JP2021111701A - 電子部品及びその製造方法 - Google Patents
電子部品及びその製造方法 Download PDFInfo
- Publication number
- JP2021111701A JP2021111701A JP2020002924A JP2020002924A JP2021111701A JP 2021111701 A JP2021111701 A JP 2021111701A JP 2020002924 A JP2020002924 A JP 2020002924A JP 2020002924 A JP2020002924 A JP 2020002924A JP 2021111701 A JP2021111701 A JP 2021111701A
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- Prior art keywords
- electronic component
- conductor
- layer
- substrate
- insulating layers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 238000004519 manufacturing process Methods 0.000 title claims description 35
- 239000004020 conductor Substances 0.000 claims abstract description 98
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 238000000034 method Methods 0.000 claims description 38
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 11
- 238000010586 diagram Methods 0.000 description 21
- 238000012986 modification Methods 0.000 description 8
- 230000004048 modification Effects 0.000 description 8
- 238000007747 plating Methods 0.000 description 7
- 239000003990 capacitor Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000313 electron-beam-induced deposition Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 238000003980 solgel method Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/0909—Preformed cutting or breaking line
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09145—Edge details
- H05K2201/09163—Slotted edge
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10015—Non-printed capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10651—Component having two leads, e.g. resistor, capacitor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
Description
2 基板
2s 基板の側面
3 平坦化層
4 誘電体膜
11〜14 絶縁層
11a〜14a 凹部
11b〜14b 凸部
11s〜14s 絶縁層の側面
21〜29 導体パターン
30〜38 犠牲パターン
41〜44,52〜54,61〜64,73,74 開口部
A 空間
D,D1,D2 ダイシング幅
E1,E2 端子電極
L 突出量
M1〜M4,MM 導体層
P メッキ層
R1〜R3 レジスト層
S シード層
Claims (7)
- 基板と、
前記基板上に交互に積層された複数の導体層及び複数の絶縁層と、を備え、
前記複数の絶縁層の少なくとも一つの側面は、前記基板の側面よりも後退した凹部と、前記凹部から突出する凸部を有することを特徴とする電子部品。 - 前記複数の絶縁層は、いずれも側面が前記凹部及び前記凸部を有することを特徴とする請求項1に記載の電子部品。
- 前記複数の絶縁層の前記少なくとも一つの側面は、全周に亘って前記凹部及び前記凸部を有することを特徴とする請求項1又は2に記載の電子部品。
- 前記基板の側面と前記凸部の端面が同一平面を構成することを特徴とする請求項1乃至3のいずれか一項に記載の電子部品。
- 前記凸部の前記凹部からの突出量は、3μm以上、10μm以下であることを特徴とする請求項1乃至4のいずれか一項に記載の電子部品。
- LCフィルタとして機能することを特徴とする請求項1乃至5のいずれか一項に記載の電子部品。
- 基板上に犠牲パターンを含む複数の導体層と複数の絶縁層を交互に積層することによって複数の電子部品を同時に作製する工程と、
前記犠牲パターンを除去することによって前記複数の電子部品間に空間を形成する工程と、
前記空間に沿って前記基板を切断することによって前記複数の電子部品を個片化する工程と、を備えることを特徴とする電子部品の製造方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020002924A JP7180619B2 (ja) | 2020-01-10 | 2020-01-10 | 電子部品及びその製造方法 |
US17/134,316 US11452209B2 (en) | 2020-01-10 | 2020-12-26 | Electronic component and its manufacturing method |
CN202110022120.1A CN113115509A (zh) | 2020-01-10 | 2021-01-08 | 电子部件及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020002924A JP7180619B2 (ja) | 2020-01-10 | 2020-01-10 | 電子部品及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021111701A true JP2021111701A (ja) | 2021-08-02 |
JP7180619B2 JP7180619B2 (ja) | 2022-11-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020002924A Active JP7180619B2 (ja) | 2020-01-10 | 2020-01-10 | 電子部品及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11452209B2 (ja) |
JP (1) | JP7180619B2 (ja) |
CN (1) | CN113115509A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7427966B2 (ja) | 2020-01-16 | 2024-02-06 | Tdk株式会社 | 電子部品 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7424157B2 (ja) * | 2020-03-25 | 2024-01-30 | Tdk株式会社 | 電子部品及びその製造方法 |
JP2022006781A (ja) | 2020-06-25 | 2022-01-13 | Tdk株式会社 | 電子部品及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007138826A1 (ja) * | 2006-05-29 | 2007-12-06 | Murata Manufacturing Co., Ltd. | セラミック多層基板の製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
JP2008235762A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
JP2012195471A (ja) * | 2011-03-17 | 2012-10-11 | Murata Mfg Co Ltd | 積層基板の製造方法及び該方法で製造された積層基板 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4288841A (en) * | 1979-09-20 | 1981-09-08 | Bell Telephone Laboratories, Incorporated | Double cavity semiconductor chip carrier |
KR950027550U (ko) * | 1994-03-07 | 1995-10-18 | 정의훈 | 클로즈 가이드(Cloth guide)의 경사안내로울러 좌. 우 이송장치 |
US6351028B1 (en) * | 1999-02-08 | 2002-02-26 | Micron Technology, Inc. | Multiple die stack apparatus employing T-shaped interposer elements |
US7667333B2 (en) * | 2006-01-27 | 2010-02-23 | Infineon Technologies Ag | Stack of semiconductor chips |
JP2008034626A (ja) | 2006-07-28 | 2008-02-14 | Tdk Corp | 電子部品及びその製造方法 |
JP5098085B2 (ja) * | 2007-12-18 | 2012-12-12 | スパンション エルエルシー | 半導体装置及びその製造方法 |
JP2009174910A (ja) * | 2008-01-22 | 2009-08-06 | Olympus Corp | 積層実装構造体 |
US7863722B2 (en) * | 2008-10-20 | 2011-01-04 | Micron Technology, Inc. | Stackable semiconductor assemblies and methods of manufacturing such assemblies |
CN103828038B (zh) * | 2011-07-25 | 2016-07-06 | 京瓷株式会社 | 布线基板、电子装置及电子模块 |
CN103065560B (zh) * | 2013-01-11 | 2015-09-09 | 深圳市晶泓科技有限公司 | 一种led显示屏显示单元及其生产方法 |
US9318451B2 (en) * | 2013-10-31 | 2016-04-19 | Freescale Semiconductor, Inc. | Wirebond recess for stacked die |
US9763327B2 (en) * | 2015-03-19 | 2017-09-12 | Multek Technologies Limited | Selective segment via plating process and structure |
TWI578582B (zh) * | 2015-04-16 | 2017-04-11 | 凱鈺科技股份有限公司 | 發光二極體載板及其製造方法 |
WO2018030128A1 (ja) * | 2016-08-08 | 2018-02-15 | 株式会社村田製作所 | 積層回路基板、積層電子部品およびモジュール |
JP6623356B1 (ja) * | 2019-05-23 | 2019-12-25 | 合同会社jujube | 電子部品の実装構造及び電子部品の実装方法 |
-
2020
- 2020-01-10 JP JP2020002924A patent/JP7180619B2/ja active Active
- 2020-12-26 US US17/134,316 patent/US11452209B2/en active Active
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2021
- 2021-01-08 CN CN202110022120.1A patent/CN113115509A/zh active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2007138826A1 (ja) * | 2006-05-29 | 2007-12-06 | Murata Manufacturing Co., Ltd. | セラミック多層基板の製造方法 |
WO2008018227A1 (fr) * | 2006-08-07 | 2008-02-14 | Murata Manufacturing Co., Ltd. | Procédé de production d'un substrat céramique multicouche |
JP2008235762A (ja) * | 2007-03-23 | 2008-10-02 | Matsushita Electric Ind Co Ltd | インダクタンス部品およびその製造方法 |
JP2012195471A (ja) * | 2011-03-17 | 2012-10-11 | Murata Mfg Co Ltd | 積層基板の製造方法及び該方法で製造された積層基板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7427966B2 (ja) | 2020-01-16 | 2024-02-06 | Tdk株式会社 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
US11452209B2 (en) | 2022-09-20 |
US20210219430A1 (en) | 2021-07-15 |
CN113115509A (zh) | 2021-07-13 |
JP7180619B2 (ja) | 2022-11-30 |
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