JP2021147701A - 高周波回路用表面処理銅箔及びその製造方法 - Google Patents
高周波回路用表面処理銅箔及びその製造方法 Download PDFInfo
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
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- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C8/00—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
- C23C8/06—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases
- C23C8/08—Solid state diffusion of only non-metal elements into metallic material surfaces; Chemical surface treatment of metallic material by reaction of the surface with a reactive gas, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using gases only one element being applied
- C23C8/10—Oxidising
- C23C8/12—Oxidising using elemental oxygen or ozone
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
- C25D5/50—After-treatment of electroplated surfaces by heat-treatment
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/385—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by conversion of the surface of the metal, e.g. by oxidation, whether or not followed by reaction or removal of the converted layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/04—Wires; Strips; Foils
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/38—Chromatising
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/60—Electroplating characterised by the structure or texture of the layers
- C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0635—In radial cells
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Laminated Bodies (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
Description
銅微粒子処理:
硫酸銅 Cu 7.0g/L(金属換算)
硫酸 60g/L
浴温度 20℃
電流密度 23A/dm2
めっき時間 2〜3sec
銅かぶせめっき処理:
硫酸銅 Cu 7.0g/L(金属換算)
硫酸 60g/L
浴温度 20℃
電流密度 5A/dm2
めっき時間 2〜3sec
4元系金属被膜用めっき条件:
めっき浴組成
CrO3 Cr 0.7g/L(金属換算、以下同じ)
Na2MoO4・2H2O Mo 4.1g/L
ZnSO4・7H2O Zn 2.6g/L
NiSO4・2H2O Ni 2.0g/L
硫酸ナトリウム 15g/L
塩化物含有量 40ppm
PH 3.7
(pH調整は希硫酸または水酸化ナトリウム希薄溶液による)
電流密度 2.5A/dm2
めっき時間 2sec
目付量:
Cr 2.5mg/m2(金属換算、以下同じ)
Mo 38mg/m2
Zn 57mg/m2
Ni 25mg/m2
クロメート処理条件:
CrO3 Cr 1.5g/L(金属換算)
pH 2.0
電流密度 2A/dm2
めっき時間 2sec
市販のアミノ系シランカップリング剤
乾燥条件 85℃ × 10sec
亜鉛めっき条件:
めっき浴組成
ZnSO4・7H2O Zn 0.8g/L(金属換算)
電流密度 2A/dm2
めっき時間 2sec
目付量:
Zn 20mg/m2
Cr 4mg/m2
実施例及び比較例の表面処理銅箔について、2種類の高周波回路用のプリプレグを使用して、高温熱処理におけるブリスターの発生評価を行った。プリプレグAとしてパナソニック製MEGTORON6、プリプレグBとして韓国斗山電子社製DS−7409−DVを用いた。
Claims (3)
- 厚さ35μm以下の銅箔の表面に耐熱処理層が形成された高周波回路用表面処理銅箔において、
耐熱処理層は、クロム、モリブデン、亜鉛、ニッケルの4元系金属酸化物とその化合物からなる被膜であることを特徴とする高周波回路用表面処理銅箔。 - 耐熱処理層は、金属換算でクロム0.1〜18mg/m2、モリブデン10〜45mg/m2、亜鉛30〜70mg/m2、ニッケル10〜30mg/m2の目付量である請求項1に記載の高周波回路用表面処理銅箔。
- 金属換算で0.2〜6.0g/Lのクロム、1.0〜9.0g/Lのモリブデン、1.0〜8.0g/Lの亜鉛、1.0〜7.0g/Lのニッケルを含む4元系金属被膜用めっき浴を用い、pH3〜4、電流密度0.5〜5.0A/dm2の条件で、厚さ35μm以下の銅箔の表面に表面処理をした後、10〜50秒間の大気中放置を行うことを特徴とする高周波回路用表面処理銅箔の製造方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
LU101698A LU101698B1 (en) | 2020-03-18 | 2020-03-18 | Surface-treated copper foil for high-frequency circuit and method for producing same |
LU101698 | 2020-03-18 |
Publications (2)
Publication Number | Publication Date |
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JP2021147701A true JP2021147701A (ja) | 2021-09-27 |
JP7194716B2 JP7194716B2 (ja) | 2022-12-22 |
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Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020156978A Active JP7194716B2 (ja) | 2020-03-18 | 2020-09-18 | 高周波回路用表面処理銅箔及びその製造方法 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20210298213A1 (ja) |
EP (1) | EP3882378B1 (ja) |
JP (1) | JP7194716B2 (ja) |
KR (1) | KR102635176B1 (ja) |
CN (1) | CN113498255A (ja) |
LU (1) | LU101698B1 (ja) |
TW (1) | TWI799802B (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7434656B1 (ja) | 2023-08-31 | 2024-02-20 | Jx金属株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114025516A (zh) * | 2021-11-19 | 2022-02-08 | 深圳玛斯兰电路科技实业发展有限公司 | 高频混压板的制作方法 |
LU501394B1 (en) | 2022-02-07 | 2023-08-07 | Circuit Foil Luxembourg | Surface-treated copper foil for high-frequency circuit and method for producing the same |
Citations (2)
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KR20090081897A (ko) * | 2008-01-25 | 2009-07-29 | 엘에스엠트론 주식회사 | 내열 특성이 개선된 인쇄회로용 동박 |
WO2013115382A1 (ja) * | 2012-02-03 | 2013-08-08 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品 |
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JPH06294862A (ja) | 1993-04-07 | 1994-10-21 | Mitsubishi Heavy Ind Ltd | 誘導標識画像処理式走行装置 |
JP4927503B2 (ja) * | 2005-12-15 | 2012-05-09 | 古河電気工業株式会社 | キャリア付き極薄銅箔及びプリント配線基板 |
JP4827952B2 (ja) * | 2008-07-07 | 2011-11-30 | 古河電気工業株式会社 | 電解銅箔および銅張積層板 |
JP5764700B2 (ja) | 2013-06-07 | 2015-08-19 | 古河電気工業株式会社 | 高周波基板用銅張り積層板及び表面処理銅箔 |
JP5651811B1 (ja) * | 2013-06-13 | 2015-01-14 | Jx日鉱日石金属株式会社 | キャリア付銅箔、銅張積層板、プリント配線板、電子機器、及び、プリント配線板の製造方法 |
KR20170038969A (ko) * | 2015-09-30 | 2017-04-10 | 일진머티리얼즈 주식회사 | 표면처리동박 및 그의 제조방법 |
TWI597390B (zh) * | 2015-11-10 | 2017-09-01 | Jx Nippon Mining & Metals Corp | Electrolytic copper foil, manufacturing method of electrolytic copper foil, copper clad laminated board, printed wiring board, the manufacturing method of a printed wiring board, and the manufacturing method of an electronic device |
JP6294862B2 (ja) | 2015-12-09 | 2018-03-14 | 古河電気工業株式会社 | プリント配線板用表面処理銅箔、プリント配線板用銅張積層板及びプリント配線板 |
JP6854114B2 (ja) | 2016-01-04 | 2021-04-07 | Jx金属株式会社 | 表面処理銅箔 |
US10448507B2 (en) * | 2016-01-15 | 2019-10-15 | Jx Nippon Mining & Metals Corporation | Copper foil, copper-clad laminate board, method for producing printed wiring board, method for producing electronic apparatus, method for producing transmission channel, and method for producing antenna |
US10820414B2 (en) * | 2016-12-05 | 2020-10-27 | Jx Nippon Mining & Metals Corporation | Surface treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device |
JP7492808B2 (ja) * | 2017-03-31 | 2024-05-30 | Jx金属株式会社 | 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
JP7055049B2 (ja) * | 2017-03-31 | 2022-04-15 | Jx金属株式会社 | 表面処理銅箔及びそれを用いた積層板、キャリア付銅箔、プリント配線板、電子機器、並びに、プリント配線板の製造方法 |
WO2019049834A1 (ja) * | 2017-09-06 | 2019-03-14 | 関東電化工業株式会社 | 電極及びその製造方法並びに再生電極の製造方法 |
-
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- 2020-03-18 LU LU101698A patent/LU101698B1/en active IP Right Grant
- 2020-09-18 JP JP2020156978A patent/JP7194716B2/ja active Active
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- 2021-01-11 KR KR1020210003353A patent/KR102635176B1/ko active IP Right Grant
- 2021-02-25 US US17/184,907 patent/US20210298213A1/en not_active Abandoned
- 2021-03-05 CN CN202110242800.4A patent/CN113498255A/zh active Pending
- 2021-03-05 TW TW110107962A patent/TWI799802B/zh active
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Patent Citations (2)
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KR20090081897A (ko) * | 2008-01-25 | 2009-07-29 | 엘에스엠트론 주식회사 | 내열 특성이 개선된 인쇄회로용 동박 |
WO2013115382A1 (ja) * | 2012-02-03 | 2013-08-08 | Jx日鉱日石金属株式会社 | プリント配線板用銅箔及びそれを用いた積層体、プリント配線板及び電子部品 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP7434656B1 (ja) | 2023-08-31 | 2024-02-20 | Jx金属株式会社 | 表面処理銅箔、銅張積層板、及びプリント配線板の製造方法 |
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Publication number | Publication date |
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KR102635176B1 (ko) | 2024-02-13 |
LU101698B1 (en) | 2021-09-20 |
US20210298213A1 (en) | 2021-09-23 |
TWI799802B (zh) | 2023-04-21 |
CN113498255A (zh) | 2021-10-12 |
EP3882378A1 (en) | 2021-09-22 |
TW202136588A (zh) | 2021-10-01 |
JP7194716B2 (ja) | 2022-12-22 |
EP3882378B1 (en) | 2024-07-17 |
KR20210117916A (ko) | 2021-09-29 |
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