JP6991277B2 - Production control method and production control system - Google Patents

Description

This specification discloses a technique relating to a production control method and a production control system including a step of capturing an image of the mounting state of a component mounted on a substrate from above and acquiring a mounting state image .

In the component mounting line that produces component mounting boards, as described in Patent Document 1 (International Publication WO2014 / 068664), in the middle or the most downstream of the component mounting line in which a plurality of component mounting machines are arranged, Each component mounting machine is equipped with an inspection machine that inspects the mounting status of components mounted on the board (misalignment of component mounting position or missing parts). Generally, the inspection machine captures the mounting state of each component of the board carried out from the component mounting machine with an inspection camera, processes the image, recognizes the mounting state of each component, and based on the recognition result, each We are trying to inspect the presence or absence of mounting defects (pass / fail inspection) of parts.

On the other hand, the component mounting machine captures the adsorption state of the component adsorbed on the adsorption nozzle from below with a component image pickup camera, processes the image, measures the deviation of the adsorption position / angle of the component, and adsorbs the component. In addition to correcting the deviation of the position and angle and mounting it on the board, in order to investigate the cause when an error such as a mounting defect occurs, the image of the suction state of the component captured by the component imaging camera is the production information related to the component (the relevant). It is stored in the storage device in association with traceability information such as the component mounting machine on which the component is mounted, the mounting time, the mounting position, and the board identification information).

International Publication WO2014 / 068664

When the inspection machine detects a mounting defect of any part on the board, the operator views the image of the mounting state of the part captured by the inspection machine on the display monitor of the inspection machine in order to investigate the cause. Check if there are any problems such as misrecognition in the inspection results, and if there are no problems such as misrecognition in the inspection results, it is considered that there is a cause of mounting failure on the component mounting machine side, so component mounting It is common practice to view an image of the suction state of a component captured on the machine side on the display monitor of the component mounting machine to check whether the recognition result has a problem such as erroneous recognition. At this time, when confirming the image of the suction state of the component captured on the component mounting machine side, the operator can check the inspection information (inspection result, component type, inspection time, etc.) regarding the component determined to be mounting defect by the inspection machine. The mounting position, board identification information, etc.) are acquired from the inspection machine, and from the images of the suction state of the parts stored in the storage device, the image of the suction state of the component determined to be mounting defect is captured. It is selected based on the inspection information and the production information about the component, and the image is displayed on the display monitor of the component mounting machine to confirm the suction state of the component determined to be mounting defect.

In this way, when the inspection machine detects a mounting defect of any part on the board, the operator sees the image of the mounting state of the part on the inspection machine side and has a problem such as erroneous recognition in the inspection result. After confirming that there is no such thing, it is necessary to check the image of the suction state of the component on the component mounting machine side to see if there is a problem such as erroneous recognition in the recognition result, and it is troublesome to confirm both images. It takes. Also, if the inspection machine detects a mounting defect of any part on the board, either the inspection machine or the part mounting machine may misrecognize the state of the part, but the mounting state of the part If you check the image of the image and the image of the suction state of the component separately, it may be difficult to tell which of the inspection machine and the component mounting machine misrecognizes the state of the component.

The present invention has a step of acquiring a suction state image by imaging the suction state of a component sucked on a suction nozzle from below, a step of mounting the component on a substrate, and a mounting state of the component mounted on the substrate. The process of acquiring a mounting state image by imaging from above and the adsorption state image including the image processing result of image processing of the captured image captured from below and the mounting state image are compared on the display device. It is a production control method including a process of displaying.

FIG. 1 is a block diagram schematically showing a configuration of a production control system for a component mounting line in one embodiment. FIG. 2 is a diagram showing an image of a suction state of the component (A) displayed on the display monitor of the component mounting machine. FIG. 3 is a diagram showing an image of a mounted state of the component (A) displayed on the display monitor of the inspection machine. FIG. 4 is a diagram showing a two-image display in which an image of a suction state of a component (A) and an image of a mounting state of a component (A) are displayed side by side for comparison. FIG. 5 is a diagram showing an overlay display in which an image of the suction state of the component (A) and an image of the mounting state of the component (A) are superimposed and displayed for comparison. FIG. 6 is a diagram showing an image of a suction state of the component (B) displayed on the display monitor of the component mounting machine. FIG. 7 is a diagram showing an image of a mounted state of the component (B) displayed on the display monitor of the inspection machine. FIG. 8 is a diagram showing a two-image display in which an image of a suction state of a component (B) and an image of a mounting state of a component (B) are displayed side by side for comparison. FIG. 9 is a diagram showing an overlay display in which an image of the suction state of the component (B) and an image of the mounting state of the component (B) are superimposed and displayed for comparison. FIG. 10 is a flowchart showing the processing flow of the production control program.

Hereinafter, an embodiment will be described with reference to the drawings.
First, the configuration of the component mounting line 10 will be described with reference to FIG.
The component mounting line 10 is provided on one or more component mounting machines 12 along the transport direction of the board 11, mounting related machines such as a solder printing machine 13 and a flux coating device (not shown), and the board 11. It is configured by arranging an inspection machine 14 for inspecting the quality of the mounted state of each mounted component. The number of inspection machines 14 installed in the component mounting line 10 is not limited to one, and may be a plurality of inspection machines, and some of the inspection machines are the component mounting machines 12 in the middle of the component mounting line 10. It may be installed in between.

Each component mounting machine 12, solder printing machine 13, and inspection machine 14 of the component mounting line 10 are connected to each other via a network 16 so as to be communicable with the production control computer 21, and the component mounting line is connected by the production control computer 21. 10 productions are controlled.

Further, a board ID recording unit 31 (board identification information recording unit) that records or stores board identification information (hereinafter referred to as “board ID”) is provided outside the component mounting area on the upper surface of the board 11. There is. The board ID recording unit 31 may record a code such as a bar code or a two-dimensional code, or may be an electronic tag (also referred to as an RF tag, a wireless tag, an IC tag, a radio wave tag, etc.) that is electronically stored. A magnetic tape or the like for magnetically recording may be used.

On the other hand, on the board carry-in side of the component mounting line 10, a reader 32 is provided as a board identification information reading device for reading the board ID recorded or stored in the board ID recording unit 31.

The production management computer 21 that manages the production of the component mounting line 10 is a reader 32 arranged on the board loading side of the component mounting line 10, and is a board ID from the board ID recording unit 31 of the board 11 carried into the component mounting line 10. Is read, the board ID is transmitted to each component mounting machine 12 and the inspection machine 14, and the board ID of the board 11 to be conveyed is notified to each component mounting machine 12 and the inspection machine 14. As a result, the control device 17 of each component mounting machine 12 and the control device 23 of the inspection machine 14 make the order of the boards 11 to be carried in and the order of the board IDs read by the reader 32 correspond to each other from the first board 11. Then, the board ID of the board 11 carried into each component mounting machine 12 and the inspection machine 14 is recognized.

Alternatively, when the board 11 on which the parts are mounted by each component mounting machine 12 is transported to the component mounting machine 12 or the inspection machine 14 on the downstream side thereof, the board ID of the board 11 is transferred from each component mounting machine 12 to the downstream side. By transmitting to the component mounting machine 12 and the inspection machine 14, the board ID of the board 11 carried into each component mounting machine 12 and the inspection machine 14 may be recognized.

The control device 17 of each component mounting machine 12 moves the mounting head (not shown) in the route of component suction position → component imaging position → component mounting position according to the production job transmitted from the production management computer 21. , The component supplied from the feeder 19 is attracted to the suction nozzle (not shown) of the mounting head, the component is imaged by the component image pickup camera 18, and the captured image is processed by the image processing function of the control device 17. The operation of recognizing the suction state (positions X and Y and the angle θ) of the component, correcting the deviation of the positions X and Y and the angle θ of the component, and mounting the component on the substrate 11 is repeated. A predetermined number of components are mounted on the board 11. Therefore, the control device 17 of each component mounting machine 12 also serves as an "image processing device" within the scope of the claims.

Further, the control device 17 of each component mounting machine 12 captures an image of the suction state of the component captured by the component imaging camera 18 with production information regarding the component (component mounting machine 12 on which the component is mounted, component type, mounting time). , Mounting position, traceability information such as board ID), and stored in the storage device 20. The storage device 20 has a storage capacity capable of storing a number of images necessary for investigating the cause when an abnormality occurs in the component mounting machine 12, and is a rewritable non-volatile storage medium (for example,) that retains storage data even when the power is off. It is composed of a hard disk device, etc.). When the number of stored images in the storage device 20 exceeds a predetermined number or a predetermined memory capacity, the oldest stored image is automatically deleted and the latest image is stored.

The control device 17 of the component mounting machine 12 transmits an image of the suction state of the component captured by the component imaging camera 18 to the production management computer 21 in association with the production information related to the component, and produces these data. The storage device 33 of the management computer 21 may be classified and stored for each component mounting machine 12. Alternatively, in an external storage (not shown) such as an image storage server connected to the network 16 of the component mounting line 10, an image of the suction state of the component is associated with the production information related to the component and classified by the component mounting machine 12. You may save it.

The component mounting board produced by sequentially passing through each component mounting machine 12 of the component mounting line 10 is carried into the inspection machine 14. The control device 23 of the inspection machine 14 is equipped with an image processing function, captures the mounting state of each component of the carried-in substrate 11 with the inspection camera 28, processes the captured image, and processes the captured image on the substrate 11. It recognizes the mounting state of each component and inspects the presence or absence of mounting defects (inspection failure) of each component based on the recognition result.

Further, the control device 23 of the inspection machine 14 associates the image of the mounting state of the component captured by the inspection camera 28 with the inspection information (part type, inspection time, mounting position, board ID, etc.) related to the component and stores the image. It is stored in 24 (inspection information storage unit). The storage device 24 has a storage capacity capable of storing a number of images necessary for investigating the cause when an abnormality occurs in the component mounting machine 12, and is a rewritable non-volatile storage medium (for example,) that retains storage data even when the power is off. It is composed of a hard disk device, etc.). When the number of stored images in the storage device 24 exceeds a predetermined number or a predetermined memory capacity, the oldest stored image is automatically deleted and the latest image is stored.

The control device 23 of the inspection machine 14 transmits an image of the mounted state of the inspected component to the production control computer 21 in association with the inspection information related to the component, and stores these data in the storage device of the production control computer 21. You may save it in 33. Alternatively, the image of the mounting state of the component may be saved in association with the inspection information related to the component in an external storage (not shown) such as an image storage server connected to the network 16 of the component mounting line 10. good.

Each component mounting machine 12 is provided with a display monitor 25 (display device), and the inspection machine 14 is also provided with a display monitor 26 (display device). Further, the production control computer 21 is also provided with a display monitor 27 (display device).

The control device 17 of each component mounting machine 12 captures an image of the suction state of the component captured by the component imaging camera 18 with production information regarding the component (component mounting machine 12 on which the component is mounted, component type, mounting time, mounting). When the information is stored in the storage device 20 in association with the traceability information such as the position and the board ID, the production information related to the part is transmitted to the production management computer 21 and / or the inspection machine 14. Further, when the control device 23 of the inspection machine 14 detects a mounting defect of any part on the substrate 11 by the inspection machine 14, inspection information (inspection result, part type, inspection time, mounting position, etc.) regarding the part is detected. The board ID, etc.) is transmitted to the production control computer 21. As a result, the production management computer 21 collates the inspection information received from the inspection machine 14 with the production information received from each component mounting machine 12, so that the component mounting machine 12 on which the component determined to be mounting defect is mounted is mounted. From the stored images of the storage device 20 of the specified component mounting machine 12, an image of the suction state of the component determined to be mounting defect is searched for and acquired. Similarly, the control device 23 of the inspection machine 14 also collates the inspection information regarding the parts determined to be mounting defects with the production information received from each component mounting machine 12, and thereby the parts to which the parts determined to be mounting defects are mounted. The mounting machine 12 may be specified, and an image of the suction state of the component determined to be mounting defect may be searched and acquired from the stored images of the storage device 20 of the specified component mounting machine 12. ..

When the inspection machine 14 detects a mounting defect of any component on the substrate 11 by executing the production control program of FIG. 10 described later, the production control computer 21 or the control device 23 of the inspection machine 14 is executed. By collating the inspection information about the parts determined to be mounting defects with the production information received from each component mounting machine 12, the component mounting machine 12 on which the components determined to be mounting defects are mounted is specified, and the specified components are identified. It functions as an "image search unit" that searches for an image of the adsorption state of the component determined to be mounting defect from the stored images of the storage device 20 of the mounting machine 12, and the mounting state of the component determined to be mounting defect. The image of the above and the searched image of the suction state of the component are compared and displayed on the display monitor 27 of the production control computer 21 or the display monitor 26 of the inspection machine 14. Alternatively, both images may be compared and displayed on the display monitor 25 of the component mounting machine 12 on which the component determined to be defective is mounted.

In this embodiment, the image data of the suction state of the component stored in the storage device 20 includes the recognition result of the image processing, and the image of the suction state of the component displayed on any of the display monitors 25 to 27 includes the recognition result of the component. As shown in FIGS. 2, 4 to 6, 8 and 9, the contour lines (outer lines) of the parts recognized by the image processing are displayed. In this way, if the contour line of the component recognized by the image processing is displayed on the image of the suction state of the component, the operator can easily determine whether or not the recognition result of the image processing of the component mounting machine 12 is erroneous recognition. You can judge. 2 to 5 are display examples of images of the same component (A), and FIGS. 6 to 9 are display examples of images of the same component (B).

Further, as shown in FIGS. 3 to 5 and 7 to 9, the contour line of the component in the correct mounted state is displayed on the image of the mounted state of the component displayed on any of the display monitors 25 to 27. I have to. By doing so, the operator can easily determine whether or not the inspection result of the inspection machine 14 is erroneous recognition based on the contour line of the component in the correct mounting state displayed in the image of the mounting state of the component. ..

Further, the image of the suction state of the component and the image of the mounting state of the component to be comparatively displayed on any of the display monitors 25 to 27 are compared and displayed by matching the component display magnification (display size of the component).

Here, as a mode of comparative display of both images, as shown in FIGS. 4 and 8, even if the image of the mounted state of the component and the image of the suction state of the component are displayed side by side side by side or vertically. Alternatively, as shown in FIGS. 5 and 9, the image of the mounting state of the component and the image of the suction state of the component may be superimposed and displayed for comparison.

Further, in this embodiment, a two-image display in which an image of a component mounting state and an image of a component adsorption state are displayed side by side for comparison and display, and an image of the component mounting state and an image of the component adsorption state are displayed. It is configured so that the operator can switch between the overlay display and the overlay display for overlapping comparison display.

By the way, since the component image pickup camera 18 of the component mounting machine 12 captures the suction state of the component sucked on the suction nozzle from below, the image of the component suction state captured by the component image pickup camera 18 is the lower surface of the component. The image is viewed from the side (see FIGS. 2 and 6). On the other hand, since the inspection camera 28 of the inspection machine 14 captures the mounted state of each component of the substrate 11 from above, the image of the mounted state of the component captured by the inspection camera 28 is viewed from the upper surface side of the component. It becomes an image (see FIGS. 3 and 7). Therefore, the image of the mounted state of the component and the image of the suction state of the component have different XY directions.

Therefore, in this embodiment, as shown in FIGS. 4 and 5, the XY direction of the image of the component mounting state and the XY direction of the image of the component suction state are set with reference to the XY coordinate system of the component mounting machine 12. One of the images is flipped and rotated so that the two images are compared and displayed so as to match. In the display examples of FIGS. 4 and 5, the images of the suction state of the parts are inverted.

Generally, when the recognition angle of the component recognized by processing the image of the suction state of the component and the correct mounting angle of the component are different, the component mounting machine 12 attracts the component to the suction nozzle by the difference between the angles. The angle of is corrected for rotation and mounted on the substrate 11.

In consideration of this point, in this embodiment, when the recognition angle of the component recognized by processing the image of the suction state of the component and the correct mounting angle of the component are different, they are shown in FIGS. 8 and 9. In this way, either image is flipped and rotated so that the correct mounting angle of the component in the image of the mounted state of the component matches the recognition angle of the component in the image of the suction state of the component. It is designed to be compared and displayed. By doing so, even when the angle of the component sucked on the suction nozzle is rotationally corrected and mounted on the substrate 11, it becomes easier to compare both images. In the display examples of FIGS. 8 and 9, the images of the suction state of the parts are inverted.

Further, in this embodiment, a component to be displayed on any of the display monitors 25 to 27 from the image of the mounted state of the component stored in the storage device 33 of the production management computer 21 or the storage device 24 of the inspection machine 14. The image of the mounting state of the above is configured so that the operator can select the image of the mounting state, and the control device 23 of the production control computer 21 or the inspection machine 14 or the control device 17 of the component mounting machine 12 is configured by the operator to be any of the display monitors 25 to 27. When the image of the mounted state of the component to be displayed is selected, the suction state of the component selected by the operator from the stored images of the storage device 20 or 33 based on the inspection information and the production information regarding the component is displayed. The captured image is searched, and the image of the mounted state of the component selected by the operator and the image of the attracted state of the searched component are compared and displayed on any of the display monitors 25 to 27. By doing so, the operator can freely select the image to be displayed on any of the display monitors 25 to 27, and the cause of the mounting defect can be investigated in more detail.

Next, the processing contents of the production control program of FIG. 10 executed by the production control computer 21 or the control device 23 of the inspection machine 14 will be described. The production control program of FIG. 10 is executed during production. When this program is started, first, in step 101, it is determined whether or not the inspection machine 14 has detected a mounting defect of any component on the substrate 11, and a mounting defect of any component is detected. Wait until. After that, when a mounting defect of any of the components is detected, the process proceeds to step 102 to acquire inspection information regarding the component determined to be a mounting defect.

After that, the process proceeds to step 103, and the inspection information regarding the parts determined to be mounting defects is collated with the production information received from each component mounting machine 12, so that the component mounting machine 12 on which the components determined to be mounting defects are mounted is collated. To identify. Then, in the next step 104, the image obtained by capturing the suction state of the component determined to be mounting defect is searched from the stored images of the storage device 20 or the like of the specified component mounting machine 12. The processes of steps 102 to 104 serve as an "image search unit".

After that, the process proceeds to step 105, and as shown in FIGS. 4 and 5, the XY direction of the image of the component mounting state and the XY direction of the image of the component suction state with reference to the XY coordinate system of the component mounting machine 12. One of the images, for example, the image of the suction state of the component, is flipped and rotated so as to match. At this time, if the recognition angle of the component recognized by processing the image of the suction state of the component is different from the correct mounting angle of the component, the image of the mounting state of the component is shown as shown in FIGS. 8 and 9. One of the images, for example, the image of the suction state of the component, is flipped and rotated so that the correct mounting angle of the component inside and the recognition angle of the component in the image of the suction state of the component match.

Then, in the next step 106, the image of the mounting state of the component determined to be mounting defect and the image of the suction state of the component are compared and displayed on the display monitor 27 of the production control computer 21 or the display monitor 26 of the inspection machine 14. .. Alternatively, both images may be compared and displayed on the display monitor 25 of the component mounting machine 12 on which the component determined to be defective is mounted. As shown in FIGS. 4 and 8, this comparative display is a two-image display in which an image of a component mounting state and an image of a component adsorption state are displayed side by side side by side or vertically, or in FIGS. 5 and 9. As shown, it may be either an overlay display in which an image of a component mounting state and an image of a component adsorption state are superimposed and comparatively displayed.

According to the present embodiment described above, when any part on the substrate 11 is determined to be mounting failure by the inspection machine 14, the stored image of the storage device 20 or 33 or the like is obtained based on the production information about the part. An image of the suction state of the component determined to be mounting defect is searched from among them, and an image of the mounting state of the component determined to be mounting failure by the inspection machine 14 and an image of the suction state of the searched component are obtained. Is displayed in comparison with any of the display monitors 25 to 27. Therefore, when any component on the substrate 11 is determined to be defective in mounting by the inspection machine 14, the suction state of the component determined to be defective in mounting is obtained. The operator does not have to select the image of the above from a large number of saved images, and the image of the mounted state of the component determined to be defective and the image of the suction state of the component are displayed on the monitors 25 to 27. The comparison display can be automatically performed on either of them, and the operator can efficiently check the inspection result of the inspection machine 14 and the recognition result of the component mounting machine 12 by viewing the comparison display of these two images. Can be done.

Moreover, when either the inspection machine 14 or the component mounting machine 12 misrecognizes the state of the component, the image of the mounted state of the component determined to be mounting defect and the image of the suction state of the component are compared and displayed. This also has the advantage of making it easier to see which of the inspection machine 14 and the component mounting machine 12 misrecognizes the state of the component.

It is needless to say that the present invention is not limited to the above embodiment, and can be variously modified within a range that does not deviate from the gist, for example, the configuration of the component mounting line 10 may be modified.

10 ... component mounting line, 11 ... board, 12 ... component mounting machine, 14 ... inspection machine, 17 ... component mounting machine control device, 18 ... component imaging camera, 20 ... storage device, 21 ... production management computer (image) Search unit), 23 ... Inspection machine control device (image search unit), 24 ... Storage device, 25-27 ... Display monitor (display device), 28 ... Inspection camera, 31 ... Board ID recording unit (board identification information recording) Part), 32 ... Reader (board identification information reader), 33 ... Storage device

Claims (11)

The process of acquiring the suction state image by imaging the suction state of the parts sucked on the suction nozzle from below, and
The process of mounting the components on the board and
The process of acquiring the mounting state image by imaging the mounting state of the component mounted on the board from above, and
A step of comparing and displaying the adsorption state image including the image processing result of the image processed from the image captured from below and the mounting state image on the display device.
Production control method with. The production control method according to claim 1, wherein the step of comparative display is to display the contour line of the component in the captured image recognized by the image processing as the image processing result. The production control method according to claim 1 or 2, wherein in the step of comparative display, the adsorption state image includes the image processing result and the captured image. The production control method according to any one of claims 1 to 3, wherein the step of comparatively displaying the adsorption state image and the mounting state image including an image showing a correct mounting state are comparatively displayed on the display device. The process of acquiring the suction state image by imaging the suction state of the parts sucked on the suction nozzle from below, and
The process of mounting the components on the board and
The process of capturing the mounting state of the component mounted on the substrate from above and acquiring the mounting state image, and
A step of comparing and displaying the adsorption state image and the mounting state image including an image showing the correct mounting state on a display device, and
Production control method with. A step of storing the adsorption state image acquired in the step of acquiring the adsorption state image in association with production information related to the component, and a step of storing the image.
A step of searching the adsorption state image of the component included in the mounting state image acquired in the step of acquiring the mounting state image based on production information about the component, and a step of searching.
The production control method according to claim 5 , further comprising. The production control method according to claim 5 or 6 , wherein the comparative display step comprises a step of displaying and reversing one of the images so that the directions of the adsorption state image and the mounting state image match. Further provided with a step of image-processing the adsorption state image acquired in the step of acquiring the adsorption state image and recognizing the adsorption state of the component.
The steps 5 to 7 include the step of displaying the contour line of the component based on the adsorption state of the component recognized in the step of recognizing the adsorption state on the adsorption state image. The production control method described in either. The production control method according to any one of claims 5 to 8 , wherein the step of comparative display includes a step of displaying a contour line of a component in a correct mounting state on the mounting state image. A suction nozzle that sucks the parts and mounts the sucked parts on the substrate,
A component image pickup camera that acquires an image by capturing the suction state of the component adsorbed by the suction nozzle from below.
An image processing device that performs image processing on the captured image acquired by the component imaging camera and recognizes the adsorption state of the component.
An inspection camera that captures the mounting state of the component mounted on the substrate from above by the suction nozzle and acquires a mounting state image.
A display device for comparing and displaying the adsorption state image including the image processing result of the captured image by the image processing device and the mounting state image acquired by the inspection camera.
Production control system equipped with. A suction nozzle that sucks the parts and mounts the sucked parts on the substrate,
A component image pickup camera that captures the suction state of the component sucked by the suction nozzle from below and acquires a suction state image.
An inspection camera that captures the mounting state of the component mounted on the substrate from above by the suction nozzle and acquires a mounting state image.
A display device that compares and displays the adsorption state image acquired by the component imaging camera, the mounting state image acquired by the inspection camera, and an image showing the correct mounting state of the component.
Production control system equipped with.

Images