JP2021086986A - 基板搬送装置及び基板処理システム - Google Patents
基板搬送装置及び基板処理システム Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims abstract description 83
- 238000012545 processing Methods 0.000 title claims description 67
- 238000012546 transfer Methods 0.000 claims abstract description 97
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 230000032258 transport Effects 0.000 abstract description 55
- 239000012636 effector Substances 0.000 description 68
- 238000000034 method Methods 0.000 description 8
- 230000008569 process Effects 0.000 description 7
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- 230000000149 penetrating effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
- B25J19/0025—Means for supplying energy to the end effector
- B25J19/0045—Contactless power transmission, e.g. by magnetic induction
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/106—Programme-controlled manipulators characterised by positioning means for manipulator elements with articulated links
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/10—Programme-controlled manipulators characterised by positioning means for manipulator elements
- B25J9/12—Programme-controlled manipulators characterised by positioning means for manipulator elements electric
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K7/00—Arrangements for handling mechanical energy structurally associated with dynamo-electric machines, e.g. structural association with mechanical driving motors or auxiliary dynamo-electric machines
- H02K7/14—Structural association with mechanical loads, e.g. with hand-held machine tools or fans
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K2201/00—Specific aspects not provided for in the other groups of this subclass relating to the magnetic circuits
- H02K2201/18—Machines moving with multiple degrees of freedom
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02K—DYNAMO-ELECTRIC MACHINES
- H02K41/00—Propulsion systems in which a rigid body is moved along a path due to dynamo-electric interaction between the body and a magnetic field travelling along the path
- H02K41/02—Linear motors; Sectional motors
- H02K41/03—Synchronous motors; Motors moving step by step; Reluctance motors
- H02K41/031—Synchronous motors; Motors moving step by step; Reluctance motors of the permanent magnet type
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- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Abstract
Description
一実施形態に係る基板処理システム100の全体構成の一例について、図1を用いて説明する。図1は、一実施形態に係る基板処理システム100の一例の構成を示す平面図である。なお、図1では、ウェハWにドットのハッチングを付して図示している。
次に、基板搬送装置125について、図2を用いて更に説明する。図2は、一実施形態に係る搬送ユニット20の一例を示す平面視図である。なお、図2(a)は、搬送ユニット20の姿勢の一例を示す。図2(b)は、搬送ユニット20の姿勢の他の一例を示す。
他の実施形態に係る基板処理システム100Bの全体構成の一例について、図5を用いて説明する。図5は、他の実施形態に係る基板処理システム100Bの一例の構成を示す平面図である。なお、図5では、ウェハWにドットのハッチングを付して図示している。
搬送ユニット20Bについて図6を用いて更に説明する。図6は、他の実施形態に係る搬送ユニット20Bの一例を示す側面視図である。搬送ユニット20Bは、2つのベース31,32と、リンク機構(リンク71〜73)と、エンドエフェクタ50と、を有する。なお、搬送ユニット20Bは、複数台設けられていてもよい。
100,100B 基板処理システム
110 処理室
111 載置台
120 真空搬送室
125 基板搬送装置
130 ロードロック室
150 制御部
10 平面モータ
15 コイル
20,20A,20B 搬送ユニット
31,32 ベース
35 永久磁石
41〜42,44〜47,71〜73 リンク
50 エンドエフェクタ(基板支持部材)
61,62 ストッパ(係止部材)
Claims (11)
- 搬送室に設けられ、配列されたコイルを有する平面モータと、
前記平面モータ上を移動する搬送ユニットと、
前記コイルの通電を制御する制御部と、を備え、
前記搬送ユニットは、
配列された磁石を有し、前記平面モータを移動する2つのベースと、
基板を支持する基板支持部材と、
2つの前記ベースと前記基板支持部材とを連結するリンク機構と、を備える、
基板搬送装置。 - 前記リンク機構は、
2つの前記ベースの間隔を変更することで、前記基板支持部材の延伸量を変更する、
請求項1に記載の基板搬送装置。 - 前記リンク機構は、第1及び第2のリンクを有し、
前記第1のリンクは、一端が一の前記ベースと回転自在に接続され、他端が前記基板支持部材と回転自在に接続され、
前記第2のリンクは、一端が他の前記ベースと回転自在に接続され、他端が前記基板支持部材と回転自在に接続される、
請求項2に記載の基板搬送装置。 - 前記リンク機構は、第1乃至第4のリンクを有し、
前記第1のリンクは、一端が一の前記ベースと回転自在に接続され、他端が前記第4のリンクの一端と回転自在に接続され、
前記第2のリンクは、一端が他の前記ベースと回転自在に接続され、他端が前記第3のリンクの一端と回転自在に接続され、
前記第3のリンクは、一端が前記第2のリンクの他端と回転自在に接続され、他端が前記基板支持部材と回転自在に接続され、
前記第4のリンクは、一端が前記第1のリンクの他端と回転自在に接続され、他端が前記基板支持部材と回転自在に接続され、
前記第1のリンクの途中と前記第2のリンクの途中で、回転自在に接続される、
請求項2に記載の基板搬送装置。 - 前記リンクの回転角度を制限する係止部材を更に有する、
請求項2乃至請求項4のいずれか1項に記載の基板搬送装置。 - 前記リンク機構は、
2つの前記ベースの間隔を変更することで、前記基板支持部材の高さを変更する、
請求項1に記載の基板搬送装置。 - 前記リンク機構は、
2つの前記ベースの間隔を変更することで、前記基板支持部材の傾きを変更する、
請求項1に記載の基板搬送装置。 - 前記リンク機構は、第1乃至第3のリンクを有し、
前記第1のリンクは、一端が一の前記ベースと回転自在に接続され、他端が前記第3のリンクの一端と回転自在に接続され、
前記第2のリンクは、一端が他の前記ベースと回転自在に接続され、他端が前記第3のリンクの他端と回転自在に接続され、
前記第1のリンクと前記第3のリンクがなす角と、前記第2のリンクと前記第3のリンクがなす角とが等しい、
請求項6に記載の基板搬送装置。 - 前記リンク機構は、第1乃至第3のリンクを有し、
前記第1のリンクは、一端が一の前記ベースと回転自在に接続され、他端が前記第3のリンクの一端と回転自在に接続され、
前記第2のリンクは、一端が他の前記ベースと回転自在に接続され、他端が前記第3のリンクの他端と回転自在に接続され、
前記リンクの少なくともいずれかの角度が固定される、
請求項7に記載の基板搬送装置。 - 複数の室と、
前記室を連結する搬送室と、
前記搬送室に設けられる、請求項1乃至請求項9のいずれか1項に記載の基板搬送装置と、
を備える、基板処理システム。 - 前記搬送室は、真空雰囲気の真空搬送室である、
請求項10に記載の基板処理システム。
Priority Applications (8)
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JP2019217076A JP7370233B2 (ja) | 2019-11-29 | 2019-11-29 | 基板搬送装置及び基板処理システム |
TW109139845A TW202131435A (zh) | 2019-11-29 | 2020-11-16 | 基板搬送裝置及基板處理系統 |
KR1020227020711A KR20220103151A (ko) | 2019-11-29 | 2020-11-20 | 기판 반송 장치 및 기판 처리 시스템 |
CN202080080931.0A CN114730727A (zh) | 2019-11-29 | 2020-11-20 | 基板输送装置和基板处理系统 |
PCT/JP2020/043454 WO2021106796A1 (ja) | 2019-11-29 | 2020-11-20 | 基板搬送装置及び基板処理システム |
US17/779,873 US11764092B2 (en) | 2019-11-29 | 2020-11-20 | Substrate transfer apparatus and substrate processing system |
US18/230,929 US20230377927A1 (en) | 2019-11-29 | 2023-08-07 | Substrate transfer apparatus and substrate processing system |
JP2023178977A JP2023184575A (ja) | 2019-11-29 | 2023-10-17 | 基板搬送装置及び基板処理システム |
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KR (1) | KR20220103151A (ja) |
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Cited By (6)
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CN113707585A (zh) * | 2021-08-23 | 2021-11-26 | 上海引万光电科技有限公司 | 一种磁悬浮式衬底传送腔及传送方法 |
US20220130701A1 (en) * | 2020-01-12 | 2022-04-28 | Tokyo Electron Limited | Substrate transfer apparatus, substrate transfer method, and substrate processing system |
JP2023004967A (ja) * | 2021-06-25 | 2023-01-17 | シンテゴンテクノロジー ゲー・エム・ベー・ハー | 平面駆動装置および平面駆動装置を運転するための方法 |
KR20230081641A (ko) | 2021-11-30 | 2023-06-07 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 장치 및 기판 반송 방법 |
KR20230137827A (ko) | 2022-03-22 | 2023-10-05 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
JP7357121B2 (ja) | 2021-10-12 | 2023-10-05 | セメス株式会社 | 基板移送装置および方法 |
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JP7370233B2 (ja) * | 2019-11-29 | 2023-10-27 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理システム |
JP2022133867A (ja) * | 2021-03-02 | 2022-09-14 | 東京エレクトロン株式会社 | 基板搬送装置及び基板処理システム |
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- 2020-11-20 WO PCT/JP2020/043454 patent/WO2021106796A1/ja active Application Filing
- 2020-11-20 US US17/779,873 patent/US11764092B2/en active Active
- 2020-11-20 CN CN202080080931.0A patent/CN114730727A/zh active Pending
- 2020-11-20 KR KR1020227020711A patent/KR20220103151A/ko not_active Application Discontinuation
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US20220130701A1 (en) * | 2020-01-12 | 2022-04-28 | Tokyo Electron Limited | Substrate transfer apparatus, substrate transfer method, and substrate processing system |
US11990357B2 (en) * | 2021-01-12 | 2024-05-21 | Tokyo Electron Limited | Substrate transport apparatus, substrate transport method, and substrate processing system |
JP2023004967A (ja) * | 2021-06-25 | 2023-01-17 | シンテゴンテクノロジー ゲー・エム・ベー・ハー | 平面駆動装置および平面駆動装置を運転するための方法 |
JP7384966B2 (ja) | 2021-06-25 | 2023-11-21 | シンテゴンテクノロジー ゲー・エム・ベー・ハー | 平面駆動装置および平面駆動装置を運転するための方法 |
CN113707585A (zh) * | 2021-08-23 | 2021-11-26 | 上海引万光电科技有限公司 | 一种磁悬浮式衬底传送腔及传送方法 |
JP7357121B2 (ja) | 2021-10-12 | 2023-10-05 | セメス株式会社 | 基板移送装置および方法 |
KR20230081641A (ko) | 2021-11-30 | 2023-06-07 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 장치 및 기판 반송 방법 |
KR20230137827A (ko) | 2022-03-22 | 2023-10-05 | 도쿄엘렉트론가부시키가이샤 | 기판 처리 시스템 |
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US20220415688A1 (en) | 2022-12-29 |
KR20220103151A (ko) | 2022-07-21 |
TW202131435A (zh) | 2021-08-16 |
CN114730727A (zh) | 2022-07-08 |
WO2021106796A1 (ja) | 2021-06-03 |
US11764092B2 (en) | 2023-09-19 |
JP7370233B2 (ja) | 2023-10-27 |
JP2023184575A (ja) | 2023-12-28 |
US20230377927A1 (en) | 2023-11-23 |
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