the server 72 via the network 71. As described above, if the inspection results and the like are written to the server 72 in a lump after the substrate is completed, it is necessary to perform complicated processing such that each data is associated with the substrate and the inspection results are added each time. In this sense, management can be simplified. Further, if the inspection result or the like is stored in the server 72 only for the board determined to be a non-defective product, complicated processing such as correcting the inspection result by associating individual data with the board is not required, and management is further improved. Can be simplified.

  As described above, the IC tag removal / data erasure work is performed in the IC tag removal / deletion means 73 provided in the non-defective product extraction unit 14. When the IC tag 15 is formed of a chip body or the like, it can be reused after removal and data erasure. Therefore, an increase in production cost due to the use of an IC tag 15 that is generally more expensive than a barcode or the like can be suppressed. Of course, the means 73 may be omitted, and the IC tag 15 may not be removed, that is, the IC tag 15 may be shipped with the IC tag 15 still attached to the printed board. In this case, even when there is a request for repair or the like and it is returned to the manufacturer, the information at the time of manufacture can be obtained by reading the information of the IC tag 15 again. In addition, there is an advantage that even after the repair is completed, the repair information (for example, repair date, repair content, worker code, etc.) is additionally written, which is useful for subsequent follow-up surveys. Of course, when the IC tag 15 is shipped with being attached, it is desirable that the data is not easily read or rewritten by a third party by encrypting the data.

  In the embodiment described above, for example, a part of the configuration can be appropriately changed as follows. Of course, other modifications not exemplified below are also possible.

  (A) In the above embodiment, the reading / writing means 51 to 54 are mainly provided corresponding to the inspection devices 21 to 24. On the other hand, as shown in FIG. 4, corresponding to any one of the cream solder printing device 11, the component mounting device 12, and the reflow device 13, the reading / writing means 91, 92, 93 may be provided. In this case, the predetermined processing may be performed by reading the data written in the IC tag 15 without reading the data for the predetermined processing in the server (data management unit) 72 one by one. For example, the cream solder printing apparatus 11 may read out printing conditions, a printing program, and the like, and the component mounting apparatus 12 may read out mounting conditions such as mounting components and mounting positions, a mounting program, and the like, and the reflow apparatus 13. In this case, reflow conditions such as temperature and time, a reflow program, and the like can be considered. As a result, as described above, effects such as avoidance of a situation in which the manufacturing system becomes large-scale can be achieved.

  A more specific effect will be described. First, when a predetermined printing program, mounting program, reflow program, or the like is prepared (stored) in the corresponding devices 11 to 13 or the server 72, the IC tag By reading out information on the type of substrate from 15, it is possible to confirm whether each prepared program corresponds to the substrate. Therefore, even when different varieties are mixed, it can be accurately detected. Second, each program is stored in the IC tag 15 itself, and when the stored program is read out, the corresponding devices 11 to 15 can immediately perform printing suitable for the board based on the program, Implementation, reflow, etc. can be executed. In this case, since the board and the program correspond one-to-one, it is not necessary to manage a complicated program in the server 72 or the like. As a result, it is possible to reduce the burden on the server 72 and the like. Thirdly, when a configuration is made such that a program is created on each of the devices 11 to 13 (that is, equipped with a program creation means) based on information on the type of substrate read from the IC tag 15, Since it is not necessary to prepare and memorize a wide variety of programs in advance, it is possible to flexibly establish programs according to many varieties, and to respond flexibly according to the occasion. .

  In this case, the cream solder printing device 11, the component mounting device 12, and the reflow device 13 correspond to a processing device for performing predetermined processing.

  (B) In the above embodiment, the printing state inspection device 21, the mounting state inspection device 22, the soldering state inspection device 23, and the electrical continuity inspection device 24 are provided. 54 is provided. On the other hand, it is good also as a structure which abbreviate | omits any (1 thru | or 3) inspection apparatus among these inspection apparatuses 21-24. Further, any one (1 to 3) of the inspection devices among the reading / writing means 51 to 54 may be omitted.

  (C) In the above embodiment, the IC tag 15 that can be read / written wirelessly (contactlessly) is provided. However, the IC tag 15 is not necessarily limited to the non-contact type, and is read / written on electrical continuity. It is good also as providing memory | storage means, such as IC chip which can be inserted.

  (D) In the above embodiment, the read / write means 51, 52, 53, 54 are embodied when connected to the server (data management unit) 72 via the network 71. It does not have to be. Further, only the first and last read / write means 51 and 54 (or 55) or only the last read / write means 54 (or 55) is connected to the server (data management unit) 72 via the network 71. May be.

  (E) In the above embodiment, the read / write heads 69 and 83 in which the read head and the write head are integrated are employed, but the read head and the write head may be provided separately.

1 is a block diagram illustrating a schematic configuration of a printed circuit board manufacturing / inspection system according to an embodiment. It is a schematic block diagram which shows the outline | summary of the printing state inspection apparatus which is one aspect | mode of an inspection apparatus. It is a schematic block diagram which shows the outline | summary of a repair apparatus. It is a block diagram which shows schematic structure of the manufacture / inspection system of the printed circuit board in another embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Arrangement | positioning means, IC tag arrangement | positioning / writing means which comprises writing means, 11 ... Processing apparatus, Cream solder printing apparatus which comprises cream solder printing means, 12 ... Processing equipment, Component mounting which comprises mounting means Device: 13 ... Processing device, Reflow device constituting solder reflow means, 15 ... IC tag as storage means, 16 ... Substrate body, 21 ... Inspection device, Print state inspection device constituting print state inspection means, 22 ... Inspection Device, mounting state inspection device constituting mounting state inspection means, 23... Inspection device, soldered state inspection device constituting soldered state inspection means, 24... Inspection device, electrical conduction state confirmation inspection means constituting electrical conduction state confirmation means Continuity testing device, 51, 52, 53, 55 ... Read / write means, 71 ... Network, 72 ... Server.

Claims (2)

In manufacturing a printed circuit board, in an inspection device for performing a predetermined inspection,
The substrate is provided with storage means capable of reading / writing predetermined information, and data necessary for manufacturing the printed circuit board is written in the storage means.
A reading means for reading the data written in the storage means for the predetermined inspection;
An inspection result writing means for further writing the inspection result of the predetermined inspection into the storage means;
The predetermined inspection is performed based on image data obtained by imaging the substrate by an imaging unit, and the inspection result of the predetermined inspection written by the inspection result writing unit includes the image data or A printed circuit board inspection apparatus comprising image data obtained by processing the image data and an inspection program. Said predetermined inspection, the inspection of the printed state of the cream solder, the inspection of mounting states of electronic components, or inspection apparatus for a printed circuit board according to claim 1, characterized in that the soldering inspection after the solder reflow .

Images