JP2021048271A - 加工装置 - Google Patents
加工装置 Download PDFInfo
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- JP2021048271A JP2021048271A JP2019170037A JP2019170037A JP2021048271A JP 2021048271 A JP2021048271 A JP 2021048271A JP 2019170037 A JP2019170037 A JP 2019170037A JP 2019170037 A JP2019170037 A JP 2019170037A JP 2021048271 A JP2021048271 A JP 2021048271A
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- 238000005520 cutting process Methods 0.000 abstract description 18
- 239000000463 material Substances 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 18
- 238000003860 storage Methods 0.000 description 17
- 230000032258 transport Effects 0.000 description 17
- 238000004140 cleaning Methods 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000001514 detection method Methods 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 4
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/6773—Conveying cassettes, containers or carriers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
- B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
Abstract
Description
被加工物を保持する保持手段と、該保持手段で保持された被加工物に加工を施す加工手段と、を備えた加工装置であって、
該被加工物を複数収容可能な第一カセットが載置される第一カセット載置台と、
該被加工物を複数収容可能な第二カセットが載置される第二カセット載置台と、
該第一カセット載置台を受渡位置と、第一カセット退避位置と、に位置付ける第一位置付け手段と、
該第二カセット載置台を該受渡位置と、第二カセット退避位置と、に位置付ける第二位置付け手段と、
該受渡位置と該保持手段の間で被加工物を搬送する搬送手段と、を備え、
該受渡位置と該第一カセット退避位置は、Z方向に隣接して配置され、
該受渡位置と該第二カセット退避位置は、該Z方向に直交するX方向に隣接して配置される、加工装置とするものである。
該加工装置は、少なくとも該第一位置付け手段と、該第二位置付け手段と、を制御する制御手段を備え、
該制御手段は、該加工手段で加工が施された被加工物が、該第一カセットと該第二カセットとのうち収容されていたカセットに搬入されるように、該第一カセット載置台と該第二カセット載置台とをそれぞれ該受渡位置に位置付けるように、該第一位置付け手段と該第二位置付け手段を制御する、こととするものである。
第二Y軸方向送り手段38は、筐体3の側部3aに設け荒れるものであり、Y軸方向にのびるボールネジ38aと、ボールネジ38aの先端に接続されたモータ38bと、ボールネジ38aと平行に配設された一対のガイドレール38cと、内部に設けたナットがボールネジ38aに螺合するとともに側部が一対のガイドレール38cに摺接する第二移動部38dとを備えている。
図1に示すように、加工装置1には、第一カセット載置台51と、第二カセット載置台52が、X軸方向(加工装置の加工送り方向)において互いに対向するように設けられている。各載置台51,52に対し、随時カセットK1,K2の搬入/搬出が行われるようになっている。第一カセット載置台51に随時載置されるカセットが第一カセット、第二カセット載置台52に随時載置されるカセットが第二カセット、として定義され、明細書、及び、図面では、適宜、カセットK1,K2・・・として表現される。
図3及び図4に示すように、第一カセット載置台51は、第一カセット退避位置P1と、受渡位置P0の間で移動する。
第一カセット退避位置P1では、第一カセットK1の搬入/搬出が行われる。
受渡位置P0では、第一カセットK1に収容された被加工物の搬入/搬出が行なわれる。
第二カセット退避位置P2では、第二カセットK2の搬入/搬出が行われる。
受渡位置P0では、第二カセットK2に収容された被加工物の搬入/搬出が行なわれる。
図3に示すように、第一カセット載置台51が受渡位置P0にある状態で、第二カセット載置台52が第二カセット退避位置P2から受渡位置P0に移動すると、カセット載置台51,52同士が衝突し、カセットK1,K2内の高価な被加工物が損傷し、損害が発生してしまうことになる。
即ち、図1乃至図4に示すように、
被加工物としての半導体ウェーハを保持する保持手段5と、保持手段5で保持された被加工物に切削加工を施す切削ブレードなどの加工手段と、を備えた加工装置であって、
被加工物を複数収容可能な第一カセットK1が載置される第一カセット載置台51と、
被加工物を複数収容可能な第二カセットK2が載置される第二カセット載置台52と、
第一カセット載置台51を受渡位置P0と、第一カセット退避位置P1と、に位置付ける第一位置付け手段510と、
第二カセット載置台52を受渡位置P0と、第二カセット退避位置P2と、に位置付ける第二位置付け手段520と、
受渡位置P0と保持手段5の間で被加工物を搬送する搬出入手段20と、を備え、
受渡位置P0と第一カセット退避位置P1は、Z方向に隣接して配置され、
受渡位置P0と第二カセット退避位置P2は、Z方向に直交するX方向に隣接して配置される、加工装置とするものである。
加工装置は、
少なくとも第一位置付け手段510と、第二位置付け手段520と、を制御する制御手段600を備え、
制御手段600は、
加工手段で加工が施された被加工物が、第一カセットK1と第二カセットK2とのうち収容されていたカセットに搬入されるように、
第一カセット載置台51と第二カセット載置台52とをそれぞれ受渡位置P0に位置付けるように、第一位置付け手段510と第二位置付け手段520を制御する、こととするものである。
23 第一搬送手段
32 第二搬送手段
51 第一カセット載置台
51a 載置面
51d 当接部
52 第二カセット載置台
52a 載置面
52d 当接部
52s 検知手段
55 保持手段
70 洗浄手段
510 第一位置付け手段
512 縦フレーム
514 縦ガイドレール
516 ボールネジ
518 モータ
520 第二位置付け手段手段
522 縦フレーム
524縦ガイドレール
526 ボールネジ
528 モータ
531 横フレーム
532 ベース
534 横ガイドレール
536 ボールネジ
538 モータ
600 制御手段
F フレーム
K1 第一カセット
K2 第二カセット
Kt 収容棚
P0 受渡位置
P1 第一カセット退避位置
P2 第二カセット退避位置
T テープ
W ウェーハ
Claims (2)
- 被加工物を保持する保持手段と、該保持手段で保持された被加工物に加工を施す加工手段と、を備えた加工装置であって、
該被加工物を複数収容可能な第一カセットが載置される第一カセット載置台と、
該被加工物を複数収容可能な第二カセットが載置される第二カセット載置台と、
該第一カセット載置台を受渡位置と、第一カセット退避位置と、に位置付ける第一位置付け手段と、
該第二カセット載置台を該受渡位置と、第二カセット退避位置と、に位置付ける第二位置付け手段と、
該受渡位置と該保持手段の間で被加工物を搬送する搬送手段と、を備え、
該受渡位置と該第一カセット退避位置は、Z方向に隣接して配置され、
該受渡位置と該第二カセット退避位置は、該Z方向に直交するX方向に隣接して配置される、加工装置。 - 該加工装置は、少なくとも該第一位置付け手段と、該第二位置付け手段と、を制御する制御手段を備え、
該制御手段は、該加工手段で加工が施された被加工物が、該第一カセットと該第二カセットとのうち収容されていたカセットに搬入されるように、該第一カセット載置台と該第二カセット載置台とをそれぞれ該受渡位置に位置付けるように、該第一位置付け手段と該第二位置付け手段を制御する、
ことを特徴とする請求項1に記載の加工装置。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019170037A JP7420514B2 (ja) | 2019-09-19 | 2019-09-19 | 加工装置 |
KR1020200102994A KR20210033887A (ko) | 2019-09-19 | 2020-08-18 | 가공 장치 |
CN202010960646.XA CN112519012A (zh) | 2019-09-19 | 2020-09-14 | 加工装置 |
TW109131863A TW202114036A (zh) | 2019-09-19 | 2020-09-16 | 加工裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019170037A JP7420514B2 (ja) | 2019-09-19 | 2019-09-19 | 加工装置 |
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Publication Number | Publication Date |
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JP2021048271A true JP2021048271A (ja) | 2021-03-25 |
JP7420514B2 JP7420514B2 (ja) | 2024-01-23 |
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JP2019170037A Active JP7420514B2 (ja) | 2019-09-19 | 2019-09-19 | 加工装置 |
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JP (1) | JP7420514B2 (ja) |
KR (1) | KR20210033887A (ja) |
CN (1) | CN112519012A (ja) |
TW (1) | TW202114036A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2023127049A1 (ja) * | 2021-12-27 | 2023-07-06 | 東邦化成株式会社 | 基板処理モジュールおよびそれを備える基板処理装置 |
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Publication number | Priority date | Publication date | Assignee | Title |
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CN114408577A (zh) * | 2022-02-25 | 2022-04-29 | 江苏京创先进电子科技有限公司 | 晶圆上料方法及晶圆上料装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007305862A (ja) * | 2006-05-12 | 2007-11-22 | Tokyo Seimitsu Co Ltd | カセット搬送方法およびカセット搬送装置 |
JP2015138856A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
JP2018181951A (ja) * | 2017-04-06 | 2018-11-15 | 株式会社ディスコ | 加工装置 |
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JP5988666B2 (ja) | 2012-04-17 | 2016-09-07 | 株式会社ディスコ | 切削装置 |
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- 2019-09-19 JP JP2019170037A patent/JP7420514B2/ja active Active
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- 2020-08-18 KR KR1020200102994A patent/KR20210033887A/ko unknown
- 2020-09-14 CN CN202010960646.XA patent/CN112519012A/zh active Pending
- 2020-09-16 TW TW109131863A patent/TW202114036A/zh unknown
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JP2007305862A (ja) * | 2006-05-12 | 2007-11-22 | Tokyo Seimitsu Co Ltd | カセット搬送方法およびカセット搬送装置 |
JP2015138856A (ja) * | 2014-01-22 | 2015-07-30 | 株式会社ディスコ | 切削装置 |
JP2018181951A (ja) * | 2017-04-06 | 2018-11-15 | 株式会社ディスコ | 加工装置 |
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WO2023127049A1 (ja) * | 2021-12-27 | 2023-07-06 | 東邦化成株式会社 | 基板処理モジュールおよびそれを備える基板処理装置 |
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