KR20220001474A - 연마 방법, 연마 장치 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 - Google Patents

연마 방법, 연마 장치 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 Download PDF

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Publication number
KR20220001474A
KR20220001474A KR1020210080554A KR20210080554A KR20220001474A KR 20220001474 A KR20220001474 A KR 20220001474A KR 1020210080554 A KR1020210080554 A KR 1020210080554A KR 20210080554 A KR20210080554 A KR 20210080554A KR 20220001474 A KR20220001474 A KR 20220001474A
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South Korea
Prior art keywords
spectrum
spectra
substrate
group
primary
Prior art date
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Pending
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KR1020210080554A
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English (en)
Korean (ko)
Inventor
요이치 시오카와
게이타 야기
유키 와타나베
나치케타 차우한
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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Publication of KR20220001474A publication Critical patent/KR20220001474A/ko
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B24B49/04—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent involving measurement of the workpiece at the place of grinding during grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
KR1020210080554A 2020-06-29 2021-06-22 연마 방법, 연마 장치 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체 Pending KR20220001474A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2020-111199 2020-06-29
JP2020111199A JP7389718B2 (ja) 2020-06-29 2020-06-29 研磨方法、研磨装置、およびプログラムを記録したコンピュータ読み取り可能な記録媒体

Publications (1)

Publication Number Publication Date
KR20220001474A true KR20220001474A (ko) 2022-01-05

Family

ID=79032185

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020210080554A Pending KR20220001474A (ko) 2020-06-29 2021-06-22 연마 방법, 연마 장치 및 프로그램을 기록한 컴퓨터 판독 가능한 기록 매체

Country Status (4)

Country Link
US (1) US20210402550A1 (enExample)
JP (1) JP7389718B2 (enExample)
KR (1) KR20220001474A (enExample)
CN (1) CN113927374A (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7547275B2 (ja) * 2021-03-31 2024-09-09 株式会社荏原製作所 ワークピースの膜厚を推定するモデルを作成する方法、そのようなモデルを用いてワークピースの研磨中に膜厚を推定する方法、およびコンピュータにこれらの方法を実行させるためのプログラム
JPWO2023189656A1 (enExample) * 2022-03-30 2023-10-05
JP2024040885A (ja) * 2022-09-13 2024-03-26 株式会社荏原製作所 研磨装置におけるグラフの表示方法およびコンピュータプログラム
CN118254096B (zh) * 2024-05-29 2024-08-16 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
CN118254098B (zh) * 2024-05-29 2024-08-16 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
WO2025246244A1 (zh) * 2024-05-29 2025-12-04 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法、参考光谱生成方法及设备
CN118254097B (zh) * 2024-05-29 2024-09-10 北京特思迪半导体设备有限公司 用于原位测量膜厚的方法及化学机械抛光设备

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083522A2 (en) 2002-03-29 2003-10-09 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP2008244335A (ja) 2007-03-28 2008-10-09 Tokyo Seimitsu Co Ltd 光学式研磨終点検出装置の自動光量調整装置及び自動光量調整方法
JP2015008303A (ja) 2014-08-04 2015-01-15 株式会社東京精密 研磨終点検出装置、及び研磨終点検出方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7764377B2 (en) * 2005-08-22 2010-07-27 Applied Materials, Inc. Spectrum based endpointing for chemical mechanical polishing
US8190285B2 (en) * 2010-05-17 2012-05-29 Applied Materials, Inc. Feedback for polishing rate correction in chemical mechanical polishing
JP5612945B2 (ja) 2010-07-23 2014-10-22 株式会社荏原製作所 基板の研磨の進捗を監視する方法および研磨装置
JP6005467B2 (ja) 2011-10-26 2016-10-12 株式会社荏原製作所 研磨方法および研磨装置
US10012494B2 (en) * 2013-10-25 2018-07-03 Applied Materials, Inc. Grouping spectral data from polishing substrates
US11557048B2 (en) * 2015-11-16 2023-01-17 Applied Materials, Inc. Thickness measurement of substrate using color metrology
WO2020005770A1 (en) * 2018-06-28 2020-01-02 Applied Materials, Inc. Training spectrum generation for machine learning system for spectrographic monitoring

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003083522A2 (en) 2002-03-29 2003-10-09 Lam Research Corporation System and method of broad band optical end point detection for film change indication
JP2008244335A (ja) 2007-03-28 2008-10-09 Tokyo Seimitsu Co Ltd 光学式研磨終点検出装置の自動光量調整装置及び自動光量調整方法
JP2015008303A (ja) 2014-08-04 2015-01-15 株式会社東京精密 研磨終点検出装置、及び研磨終点検出方法

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CN113927374A (zh) 2022-01-14
JP2022010553A (ja) 2022-01-17
US20210402550A1 (en) 2021-12-30
JP7389718B2 (ja) 2023-11-30
TW202218808A (zh) 2022-05-16

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