JP2021091038A5 - - Google Patents

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Publication number
JP2021091038A5
JP2021091038A5 JP2019222892A JP2019222892A JP2021091038A5 JP 2021091038 A5 JP2021091038 A5 JP 2021091038A5 JP 2019222892 A JP2019222892 A JP 2019222892A JP 2019222892 A JP2019222892 A JP 2019222892A JP 2021091038 A5 JP2021091038 A5 JP 2021091038A5
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JP
Japan
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data
polishing
training
film thickness
dimensional
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JP2019222892A
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English (en)
Japanese (ja)
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JP2021091038A (ja
JP7469032B2 (ja
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Priority claimed from JP2019222892A external-priority patent/JP7469032B2/ja
Priority to JP2019222892A priority Critical patent/JP7469032B2/ja
Priority to SG10202012033VA priority patent/SG10202012033VA/en
Priority to US17/110,797 priority patent/US11759913B2/en
Priority to KR1020200168165A priority patent/KR102802312B1/ko
Priority to TW109143142A priority patent/TWI901615B/zh
Priority to CN202011422501.0A priority patent/CN112936090B/zh
Publication of JP2021091038A publication Critical patent/JP2021091038A/ja
Publication of JP2021091038A5 publication Critical patent/JP2021091038A5/ja
Priority to US18/232,278 priority patent/US20230381919A1/en
Publication of JP7469032B2 publication Critical patent/JP7469032B2/ja
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JP2019222892A 2019-12-10 2019-12-10 研磨方法および研磨装置 Active JP7469032B2 (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2019222892A JP7469032B2 (ja) 2019-12-10 2019-12-10 研磨方法および研磨装置
SG10202012033VA SG10202012033VA (en) 2019-12-10 2020-12-02 Polishing method and polishing apparatus
US17/110,797 US11759913B2 (en) 2019-12-10 2020-12-03 Polishing method and polishing apparatus
KR1020200168165A KR102802312B1 (ko) 2019-12-10 2020-12-04 연마 방법 및 연마 장치
TW109143142A TWI901615B (zh) 2019-12-10 2020-12-08 研磨方法及研磨裝置
CN202011422501.0A CN112936090B (zh) 2019-12-10 2020-12-08 研磨方法及研磨装置
US18/232,278 US20230381919A1 (en) 2019-12-10 2023-08-09 Polishing method and polishing apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2019222892A JP7469032B2 (ja) 2019-12-10 2019-12-10 研磨方法および研磨装置

Publications (3)

Publication Number Publication Date
JP2021091038A JP2021091038A (ja) 2021-06-17
JP2021091038A5 true JP2021091038A5 (enExample) 2022-05-09
JP7469032B2 JP7469032B2 (ja) 2024-04-16

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Family Applications (1)

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JP2019222892A Active JP7469032B2 (ja) 2019-12-10 2019-12-10 研磨方法および研磨装置

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US (2) US11759913B2 (enExample)
JP (1) JP7469032B2 (enExample)
KR (1) KR102802312B1 (enExample)
CN (1) CN112936090B (enExample)
SG (1) SG10202012033VA (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7709281B2 (ja) * 2021-01-14 2025-07-16 株式会社荏原製作所 研磨装置、研磨方法、および基板の膜厚分布の可視化情報を出力する方法
EP4301548A4 (en) * 2021-03-03 2025-01-29 Applied Materials, Inc. IN-SITU MONITORING FOR MARKING TRAINING SPECTRA FOR A MACHINE LEARNING SYSTEM FOR SPECTROGRAPHIC MONITORING
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
JP7709930B2 (ja) 2022-02-18 2025-07-17 株式会社Ｓｃｒｅｅｎホールディングス 基板処理条件の設定方法、基板処理方法、基板処理条件の設定システム、及び、基板処理システム
CN116713892B (zh) * 2023-08-10 2023-11-10 北京特思迪半导体设备有限公司 用于晶圆薄膜磨削的终点检测方法及设备
US20250316491A1 (en) * 2024-04-08 2025-10-09 Applied Materials, Inc. Integrated substrate thinning

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05128256A (ja) 1991-10-31 1993-05-25 Sumitomo Light Metal Ind Ltd 欠陥画像処理装置及び静止画像取込装置
JPH07111721B2 (ja) 1992-06-05 1995-11-29 日本アイ・ビー・エム株式会社 線要素データの３次元変換装置及び方法
JP3971731B2 (ja) 2003-10-23 2007-09-05 日本電信電話株式会社 光周波数シフタアレイ
JP2005342310A (ja) 2004-06-04 2005-12-15 Takeya Co Ltd 遊技機
JP3906230B2 (ja) 2005-03-11 2007-04-18 株式会社東芝 音響信号処理装置、音響信号処理方法、音響信号処理プログラム、及び音響信号処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP5534672B2 (ja) * 2005-08-22 2014-07-02 アプライド マテリアルズ インコーポレイテッド 化学機械的研磨のスペクトルに基づく監視のための装置および方法
JP5376293B2 (ja) * 2008-11-17 2013-12-25 株式会社ニコン 終点検出装置および研磨装置
US9579767B2 (en) * 2010-04-28 2017-02-28 Applied Materials, Inc. Automatic generation of reference spectra for optical monitoring of substrates
WO2011139575A2 (en) * 2010-05-05 2011-11-10 Applied Materials, Inc. Endpoint method using peak location of modified spectra
JP5980476B2 (ja) * 2010-12-27 2016-08-31 株式会社荏原製作所 ポリッシング装置およびポリッシング方法
US8547538B2 (en) * 2011-04-21 2013-10-01 Applied Materials, Inc. Construction of reference spectra with variations in environmental effects
JP6105371B2 (ja) * 2013-04-25 2017-03-29 株式会社荏原製作所 研磨方法および研磨装置
TWI635929B (zh) * 2013-07-11 2018-09-21 日商荏原製作所股份有限公司 研磨裝置及研磨狀態監視方法
JP6215602B2 (ja) 2013-07-11 2017-10-18 株式会社荏原製作所 研磨装置および研磨状態監視方法
JP2015126179A (ja) * 2013-12-27 2015-07-06 株式会社荏原製作所 研磨終点検出方法、及び研磨終点検出装置
WO2015163164A1 (ja) 2014-04-22 2015-10-29 株式会社 荏原製作所 研磨方法および研磨装置
JP6475604B2 (ja) * 2015-11-24 2019-02-27 株式会社荏原製作所 研磨方法

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