JP2021136195A - Test device and deterioration determination method for contact relay - Google Patents

Abstract

To provide a test device capable of predicting deterioration of a contact relay with high accuracy, and a deterioration determination method for the contact relay.SOLUTION: The present invention relates to a test device comprising: a plurality of contact relays 30; a voltage control section 10 which controls a voltage to be applied to the contact relay 30; a driving control section 10 which controls driving of the contact relay 30; a test processing section 10 which brings the contact relay 30 into an ON state and applies a predetermined test voltage to a test object, thereby determining electrical characteristics of the test object; and a deterioration determination section 10 which determines deterioration of the contact relay 30 on the basis of an operation time from starting the driving control for bringing the contact relay 30 into the ON state to bringing the contact relay 30 into the ON state or a recovery time from starting the driving control for bringing the contact relay 30 into an OFF state to bringing the contact relay 30 into the OFF state. The deterioration determination section 10 applies a voltage which is lower than the test voltage, as a deterioration determination voltage in determining the deterioration of the contact relay.SELECTED DRAWING: Figure 1

Description

The present invention relates to a test device for testing an electronic component using a contact relay, a test device capable of predicting deterioration of the contact relay with high accuracy, and a method for determining deterioration of the contact relay.

Conventionally, a test device for testing the electrical characteristics of an electronic component such as a semiconductor element represented by a power device such as an IGBT (Insulated Gate Bipolar Transistor) has been known (see, for example, Patent Documents 1 to 3). In such a test device, a reliability test is performed in which a contact needle derived from the test device is connected to an electrode of the semiconductor element, electrical stress is applied to the semiconductor element, and the electrical characteristics of the semiconductor element due to the stress are tested. It is done.

Japanese Unexamined Patent Publication No. 2016-103984 JP 2015-505472 Japanese Unexamined Patent Publication No. 2000-98000

In such a test device, a device using a contact relay such as a reed relay or a mercury relay is known as a mechanism for applying electrical stress. A contact relay is a mechanically movable part and deteriorates over time with use, but there are large differences depending on the circuit to be mounted, depending on the contact opening / closing frequency, contact opening / closing energy conditions, inrush current, and other usage conditions. Therefore, the degree of wear of the contact portion is also different. Therefore, there are individual differences in the degree of deterioration, and even before the initial number of relay component lifespans, the contact surface of some contact relays deteriorates, causing poor opening / closing operation of the contact relays or instability. Or, there is something that becomes an intermittent defect. Then, when such a contact relay with a defective operation is used, the defective device may be determined as a non-defective device. Therefore, a technique for determining deterioration of a contact relay with high accuracy is desired.

In Patent Document 3, the contact of the relay to be tested is driven from the on state to the off state, and from the switching characteristic from immediately after the drive in the off direction until the switch contact of the relay is electrically turned off, until the contact is electrically turned off. The technology to determine the deterioration of the relay by the deviation from the break time value and the standard break time value of the relay type, and the contact of the relay to be tested is driven from the off state to the on direction and turned on. From the switching characteristics from immediately after driving until the switch contact of the relay is electrically turned on, the make time value until the switch contact is electrically turned on is obtained, and from the make time value and the reference make time value of the relay type. A technique for determining the deterioration of the relay based on the deviation of the relay is disclosed. However, in the invention described in Patent Document 3, the difference between the deteriorated relay and the normal relay may not be large, and it may be difficult to determine the deteriorated relay.

An object of the present invention is to provide a test device capable of predicting deterioration of a contact relay with high accuracy, and a method for determining deterioration of the contact relay.

The test apparatus according to the present invention includes a plurality of contact relays, a voltage control unit that controls a voltage applied to the coil of the contact relay, a drive control unit that controls the drive of the contact relay, and the drive control. The contact relay is turned on by the unit, and a predetermined test voltage or test current is applied to the test object to determine the electrical characteristics of the test object, and the drive control unit has the drive control unit. The operating time from the start of the drive control for turning on the contact relay until the contact relay is turned on, or the drive control for the drive control unit to turn the contact relay off. It has a deterioration determination unit that determines deterioration of the contact relay based on the recovery time from the start of the operation until the contact relay is turned off, and the deterioration determination unit is the voltage control unit. A voltage lower than the test voltage is applied as a deterioration determination voltage when determining the deterioration of the contact relay.
The test apparatus may be configured such that the test voltage is equal to or higher than the rated voltage.
In the above test apparatus, the deterioration determination voltage may be configured to be 80% or less of the test voltage.
In the above test apparatus, the deterioration determination unit may be configured to determine that the contact relay that exceeds 100 μs with respect to the average value of the return time is deteriorated.
In the test apparatus, the deterioration determination unit determines deterioration of the contact relay by comparing the operation time or recovery time in the initial state with the operation time or recovery time at the time of deterioration determination. It can be configured as follows.
In the test apparatus, the deterioration determination unit measures the minimum operating voltage of the contact relay in the return operation, and considers the amount of change in the minimum operating voltage to determine the deterioration of the contact relay. can do.
The method for determining deterioration of a contact relay according to the present invention is the operating time from the transmission of the relay drive signal for turning on the contact relay to the turning on of the contact relay, or the presence. When determining the deterioration of the contact relay based on the recovery time from the start of the relay drive signal for turning the contact relay to the off state until the contact relay is turned off, the contact relay Apply a lower voltage than when testing the electrical properties of the test object.

According to the present invention, deterioration of the contact relay can be predicted with high accuracy.

It is a block diagram which shows the structure of the test apparatus which concerns on this embodiment. It is a figure for demonstrating the deterioration determination method of the reed relay which concerns on this embodiment. It is a figure which shows an example of the measurement result of the operation time with respect to the reed relay arranged in the horizontal direction. It is a figure which shows an example of the measurement result of the operation time with respect to the reed relay arranged in the vertical direction. It is a figure which shows an example of the measurement result of the return time with respect to the reed relay arranged in the horizontal direction. It is a figure which shows an example of the measurement result of the return time with respect to the reed relay arranged in the vertical direction. It is a figure which shows an example of the measurement result of the minimum operating voltage at the time of a return operation.

An embodiment of the test apparatus according to the present invention will be described with reference to the drawings. In this embodiment, a test apparatus capable of testing the electrical characteristics of electronic components such as semiconductor elements and determining the deterioration of the contact relay will be described as an example. Further, in the present embodiment, the reed relay will be described as an example of the contact relay, but the contact relay is not particularly limited, and may be, for example, a mercury relay.

FIG. 1 is a configuration diagram of the test device 1 according to the present embodiment. As shown in FIG. 1, the test device 1 according to the present embodiment includes a control device 10, a transistor array 20, a reed relay 30, a power supply 40, a voltage switching circuit 41, and a measuring device 50. In FIG. 1 shows only 30 ₁ and 30 ₄ of the 8 reed relay ₃₀ 1 to 30 ₈ connected to the transistor array 20. In the following, simply it will be referred to as a reed relay 30 the reed relay ₃₀ 1 to 30 _8.

The control device 10 tests the electrical characteristics of the electronic component. Specifically, the control device 10 is electrically connected to the transistor array 20 and controls the on / off state of each reed relay 30 by controlling the on / off state of each transistor of the transistor array 20. Then, by applying an electrical stress to the electronic component connected to the reed relay 30, the electrical characteristics of the electronic component are tested. In particular, in the present embodiment, the control device 10 tests the electrical characteristics of the electronic component by applying a voltage equal to or higher than the rated voltage to the electronic component as the test voltage VE. As a test method for electronic components other than the above, a known method can be used.

Further, in the present embodiment, the control device 10 also determines the deterioration of the reed relay 30. When determining the deterioration of the reed relay 30, the control device 10 controls the on / off state of each transistor of the transistor array 20 by outputting a 0V / 5V pulse signal (relay control signal) to the transistor array 20. , Thereby controlling the on / off state of each reed relay 30. The frequency of the pulse signal (relay control signal) is not particularly limited, but may be, for example, a frequency of 50 Hz to 100 Hz. The energized state (on state / off state) of the reed relay 30 is monitored by the measuring device 50, and the control device 10 acquires the energized state of the reed relay 30 from the measuring device 50. Then, the control device 10 deteriorates the reed relay 30 based on the timing at which the relay control signal is output and the timing at which the energization state (on state / off state) of the reed relay 30 acquired from the measuring device 50 changes. Determine if it is. The details of the method for determining the reed relay 30 by the control device 10 will be described later.

The transistor array 20 is a collection of transistors, and is connected to a plurality of reed relays 30 respectively. When the pulse signal output from the control device 10 is input to the transistor array 20, each transistor of the transistor array 20 is turned on. As a result, electric power is supplied from the power source 40 for driving the lead relay 30, and the coil of the lead relay 30 is energized. In the present embodiment, the control device 10 can control which transistor of the transistor array 20 is turned on / off, thereby which reed relay 30 is turned on / off. It is possible to control. In the present embodiment, the control device 10 can sequentially determine the deterioration of each reed relay 30 by sequentially performing on / off control of each reed relay 30.

The reed relay 30 has a built-in coil, and when the transistor of the transistor array 20 connected to the coil is turned on, the electric power from the power supply 40 is supplied to the coil to energize the coil. Then, when the coil is energized, the lead pieces of the reed relay 30 are driven by the electromagnetic action of the coil and the lead pieces come into contact with each other, and the energized state of the reed relay 30 is turned on (energized state). As a result, the electronic component to be tested can be electrically connected to the lead relay 30 and an electric current or voltage can be applied to the lead relay 30 to apply electrical stress to the electronic component. On the other hand, when the electrical stress on the electronic component is stopped, the current and voltage applied to the reed relay 30 are stopped, and then the transistor array 20 cuts off the energization of the transistor and energizes the coil connected to the transistor. Is also blocked. As a result, the energized state of the reed relay 30 is switched from the on state to the off state (state in which energization is not possible).

The measuring device 50 is, for example, a device such as a logger that measures current or voltage. As shown in FIG. 1, the measuring device 50 is electrically connected to each of the reed relays 30, and when determining the deterioration of the reed relay 30, it is determined whether or not the reed relay 30 is in the energized state. By applying a voltage for this to the lead piece of the reed relay 30, the energized state of each reed relay 30 (on state / off state of the reed relay 30 due to contact / non-contact of the reed piece) is detected. Then, the measuring device 50 outputs the detected energized state of the reed relay 30 to the control device 10.

Further, the control device 10 outputs a relay control signal (a relay on signal for turning on the energized state of the reed relay 30 and a relay off signal for turning on the energized state of the reed relay 30), and the energized state of the reed relay 30 to be inspected. By returning from the off state to the on state and then from the on state to the off state, the timing at which the control device 10 outputs the relay control signal (relay on signal and relay off signal) and the reed relay 30 detected by the measuring device 50 It is determined whether or not the reed relay 30 is deteriorated based on the timing at which the energized state of the reed relay 30 is changed. FIG. 2 is a diagram for explaining a method of determining deterioration of the reed relay 30, and shows an example of the output of the relay control signal and the energized state of the reed relay 30. When the energization state of the reed relay 30 is changed from the off state to the on state, first, the control device 10 outputs a relay on signal for enabling the reed relay 30 to be inspected to be energized, and the reed relay 30 to be inspected is energized. The coil is energized, the lead pieces are driven by the electromagnetic action of the coil, and the lead pieces come into contact with each other, so that the reed relay 30 to be inspected can be energized. Further, in the present embodiment, when the reed-on signal is output to the reed relay 30 by the control device 10, a predetermined voltage is applied to the reed piece of the reed relay 30 by the measuring device 50, and the reed relay 30 can be energized at the same time. The reed relay 30 is energized. In this way, a certain time lag (hereinafter referred to as operating time) occurs from the output of the relay-on signal to the energization of the reed relay 30. For example, in the example shown in FIG. 2, since the relay-on signal of the reed relay 30 is output at time t1 and the reed relay 30 is energized at time t2, the operating time is “a” shown in FIG. ..

Further, when the energized state of the reed relay 30 is changed from the on state to the off state, first, the control device 10 outputs a relay off signal for making the reed relay 30 to be inspected unenergized, and the reed to be inspected. The energization of the relay 30 to the coil is cut off, and the electromagnetic action of the coil is lost. As a result, the contact between the lead pieces is released, and the energized state of the lead relay 30 to be inspected is turned off. In this way, a certain time lag (hereinafter referred to as recovery time) occurs even after the relay off signal is output until the reed relay 30 is turned off. For example, in the example shown in FIG. 2, since the relay off signal of the reed relay 30 is output at time t3 and the reed relay 30 is changed to the off state at time t4, the return time is “c”.

The operating time and the recovery time tend to increase as the reed relay 30 deteriorates over time. Therefore, in the present embodiment, as will be described later, the control device 10 determines that the reed relay 30 has deteriorated when the operation time or the return time is equal to or longer than a predetermined length. Then, when it is determined that the reed relay 30 is deteriorated, the control device 10 can be configured to display a message or a warning to the user.

Here, in the test apparatus 1 according to the present embodiment, when determining the deterioration of the reed relay 30, the reed relay 30 uses a deterioration determination voltage VJ lower than the test voltage VE for testing the electrical characteristics of the electronic component. Judge the deterioration of. Specifically, the deterioration determination voltage VJ is set to a voltage of 80% or less of the test voltage VE, preferably a voltage of 70% or less of the test voltage VE, more preferably a voltage of 60% or less of the test voltage VE, and read. Determine the deterioration of the relay 30. The deterioration determination voltage VJ is set to be equal to or higher than the minimum operating voltage of the transistor array 20 and the reed relay 30. In the present embodiment, when testing the electrical characteristics of electronic components, a voltage of 13V, which is higher than the rated voltage of 12V, is used as the test voltage VE in consideration of the output saturation voltage and path loss in the transistor array 20. There is. Therefore, when determining the deterioration of the reed relay 30, the test apparatus 1 uses a voltage lower than the test voltage VE of 13V, for example, a voltage of 10V or 8V as the deterioration determination voltage VJ, and deteriorates the reed relay 30. To judge. The control device 10 can switch the voltage input to the coil of the reed relay 30 to 10V or 8V by controlling the voltage switching circuit 41 connected to the power supply 40.

As described above, in the test apparatus 1 according to the present embodiment, when determining the deterioration of the reed relay 30, the operation of the reed relay 30 is performed by reducing the voltage input to the coil of the reed relay 30 to 10V or 8V. The time and recovery time can be lengthened, and the difference between the deteriorated reed relay 30 and the normal reed relay 30 can be clarified. The following is an effect of determining the deterioration of the reed relay 30 by using a voltage lower than that of testing the electrical characteristics of electronic components when determining the deterioration of the reed relay 30 based on the examples. explain.

In this embodiment, the output of the relay control signal is controlled by using a function generator (FG120, manufactured by Yokogawa Test & Measurement Corporation) instead of the control device 10. Further, transistor array 20 (TD62083AP, manufactured by Toshiba Semiconductor), reed relay 30 (URM-26212GTNB-70, manufactured by Sanyu Kogyo Co., Ltd.), power supply 40 (P4L36-1, manufactured by Matsusada Precision Co., Ltd.), voltage switching circuit 41. A multimeter (34410A, manufactured by Agilent Technologies, Inc.) was used. Further, as the measuring device 50, an oscilloscope (TPS2024, manufactured by Tektronix Co., Ltd.) was used instead of the logger. In addition, a counter (H7EC, manufactured by OMRON Corporation) for counting the number of relays was used. In addition, four reed relays 30 were mounted on eight boards, and a test was conducted using a total of 32 reed relays 30.

Further, in this embodiment _{, among the 32 reed relays 30 1} to 30 32, in the reed relays 30 ₁ to 30 ₃ , the operation time and the recovery time after the relay was performed 1 million times were measured. Similarly, after the reed relay ₃₀ 4-30 ₆ went 5,000,000 relay, after reed relay ₃₀ 7-30 ₉ was performed 10 million times relay, a reed relay _{30 10-30 12} 50 million times Relay After that, the reed relays 30 ₁₃ to 30 ₁₅ relayed 100 million times, the reed relays 30 ₁₆ to 30 ₁₈ relayed 150 million times, and then the reed relays 30 ₁₉ to 30 _{21 relayed 200 million times.} After performing multiple relays, reed relays 30 ₂₂ to 30 ₂₄ relayed 300 million times, reed relays 30 ₂₅ to 30 ₂₇ relayed 400 million times, and reed relays 30 ₂₈ to 30 ₃₂ relayed 500 million times. The operation time and recovery time after the above were measured. Further, the operating time and the recovery time were measured after the reed relays 30 ₂₂ to 30 ₃₂ were relayed 600 million times and the reed relays 30 ₂₅ to 30 _{32 were relayed 700 million times.} In this embodiment, the measurement under the same conditions was repeated twice using another reed relay. Further, in this embodiment, when measuring the operation time and the return time of the reed relay, the reed relay 30 is measured twice, when it is placed on a horizontal plane (horizontal direction) and when it is erected vertically (vertical direction). Was done.

FIG. 3 is a graph showing an example of the measurement result of the operation time (time lag from the output of the relay-on signal to the energization of the reed relay 30) with respect to the reed relay 30 arranged in the horizontal direction. Further, in the graph shown in FIG. 3, (A) is the operating time when the deterioration determination voltage VJ applied to the coil of the reed relay 30 is 13V, which is the test voltage, and (B) is the deterioration determination voltage VJ of 10V. (C) shows the operating time when the deterioration determination voltage VJ is 8V. As shown in FIG. 3, in the case of (B) relayed at 10 V as compared with (A) relayed at 13 V, the operating time tends to be longer and the operating time varies. rice field. Further, in (C) in which the relay was performed at 8 V, the operating time of some of the reed relays 30 exceeded 1 ms from the extent that the relay occurred 300 million times, and the deterioration of these reed relays 30 progressed. It is possible that you are doing this. Further, FIG. 4 is a graph showing an example of the measurement result of the operation time for the reed relay arranged in the vertical direction. Also in FIG. 4, as in FIG. 3, by lowering the deterioration determination voltage applied to the coil of the reed relay 30 to be lower than the test voltage, the operating time tends to be long, and the operating time varies. Further, in (C) in which the relay was performed at 8 V, the operating time of some reed relays exceeded 1 ms after the relay was performed 300 million times, and it can be seen that the deterioration is progressing. Therefore, for example, the control device 10 can be configured to determine that the reed relay whose operating time exceeds 1 ms is deteriorated and output the determination result.

FIG. 5 is a graph showing an example of the measurement result of the return time (the time lag from the output of the relay off signal to the non-energized state of the reed relay 30) with respect to the reed relay 30 arranged in the horizontal direction. Further, in the graph shown in FIG. 5, (A) is the recovery time when the deterioration determination voltage VJ applied to the coil of the reed relay 30 is 13V, which is the test voltage, and (B) is the deterioration determination voltage VJ of 10V. (C) shows the recovery time when the deterioration determination voltage VJ is 8V. As shown in FIG. 5, in the normal reed relay 30 (reed relay 30 other than the deteriorated reed relay 30 shown in FIG. 5), the relay was performed at 13 V (A) and the relay was performed at 10 V (A). With B), there was no significant change in the length of the return time and the variation in the return time. On the other hand, in the deteriorated reed relay 30, as shown in FIG. 5, in (A) in which the relay was performed at 13 V, there was a large difference in the recovery time between the deteriorated reed relay 30 and the normal reed relay 30. Although it was not observed, in (B) in which the relay was performed at 10 V, a large difference in the recovery time was obtained between the deteriorated reed relay 30 and the normal reed relay 30. Further, in (C) in which the relay was performed at 8 V, the difference in recovery time between the deteriorated reed relay 30 and the normal reed relay 30 became even larger. In particular, the deteriorated reed relay 30 has a difference of about 100 μs from the average value of the return time when the relay is relayed at 10 V (B), and the average return time is about 100 μs when the relay is relayed at 8 V (C). It was found that the difference from the value became large, about 300 μs, and the lower the deterioration determination voltage applied to the coil of the relay 30, the larger the difference from the normal reed relay 30. Further, FIG. 6 is a graph showing an example of the measurement result of the return time in the reed relay 30 arranged in the vertical direction. In FIG. 6, similarly to FIG. 5, in (A) in which the relay was performed at 13 V, there was no significant difference in the recovery time between the deteriorated reed relay 30 and the normal reed relay, but at 10 V. In (B) where the relay was performed, a large difference in recovery time was obtained between the deteriorated reed relay 30 and the normal reed relay, and in (C) where the relay was performed at 8 V, the deteriorated reed relay was used. A larger difference was obtained between 30 and the return time of a normal reed relay. Therefore, for example, the control device 10 determines that the reed relay 30 that exceeds a predetermined time (for example, 100 μs or 300 μs) is deteriorated with respect to the average value of the return time of the reed relay 30, and outputs the determination result. It can be configured to be.

As described above, in the test apparatus 1 according to the present embodiment, a deterioration determination voltage VJ lower than the test voltage VE (voltage equal to or higher than the rated voltage) when testing the electrical characteristics of the electronic component is applied to the lead relay. By determining the deterioration of 30, the determination accuracy of the deteriorated reed relay 30 can be improved. In particular, the deterioration determination voltage VJ is preferably 80% or less of the test voltage VE, more preferably 70% or less of the test voltage VE, and further preferably 60% or less of the test voltage VE. By determining the deterioration of the reed relay 30 in this way, for example, the test apparatus 1 can determine that the reed relay 30 whose operating time exceeds 1 ms is deteriorated when the deterioration determination voltage VJ is 8V. It can be determined that the reed relay 30 that exceeds 100 μs with respect to the average value of the return time is deteriorated. In the test apparatus 1 according to the present embodiment, the deterioration accuracy of the reed relay 30 can be improved only by changing the deterioration determination voltage applied to the coil of the relay 30 when the deterioration of the reed relay 30 is determined. It is not necessary to change the configuration of the existing test device 1, and the cost for improving the deterioration determination accuracy of the reed relay 30 can be suppressed. Further, in the present embodiment, since the deterioration determination accuracy can be improved, it is considered that the mercury relay is particularly useful in the reed relay, which has a relatively short life and the deterioration determination is important.

Although the preferred embodiment of the present invention has been described above, the technical scope of the present invention is not limited to the description of the above embodiment. Various changes / improvements can be made to the above-described embodiment, and those in which such changes / improvements have been made are also included in the technical scope of the present invention.

For example, in the above-described embodiment, a configuration in which the reed relay 30 is determined to be deteriorated when the operation time or the return time is equal to or longer than a predetermined length is exemplified, but the configuration is not limited to this configuration, and the reed relay is not limited to this configuration. By storing the operating time or recovery time in the initial state of 30 and comparing the operating time or recovery time in the initial state with the operating time or recovery time at the time of determining the deterioration of the reed relay 30, the reed relay 30 It can also be configured to determine whether it has deteriorated. For example, when the relative time, which is the difference between the operating time in the initial state of the reed relay 30 and the operating time at the time of deterioration determination, is equal to or longer than a predetermined reference time, it can be determined that the reed relay 30 is deteriorated. .. For example, if the operating time of the reed relay 30 in the initial state is 1.0 ms and the operating time at the time of deterioration determination one year later is 2.0 ms, the relative time is 1.0 ms (2.0 ms-1.0 ms). = 1.0 ms), and when the predetermined reference time is 0.5 ms, it can be determined that the deterioration has occurred because the relative time 1.0 ms> the reference time 0.5 ms. If the operating time at the time of deterioration determination one year later is 1.1 ms, the relative time is 0.1 ms (1.1 ms-1.0 ms = 0.1 ms), and the relative time 0.1 ms <reference. Since the time is 0.5 ms, it can be determined that the deterioration has not occurred. Similarly, when the relative time, which is the difference between the recovery time in the initial state of the reed relay 30 and the recovery time at the time of deterioration determination, is equal to or longer than a predetermined reference time, it can be determined that the reed relay 30 has deteriorated. can. For example, when the return time of the reed relay 30 in the initial state is 1.5 ms and the operation time at the time of deterioration determination one year later is 2.2 ms, the relative time is 0.7 ms (2.2 ms-1.5 ms). = 0.7 ms), and when the predetermined reference time is 0.5 ms, it can be determined that the deterioration has occurred because the relative time 0.7 ms> the reference time 0.5 ms. If the recovery time at the time of deterioration determination after one year is 1.6 ms, the relative time is 0.1 ms (1.6 ms-1.5 ms = 0.1 ms), and the relative time is 0.1 ms <reference. Since the time is 0.5 ms, it can be determined that the deterioration has not occurred.

Further, in the above-described embodiment, the configuration in which the control device 10 performs control related to the test of electronic components in addition to the deterioration determination of the reed relay 30 is illustrated, but the control device 10 performs the deterioration determination of the contact relay. The control related to the test of the electronic component may be performed by another device. Further, in the above-described embodiment, the configuration in which the power is supplied from the power supply 40 is exemplified in both the case of determining the deterioration of the reed relay 30 and the case of performing the control related to the test of the electronic component, but the configuration is not limited to this configuration. A power source having a different voltage may be used depending on whether the deterioration of the reed relay 30 is determined or the control related to the test of the electronic component is performed. In this case, the control of switching between the voltage for determining the deterioration of the lead relay 30 and the power supply for the electronic component test becomes unnecessary. Further, in the present embodiment, the configuration in which the energization state (on / off state) of the reed relay 30 is detected by the measuring device 50 and the detection result is output to the control device 10 is illustrated, but the configuration is not limited to this configuration. By directly connecting the control device 10 to each reed relay 30, the configuration may be such that the energized state (on / off state) of the reed relay 30 is directly detected.

Further, in the above-described embodiment, a configuration in which a voltage of 13V is used as the test voltage VE and a voltage of 10V or 8V is used as the deterioration determination voltage VJ when testing the electrical characteristics of the electronic component is illustrated, but the configuration is limited to this configuration. However, the deterioration determination voltage VJ may be set to a voltage lower than the test voltage VE by a predetermined value. For example, regardless of the value of the test voltage VE, the deterioration determination voltage VJ can be a voltage 3 V or more lower than the test voltage VE, preferably a voltage 5 V or more lower than the test voltage VE.

In addition, in the above-described embodiment, the configuration having the transistor array 20 is illustrated, but the configuration is not limited to this configuration, and a configuration having a transistor or a FET (field effect transistor) corresponding to each lead relay may be used.

Further, in addition to the above-described embodiment, a device capable of measuring a voltage value such as an oscilloscope is further provided, the minimum operating voltage of the reed relay 30 during the return operation is measured, and the amount of change in the minimum operating voltage is taken into consideration. It can be configured to determine the deterioration of the reed relay 30. Here, in FIG. 7, the measurement result of the minimum operating voltage at the time of the return operation is measured a predetermined number of times (1 million times, 5 million times, 10 million times, 100 million times, 150 million times) up to the initial time and 500 million times. An example of the measurement result measured after relaying 200 million times, 300 million times, 400 million times, and 500 million times is shown. In FIG. 7, the difference between the minimum operating voltage value of the initial return operation and the minimum operating voltage value of the return operation after the relay is performed a predetermined number of times (minimum operating voltage value of the return operation after a predetermined number of times − initial The minimum operating voltage value for the return operation) is displayed. Further, in FIG. 7, (A) is a measurement result of the minimum operating voltage value of the return operation when the reed relay 30 is placed on a horizontal plane (horizontal direction), and (B) is a measurement result of the reed relay 30 standing vertically. This is the measurement result of the minimum operating voltage value of the return operation in the case of (vertical direction).

As shown in FIG. 7, in the deteriorated reed relay 30, the minimum operating voltage value at the time of the return operation is smaller after the relay is performed a predetermined number of times than in the initial stage, as compared with the normal reed relay 30. It was found that the difference between the minimum voltage value of the initial return operation and the minimum voltage value of the return operation after relaying a predetermined number of times increases in the negative direction). Further, when the reed relay is arranged in the vertical direction, the difference between the minimum voltage value of the return operation after a predetermined number of times and the minimum voltage value of the initial return operation is larger than that in the case of arranging the reed relay in the horizontal direction. It turned out. From this, in the control device 10, in addition to the operation time and the recovery time, when the difference between the minimum operating voltage of the recovery operation at the time of deterioration determination and the minimum operating voltage of the initial recovery operation is equal to or less than a predetermined operation threshold value. By determining that the reed relay 30 is deteriorated, it is possible to determine the deterioration of the reed relay with higher accuracy.

1 ... Test device 10 ... Control device 20 ... Transistor array 30 ... Lead relay 40 ... Power supply 41 ... Voltage switching circuit 50 ... Measuring device

Claims (7)

With multiple contact relays,
A voltage control unit that controls the voltage applied to the coil of the contact relay,
A drive control unit that controls the drive of the contact relay,
A test processing unit that determines the electrical characteristics of the test object by turning on the contact relay by the drive control unit and applying a predetermined test voltage or test current to the test object.
The operating time from when the drive control unit starts the drive control for turning on the contact relay until the contact relay is turned on, or when the drive control unit turns off the contact relay. It has a deterioration determination unit that determines deterioration of the contact relay based on the recovery time from the start of the drive control for bringing the contact to the state until the contact relay is turned off.
The deterioration determination unit is a test device that applies a voltage lower than the test voltage to the voltage control unit as a deterioration determination voltage when determining deterioration of the contact relay. The test apparatus according to claim 1, wherein the test voltage is a voltage equal to or higher than a rated voltage. The test apparatus according to claim 1 or 2, wherein the deterioration determination voltage is a voltage of 80% or less of the test voltage. The test apparatus according to any one of claims 1 to 3, wherein the deterioration determination unit determines that the contact relay that exceeds 100 μs with respect to the average value of the return time is deteriorated. The deterioration determination unit determines the deterioration of the contact relay by comparing the operation time or the recovery time in the initial state with the operation time or the recovery time at the time of deterioration determination. The test apparatus according to any one of 4. The deterioration determination unit measures the minimum operating voltage of the contact relay in the return operation, and determines the deterioration of the contact relay by adding the amount of change in the minimum operating voltage, according to any one of claims 1 to 5. Test equipment described in Crab. The operating time from the transmission of the relay drive signal for turning on the contact relay to the turning on of the contact relay, or the relay drive signal for turning off the contact relay. When the contact relay is tested for electrical characteristics of the test object when the deterioration of the contact relay is determined based on the recovery time from the start until the contact relay is turned off. A method for determining deterioration of a contact relay by applying a lower voltage.

Images