JP2021040044A - 電子部品およびその製造方法 - Google Patents
電子部品およびその製造方法 Download PDFInfo
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- JP2021040044A JP2021040044A JP2019160557A JP2019160557A JP2021040044A JP 2021040044 A JP2021040044 A JP 2021040044A JP 2019160557 A JP2019160557 A JP 2019160557A JP 2019160557 A JP2019160557 A JP 2019160557A JP 2021040044 A JP2021040044 A JP 2021040044A
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000002184 metal Substances 0.000 claims abstract description 152
- 229910052751 metal Inorganic materials 0.000 claims abstract description 152
- 239000006247 magnetic powder Substances 0.000 claims abstract description 63
- 239000002131 composite material Substances 0.000 claims abstract description 29
- 239000011347 resin Substances 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- 238000007772 electroless plating Methods 0.000 claims description 9
- 239000010410 layer Substances 0.000 description 64
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 40
- 238000007747 plating Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 230000002829 reductive effect Effects 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 229910003962 NiZn Inorganic materials 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910002546 FeCo Inorganic materials 0.000 description 1
- 229910005347 FeSi Inorganic materials 0.000 description 1
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910000808 amorphous metal alloy Inorganic materials 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- -1 for example Substances 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- LJCNRYVRMXRIQR-OLXYHTOASA-L potassium sodium L-tartrate Chemical compound [Na+].[K+].[O-]C(=O)[C@H](O)[C@@H](O)C([O-])=O LJCNRYVRMXRIQR-OLXYHTOASA-L 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000000790 scattering method Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000011006 sodium potassium tartrate Nutrition 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/20—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder
- H01F1/22—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together
- H01F1/24—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated
- H01F1/26—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys in the form of particles, e.g. powder pressed, sintered, or bound together the particles being insulated by macromolecular organic substances
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/255—Magnetic cores made from particles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
- H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/10—Connecting leads to windings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0066—Printed inductances with a magnetic layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F2017/048—Fixed inductances of the signal type with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/2804—Printed windings
- H01F2027/2809—Printed windings on stacked layers
Abstract
Description
樹脂および金属磁性粉のコンポジット材料からなるコンポジット体と、
前記コンポジット体の外面上に配置された金属膜と
を備え、
前記金属磁性粉は、Feを含み、
前記金属膜は、主としてCuを含み、さらにFeを含み、前記樹脂および前記金属磁性粉に接触する。
前記コンポジット体内において、前記外面と平行に伸びるインダクタ配線と、
前記インダクタ配線から前記外面と垂直に延びて前記コンポジット体の内部を貫通し、前記外面に露出する柱状配線と、
前記金属膜上を覆う被覆膜と、をさらに備え、
前記金属膜は、前記柱状配線に接触し、
前記金属膜および前記被覆膜は、外部端子を構成する。
樹脂および金属磁性粉のコンポジット材料からなるコンポジット体の外面上に、無電解めっき処理により、金属膜を形成して、電子部品を製造する方法であって、
主としてCuを含みさらにFeを含む前記金属膜を、無電解めっき処理により、Feを含む前記金属磁性粉上に析出させ、前記樹脂に接触させる。
(構成)
図1Aは、電子部品の第1実施形態を示す透視平面図である。図1Bは、図1AのA−A断面図である。図2は、図1Bの一部拡大図である。
第2被覆膜412は、第1被覆膜411を直接覆い、第1外部端子41の最外層を構成する金属膜であって、例えばAuやSnなどの金属膜である。第2被覆膜412は、はんだの濡れ性を確保する役割を有する。
次に、インダクタ部品1の製造方法について説明する。
前述の金属膜410の製造方法について説明する。
2A 第1インダクタ素子
2B 第2インダクタ素子
10 素体
101 第1端縁
102 第2端縁
10a 第1主面
10b 第1側面
10c 第2側面
11 第1磁性層(コンポジット体)
12 第2磁性層(コンポジット体)
21 第1インダクタ配線
22 第2インダクタ配線
31 第1柱状配線
32 第2柱状配線
33 第3柱状配線
34 第4柱状配線
41 第1外部端子
410 金属膜
411 第1被覆膜
412 第2被覆膜
42 第2外部端子
43 第3外部端子
44 第4外部端子
50 絶縁膜
61 絶縁層
100 マザー基板
135 樹脂
136 金属磁性粉
Claims (5)
- 樹脂および金属磁性粉のコンポジット材料からなるコンポジット体と、
前記コンポジット体の外面上に配置された金属膜と
を備え、
前記金属磁性粉は、Feを含み、
前記金属膜は、主としてCuを含み、さらにFeを含み、前記樹脂および前記金属磁性粉に接触する、電子部品。 - 前記金属膜におけるCuに対するFeの含有率は、0.01wt%以上2.6wt%以下である、請求項1に記載の電子部品。
- 前記金属膜は、さらにNiを含む、請求項1または2に記載の電子部品。
- 前記コンポジット体内において、前記外面と平行に伸びるインダクタ配線と、
前記インダクタ配線から前記外面と垂直に延びて前記コンポジット体の内部を貫通し、前記外面に露出する柱状配線と、
前記金属膜上を覆う被覆膜と、をさらに備え、
前記金属膜は、前記柱状配線に接触し、
前記金属膜および前記被覆膜は、外部端子を構成する、請求項1から3何れか一つに記載の電子部品。 - 樹脂および金属磁性粉のコンポジット材料からなるコンポジット体の外面上に、無電解めっき処理により、金属膜を形成して、電子部品を製造する方法であって、
主としてCuを含みさらにFeを含む前記金属膜を、無電解めっき処理により、Feを含む前記金属磁性粉上に析出させ、前記樹脂に接触させる、電子部品の製造方法。
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JP2019160557A JP7226198B2 (ja) | 2019-09-03 | 2019-09-03 | 電子部品およびその製造方法 |
CN202010777200.3A CN112447359B (zh) | 2019-09-03 | 2020-08-05 | 电子部件及其制造方法 |
US16/995,103 US11804325B2 (en) | 2019-09-03 | 2020-08-17 | Electronic component and production method thereof |
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Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11345741A (ja) * | 1998-06-02 | 1999-12-14 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2003243246A (ja) * | 2002-02-15 | 2003-08-29 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2007250787A (ja) * | 2006-03-15 | 2007-09-27 | Tdk Corp | コイル部品 |
KR20150009808A (ko) * | 2013-07-17 | 2015-01-27 | 삼성전기주식회사 | 칩 인덕터 |
JP2017011256A (ja) * | 2015-06-16 | 2017-01-12 | 株式会社村田製作所 | セラミック電子部品の製造方法及びセラミック電子部品 |
JP2017107971A (ja) * | 2015-12-09 | 2017-06-15 | 株式会社村田製作所 | インダクタ部品 |
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JP3999676B2 (ja) * | 2003-01-22 | 2007-10-31 | Dowaホールディングス株式会社 | 銅基合金およびその製造方法 |
JP4619026B2 (ja) * | 2003-10-24 | 2011-01-26 | 京セラ株式会社 | ガラスセラミック基板およびその製造方法 |
JP5446262B2 (ja) * | 2006-07-05 | 2014-03-19 | 日立金属株式会社 | 積層部品 |
JP4687760B2 (ja) * | 2008-09-01 | 2011-05-25 | 株式会社村田製作所 | 電子部品 |
JP2018182203A (ja) * | 2017-04-19 | 2018-11-15 | 株式会社村田製作所 | コイル部品 |
JP5761609B2 (ja) * | 2011-09-02 | 2015-08-12 | 株式会社村田製作所 | セラミック電子部品、及びセラミック電子部品の製造方法 |
WO2013035717A1 (ja) * | 2011-09-07 | 2013-03-14 | 株式会社村田製作所 | モジュールおよびモジュールの製造方法 |
JP5614479B2 (ja) | 2013-08-09 | 2014-10-29 | Tdk株式会社 | コイル部品の製造方法 |
JP6502627B2 (ja) * | 2014-07-29 | 2019-04-17 | 太陽誘電株式会社 | コイル部品及び電子機器 |
KR20170066538A (ko) * | 2014-11-06 | 2017-06-14 | 가부시키가이샤 무라타 세이사쿠쇼 | 적층 코일 부품 |
KR102052770B1 (ko) * | 2014-12-23 | 2019-12-09 | 삼성전기주식회사 | 파워인덕터 및 그 제조방법 |
JP6672756B2 (ja) * | 2015-12-04 | 2020-03-25 | 株式会社村田製作所 | 電子部品および電子部品の製造方法 |
JP6451654B2 (ja) * | 2016-01-07 | 2019-01-16 | 株式会社村田製作所 | コイル部品 |
JP6107998B1 (ja) * | 2016-03-23 | 2017-04-05 | Tdk株式会社 | 電子回路パッケージ |
JP7223525B2 (ja) * | 2018-08-09 | 2023-02-16 | 新光電気工業株式会社 | インダクタ及びインダクタの製造方法 |
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Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11345741A (ja) * | 1998-06-02 | 1999-12-14 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2003243246A (ja) * | 2002-02-15 | 2003-08-29 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
JP2007250787A (ja) * | 2006-03-15 | 2007-09-27 | Tdk Corp | コイル部品 |
KR20150009808A (ko) * | 2013-07-17 | 2015-01-27 | 삼성전기주식회사 | 칩 인덕터 |
JP2017011256A (ja) * | 2015-06-16 | 2017-01-12 | 株式会社村田製作所 | セラミック電子部品の製造方法及びセラミック電子部品 |
JP2017107971A (ja) * | 2015-12-09 | 2017-06-15 | 株式会社村田製作所 | インダクタ部品 |
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JP7226198B2 (ja) | 2023-02-21 |
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