JP2021017264A - Carrier tape body - Google Patents

Abstract

To provide a carrier tape body capable of efficiently cleaning electronic components in a pocket part.SOLUTION: In the carrier tape body 10 in which a plurality of pocket parts 11 capable of storing electronic components 6 are provided along a longitudinal direction, four side faces 112 of the pocket parts 11 have such a taper shape of a mode that the pocket parts 11 are reduced in an opening area toward a lower side, and a lower side end part forms an opening edge part in a mode of the carrier tape body 10 in which a bottom face of the pocket part 11 is opened.SELECTED DRAWING: Figure 2

Description

The present disclosure relates to a carrier tape body.

A carrier tape main body in which a plurality of pockets capable of storing electronic components are provided along the longitudinal direction is known (see, for example, Patent Document 1).

Japanese Patent No. 3247662

However, with the above-mentioned conventional techniques, it is difficult to efficiently clean the electronic components in the pocket portion.

Therefore, on one aspect, it is an object of the present invention to make it possible to efficiently clean the electronic components in the pocket portion.

On one side, the carrier tape body is provided with a plurality of pockets that can store electronic components along the longitudinal direction.
The four side surfaces of the pocket portion have a tapered shape in which the opening area of the pocket portion decreases toward the lower side, and the lower end portion opens in a manner in which the bottom surface of the pocket portion is opened. A carrier tape body that forms an edge is disclosed.

On one side, according to the present invention, electronic components in pockets can be efficiently cleaned.

It is a top view which shows the carrier tape which concerns on Embodiment 1. FIG. It is sectional drawing of the carrier tape when cut in the XZ plane in Embodiment 1. FIG. It is sectional drawing of the carrier tape when cut in the XZ plane in Embodiment 2. FIG.

Hereinafter, each embodiment will be described in detail with reference to the accompanying drawings. In the attached drawings, for the sake of readability, only a part of a plurality of parts having the same attribute may have reference numerals.

[Embodiment 1]
FIG. 1 is a plan view showing the carrier tape 1 according to the first embodiment, and FIG. 2 is a cross-sectional view of the carrier tape 1 when cut in the XZ plane in the first embodiment. In FIGS. 1 and 2, three directions orthogonal to each other, the X direction, the Y direction, and the Z direction, are defined. In this case, the longitudinal direction of the carrier tape body 10 is indicated by the X direction, and the width direction is indicated by the Y direction. In the following, the Z direction is the vertical direction, the positive side is the upper side, and the negative side is the lower side.

[Carrier tape body]
The carrier tape main body 10 is formed by processing a tape-shaped base material having a thickness of 0.2 mm to 0.6 mm. The tape-shaped base material is, for example, a synthetic resin such as polyvinyl chloride, polystyrene, amorphous polyethylene terephthalate, polycarbonate, or polypropylene, a synthetic resin kneaded with carbon to give conductivity, or a conductive coating on the surface. It is made of plastic. The width of the carrier tape main body 10 is generally about 8 mm to 24 mm.

The carrier tape main body 10 is provided with pocket portions (embossed) 11 for accommodating electronic components 6 at predetermined intervals in the longitudinal direction. The pocket portion 11 corresponds to the shape and dimensions of the electronic component 6 to be stored, and in the present embodiment, the pocket portion 11 is rectangular in top view. The top view means a case of viewing in a direction perpendicular to the XY plane.

In the present embodiment, the electronic component 6 to be housed in the pocket portion 11 is a semiconductor chip having a rectangular parallelepiped outer shape and having solder bumps 61 (an example of a terminal portion) bonded to a plurality of chip electrodes provided on the lower surface (bump surface). Is assumed. In the present embodiment, this type of electronic component 6 is cleaned with a cleaning liquid while being housed in the carrier tape 1 before mounting.

The pocket portion 11 has an upper surface opening 111 that opens upward and serves as an entrance / exit for the electronic component 6, four side surfaces 112 extending downward from the four sides of the upper surface opening 111, and a bottom surface that opens the bottom surface of the pocket portion 11. It includes an opening 113.

The four side surfaces 112 of the pocket portion 11 have a tapered shape in which the opening area of the pocket portion 11 decreases toward the lower side, and the lower end portion 112a in a manner in which the bottom surface of the pocket portion 11 is opened. Form the opening edge of the bottom opening 113. In the area comparison in the top view, the top opening 111 is larger than the electronic component 6, and the bottom opening 113 is smaller than the electronic component 6. Therefore, the four side surfaces 112 of the pocket portion 11 have the lower edge of the electronic component 6 while restricting the protrusion of the electronic component 6 from the bottom opening 113 in a state where the electronic component 6 is contained in the pocket portion 11. The portion (hereinafter referred to as the lower edge portion) can be supported by an inclined surface.

According to such a pocket portion 11, the lower edge portion of the electronic component 6 is supported by the four side surfaces 112, and the entire bottom surface of the pocket portion 11 can be widely opened by the bottom surface opening 113, so that when cleaning the electronic component 6. , The cleaning liquid can be efficiently brought into contact with the entire lower surface of the electronic component 6, and the cleaning time can be shortened.

The angle θ formed by the normal direction of the four side surfaces 112 of the pocket portion 11 with respect to the surface of the carrier tape main body 10 is preferably between 25 degrees and 65 degrees, and particularly preferably 40 degrees to 50 degrees. The reason is that if the angle θ is less than 25 degrees, the electronic component 6 tends to slide down, and if the angle θ exceeds 65 degrees, the volume of the pocket portion 11 increases and the storage efficiency of the electronic component 6 decreases. Is. In particular, when the angle θ is set to 40 to 50 degrees, the storage efficiency of the electronic component 6 can be improved while stably supporting the electronic component 6.

Further, as shown in FIG. 1, the four side surfaces 112 of the pocket portion 11 are within a range that does not overlap with the solder bump 61 at the lower portion of the electronic component 6 when viewed in a direction perpendicular to the surface of the carrier tape main body 10. It is preferable to extend it. By doing so, the possibility that the side surface 112 hits the solder bump 61 is reduced, so that the possibility that the solder bump 61 is damaged can also be reduced.

The pocket portions 11 are provided at predetermined pitches at equal intervals in the longitudinal direction. The predetermined pitch is arbitrary, but may be, for example, about 1 mm to 8 mm.

Further, in the carrier tape main body 10, a plurality of feed holes (sprocket holes) 12 used for positioning in a mounting device or the like are bored in one or both sides of the pocket portion 11 at predetermined intervals in the longitudinal direction. The shape and spacing of the feed holes 12 may be formed according to a feed mechanism such as a sprocket. The diameter of the feed hole 12 is about 0.8 mm to 1.5 mm.

In the present embodiment, the carrier tape main body 10 has a flat region other than the pocket portion 11 and the feed hole 12, but concave portions, convex portions, and the like may be formed. For example, a recess significantly shallower than the pocket portion 11 may be formed in the region between the pocket portions 11 in the X direction. In this case, the recess may be used as a joint with the top cover tape 20 described later.

[Carrier tape]
As shown in FIGS. 1 and 2, the carrier tape 1 includes a carrier tape main body 10 and a top cover tape 20.

[Top cover tape]
The top cover tape 20 is attached to the upper surface of the carrier tape main body 10. The top cover tape 20 is attached to the carrier tape main body 10 after the electronic component 6 is arranged in the pocket portion 11 (covers the carrier tape main body 10 so as to cover the pocket portion 11). The carrier tape main body 10 to which the top cover tape 20 is attached is referred to as a "carrier tape".

The top cover tape 20 is a tape-shaped base material formed by using a synthetic resin such as polyethylene, polystyrene, polyethylene terephthalate (PET), or polycarbonate. It should be noted that carbon may be kneaded into these synthetic resins to impart conductivity, a conductive coating may be applied to the surface of the tape-shaped base material, or an antistatic property may be imparted. ..

The top cover tape 20 has an adhesive layer formed of an adhesive or an adhesive at a joint portion 21 (indicated by hatching in FIG. 1) on the surface of the carrier tape body 10 side. The heat-sealing type adhesive layer may be formed at a position other than the joint portion 21 in addition to the joint portion 21. However, the adhesive layer is formed only on one side of the top cover tape 20 (the surface on the carrier tape body side). As the adhesive, acrylic resin-based, natural rubber-based, urethane-based, epoxy-based, polyvinyl alcohol-based, and the like can be used. The joints 21 extend parallel to the X direction, separated by a predetermined distance in the Y direction. Although the joint portion 21 is continuous in the X direction, it may be set discontinuously in the X direction.

The top cover tape 20 is basically continuously sealed to the carrier tape main body 10 along the X direction at positions on both sides of the pocket portion 11 in the Y direction by the joint portion 21 described above. However, in another embodiment, the top cover tape 20 may be further joined at a point-shaped joint in the region between the pockets 11 in the X direction.

The top cover tape 20 preferably has a flow port 22 which is a through hole. When the carrier tape 1 is immersed in the cleaning tank, the distribution port 22 can communicate the inside of the cleaning tank and the inside of the pocket portion 11 to guide the cleaning liquid to the electronic component 6. In FIG. 1, the distribution ports 22 are circular and are formed at regular intervals in the X direction at predetermined pitches. However, the position and shape of the distribution port 22 are arbitrary. Further, the distribution port 22 is formed in a size such that the electronic component 6 in the pocket portion 11 does not protrude like the bottom opening 113 of the pocket portion 11.

[How to clean electronic components]
The electronic component 6 may be, for example, a semiconductor chip in which a solder bump 61 is bonded to a chip electrode. The electronic component 6 is wet-cleaned by immersing the carrier tape 1 in the cleaning liquid in the cleaning tank of the ultrasonic cleaner.

Specifically, when cleaning and drying the electronic component 6, first, an unused carrier tape main body 10 is prepared, and the dirty electronic component 6 is stored in a plurality of pockets 11 of the carrier tape main body 10. Then, the top cover tape 20 is thermocompression bonded to partially cover and protect the electronic component 6. Then, after that, the carrier tape 1 is immersed in the cleaning liquid of the cleaning tank of the ultrasonic cleaner for a predetermined time (for example, 1 minute, 3 minutes, 5 minutes, 10 minutes, 30 minutes, etc.) to ultrasonically clean the electronic component 6. Just do it.

At the time of this immersion, the electronic component 6 may be immersed in the cleaning liquid of the cleaning tank while continuously feeding the carrier tape 1 from the reel to the take-up reel, or after winding the carrier tape 1 on the take-up reel, The carrier tape 1 may be immersed in the cleaning liquid of the cleaning tank together with the take-up reel to ultrasonically clean the electronic component 6.

The cleaning liquid in the cleaning tank is not particularly limited, but for example, a glycol ether-based solution (for example, PGMEA (propylene glycol monomethyl ether acetate), PGME (propylene glycol monomethyl ether), etc.) is used. Further, the cleaning liquid for flux is not limited, but Pine Alpha (manufactured by Arakawa Chemical Industry Co., Ltd .: product name), Cleanthru (manufactured by Kao Corporation: product name) and the like are used.

When the carrier tape 1 is immersed in the cleaning liquid of the cleaning tank, the cleaning liquid flows into the pocket portion 11 from the outside via the bottom opening 113 of the carrier tape main body 10 and the distribution port 22 of the top cover tape 20, and enters the pocket portion 11. The dirty electronic component 6 is washed and leaked to the outside. As described above, the pocket portion 11 supports the lower edge portion of the electronic component 6 on the four side surfaces 112, and the entire bottom surface of the pocket portion 11 is widely opened by the bottom surface opening 113, so that the electronic component 6 is washed. At this time, the cleaning liquid can be efficiently brought into contact with the entire lower surface of the electronic component 6 to shorten the cleaning time.

When the electronic component 6 has been ultrasonically cleaned, the carrier tape 1 is pulled up from the cleaning tank, the cleaning liquid adhering to the carrier tape 1 is drained, and then air is blown onto the electronic component 6 to circulate the electronic component 6. 6 can be dried. At this time, like the cleaning liquid, air flows into the pocket portion 11 via the bottom opening 113 of the carrier tape main body 10 and the distribution port 22 of the top cover tape 20, so that the electronic component 6 is quickly dried in a short time. It is possible to obtain a high quality electronic component 6.

By the way, the electronic component 6 needs to be cleaned in order to remove the flux, the resin residue, and the protective film. Explaining the necessity of this cleaning in detail, for example, when the electronic component 6 is a semiconductor chip in which a solder bump 61 is bonded to a chip electrode, the semiconductor chip is mounted on a printed circuit board. There are wire bonding method and flip chip mounting method as methods for mounting a semiconductor chip on a printed circuit board. In recent years, the flip chip mounting method, which can be expected to reduce the mounting area and improve the electrical characteristics, has become the mainstream.

In such a flip chip mounting method, solder bumps of a semiconductor chip are bonded to a printed circuit board, and the solder joint is reinforced with an underfill resin, but there is a residue of flux used in the solder bonding at the time of mounting. Then, vacancies are generated in this residue portion. This hole becomes a space that causes solder migration in the mounting portion of the semiconductor chip, and causes a decrease in reliability. In addition, when a large amount of flux residue absorbs moisture, migration is likely to occur at a nearby solder joint. From the above, it is useful to clean the flux residue around the solder bump of the semiconductor chip and the flux residue after mounting.

Further, as the semiconductor package is made thinner, the semiconductor wafer is becoming thinner. In this thinning of the semiconductor wafer, solder bumps are formed in various processes such as a polishing process and a rewiring process on the back surface of the semiconductor wafer. It is necessary to protect the circuit surface on the surface of the semiconductor wafer with a protective sheet made of resin. At the time of this protection, the resin residue of the protective sheet may cause contact failure, so it is important to clean the circuit surface of the semiconductor wafer.

In this regard, when cleaning electronic components, as a cleaning method for electronic components, (1) a batch-type cleaning method in which a large number of electronic components are stored in a basket and then the basket is immersed in a cleaning tank, and (2) a large number are placed on a conveyor. A conveyor-type cleaning method may be adopted in which the electronic components of the above are arranged via a dedicated jig, and a large number of electronic components are conveyed by a conveyor for shower cleaning.

However, in the case of the batch-type cleaning method (1), since the electronic components are simply stored in the basket, effective protection of the electronic components during cleaning cannot be expected, and the solder bumps of the electronic components are damaged or chipped. May occur. Further, in the case of the conveyor type cleaning method (2), since it is necessary to prepare a plurality of dedicated jigs for appropriately storing and protecting electronic parts at the time of cleaning, it is not possible to reduce the number of parts in the process. Moreover, there arises a problem that the cleaning work becomes complicated and delayed.

In this respect, in the present embodiment, by providing the above-described configuration, the problems caused by the conventional cleaning method can be effectively solved.

Specifically, according to the present embodiment, it is possible to obtain a carrier tape 1 that can be used for cleaning and drying the contaminated electronic component 6. That is, since the electronic component 6 is housed in the pocket portion 11 for proper protection, it is possible to prevent the electronic component 6 from being displaced or rattling during cleaning, and the solder bump of the electronic component 6 may be damaged during cleaning. The risk of chipping can be effectively eliminated. Further, since a special jig for appropriately storing and protecting the electronic component 6 is not particularly required, the number of components in the process can be reduced, and moreover, it contributes to simplification, speeding up, and facilitation of cleaning / drying work. be able to.

Further, since the pocket portion 11 supports the lower edge portion of the electronic component 6 on the four side surfaces 112 and the entire bottom surface of the pocket portion 11 is widely opened by the bottom surface opening 113, when cleaning the electronic component 6, when cleaning the electronic component 6. The cleaning liquid can be efficiently brought into contact with the entire lower surface of the electronic component 6. As a result, not only the entire lower surface of the electronic component 6 can be efficiently cleaned, but also the contaminated cleaning liquid is quickly drained, and the contaminated flux and resin residue, the protective film, the film forming the electrode surface of the electronic component 6 and the like are formed on the electronic component 6. It becomes possible to effectively prevent reattachment to.

Further, according to the present embodiment, since the distribution port 22 is further formed on the top cover tape 20, the upper surface opening 111 side of the pocket portion 11 is compared with the case where the distribution port 22 is not formed on the top cover tape 20. The distribution of the cleaning liquid is promoted. As a result, the upper surface side of the electronic component 6 in the pocket portion 11 can also be efficiently cleaned.

In the present embodiment, the top cover tape 20 is used as the cover tape of the carrier tape 1 even after cleaning, but it may be peeled off after cleaning. In this case, a new top cover tape may be attached to the carrier tape main body 10. In this case, the new top cover tape does not have to have the distribution port 22. By attaching the cover tape in this way, the carrier tape main body 10 can be used for supply, storage, inventory management, transportation, and the like of the electronic component 6.

[Embodiment 2]
Next, the second embodiment will be described. In the present embodiment, components that may be the same as those in the first embodiment may be designated by the same reference numerals and description thereof may be omitted.

FIG. 3 is a cross-sectional view of the carrier tape 1A when cut in the XZ plane according to the second embodiment.

The carrier tape 1A of the present embodiment has a different shape of the pocket portion 11A of the carrier tape main body 10A from the carrier tape 1 according to the above-described first embodiment. Specifically, the four side surfaces 112 of the pocket portion 11 of the first embodiment described above are each composed of one plane having a predetermined taper angle, but the four sides of the pocket portion 11A of the present embodiment are formed. The side surface 112A is composed of two upper and lower planes 112b and 112c having two types of taper angles, respectively.

The angle θ1 formed by the normal direction of the lower plane 112c with respect to the surface of the carrier tape main body 10 is preferably between 25 degrees and 65 degrees, and particularly preferably 40 degrees to 50 degrees. The reason is the same as that of the above-described embodiment.

The angle θ2 formed by the normal direction of the upper plane 112b with respect to the surface of the carrier tape main body 10 is smaller than the angle θ1, and is selected, for example, between 5 degrees and 15 degrees. According to such a pocket portion 11A, not only the same effect as that of the pocket portion 11 of the first embodiment described above can be obtained, but also the volume of the pocket portion 11A can be reduced to improve the storage efficiency of the electronic component 6. it can.

Although each embodiment has been described in detail above, the present invention is not limited to a specific embodiment, and various modifications and changes can be made within the scope of the claims. It is also possible to combine all or a plurality of the components of the above-described embodiment. For example, in each of the above-described embodiments, the four side surfaces 112 and 112A of the pocket portions 11 and 11A are composed of one or two planes having one or two taper angles, respectively. , 112A may be a curved surface. The curved surface may be a convex curved surface that bulges toward the inside of the pockets 11 and 11A, or a concave curved surface that is recessed with respect to the inside of the pockets 11 and 11A.

1,1A Carrier tape 10,10A Carrier tape body 11,11A Pocket part 111 Top opening 112, 112A Side surface 112a Lower end 112b Flat surface 112c Flat surface 113 Bottom opening 12 Feed hole 20 Top cover tape 21 Joint part 22 Distribution port 6 Electronics Parts 61 Handa bump

Claims (6)

A carrier tape body in which a plurality of pockets capable of storing electronic components are provided along the longitudinal direction.
The four side surfaces of the pocket portion have a tapered shape in which the opening area of the pocket portion decreases toward the lower side, and the lower end portion opens in a manner in which the bottom surface of the pocket portion is opened. The carrier tape body that forms the edge. The carrier tape body according to claim 1, wherein the angle formed by the normal directions of the four side surfaces of the pocket portion with respect to the surface of the carrier tape body is between 25 degrees and 65 degrees. The carrier tape body according to claim 1 or 2, wherein the four side surfaces of the pocket portion support the lower edge portion of the electronic component in a state where the electronic component is contained in the pocket portion. The third aspect of the present invention, wherein when viewed in a direction perpendicular to the surface of the carrier tape body, the four side surfaces of the pocket portion extend within a range that does not overlap with the terminal portion at the lower part of the electronic component. Carrier tape body. The carrier tape body according to any one of claims 1 to 4,
A carrier tape including a top cover tape attached to the carrier tape body. A cleaning method comprising cleaning the electronic component by immersing the carrier tape according to claim 5 in a cleaning solution with the electronic component contained in the pocket portion.

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