|
GB1328041A
(en)
*
|
1971-03-01 |
1973-08-22 |
Ipsen Ind Int Gmbh |
Vacuum furnaces
|
|
GB1450912A
(en)
*
|
1973-07-31 |
1976-09-29 |
Welding Inst |
Arc welding process
|
|
US4886449A
(en)
*
|
1982-12-04 |
1989-12-12 |
General Motors Corporation |
Vacuum brazing of aluminum alloy workpieces
|
|
US4906182A
(en)
*
|
1988-08-25 |
1990-03-06 |
Abar Ipsen Industries, Inc. |
Gas cooling system for processing furnace
|
|
JPH0248132Y2
(enExample)
*
|
1988-09-16 |
1990-12-18 |
|
|
|
US5016707A
(en)
*
|
1989-12-28 |
1991-05-21 |
Sundstrand Corporation |
Multi-pass crossflow jet impingement heat exchanger
|
|
US5020331A
(en)
*
|
1990-02-09 |
1991-06-04 |
National Refrigeration Products, Inc. |
Refrigerant reclamation system
|
|
JPH0739483Y2
(ja)
*
|
1990-11-15 |
1995-09-13 |
千住金属工業株式会社 |
リフロー炉
|
|
US5267257A
(en)
*
|
1991-08-14 |
1993-11-30 |
Grier-Jhawar-Mercer, Inc. |
Vacuum furnace with convection heating and cooling
|
|
US5341978A
(en)
*
|
1993-08-16 |
1994-08-30 |
General Motors Corporation |
Braze furnace with improved inert gas system
|
|
US5542596A
(en)
*
|
1994-12-20 |
1996-08-06 |
United Technologies Corp. |
Vapor phase soldering machine having a tertiary cooling vapor
|
|
US5535812A
(en)
|
1995-01-06 |
1996-07-16 |
Singleton Technology, Inc. |
Method of and apparatus for continuous casting of metal
|
|
US5860583A
(en)
*
|
1996-07-01 |
1999-01-19 |
Motorola, Inc. |
Evaporative cooling vessel for controlling the temperature of a portion of an electronic part during solder reflow
|
|
JP3495207B2
(ja)
*
|
1996-11-01 |
2004-02-09 |
日本電熱計器株式会社 |
リフローはんだ付け装置
|
|
JPH1154903A
(ja)
*
|
1997-07-31 |
1999-02-26 |
Fujitsu Ltd |
リフローソルダリング方法及びリフロー炉
|
|
JP3644354B2
(ja)
*
|
2000-05-09 |
2005-04-27 |
トヨタ自動車株式会社 |
温度推定方法および装置
|
|
FR2818088B1
(fr)
*
|
2000-12-11 |
2003-02-28 |
Air Liquide |
Procede de realisation d'une brasure entre des billes metalliques d'un composant electronique et des plages d'accueil d'un circuit et four de brasage pour la mise en oeuvre de ce procede
|
|
US6349108B1
(en)
*
|
2001-03-08 |
2002-02-19 |
Pv/T, Inc. |
High temperature vacuum furnace
|
|
US6593549B2
(en)
*
|
2001-11-30 |
2003-07-15 |
Intel Corporation |
Cooling device/heater assembly including a supporting bracket for a reflow oven
|
|
RU2301727C2
(ru)
*
|
2002-02-05 |
2007-06-27 |
Ипсен Интернешнл, Инк. |
Вакуумная печь для пайки давлением и способ ее использования
|
|
JP2003290973A
(ja)
*
|
2002-04-08 |
2003-10-14 |
Matsushita Electric Ind Co Ltd |
はんだ付け装置
|
|
US6936793B1
(en)
*
|
2002-04-17 |
2005-08-30 |
Novastar Technologiesm Inc. |
Oven apparatus and method of use thereof
|
|
KR100943463B1
(ko)
*
|
2003-06-27 |
2010-02-19 |
가부시키가이샤 아이에이치아이 |
가스 냉각식 진공 열처리로 및 그 냉각 가스의 방향 절환장치
|
|
CN1303647C
(zh)
*
|
2003-09-30 |
2007-03-07 |
佳能株式会社 |
加热方法、加热装置、以及图像显示装置的制造方法
|
|
US7259350B2
(en)
|
2004-08-26 |
2007-08-21 |
United Technologies Corporation |
Turbine component crack repair using cathodic arc and/or low pressure plasma spraying and HIP
|
|
US7377774B2
(en)
*
|
2004-09-16 |
2008-05-27 |
Ihi Corp. |
Change-over apparatus for cooling gas passages in vacuum heat treating furnace
|
|
JP4448749B2
(ja)
|
2004-09-16 |
2010-04-14 |
神港精機株式会社 |
加熱及び冷却装置
|
|
US20080006294A1
(en)
*
|
2006-06-27 |
2008-01-10 |
Neeraj Saxena |
Solder cooling system
|
|
DE102006034600B4
(de)
*
|
2006-07-26 |
2010-01-14 |
Infineon Technologies Ag |
Verfahren zur Herstellung einer Lötverbindung
|
|
JP5078537B2
(ja)
*
|
2007-10-15 |
2012-11-21 |
三菱重工業株式会社 |
補修方法
|
|
JP5424201B2
(ja)
*
|
2009-08-27 |
2014-02-26 |
アユミ工業株式会社 |
加熱溶融処理装置および加熱溶融処理方法
|
|
US9777971B2
(en)
*
|
2009-10-06 |
2017-10-03 |
Lockheed Martin Corporation |
Modular heat exchanger
|
|
US8791564B2
(en)
*
|
2010-02-24 |
2014-07-29 |
Toyota Jidosha Kabushiki Kaisha |
Method of Manufacturing a semiconductor module and device for the same
|
|
JP5726545B2
(ja)
|
2011-01-24 |
2015-06-03 |
株式会社東芝 |
トランジションピースの損傷補修方法およびトランジションピース
|
|
CN102240860B
(zh)
*
|
2011-04-26 |
2014-04-02 |
罗键 |
梯度材料模具制造方法及设备
|
|
CN104284749B
(zh)
*
|
2012-04-25 |
2016-09-21 |
欧利生电气株式会社 |
焊接装置及焊接制品的制造方法
|
|
JP2014157858A
(ja)
*
|
2013-02-14 |
2014-08-28 |
Fuji Electric Co Ltd |
半導体装置の製造方法
|
|
DE102013008396B4
(de)
*
|
2013-05-17 |
2015-04-02 |
G. Rau Gmbh & Co. Kg |
Verfahren und Vorrichtung zum Umschmelzen und/oder Umschmelzlegieren metallischer Werkstoffe, insbesondere von Nitinol
|
|
US9597744B2
(en)
|
2013-11-11 |
2017-03-21 |
Siemens Energy, Inc. |
Method for utilizing a braze material with carbon structures
|
|
EP2881205A1
(en)
*
|
2013-12-04 |
2015-06-10 |
Alstom Technology Ltd |
Method for manufacturing a braze joint gap and method for brazing or soldering
|
|
US11072044B2
(en)
|
2014-04-14 |
2021-07-27 |
Siemens Energy, Inc. |
Superalloy component braze repair with isostatic solution treatment
|
|
US10596649B2
(en)
*
|
2014-12-09 |
2020-03-24 |
Pink Gmbh Thermosysteme |
Heat transfer device for producing a soldered connection of electrical components
|
|
US20160238323A1
(en)
*
|
2015-02-12 |
2016-08-18 |
Energyor Technologies Inc |
Plate fin heat exchangers and methods for manufacturing same
|
|
CN105364269B
(zh)
*
|
2015-12-08 |
2017-08-04 |
辽宁石油化工大学 |
一种铜板及其合金的熔化焊接方法
|
|
CN206028955U
(zh)
*
|
2016-08-30 |
2017-03-22 |
中国西电电气股份有限公司 |
一种用于火焰钎焊的工作装置
|
|
US20180200817A1
(en)
|
2017-01-19 |
2018-07-19 |
General Electric Company |
Method of brazing and brazed article
|
|
CN110678288B
(zh)
*
|
2017-05-05 |
2021-11-26 |
平克塞莫系统有限公司 |
用于产生焊接连接部的方法
|
|
JP6739417B2
(ja)
*
|
2017-10-31 |
2020-08-12 |
Ｄｏｗａサーモテック株式会社 |
熱処理設備
|
|
WO2019164485A1
(en)
|
2018-02-22 |
2019-08-29 |
Siemens Energy, Inc. |
Sintered weld rod for laser braze repair of nickel base components
|
|
WO2019168517A1
(en)
|
2018-02-28 |
2019-09-06 |
Siemens Energy, Inc. |
Brazing of superalloy components with hydrogen addition for boron capture
|
|
CN109848638B
(zh)
*
|
2019-01-25 |
2021-02-05 |
哈尔滨工业大学 |
一种高温合金复合修复方法及修复材料
|
|
US11443981B2
(en)
*
|
2019-08-16 |
2022-09-13 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
Bonding method of package components and bonding apparatus
|
|
KR102860020B1
(ko)
*
|
2019-09-06 |
2025-09-12 |
삼성전자주식회사 |
솔더 범프 제조 장치 및 솔더 범프 형성 방법
|
|
CN115605310A
(zh)
*
|
2020-05-15 |
2023-01-13 |
平克塞莫系统有限公司（De） |
用于连接电子组件的系统
|