JP2021118206A - ウエーハ生成方法、及びウエーハ生成装置 - Google Patents
ウエーハ生成方法、及びウエーハ生成装置 Download PDFInfo
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- JP2021118206A JP2021118206A JP2020008605A JP2020008605A JP2021118206A JP 2021118206 A JP2021118206 A JP 2021118206A JP 2020008605 A JP2020008605 A JP 2020008605A JP 2020008605 A JP2020008605 A JP 2020008605A JP 2021118206 A JP2021118206 A JP 2021118206A
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- 238000000034 method Methods 0.000 title claims description 19
- 235000012431 wafers Nutrition 0.000 claims abstract description 92
- 230000008646 thermal stress Effects 0.000 claims abstract description 75
- 239000000463 material Substances 0.000 claims abstract description 15
- 230000035882 stress Effects 0.000 claims abstract description 11
- 230000001678 irradiating effect Effects 0.000 claims description 15
- 238000010521 absorption reaction Methods 0.000 claims description 8
- 230000001902 propagating effect Effects 0.000 claims description 7
- 230000002745 absorbent Effects 0.000 claims description 6
- 239000002250 absorbent Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 2
- 239000010410 layer Substances 0.000 description 38
- 238000003384 imaging method Methods 0.000 description 8
- 230000003287 optical effect Effects 0.000 description 8
- 230000003028 elevating effect Effects 0.000 description 5
- 230000003111 delayed effect Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000002346 layers by function Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000010355 oscillation Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 238000002679 ablation Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000001066 destructive effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000638 solvent extraction Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
- B28D5/0052—Means for supporting or holding work during breaking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Optics & Photonics (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
波長 :355nm
繰り返し周波数 :50kHz
平均出力 :1W
パルス幅 :100ps以下
波長 :1064nm
繰り返し周波数 :50kHz
平均出力 :10W
パルス幅 :10ns
3:基台
4:保持手段
18:X軸方向可動板
20:Y軸方向可動板
22:チャックテーブル
5:移動手段
24:X軸方向移動手段
26:Y軸方向移動手段
6:レーザー光線照射手段
6A:第一レーザー光線生成部
61:第一レーザー光線発振手段
611:第一レーザー発振器
612:第一アッテネータ
62:反射ミラー
6B:第二レーザー光線生成部
63:第二レーザー光線発振手段
631:第二レーザー発振器
632:第二アッテネータ
64:遅延手段
6C:レーザー光線導入部
65:ダイクロイックミラー
66:反射ミラー
67:割出スキャナー
68:走査スキャナー
69:集光器
691:fθレンズ
7:研削手段
7c:研削ホイール
7d:研削砥石
12:撮像手段
14:表示手段
16:剥離手段
16a:ケーシング
16b:アーム
16c:モータ
16d:吸着片
50:インゴット
52:上面
54:下面
H1:熱応力波生成手段
H2:破砕層形成手段
Claims (4)
- インゴットからウエーハを生成するウエーハ生成方法であって、
保持手段にインゴットを保持する保持工程と、
該保持手段に保持されたインゴットの上面にインゴットに対して吸収性を有する波長のパルスレーザー光線を照射して熱応力波を生成し該熱応力波をインゴットの内部に伝播させる熱応力波生成工程と、
該熱応力波生成工程において生成された熱応力波がインゴットの材質に応じた音速で内部に伝播し生成すべきウエーハの厚みに相当する位置に達する時間に合わせてインゴットに対して透過性を有する波長のパルスレーザー光線をインゴットの上面から照射して該熱応力波の引っ張り応力でバンドギャップが狭くなった領域で透過性を有する波長のパルスレーザー光線の吸収を生じさせて破砕層を形成する破砕層形成工程と、
該破砕層を起点として生成すべきウエーハをインゴットから剥離する剥離工程と、
を含み構成されるウエーハ生成方法。 - 該剥離工程の後、インゴットの剥離面を平坦化する平坦化工程が含まれる請求項1に記載のウエーハ生成方法。
- インゴットからウエーハを生成するウエーハ生成装置であって、
インゴットを保持する保持手段と、
該保持手段に保持されたインゴットの上面にインゴットに対して吸収性を有する波長のパルスレーザー光線を照射して熱応力波を生成し、該熱応力波をインゴットの内部に伝播させる熱応力波生成手段と、
該熱応力波生成手段によって生成された熱応力波がインゴットの材質に応じた音速で内部に伝播し生成すべきウエーハの厚みに相当する位置に達する時間に合わせてインゴットに対して透過性を有する波長のパルスレーザー光線をインゴットの上面から照射して該熱応力波の引っ張り応力でバンドギャップが狭くなった領域で透過性を有する波長のパルスレーザー光線の吸収を生じさせて破砕層を形成する破砕層形成手段と、
を含み構成されるウエーハ生成装置。 - 該破砕層形成手段によって形成された破砕層からウエーハを剥離する剥離手段が含まれる請求項3に記載のウエーハ生成装置。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020008605A JP7370879B2 (ja) | 2020-01-22 | 2020-01-22 | ウエーハ生成方法、及びウエーハ生成装置 |
KR1020200174924A KR20210095025A (ko) | 2020-01-22 | 2020-12-15 | 웨이퍼 생성 방법, 및 웨이퍼 생성 장치 |
US17/146,657 US20210221026A1 (en) | 2020-01-22 | 2021-01-12 | Wafer producing method and wafer producing apparatus |
CN202110052917.6A CN113231906A (zh) | 2020-01-22 | 2021-01-15 | 晶片生成方法和晶片生成装置 |
TW110102021A TW202129745A (zh) | 2020-01-22 | 2021-01-19 | 晶圓生成方法以及晶圓生成裝置 |
DE102021200574.8A DE102021200574A1 (de) | 2020-01-22 | 2021-01-22 | Waferherstellungsverfahren und waferherstellungsvorrichtung |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2020008605A JP7370879B2 (ja) | 2020-01-22 | 2020-01-22 | ウエーハ生成方法、及びウエーハ生成装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021118206A true JP2021118206A (ja) | 2021-08-10 |
JP7370879B2 JP7370879B2 (ja) | 2023-10-30 |
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JP2020008605A Active JP7370879B2 (ja) | 2020-01-22 | 2020-01-22 | ウエーハ生成方法、及びウエーハ生成装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20210221026A1 (ja) |
JP (1) | JP7370879B2 (ja) |
KR (1) | KR20210095025A (ja) |
CN (1) | CN113231906A (ja) |
DE (1) | DE102021200574A1 (ja) |
TW (1) | TW202129745A (ja) |
Families Citing this family (3)
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CN114260811A (zh) * | 2021-12-27 | 2022-04-01 | 江西兆驰半导体有限公司 | 一种蓝宝石晶棒的加工系统及方法 |
CN115821394B (zh) * | 2023-01-05 | 2023-05-26 | 西北电子装备技术研究所(中国电子科技集团公司第二研究所) | 一种SiC晶片的检测系统及其检测方法 |
CN116638643B (zh) * | 2023-06-27 | 2024-02-06 | 沈阳和研科技股份有限公司 | 一种划片机共振的解决方法 |
Family Cites Families (14)
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US4244348A (en) * | 1979-09-10 | 1981-01-13 | Atlantic Richfield Company | Process for cleaving crystalline materials |
JP2000094221A (ja) | 1998-09-24 | 2000-04-04 | Toyo Advanced Technologies Co Ltd | 放電式ワイヤソー |
JP4791073B2 (ja) * | 2005-04-26 | 2011-10-12 | Sumco Techxiv株式会社 | シリコンウェーハの製造方法 |
US8835802B2 (en) * | 2006-01-24 | 2014-09-16 | Stephen C. Baer | Cleaving wafers from silicon crystals |
JP2012109341A (ja) | 2010-11-16 | 2012-06-07 | Shibuya Kogyo Co Ltd | 半導体材料の切断方法と切断装置 |
US20130252011A1 (en) * | 2011-09-14 | 2013-09-26 | MEMC Singapore, Pte. Ltd. (UEN200614797D) | Multi-Crystalline Silicon Ingot And Directional Solidification Furnace |
US9757815B2 (en) | 2014-07-21 | 2017-09-12 | Rofin-Sinar Technologies Inc. | Method and apparatus for performing laser curved filamentation within transparent materials |
JP6399913B2 (ja) | 2014-12-04 | 2018-10-03 | 株式会社ディスコ | ウエーハの生成方法 |
CN105436710B (zh) | 2015-12-30 | 2019-03-05 | 大族激光科技产业集团股份有限公司 | 一种硅晶圆的激光剥离方法 |
WO2017167614A1 (de) * | 2016-03-22 | 2017-10-05 | Siltectra Gmbh | Kombinierte laserbehandlung eines zu splittenden festkörpers |
JP6495230B2 (ja) * | 2016-12-22 | 2019-04-03 | 花王株式会社 | シリコンウェーハ用リンス剤組成物 |
KR102551442B1 (ko) | 2017-04-20 | 2023-07-06 | 실텍트라 게엠베하 | 정의된 방향의 수정 라인으로 웨이퍼를 생산하는 방법 |
JP2019029382A (ja) * | 2017-07-25 | 2019-02-21 | 株式会社ディスコ | ウエーハの生成方法およびウエーハ生成装置 |
JP7188886B2 (ja) | 2018-01-29 | 2022-12-13 | 浜松ホトニクス株式会社 | 加工装置 |
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2020
- 2020-01-22 JP JP2020008605A patent/JP7370879B2/ja active Active
- 2020-12-15 KR KR1020200174924A patent/KR20210095025A/ko active Search and Examination
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2021
- 2021-01-12 US US17/146,657 patent/US20210221026A1/en active Pending
- 2021-01-15 CN CN202110052917.6A patent/CN113231906A/zh active Pending
- 2021-01-19 TW TW110102021A patent/TW202129745A/zh unknown
- 2021-01-22 DE DE102021200574.8A patent/DE102021200574A1/de active Pending
Also Published As
Publication number | Publication date |
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DE102021200574A1 (de) | 2021-07-22 |
CN113231906A (zh) | 2021-08-10 |
US20210221026A1 (en) | 2021-07-22 |
JP7370879B2 (ja) | 2023-10-30 |
TW202129745A (zh) | 2021-08-01 |
KR20210095025A (ko) | 2021-07-30 |
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