JP2022010553A5 - - Google Patents

Download PDF

Info

Publication number
JP2022010553A5
JP2022010553A5 JP2020111199A JP2020111199A JP2022010553A5 JP 2022010553 A5 JP2022010553 A5 JP 2022010553A5 JP 2020111199 A JP2020111199 A JP 2020111199A JP 2020111199 A JP2020111199 A JP 2020111199A JP 2022010553 A5 JP2022010553 A5 JP 2022010553A5
Authority
JP
Japan
Prior art keywords
spectra
spectrum
substrate
group
primary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2020111199A
Other languages
English (en)
Japanese (ja)
Other versions
JP2022010553A (ja
JP7389718B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2020111199A external-priority patent/JP7389718B2/ja
Priority to JP2020111199A priority Critical patent/JP7389718B2/ja
Priority to US17/340,548 priority patent/US20210402550A1/en
Priority to TW110121320A priority patent/TWI899255B/zh
Priority to KR1020210080554A priority patent/KR20220001474A/ko
Priority to CN202110717711.0A priority patent/CN113927374A/zh
Publication of JP2022010553A publication Critical patent/JP2022010553A/ja
Publication of JP2022010553A5 publication Critical patent/JP2022010553A5/ja
Publication of JP7389718B2 publication Critical patent/JP7389718B2/ja
Application granted granted Critical
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2020111199A 2020-06-29 2020-06-29 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体 Active JP7389718B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2020111199A JP7389718B2 (ja) 2020-06-29 2020-06-29 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体
US17/340,548 US20210402550A1 (en) 2020-06-29 2021-06-07 Polishing method, polishing apparatus, and computer-readable storage medium storing program
TW110121320A TWI899255B (zh) 2020-06-29 2021-06-11 研磨方法、研磨裝置、及記錄有程式之電腦可讀取記錄媒體
KR1020210080554A KR20220001474A (ko) 2020-06-29 2021-06-22 연마 방법, 연마 장치 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체
CN202110717711.0A CN113927374A (zh) 2020-06-29 2021-06-28 研磨方法、研磨装置及计算机可读取的记录介质

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2020111199A JP7389718B2 (ja) 2020-06-29 2020-06-29 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体

Publications (3)

Publication Number Publication Date
JP2022010553A JP2022010553A (ja) 2022-01-17
JP2022010553A5 true JP2022010553A5 (enExample) 2022-10-26
JP7389718B2 JP7389718B2 (ja) 2023-11-30

Family

ID=79032185

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020111199A Active JP7389718B2 (ja) 2020-06-29 2020-06-29 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体

Country Status (4)

Country Link
US (1) US20210402550A1 (enExample)
JP (1) JP7389718B2 (enExample)
KR (1) KR20220001474A (enExample)
CN (1) CN113927374A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
JPWO2023189656A1 (enExample) * 2022-03-30 2023-10-05
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN118254096B (zh) * 2024-05-29 2024-08-16 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
CN118254098B (zh) * 2024-05-29 2024-08-16 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
WO2025246244A1 (zh) * 2024-05-29 2025-12-04 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
CN118254097B (zh) * 2024-05-29 2024-09-10 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法及化学机械抛光设备

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6806948B2 (en) 2002-03-29 2004-10-19 Lam Research Corporation System and method of broad band optical end point detection for film change indication
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
JP2008244335A (ja) 2007-03-28 2008-10-09 Tokyo Seimitsu Co Ltd 光学式研磨終点検出装置の自動光量調整装置及び自動光量調整方法
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
JP5612945B2 (ja) 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
JP6005467B2 (ja) 2011-10-26 2016-10-12 株式会社荏原製作所 研磨方法および研磨装置
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
JP5903135B2 (ja) 2014-08-04 2016-04-13 株式会社東京精密 研磨終点検出装置、及び研磨終点検出方法
US11557048B2 (en) * 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
WO2020005770A1 (en) * 2018-06-28 2020-01-02 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring

Similar Documents

Publication Publication Date Title
JP2022010553A5 (enExample)
US20200184146A1 (en) Techniques for combining human and machine learning in natural language processing
Mariana Education as a determinant of the economic growth. The case of Romania
JP6774551B2 (ja) 音声認識処理方法及び装置
CN111080109B (zh) 客服服务质量评价方法、装置及电子设备
TWI375289B (en) Weighting function to enhance measured diffraction signals in optical metrology
TW201706960A (zh) 用於缺陷分類之方法及系統
Mass et al. Alternative tests for the selection of model variables
Coutinho et al. Automatically estimating emotion in music with deep long-short term memory recurrent neural networks
JPWO2021210172A5 (ja) データ処理装置、システム、データ処理方法、およびプログラム
Rikters et al. Confidence through attention
JPWO2021225097A5 (enExample)
CN107193969A (zh) 一种自动生成小说文本情感曲线并预测推荐的方法
De Oliveira et al. Humor detection in yelp reviews
Caetano et al. Leveraging diversity in computer-aided musical orchestration with an artificial immune system for multi-modal optimization
CN113884445B (zh) 测量薄膜光学常数的方法、系统、计算设备和存储介质
JP6785752B2 (ja) グレージング入射ｘ線反射率独立モデル
JP7120468B2 (ja) 音響解析方法、音響解析装置およびプログラム
JPWO2015163322A1 (ja) データ分析装置、データ分析方法およびプログラム
JP2017151308A5 (enExample)
CN108154382B (zh) 评价装置、评价方法及存储介质
Sandri et al. 2ssp: A two-stage framework for structured pruning of llms
Fernández Martínez et al. Combining audio-visual features for viewers' perception classification of Youtube car commercials
US9734844B2 (en) Irregularity detection in music
Shi et al. General phrase debiaser: Debiasing masked language models at a multi-token level