JP2021145068A - 半導体装置及び半導体装置の製造方法 - Google Patents
半導体装置及び半導体装置の製造方法 Download PDFInfo
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- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
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Abstract
Description
半導体基板と、
前記半導体基板の第1の面に設けられた電極パッドと、
前記電極パッドに電気的に接続された再配線と、
前記半導体基板の前記第1の面とは反対側の第2の面から前記半導体基板を貫通して前記電極パッドに達する貫通孔と、
前記貫通孔の内壁を覆い、前記電極パッドに電気的に接続された導電膜と、
前記半導体基板の第2の面の側に設けられ、前記導電膜を介して前記電極パッドに電気的に接続された導電性接着剤と、
前記導電性接着剤によって前記半導体基板の第2の面に接合された放熱部材と、
前記貫通孔に充填され、前記導電性接着剤よりも熱膨張率が小さい充填部材と、
を含む半導体装置。
前記充填部材は、フィラー含有樹脂を含む
付記1に記載の半導体装置。
前記フィラー含有樹脂に含まれるフィラーの含有率が85%以上である
付記2に記載の半導体装置。
前記フィラー含有樹脂に含まれるフィラーは、直径0.5μm以上10μm以下の球形である
付記2または付記3に記載の半導体装置。
前記フィラー含有樹脂に含まれるフィラーの直径は不均一である
付記4に記載の半導体装置。
前記半導体基板とは別の第2の半導体基板と、
前記半導体基板及び前記第2の半導体基板を一体的に封止する封止部材と、を更に含み、
前記半導体基板及び前記第2の半導体基板は、前記再配線を介して互いに電気的に接続されている
付記1から付記5のいずれか1つに記載の半導体装置。
第1の面に電極パッドを有する半導体基板の、前記第1の面とは反対側の第2の面から前記電極パッドに達する貫通孔を形成する工程と、
前記貫通孔の内壁を覆い、前記電極パッドに電気的に接続された導電膜を形成する工程と、
前記貫通孔に充填部材を充填する工程と、
前記電極パッドに電気的に接続された再配線を形成する工程と、
前記半導体基板の前記第2の面に前記導電膜を介して前記電極パッドに電気的に接続された導電性接着剤を形成する工程と、
前記導電性接着剤によって前記半導体基板の前記第2の面に接合された放熱部材を形成する工程と、を含み、
前記充填部材は、前記導電性接着剤よりも熱膨張率が小さい
半導体装置の製造方法。
前記充填部材は、フィラー含有樹脂を含む
付記7に記載の製造方法。
前記フィラー含有樹脂に含まれるフィラーの含有率が85%以上である
付記8に記載の製造方法。
前記フィラー含有樹脂に含まれるフィラーは、直径0.5μm以上10μm以下の球形である
付記8または付記9に記載の製造方法。
前記フィラー含有樹脂に含まれるフィラーの直径は不均一である
付記10に記載の製造方法。
前記半導体基板及び前記半導体基板とは別の第2の半導体基板を一体的に封止する工程を更に含み、
前記半導体基板及び前記第2の半導体基板は、前記再配線を介して互いに電気的に接続されている
付記7から付記11のいずれか1つに記載の製造方法。
10 第1の半導体チップ
11、21 半導体基板
12 電極パッド
13 貫通孔
14 導電膜
15 充填部材
17 フィラー
20 第2の半導体チップ
31 再配線
40 封止部材
50 導電性接着剤
60 放熱部材
Claims (5)
- 半導体基板と、
前記半導体基板の第1の面に設けられた電極パッドと、
前記電極パッドに電気的に接続された再配線と、
前記半導体基板の前記第1の面とは反対側の第2の面から前記半導体基板を貫通して前記電極パッドに達する貫通孔と、
前記貫通孔の内壁を覆い、前記電極パッドに電気的に接続された導電膜と、
前記半導体基板の第2の面の側に設けられ、前記導電膜を介して前記電極パッドに電気的に接続された導電性接着剤と、
前記導電性接着剤によって前記半導体基板の第2の面に接合された放熱部材と、
前記貫通孔に充填され、前記導電性接着剤よりも熱膨張率が小さい充填部材と、
を含む半導体装置。 - 前記充填部材は、フィラー含有樹脂を含む
請求項1に記載の半導体装置。 - 前記フィラー含有樹脂に含まれるフィラーの含有率が85%以上である
請求項2に記載の半導体装置。 - 前記フィラー含有樹脂に含まれるフィラーは、直径0.5μm以上10μm以下の球形である
請求項2または請求項3に記載の半導体装置。 - 前記半導体基板とは別の第2の半導体基板と、
前記半導体基板及び前記第2の半導体基板を一体的に封止する封止部材と、を更に含み、
前記半導体基板及び前記第2の半導体基板は、前記再配線を介して互いに電気的に接続されている
請求項1から請求項4のいずれか1項に記載の半導体装置。
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JP2001244636A (ja) | 2000-03-01 | 2001-09-07 | Ibiden Co Ltd | プリント配線板 |
JP4445351B2 (ja) | 2004-08-31 | 2010-04-07 | 株式会社東芝 | 半導体モジュール |
JP2006147744A (ja) | 2004-11-18 | 2006-06-08 | Seiko Epson Corp | 光源装置及びこれを用いたプロジェクタ |
JP2006253953A (ja) * | 2005-03-09 | 2006-09-21 | Fujitsu Ltd | 通信用高周波モジュールおよびその製造方法 |
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JP5568357B2 (ja) | 2010-04-05 | 2014-08-06 | 株式会社フジクラ | 半導体装置及びその製造方法 |
TWI418269B (zh) * | 2010-12-14 | 2013-12-01 | Unimicron Technology Corp | 嵌埋穿孔中介層之封裝基板及其製法 |
US9129929B2 (en) * | 2012-04-19 | 2015-09-08 | Sony Corporation | Thermal package with heat slug for die stacks |
TWI662670B (zh) * | 2013-08-30 | 2019-06-11 | 精材科技股份有限公司 | 電子元件封裝體及其製造方法 |
JP6275990B2 (ja) | 2013-10-11 | 2018-02-07 | 日本特殊陶業株式会社 | セラミック配線基板 |
US20150115433A1 (en) * | 2013-10-25 | 2015-04-30 | Bridge Semiconductor Corporation | Semiconducor device and method of manufacturing the same |
US20150262902A1 (en) * | 2014-03-12 | 2015-09-17 | Invensas Corporation | Integrated circuits protected by substrates with cavities, and methods of manufacture |
US9786623B2 (en) * | 2015-03-17 | 2017-10-10 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming PoP semiconductor device with RDL over top package |
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