JP4814008B2 - Defect analysis method, substrate used for the defect analysis method, electronic device and electronic device manufacturing apparatus - Google Patents

Description

  The present invention relates to an electronic device failure analysis method, a substrate used for the failure analysis method, an electronic device, and an electronic device manufacturing apparatus.

A failure analysis method for a multilayer wiring structure is known, and failure analysis is performed as follows. The main surface of the multilayer wiring structure is photographed and stored in the defect analysis apparatus for each step of forming the wiring layer of the multilayer wiring structure. A defective product image is extracted from the process-specific images stored in the defect analysis apparatus. Then, defective images are analyzed by observing defective product images (for example, Patent Document 1).
JP 2005-142552 A

  In the conventional defect analysis method as described in Patent Document 1, since a non-defective product and a defective product are determined in an inspection process before product shipment, a defective product can be determined immediately. Therefore, it is not necessary to increase the capacity of the storage memory by erasing the image data stored in the failure analysis apparatus after the failure analysis. However, if this failure analysis method is applied to failure analysis of products after sales, a considerable amount of time elapses until a defective product is identified. It becomes huge and is not realistic.

(1) According to a first aspect of the present invention, there is provided an electronic apparatus comprising: a storage device; a processor that executes a predetermined process based on various data stored in the storage device; and at least the storage device and a board on which the processor is mounted. The storage device stores at least image data of the substrate in the manufacturing process.
(2) An electronic device manufacturing apparatus according to a second aspect of the present invention is the electronic device manufacturing apparatus according to the first aspect, wherein an imaging means for imaging the substrate in each manufacturing process and image data obtained by imaging the substrate are manufactured. It is characterized by comprising a server for storing each process and a control means for transferring the image data of the substrate stored in the server to the storage device of the substrate.
(3) The invention of claim 3 is the electronic device manufacturing apparatus according to claim 2, further comprising a recognizing means for recognizing the identification number assigned to the substrate based on the image data, and taking an image in each manufacturing process. The acquired image data is stored in the server in association with the recognized identification number.
(4) The invention of claim 4 is the electronic device manufacturing apparatus according to claim 3, wherein the control means transfers the data based on the identification number when transferring the image data stored in the server to the storage device of the electronic device. A transfer destination electronic device is specified, and image data associated with an identification number is transferred to a corresponding storage device.
(5) The invention of claim 5 is the electronic device manufacturing apparatus according to any one of claims 2 to 4, wherein the control means transfers the image data of the substrate to the storage device of the substrate through an electric communication line. It is characterized by doing.
(6) The defect analysis method of the invention of claim 6 is the electronic device defect analysis method according to claim 1, wherein the image data in the manufacturing process stored in the storage device is read and the image data is used as a monitor. It is characterized by displaying or printing and analyzing defects.
(7) The substrate of the invention of claim 7 is a storage device storing at least image data of the substrate in the manufacturing process, and a processor for executing a predetermined process based on various data stored in the storage device. Is implemented.

  According to the present invention, the image taken in the board mounting process is stored in the storage device on the board. Therefore, it is not necessary to store a large amount of image data taken on the production line in a server in the factory, and it is not necessary to increase the storage memory of the server.

  FIG. 1 is a diagram for explaining the outline of an image recording system for analyzing failure of an electronic apparatus according to an embodiment of the present invention. Here, manufacturing process data such as images taken in the electronic device manufacturing process is stored in the memory of the electronic device, and failure analysis is performed based on the data. The image recording system 1 includes a server 2, a camera 3, an electrical inspection device 4, an X-ray camera 5, and a memory 6 provided in an electronic device.

  The server 2 acquires image data of an image captured by the camera 3, an inspection result inspected by an electrical inspection apparatus 4 such as a tester, an image captured by the X-ray camera 5, and stores these data in the database 21. .

  The configuration of the database 21 will be described with reference to FIG. The database 21 includes a product name column 31, a board front serial number column 32, a substrate back serial number column 33, a board packing serial number column 34, a product barcode column 35, a product packing serial number column 36, a database serial number column 37, an appearance. It has a plurality of data fields including an image data field 38, an electrical inspection result field 39, and an X-ray image data field 310.

  The product name column 31 stores the product name of the electronic device to be manufactured. The substrate surface serial number column 32 stores the substrate surface serial number displayed on the surface of the substrate attached to the electronic device. The board back serial number 33 column stores the board back serial number displayed on the back of the board attached to the electronic device. The board packing serial number column 34 stores the board packing serial number attached to the box in which the board is packed. The product barcode column 35 stores the product barcode read from the barcode attached to the electronic device to which the substrate is attached.

  The product packaging serial number column 36 stores the product packaging serial number attached to the box in which the electronic device is packaged. The database serial number column 37 stores a serial number generated as a search key. The appearance image data column 38 stores image data such as a circuit board photographed in the manufacturing process of the electronic device. The electrical test result column 39 stores the test result of the continuity test by the electrical test device 4 such as a tester. The X-ray image data column 310 stores X-ray image data of the circuit board imaged at the time of the X-ray inspection of the board.

  As shown in FIG. 1, the data of each electronic device stored in the database 21 is stored for a predetermined period, and the data 211 after the predetermined storage period has been discarded (erased).

  The camera 3 photographs the appearance of the substrate to be attached to the electronic device for each process and the appearance of the electronic device being assembled. The electrical inspection device 4 is composed of a tester or the like, and performs a continuity check of a substrate attached to the electronic device. The X-ray camera 5 captures an X-ray image of a substrate attached to the electronic device. The memory 6 acquires data related to the electronic device to which the memory 6 is attached from the server 2 and stores it.

  Next, the manufacturing process of the electronic device in the embodiment of the present invention will be described with reference to FIG. The electronic equipment includes a substrate inspection process (S901), a surface mounting process (S902), a substrate rear assembly process (S903), a continuity inspection process (S904), an X-ray inspection process (S905), a total assembly process (S906), and a packaging process. Shipped via (S907).

  In the substrate inspection step (S901), an appearance inspection is performed to check whether there is a defective product on the raw substrate on which no component is mounted. In the surface mounting process (S902), after solder is printed or a bond is applied to the substrate surface, electronic components are mounted by a mounter, and heat treatment is performed in a reflow furnace. In the board post-assembly process (S903), electronic components that cannot be mounted by the mounter are manually soldered to the board. In the continuity inspection step (S904), the electrical inspection device 4 is used to check the continuity of the board on which the component is mounted. In the X-ray inspection step (S905), the board on which the component is mounted is photographed with the X-ray camera 5 and inspected for cracks that cannot be seen from the surface of the board. In the total assembly process (S906), a board, a hard disk, a disk drive and the like on which components are mounted are attached to assemble an electronic device. In the packing step (S907), the assembled electronic device is packed in a box.

  Next, a process of storing data in the manufacturing process of the electronic device in the database 21 and saving the data in the memory 6 of the electronic apparatus will be described with reference to flowcharts of FIGS.

  First, a process of storing image data of the substrate 41 in the database 21 will be described. In step S701 in FIG. 7, a substrate surface serial number is assigned to the surface of the substrate.

  The provision of the substrate surface serial number will be described with reference to FIG. A serial number giving unit 42 is provided on the surface of the substrate 41, and alphabets A to H are printed on the serial number giving unit 42. And the bond 43 is apply | coated to the upper stage or lower stage in each alphabet with a bond applicator. The combination of the positions of the bonds 43 applied to the upper or lower part of each alphabet corresponds to a predetermined serial number. By applying the bond 43 as described above, the substrate surface serial number is applied to the surface of the substrate 41. Can be granted. The combination of the substrate surface serial number and the position of the bond 43 is made unique for each product lot.

  In step S <b> 702, the surface of the substrate 41 is photographed by the camera 3. At this time, the serial number giving unit 42 is also photographed so that the substrate surface serial number can be identified. The entire front surface of the substrate 41 may be taken with a single image, or may be taken separately as shown in FIG. In the case of dividing and shooting, the serial number giving unit 42 is first shot (shooting number 1), and then the other parts (shooting numbers 2 to 9) are shot. As shown in FIG. 5A, the file name of the image data of the captured image is “m_bondA_shooting number.bmp”. In step S703, the substrate surface serial number is recognized by recognizing the image captured by the serial number assigning unit 42. In step S704, as shown in FIG. 5B, the file name “m” is replaced with the board surface serial number. For example, in FIG. 5B, the “m” portion of the file name is replaced with “10111010”. In step S705, the product name, substrate surface serial number, and image data are stored in the database 21.

  In step S706, a substrate back surface serial number is assigned to the back surface of the substrate 41 by the same method as in step S701. In step S707, the back surface of the substrate 41 is photographed by the camera 3 in the same manner as in step S702. The file name of the image data at this time is “n_bondB_shooting number.bmp”. In step S708, the substrate backside serial number is recognized by recognizing the image obtained by photographing the serial number assigning unit. In step S709, “n” in the file name is replaced with the backside serial number of the substrate. In step S 710, the back side serial number and the image data are stored in the database 21.

  Next, a process of storing image data of the substrate 41 on which electronic components are mounted by the mounter in the database 21 will be described. In step S711 of FIG. 8, solder 44 or a bond is applied to the substrate 41 as shown in FIG. In step S712, electronic components such as the memory 6, the processor 45, and a capacitor are mounted on the substrate 41 by a mounter as shown in FIG. The processor 45 executes predetermined processes based on various data stored in the memory 6. In step S713, the substrate 41 on which the electronic component is mounted is heat-treated in a reflow furnace.

  In step S714, as in step S702, the camera 3 captures an image of the surface of the substrate 41 heat-treated in the reflow furnace. The file name of the image data at this time is “m_handaA_shooting number.bmp”. In step S715, the substrate surface serial number is recognized by recognizing the image of the serial number assigning unit 42. In step S716, “m” in the file name is replaced with the board surface serial number. In step S717, the image data is stored in the database 21 in association with the substrate surface serial number.

  In step S718, as in step S702, the back surface of the substrate 41 that has been heat-treated by the reflow furnace is photographed by the camera 3. The file name of the image data at this time is “n_handaB_shooting number.bmp”. In step S719, the serial number on the back side of the substrate is recognized by recognizing the image obtained by photographing the serial number assigning unit. In step S720, “n” in the file name is replaced with the backside serial number of the substrate. In step S721, the image data is stored in the database 21 in association with the substrate backside serial number.

  Next, a process of storing image data of the board 41 on which components are manually attached in the database 21 will be described. In step S722 of FIG. 9, as shown in FIG. 6A, components (for example, a power supply device and a connector) that cannot be mounted by the mounter are manually attached to the substrate 41. In step S723, the surface of the substrate 41 to which the component is attached is photographed by the camera 3 as in step S702. The file name of the image data at this time is “m_atokumiA_shooting number.bmp”. In step S724, the substrate surface serial number is recognized by recognizing the image of the serial number assigning unit 42. In step S725, “m” in the file name is replaced with the board surface serial number. In step S726, the image data is stored in the database 21 in association with the substrate surface serial number.

  In step S727, the back surface of the substrate 41 to which the component is attached is photographed by the camera 3 as in step S702. The file name of the image data at this time is “n_atokumiB_shooting number.bmp”. In step S728, the substrate backside serial number is recognized by recognizing the image obtained by photographing the serial number assigning unit. In step S729, “n” in the file name is replaced with the backside serial number of the substrate. In step S730, the image data is stored in the database 21 in association with the substrate backside serial number.

  Next, a process of storing the electrical inspection result of the substrate 41 in the database 21 will be described. In step S731 in FIG. 10, the electrical inspection device 4 is used to check the continuity of the board 41 to which the component is attached. In step S <b> 732, the camera 3 photographs the serial number assigning portions on the front and back surfaces of the substrate 41. In step S733, the front surface serial number and the back surface serial number are recognized by recognizing images of the front and back serial number assigning units. Here, the board front serial number and the board back serial number are associated with each other. In step S734, the electrical inspection result by the continuity check is stored in the database 21 in association with the substrate surface serial number. Here, “OK” is stored when there is no problem in circuit conduction, and “NG” is stored when there is a non-conduction portion in the circuit.

  Next, the process of storing the X-ray image of the substrate 41 in the database 21 will be described. In step S <b> 735 of FIG. 11, the camera 3 captures an image of the serial number assigning unit 42 on the surface of the substrate 41. In step S736, the surface of the substrate 41 to which the component is attached is photographed by the X-ray camera 5 as in step S702. The file name of the image data at this time is “m_xsenA_shooting number.bmp”. In step S737, the substrate surface serial number is recognized by recognizing the image of the serial number assigning unit. In step S738, the “m” portion of the file name is replaced with the board surface serial number. In step S739, the X-ray image data is stored in the database 21 in association with the substrate surface serial number.

  In step S 740, the camera 3 captures an image of the serial number assigning unit on the back surface of the substrate 41. In step S741, as in step S702, the back surface of the substrate 41 to which the component is attached is photographed with the X-ray camera 5. The file name of the image data at this time is “n_xsenB_shooting number.bmp”. In step S742, the substrate backside serial number is recognized by recognizing the image of the serial number assigning unit. In step S 743, “n” in the file name is replaced with the board rear surface serial number. In step S744, the X-ray image data is stored in the database 21 in association with the substrate backside serial number.

  Next, a step of storing an image obtained by photographing the assembly process of the electronic device 63 in the database 21 and a step of copying the data of the electronic device 63 stored in the database 21 to the memory 6 of the electronic device will be described. In step S745 of FIG. 12, the substrate 41 to which the components are attached is packed in a predetermined box 61 as shown in FIG. A sticker 62 with a serial number (substrate packaging serial number) is attached to the box 61.

  In step S746, the seal 62 of the box 61 is photographed. In step S 747, the camera 3 captures an image of the serial number assigning unit 42 on the surface of the substrate 41 taken out from the box 61. As a result, the board surface serial number and the board packing serial number can be associated with each other. In step S748, the camera 3 takes an image of the electronic device being assembled in the assembly process of assembling the electronic device using the substrate 41 and other components. The file name of the image data at this time is assumed to be “m_soukumi_shooting number.bmp”. In step S749, the substrate surface serial number and the substrate packing serial number are recognized by recognizing the image of the photographed serial number assigning unit 42 and the image of the sticker 72. In step S750, the file name “m” is replaced with the substrate surface serial number. In step S751, the board packing serial number and the image data are stored in the database 21 in association with the board surface serial number.

  In step S752, as shown in FIG. 6C, the product barcode sticker 64 to which the product lot number is assigned is attached to the assembled electronic device 63. In step S753, the product barcode displayed on the seal 74 is read. Here, the product barcode is associated with the board surface serial number. In step S754, the product barcode is stored in the database 21 in association with the substrate surface serial number. In step S755, the data of the electronic device 63 stored in the database 21 is copied to the memory 6 built in the assembled electronic device 63. At this time, the data of the electronic device 63 is encrypted and stored in the memory 6. Since the data relating to the electronic device 63 is associated with the product barcode and the board surface serial number, it can be easily extracted from the server 2 by reading the product barcode attached to the electronic device.

  Next, a process of storing the serial number of the box 65 in which the electronic device 63 is packed in the database 21 will be described. In step S756 of FIG. 13, the product barcode displayed on the sticker 64 attached to the electronic device 63 is read. In step S757, the electronic device 63 is packed in a predetermined box 65 as shown in FIG. A sticker 66 with a serial number (product packaging serial number) is attached to the box 65. In step S758, the seal 66 is photographed by the camera 3. In step S759, the product packing serial number is recognized by recognizing the image of the photographed sticker 66. In step S760, the product packaging serial number is stored in the database 21. In step S761, a predetermined database serial number of the electronic device 63 is assigned to the database 21.

Next, the failure analysis process in the embodiment of the present invention will be described with reference to the flowchart of FIG.
In step S801, a defective electronic device is ordered. In step S802, the electrical inspection device 4 is used to identify a defective part. In step S803, the defective portion is disassembled and the defective portion is analyzed. In step S804, image data of the manufacturing process is read from the memory 6 of the electronic device. In step S805, an image of a defective portion in the manufacturing process is extracted. In step S806, the cause of the failure is specified by examining the image of the defective portion displayed in the monitor or printed in the manufacturing process and the analysis result of the defective portion. In step S807, the cause of failure is fed back to the manufacturing process.

In the image storage system according to the above embodiment, the following operational effects can be obtained.
(1) The state in each manufacturing process of the substrate 41 on which the memory 6 and the processor 45 are mounted is photographed, and this image is stored in the memory 6 mounted on the substrate 41. The cause of the failure of the electronic device 63 that has failed after product shipment can be analyzed by reading the image data from the memory 6 of the failed electronic device 63.
(2) The photographic data is once transferred to the server 22 and stored in the database 21, and the image data in the database 21 is transferred to the memory 6 of the corresponding board 41 in the manufacturing process of the electronic device 63 in which the board 41 is incorporated. To remember. Then, the image data in the database 21 is deleted. As a result, the image of each manufacturing process can be used when specifying the cause of failure for each electronic device 63 while making the data storage capacity of the database 21 (server 2) in the factory a realistic value. .

(3) The identification number assigned to the substrate 41 is recognized based on the image data, and when the shooting data of the substrate 41 is transferred to the server 2, the memory area is specified by the identification number. Therefore, the process of associating the image data with the substrate 41 when storing the image data is simplified.
(4) The identification number assigned to the board 41 is recognized based on the image data, and when the image data is transferred from the server 2 to each board 41, the memory 6 of the transfer destination board 41 is specified by the identification number. I made it. Therefore, the process of associating with the substrate 41 when transferring the image data is simplified.

The storage system 1 of the above embodiment can be modified as follows.
(1) When the electronic device can be connected to the telecommunication line, after shipping from the factory, the image data of the manufacturing process is transmitted from the server 2 to the memory 6 of the electronic device through the telecommunication line and stored in the memory 6. Good. After packing the electronic device, the product packing serial number and the database serial number attached to the packed box can also be stored in the memory 6, which improves convenience. As an example of using a telecommunication line, when an electronic device can be connected to the Internet, image data of a manufacturing process is downloaded from the Internet and stored in the memory 6. At this time, the serial number shown in the product barcode is transmitted from the electronic device so that the electronic device can be specified. As described in the embodiment, since the product barcode and the image data are associated with each other, the server 2 can easily extract and transmit the image data of the electronic device.
(2) You may make it perform the external appearance inspection in a manufacturing process using the image image | photographed at the manufacturing process. In this case, the employee may visually observe the captured image, or the appearance inspection apparatus may automatically inspect the captured image. Images taken for defect analysis can also be used for inspections in the manufacturing process, increasing the efficiency of the inspection process.
(3) The image captured in the manufacturing process may be a moving image.
(4) In one lot, the order of each product flowing through the manufacturing process may be always constant, and the product image may be specified by the number of images taken. In this case, it is not necessary to manage the image data with the serial number.
(5) Instead of providing the camera 3 for photographing the manufacturing process separately, the manufacturing process may be photographed using a camera attached for the purpose of controlling the manufacturing apparatus.
(6) The electronic device that performs failure analysis using the storage system 1 according to the embodiment of the present invention is not particularly limited as long as it includes a memory that stores image data and the like. For example, a navigation device may be used. Since the navigation device includes a memory for storing a program for executing processing such as route guidance, image data and the like can be stored in the memory. In this case, when the navigation program is written in the memory, the inspection image data is stored in the memory.

  The above description is merely an example, and the present invention is not limited to the above embodiment.

It is a figure for demonstrating the structure of the storage system of embodiment of this invention. It is a figure for demonstrating the structure of a database. It is a figure for demonstrating the manufacturing process of a board | substrate. It is a figure for demonstrating the imaging | photography method of the board | substrate which divides | segments and image | photographs. It is a figure for demonstrating substitution by the serial number of the file name of the image | photographed image. It is a figure for demonstrating the assembly process of an electronic device. It is a flowchart for demonstrating the process of storing the image data of a board | substrate in a database. It is a flowchart for demonstrating the process of storing the image data of the board | substrate which mounted the electronic component in a mounter in a database. It is a flowchart for demonstrating the process of storing the image data of the board | substrate which attached components manually in a database. It is a flowchart for demonstrating the process of storing the electrical test result of a board | substrate in a database. It is a flowchart for demonstrating the process of storing the X-ray image of a board | substrate in a database. It is a flowchart for demonstrating the process of storing the image which image | photographed the assembly process of the electronic device in a database. It is a flowchart for demonstrating the process of storing the serial number of the box which packed the electronic device in a database. It is a flowchart for demonstrating a defect analysis process. It is a flowchart for demonstrating the manufacturing process of an electronic device.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Storage system 2 Server 3 Camera 4 Electrical inspection apparatus 5 X-ray camera 6 Memory 21 Database 41 Board | substrate 45 Processor 61, 65 Box 63 Electronic device

Claims (7)

A storage device;
A processor that executes predetermined processing based on various data stored in the storage device;
Comprising at least the storage device and a substrate on which the processor is mounted;
An electronic apparatus characterized in that the storage device stores at least image data of a substrate in a manufacturing process. In the apparatus for manufacturing the electronic device according to claim 1,
Imaging means for imaging the substrate in each manufacturing step;
A server that stores image data obtained by imaging the substrate for each manufacturing process;
An electronic apparatus manufacturing apparatus comprising: control means for transferring image data of the substrate stored in the server to a storage device of the substrate. In the electronic device manufacturing apparatus according to claim 2,
Recognizing means for recognizing the identification number assigned to the substrate based on the image data;
An apparatus for manufacturing an electronic apparatus, wherein image data obtained by photographing in each manufacturing process is stored in the server in association with the recognized identification number. In the electronic device manufacturing apparatus according to claim 3,
When transferring the image data stored in the server to the storage device of the electronic device, the control means specifies the data transfer destination electronic device based on the identification number, and associates the identification number with the identification number. A device for manufacturing an electronic device, wherein the image data is transferred to a corresponding storage device. In the electronic device manufacturing apparatus according to any one of claims 2 to 4,
The electronic device manufacturing apparatus, wherein the control means transfers image data of the substrate to a storage device of the substrate through an electric communication line. In the electronic device failure analysis method according to claim 1,
Read image data in the manufacturing process stored in the storage device,
A failure analysis method, wherein the image data is displayed on a monitor or printed to analyze the failure. A storage device storing at least image data of the substrate in the manufacturing process;
A board on which a processor that executes a predetermined process based on various data stored in the storage device is mounted.

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