JP2020006965A - Cover tape for carrier tape, and carrier tape - Google Patents

Abstract

To provide a cover tape for a carrier tape, and the carrier tape by which effective protection of electronic components can be expected during cleaning of the components and reduction of the number of components in processes can be expected by omitting an electronic component storage jig and the like.SOLUTION: A carrier tape comprises a long resin tape 1 and a plurality of storage embossments 4 for an electronic component 10 arrayed on this resin tape 1. A cover tape 20 with through-circulation holes 22 for cleaning, which covers a plurality of storage embossments 4, is thermo-compression bonded to the resin tape 1 so as to be peelable, a working hole 6 is punched at a bottom 5 of each storage embossment 4, the carrier tape is immersed in a cleaning fluid in a cleaning tank, and thereby the electronic component 10 in the storage embossment 4 is cleaned. The cleaning fluid flows and circulates through the through-circulation hole 22 and the working hole 6, so that the soiled electronic component 10 can be effectively cleaned, and removal of a fine flux and resin residue adhering to the electronic component 10, a protective film, and a film formed on an electrode surface can be expected.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a carrier tape cover tape and a carrier tape used for supplying, cleaning, and drying electronic components.

  As shown in FIGS. 4 and 5, a conventional carrier tape includes a long resin tape 1 and a large number of storage embosses 4 for electronic components 10 arranged and formed at predetermined intervals in the longitudinal direction of the resin tape 1. A long cover tape 20A that completely covers the electronic component 10 is releasably attached to the surface 3 of the resin tape 1 (see Patent Document 1), and supply, storage, and inventory management of the electronic component 10 , Transportation, etc.

  The resin tape 1 is formed into a long and narrow strip shape by a predetermined resin, and a large number of feed holes 2 are punched at predetermined intervals on a side portion, and the large number of feed holes 2 are used for feeding out a carrier tape. Each of the storage embosses 4 is formed to have a concave shape in a plane square shape, and as the electronic component 10, a semiconductor chip in which solder bumps are bonded to chip electrodes, individual MEMS (micro electro mechanical system), and the like are stored.

  The storage emboss 4 has a bottom 5 formed in a substantially flat plate, and a work hole 6 shown in FIGS. 5B and 5C is punched in the bottom 5 as necessary. The working hole 6 is used by a sensor to detect whether or not the electronic component 10 is stored in the storage emboss 4, or the electronic component 10 does not protrude from the storage emboss 4 when the cover tape 20 </ b> A is peeled off. Used for vacuum suction of the electronic component 10.

JP 2017-171393 A

  By the way, the electronic component 10 needs to be cleaned in order to remove the flux, the residue of the resin, and the protective film. The necessity of this cleaning will be described in detail. For example, when the electronic component 10 is a semiconductor chip in which solder bumps are bonded to chip electrodes, the semiconductor chip is mounted on a printed board. As a method of mounting a semiconductor chip on a printed board, there are a wire bonding method and a flip chip mounting method. In recent years, a flip chip mounting method that can be expected to reduce a mounting area and improve electrical characteristics has become mainstream.

  In such a flip-chip mounting method, solder bumps of a semiconductor chip are bonded to a printed circuit board, and a solder bonding portion is reinforced with an underfill resin.However, if there is a flux residue used in the solder bonding at the time of mounting, Voids are generated in the residue. These holes become spaces that cause migration of solder in the mounting portion of the semiconductor chip, and cause a loss of reliability. In addition, when a large amount of flux residue absorbs moisture, migration tends to occur at a nearby solder joint. From the above, it is indispensable to wash the flux residue around the solder bumps of the semiconductor chip and the flux residue after mounting.

  Further, as semiconductor packages become thinner, semiconductor wafers are becoming thinner. In this thinner semiconductor wafer, solder bumps are formed in various processes such as a polishing process and a rewiring process on the back surface of the semiconductor wafer. It is necessary to protect the circuit surface on the surface of the semiconductor wafer with a protective sheet made of resin. At the time of this protection, the residue of the resin on the protection sheet may cause a contact failure, so that it is important to clean the circuit surface of the semiconductor wafer.

  Further, when the electronic component 10 is a fragile component such as a MEMS, the fragile component may be separated into individual pieces while being protected by a protective film such as a resist. Removal is required.

  When the electronic components 10 are to be washed, (1) a batch type washing method in which a large number of electronic components 10 are stored in a basket and then the basket is immersed in a washing tank, and (2) a large number of electronic components 10 are washed on a conveyor. A conveyor-type cleaning method is employed in which the electronic components 10 are arranged via a dedicated jig, and a number of electronic components 10 are conveyed by a conveyor and shower-cleaned.

  However, in the case of the batch cleaning method (1), since the electronic component 10 is simply stored in the basket, effective protection of the electronic component 10 during cleaning cannot be expected, and solder bumps of the electronic component 10 may be damaged. And chipping may occur. Further, in the case of the conveyor-type cleaning method (2), it is necessary to prepare a plurality of dedicated jigs for appropriately storing and protecting the electronic components 10 at the time of cleaning, so that the number of parts in the process cannot be reduced. In addition, there is a problem that the cleaning operation is complicated and delayed.

  Considering these facts, the carrier tape can effectively protect the electronic components 10 by appropriately storing the electronic components 10 in a large number of storage embosses 4, and furthermore, can continuously transport the electronic components 10, Since no special jig is required for transporting the component 10, it would be very significant if a type that can be used for cleaning and drying the contaminated electronic component 10 can be developed.

  The present invention has been made in view of the above, and it is possible to expect effective protection of electronic components at the time of cleaning, and a cover tape for a carrier tape that can be expected to reduce the number of components in a process by omitting a jig or the like for housing electronic components. And a carrier tape.

In order to solve the above problems, the present invention is characterized in that a through-flow hole for cleaning is provided in a cover tape for a carrier tape.
Note that a plurality of through-flow holes for cleaning may be provided at predetermined intervals in the longitudinal direction of the carrier tape cover tape.

Further, in the present invention, in order to solve the above problems, a storage emboss for housing the electronic component is formed on the resin tape, and a work hole is provided in the storage emboss,
A carrier tape cover tape according to claim 1 or 2 is attached to the resin tape.

Note that it is preferable that the electronic component is dried after being cleaned with the cleaning liquid.
Also, both sides of the carrier tape cover tape can be adhered to the resin tape, and the remaining portions other than the both sides of the carrier tape cover tape can face the resin tape.
Further, among the working holes of the resin tape and the storage emboss, at least the work holes of the storage emboss can be made to substantially face the through-flow holes of the carrier tape cover tape.

In addition, it is possible that at least the bottom of the storage emboss of the resin tape and the bottom of the storage emboss is opposed to the through-flow hole of the carrier tape cover tape.
Further, it is also possible to make the central portion of the storage emboss substantially face the through-flow hole of the carrier tape cover tape.

  Furthermore, a long resin tape, comprising a plurality of storage embosses for electronic components formed side by side in the longitudinal direction of the resin tape, a carrier tape that is washed with a cleaning liquid, at least of both sides of the resin tape A plurality of feed holes are arranged in the longitudinal direction of one side, and a long carrier tape cover tape covering a plurality of storage embosses is attached to the surface of the resin tape. A plurality of through-flow holes for cleaning are arranged in the direction, a working hole is provided through the bottom of each storage emboss, and at least one of the bottom of the storage emboss and the work hole is provided with a carrier tape cover. It is possible to substantially face the through-flow hole of the tape.

  Here, the cover tape for a carrier tape in the claims is not particularly limited to transparent, opaque, and translucent. The number of through-flow holes in the carrier tape cover tape is not particularly limited to one or more. This through-flow hole can be formed in a plane circular shape, an elliptical shape, a rectangular shape, a polygonal shape, a lattice shape, a groove shape, or the like.

  The resin tape used for the carrier tape is provided with transparency, insulation, conductivity, and color as needed. This resin tape can use an existing type. The electronic components include at least a semiconductor chip in which solder bumps are bonded to chip electrodes, singulated MEMS, capacitors, resistance elements, and the like. Further, the working hole of the storage emboss does not matter singly or plurally. The working hole can be formed in a plane circular shape, an elliptical shape, a rectangular shape, a polygonal shape, a lattice shape, a groove shape, or the like.

  According to the present invention, when cleaning an electronic component, a carrier tape is prepared, the electronic component is stored in a storage embossment of the resin tape, a cover tape for a carrier tape is attached to the resin tape, and the electronic component is covered. The carrier tape may be washed with a washing liquid. Then, the cleaning liquid flows from the outside of the carrier tape cover tape through the through-flow holes into the storage emboss, and cleans the electronic components in the storage emboss.

  ADVANTAGE OF THE INVENTION According to this invention, effective protection of an electronic component at the time of washing | cleaning can be expected and there exists an effect that reduction of the number of parts in a process can be expected by omitting the jig etc. which accommodate an electronic component.

  According to the second aspect of the present invention, by providing a plurality of through-flow holes in the longitudinal direction of the carrier tape cover tape, the inflow amount of the cleaning liquid into the storage emboss is increased, and the electronic components in the storage emboss can be more effectively used. Can be washed. Also, even when there are a plurality of storage embosses, the cleaning liquid can flow into each storage emboss, and the electronic components in the storage emboss can be effectively cleaned.

According to the third aspect of the present invention, the electronic components can be effectively protected at the time of cleaning, and the omission of the electronic component storage jig can contribute to a reduction in the number of components in the process.
According to the fourth aspect of the present invention, since the electronic components in the storage emboss are wet-cleaned by the cleaning liquid, it is possible to obtain a greater cleaning power than dry cleaning.

  According to the fifth aspect of the present invention, the cleaning liquid can flow between the resin tape and the carrier tape cover tape from the through-flow hole of the carrier tape cover tape and flow into the storage emboss. Therefore, the flow rate of the cleaning liquid into the storage emboss can be increased, and the electronic components in the storage emboss can be precisely cleaned.

  According to the invention as set forth in claim 6, the through-flow holes of the carrier tape cover tape and the working holes of the storage emboss, which are substantially opposed to each other, allow the cleaning liquid to smoothly flow to clean the dirty electronic components, and to clean the dirty cleaning liquid. Since the electronic components are discharged to the outside of the storage emboss, efficient cleaning of the dirty electronic components can be expected, and foreign substances and dust attached to the electronic components can be effectively removed.

  According to the invention as set forth in claim 7, the through-flow holes of the carrier tape cover tape and the working holes of the storage emboss allow the cleaning liquid to flow to wash the dirty electronic components, and the dirty cleaning liquid flows outside the storage emboss. Since the discharge is performed, efficient cleaning of the contaminated electronic components can be expected, and foreign matters and dust adhering to the electronic components can be effectively removed.

BRIEF DESCRIPTION OF THE DRAWINGS It is explanatory drawing which shows typically the embodiment of the cover tape for carrier tapes and carrier tape which concerns on this invention, (a) figure is a top view, (b) figure is sectional side view, (c) figure is sectional end view. is there. It is explanatory drawing which shows 2nd Embodiment of the cover tape for carrier tapes and carrier tape which concerns on this invention typically, (a) figure is a top view, (b) figure is sectional side view, (c) figure is sectional. It is an end elevation. It is explanatory drawing which shows 3rd Embodiment of the cover tape for carrier tapes and carrier tape which concerns on this invention typically, (a) figure is a top view, (b) figure is sectional side view, (c) figure is sectional. It is an end elevation. It is explanatory drawing which shows the conventional carrier tape typically, (a) figure is a top view, (b) figure is sectional side view, (c) figure is sectional end elevation. It is explanatory drawing which shows the other conventional carrier tape typically, (a) figure is a top view, (b) figure is sectional side view, (c) figure is sectional end elevation.

  Hereinafter, a preferred embodiment of the present invention will be described with reference to the drawings. As shown in FIGS. 1A, 1B, and 1C, a carrier tape according to this embodiment is wound around a take-up reel. A long resin tape 1 is provided, and a large number of storage embosses 4 for electronic components 10 arranged and formed on the resin tape 1 at predetermined intervals. The resin tape 1 is covered with a large number of storage embosses 4 for cleaning. A cover tape 20 with a through-flow hole 22 is releasably adhered, and a working hole 6 is punched in a bottom portion 5 of each storage emboss 4 and is immersed in a cleaning liquid in a cleaning tank of an ultrasonic cleaning machine, The electronic component 10 in the storage emboss 4 is wet-cleaned.

  The resin tape 1 is formed of a predetermined resin into a flexible elongated strip extending in the left-right direction of FIG. 1A, and a plurality of feed holes 2 are arranged in a line at predetermined intervals in one side longitudinal direction. While being punched, each feed hole 2 is formed in a plane circular shape, and a large number of feed holes 2 are used for feeding out a carrier tape. The material of the resin tape 1 is not particularly limited, but is a transparent polystyrene having excellent versatility, A-PET, polyethylene terephthalate having excellent strength, polypropylene having excellent chemical resistance, and having excellent mechanical properties and moldability. Substrates such as excellent ABS resin and polycarbonate excellent in impact resistance and dimensional stability.

  The length of the resin tape 1 is set to, for example, 500 m or more, 1400 m or more, and 2000 m or more. The width of the resin tape 1 is set to, for example, standardized sizes such as 8, 12, 16, 24, 32, 44, 56, and 72 mm. The thickness of the resin tape 1 is not particularly limited, but from the viewpoint of achieving both flexibility and strength, from 0.17 mm to 0.50 mm, preferably from 0.20 mm to 0.40 mm, Preferably, the thickness is about 0.30 mm.

  A large number of storage embossments 4 are arranged at regular intervals in the longitudinal direction of a substantially central portion of the resin tape 1. Each of the storage embosses 4 is, for example, formed in a recessed shape in a flat rectangular pocket shape having a shallow bottom, and stores, as the electronic component 10, a semiconductor chip in which solder bumps are bonded to chip electrodes, individual MEMS, capacitors, resistance elements, and the like. Is done.

  In the center of the flat bottom 5 of the storage embossing 4, a flat circular work hole 6 is punched. The working holes 6 are used as outflow holes and inflow holes of a cleaning liquid when the electronic component 10 is cleaned. Also, the electronic device 10 is used by a sensor to detect whether or not the electronic component 10 is stored in the storage emboss 4, or by an electronic device using a suction device so that the electronic component 10 does not protrude from the storage emboss 4 when the cover tape 20 is peeled off. It can also be used for vacuum suction of the component 10.

  The cover tape 20 is formed of a predetermined material into a flexible elongated strip extending in the left-right direction of FIG. 1A, and is thermocompression-bonded in the longitudinal direction of the surface 3 excluding one side of the resin tape 1 to form a large number. By covering the opening of the storage emboss 4, the protrusion of the electronic component 10 in the storage emboss 4 is restricted. The material of the cover tape 20 is not particularly limited. For example, a normal temperature adhesive pressure-sensitive adhesive layer or a heat fusible adhesive layer is applied to a base material such as a polyester film, a polyethylene terephthalate film, or a polyethylene film. Are used.

  The cover tape 20 is made of a transparent type or the like, and has a thickness of about 40 μm to 70 μm, preferably about 45 μm to 65 μm, more preferably about 48 μm to 55 μm. This cover tape 20 is thermocompression-bonded on both sides 21 to the surface 3 other than one side of the resin tape 1, and the remainder other than both sides 21 is thermocompression-bonded to the surface 3 other than one side of the resin tape 1. The cleaning liquid can penetrate into a slight gap between the resin tape 1 and the front surface 3.

  In the longitudinal direction of the central portion of the cover tape 20, a large number of through-flow holes 22 for cleaning are punched at predetermined intervals, and each of the through-flow holes 22 is formed in a plane circular shape. Faces the working hole 6 of the storage emboss 4 from above in a one-to-one relationship. The through-flow holes 22 function as an inflow hole and an outflow hole of the cleaning liquid when the electronic component 10 is cleaned, and allow the cleaning liquid to flow smoothly between the opposing working holes 6. The through-flow hole 22 may have a relationship in which the through-flow hole 22 partially opposes the working hole 6, but in order to obtain an excellent cleaning effect, the relationship directly facing the working hole 6 is optimal.

  In the above configuration, when the electronic component 10 is to be washed and dried, first, an unused carrier tape is prepared, and the dirty electronic components 10 are stored in a large number of storage embosses 4 of the resin tape 1 of the carrier tape. The both sides 21 of the cover tape 20 are thermocompression-bonded to the surface 3 of the resin tape 1 to cover and protect the electronic component 10, and the through-flow holes 22 of the cover tape 20 are inserted into the working holes 6 of the storage embosses 4 from above. After that, the carrier tape is immersed in a cleaning liquid in a cleaning tank of the ultrasonic cleaning machine for a predetermined time (for example, 1, 3, 5, 10, 30 minutes, etc.) to ultrasonically clean the electronic component 10. Good.

  In this immersion, the electronic component 10 may be immersed in the cleaning liquid in the cleaning tank while continuously feeding the carrier tape from the take-out reel to the take-up reel, or the carrier tape may be wound on the take-up reel and then taken up. The electronic component 10 may be ultrasonically cleaned by immersing the carrier tape together with the reel in a cleaning solution in a cleaning tank.

  The cleaning liquid in the cleaning tank is not particularly limited, but for example, a glycol ether-based solution (eg, PGMEA (propylene glycol monomethyl ether acetate), PGME (propylene glycol monomethyl ether), etc.) is used. Further, examples of the cleaning liquid for the flux include, but are not limited to, Pine Alpha (manufactured by Arakawa Chemical Industries, Ltd .: product name) and Clean Through (manufactured by Kao Corporation: product name).

  When the carrier tape is immersed in the cleaning liquid in the cleaning tank, the cleaning liquid flows into the storage emboss 4 from the outside of the cover tape 20 via the through-flow hole 22, and cleans the dirty electronic component 10 in the storage emboss 4. It flows out of the working hole 6 of the storage emboss 4 to the outside. In addition, it flows into the storage emboss 4 from outside the storage emboss 4 via the work hole 6, cleans the dirty electronic component 10 in the storage emboss 4, and flows out through the through circulation hole 22 of the cover tape 20. . By such a circulation and circulation of the cleaning liquid, the contaminated electronic component 10 can be effectively cleaned, and the contaminated cleaning liquid can be quickly drained. The removal of the film and the film formed on the electrode surface of the electronic component 10 can be greatly expected.

  When the electronic component 10 is ultrasonically cleaned, the carrier tape is pulled up from the cleaning tank, the cleaning liquid attached to the carrier tape is drained, and then the electronic component 10 is dried by blowing air on the electronic component 10 and circulating. be able to. At this time, like the cleaning liquid, the air flows into and out of the storage emboss 4 through the working hole 6 of the storage emboss 4 and the through-flow hole 22 of the cover tape 20, so that the electronic component 10 is quickly and quickly dried. Thus, a high quality electronic component 10 can be obtained.

  After the electronic component 10 is ultrasonically cleaned, the carrier tape is housed in a vacuum dryer, and the inside of the tank of the vacuum dryer is depressurized to promote the evaporation of the attached cleaning liquid and to dry it. Electronic component 10 can be obtained.

  According to the above, a carrier tape that can be used for cleaning and drying the contaminated electronic component 10 can be obtained. That is, since the electronic component 10 is stored in the storage embossment 4 to appropriately protect the electronic component 10, misalignment and rattling of the electronic component 10 during cleaning can be prevented, and solder bumps of the electronic component 10 can be damaged during cleaning. The possibility that chipping occurs can be effectively eliminated. In addition, since a special jig for appropriately storing and protecting the electronic component 10 is not required, the number of components in the process can be reduced, and the washing and drying operations can be simplified, speeded up, and facilitated. be able to.

  In addition, since the through-flow hole 22 is located at the center of the storage emboss 4 in a plan view, the cleaning liquid can flow uniformly into and out of the entire inside of the storage emboss 4, and the entire electronic component 10 can be precisely cleaned. Become. Further, since the cleaning liquid flows and circulates without stagnation, the contaminated cleaning liquid is quickly drained, and contaminated flux, resin residue, a protective film, a film formed on the electrode surface of the electronic component 10, and the like are transferred to the electronic component 10. It is possible to effectively prevent redeposition.

  Next, FIGS. 2A, 2B, and 2C show a second embodiment of the present invention. In this case, a large number of cleaning Are formed at predetermined intervals by punching, a part of the plurality of through-flow holes 22 is directly opposed to the working hole 6 of the storage emboss 4, and the remaining portions of the plurality of through-flow holes 22 are adjacent to the plurality of through-holes 22. It is made to face the surface 3 of the resin tape 1 between the storage embossments 4. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.

  In this embodiment, the same operation and effect as those in the above embodiment can be expected, and the remaining portion of the large number of through-flow holes 22 is opposed to the surface 3 of the resin tape 1. After flowing through a small gap between the cover embossing tape 20 and the cover tape 20, it can flow into the storage emboss 4. Therefore, the flow rate of the cleaning liquid into the storage emboss 4 can be increased, and the dirty electronic component 10 in the storage emboss 4 can be more effectively and precisely cleaned. It is also possible to clean the surface 3 of the resin tape 1 to remove fine foreign matter.

  Next, FIGS. 3A, 3B, and 3C show a third embodiment of the present invention. In this case, the cleaning tape is disposed substantially in the longitudinal direction of the central portion of the cover tape 20. A large number of through-flow holes 22 are formed at predetermined intervals by punching, and the large number of through-holes 22 are divided into a pair of through-holes 22. To be opposed.

The pair of through-flow holes 22 are arranged adjacent to each other at a predetermined interval in the width direction and the longitudinal direction of the cover tape 20. The other parts are the same as those in the above-described embodiment, and a description thereof will be omitted.
In this embodiment, it is apparent that the same operation and effect as the above embodiment can be expected, and that the pattern of the through-flow holes 22 of the cover tape 20 can be expected to be diversified.

  In the above embodiment, the flat resin tape 1 is shown, but the present invention is not limited to this. For example, the resin tape 1 is integrally provided with a pair of left and right flange pieces facing each other at an interval, and a step receiving piece that is bridged between the pair of right and left flange pieces and supports a large number of storage embosses 4. It may be formed in a long flexible band shape. Alternatively, a plurality of feed holes 2 may be arranged in a row at predetermined intervals on both sides of the resin tape 1 and punched.

  The bottom 5 of the storage emboss 4 may be flat or raised. In addition, the working holes 6 are punched in the bottom 5 of the storage embossing 4, but a plurality of such working holes 6 may be formed and arranged in a plane H shape, an X shape, a cross shape, a pentagonal shape of dice, or the like. Further, the working hole 6 may be punched in the peripheral wall of the storage emboss 4, or the work hole 6 may be punched in the bottom 5 and the peripheral wall of the storage emboss 4.

  Further, both side portions 21 of the cover tape 20 may be thermocompression-bonded to the front surface 3 of the resin tape 1, respectively, or may be detachably adhered. Further, the through-flow hole 22 of the cover tape 20 may be completely opposed to the working hole 6 of the storage emboss 4, or may be partially opposed. Further, it is also possible that the bottom 5 of each storage emboss 4 and the plurality of through-flow holes 22 of the cover tape 20 face each other, and the plurality of through-flow holes 22 are arranged in a predetermined pattern. Specifically, the bottom four corners of the storage emboss 4 and the plurality of through-flow holes 22 of the cover tape 20 may be opposed to each other, or the plurality of through-flow holes 22 facing the bottom 5 of the storage emboss 4 may be formed into a flat H-shape or an X-shape. It is also possible to arrange them in a cross shape, or to arrange the plurality of through-flow holes 22 in a quincunx shape of a dice.

Hereinafter, examples of the carrier tape according to the present invention will be described together with comparative examples.
[Example 1]
First, a carrier tape shown in FIGS. 1 (a), 1 (b) and 1 (c) is prepared, a 4 × 4 mm electronic component made of a semiconductor chip is stored in a storage emboss of the carrier tape, and a cover is provided on the surface of the carrier tape. The electronic components were covered by thermocompression bonding on both sides of the tape.

  The carrier tape is a resin tape molded to a width of 12 mm by A-PET. A number of feed holes are arranged in a line at a predetermined pitch in one longitudinal direction of one side of the resin tape and punched. The size was 5 mm. Further, a large number of storage embosses capable of accommodating 4 × 4 mm electronic components were formed at a pitch of 8 mm in the longitudinal direction of the central portion of the resin tape, and a work hole of φ1.0 mm was punched at the center of the bottom of each storage emboss.

  The cover tape was a 9.5 mm wide tape made of a polyethylene terephthalate film, and a large number of through-flow holes were punched in the tape at a pitch of 8 mm, and each of the through-flow holes was made to have a size of φ1.0 mm. Further, when the both sides of the cover tape were thermocompression-bonded to the surface of the carrier tape, the through-holes were directly opposed to the working holes of each storage emboss in a one-to-one relationship.

  After the cover tape was thermocompression-bonded to the surface of the resin tape of the carrier tape, the carrier tape was immersed in a cleaning solution in a cleaning tank of an ultrasonic cleaner, and the electronic components were ultrasonically cleaned at 30 KHz for 30 minutes. As a cleaning liquid for the cleaning tank, a flux cleaning agent (Pine Alpha ST-180, manufactured by Arakawa Chemical Industries, Ltd.) was used.

  After the electronic parts are ultrasonically cleaned, the carrier tape is pulled up from the cleaning tank, the cleaning liquid attached to the carrier tape is drained, and then compressed air is blown into the through-flow holes of the cover tape under the condition of 0.5 MPa for 10 seconds and stored. The electronic components in the emboss were dried. When the electronic component was dried in this way, the cleaning results and the drying results are summarized in Table 1.

  The cleaning result is to check the presence or absence of residual foreign substances on the electronic component and the effect of component analysis on the electrode surface of the electronic component by EDX. X. The drying result was determined based on whether or not the cleaning liquid remained in the storage emboss. When the cleaning liquid did not remain, it was evaluated as ○, and when the cleaning liquid did not remain, it was evaluated as X.

[Comparative Example 1]
First, a carrier tape shown in FIGS. 4A, 4B, and 4C is prepared, and a 4 × 4 mm electronic component made of a semiconductor chip is stored in a storage emboss of the carrier tape, and a cover is provided on the surface of the carrier tape. The electronic components were covered by thermocompression bonding on both sides of the tape.

The carrier tape is a resin tape molded to a width of 12 mm by A-PET. A number of feed holes are arranged in a line at predetermined intervals in a longitudinal direction of one side of the resin tape and punched. The size was 0.5 mm. In the longitudinal direction of the central portion of the resin tape, a large number of storage embosses capable of storing 4 × 4 mm electronic components were formed at a pitch of 8 mm, but the working holes of each storage emboss were omitted.
The cover tape was a tape made of polyethylene terephthalate film having a width of 9.5 mm, but the through-flow holes were omitted.

  After the cover tape was thermocompression-bonded to the surface of the resin tape of the carrier tape, the carrier tape was immersed in a cleaning solution in a cleaning tank of an ultrasonic cleaner, and the electronic components were ultrasonically cleaned at 30 KHz for 30 minutes. As a cleaning liquid for the cleaning tank, a flux cleaning agent (Pine Alpha ST-180, manufactured by Arakawa Chemical Industries, Ltd.) was used.

  After ultrasonic cleaning of the electronic components, the carrier tape was pulled up from the cleaning tank, the cleaning liquid attached to the carrier tape was drained, and the electronic components in the storage emboss were dried. When the electronic component was dried in this way, the cleaning results and the drying results are summarized in Table 1.

  The cleaning result is to check the presence or absence of residual foreign substances on the electronic component and the effect of component analysis on the electrode surface of the electronic component by EDX. X. The drying result was determined based on whether or not the cleaning liquid remained in the storage emboss. When the cleaning liquid did not remain, it was evaluated as ○, and when the cleaning liquid did not remain, it was evaluated as X.

[Comparative Example 2]
First, a carrier tape shown in FIGS. 5 (a), 5 (b) and 5 (c) is prepared, a 4 × 4 mm electronic component made of a semiconductor chip is stored in a storage emboss of the carrier tape, and a cover is provided on the surface of the carrier tape. The electronic components were covered by thermocompression bonding on both sides of the tape.

The carrier tape is a resin tape molded to a width of 12 mm by A-PET. A number of feed holes are arranged in a line at predetermined intervals in a longitudinal direction of one side of the resin tape and punched. It was formed in a size of 0.5 mm. In addition, a large number of storage embosses for accommodating 4 × 4 mm electronic components were formed at a pitch of 8 mm in the longitudinal direction of the central portion of the resin tape, and a work hole of φ1.0 mm was punched at the center of the bottom of each storage emboss.
The cover tape was a 9.5 mm wide tape made of a polyethylene terephthalate film, but the through-flow holes were omitted.

  After the cover tape was thermocompression-bonded to the surface of the resin tape of the carrier tape, the electronic components were subjected to ultrasonic cleaning in the same manner as in Comparative Example 1, and the electronic components were dried. The results of cleaning and drying are shown in Table 1.

[Comparative Example 3]
First, a carrier tape having no working holes is prepared, a 4 × 4 mm electronic component made of a semiconductor chip is stored in the embossment of the carrier tape, and both sides of the cover tape are thermocompression-bonded to the surface of the carrier tape. Parts were coated.

The carrier tape was the same as in Comparative Example 1. The cover tape was a polyethylene terephthalate film tape having a width of 9.5 mm, and a large number of through-flow holes were punched into the tape at a pitch of 8 mm, and each of the through-flow holes was formed to have a size of φ1.0 mm. When both sides of the cover tape were thermocompression-bonded to the surface of the resin tape, the through-flow holes were made to face the bottom of each storage emboss.
After the cover tape was thermocompression-bonded to the surface of the resin tape of the carrier tape, the electronic components were subjected to ultrasonic cleaning in the same manner as in Comparative Example 1, and the electronic components were dried. The results of cleaning and drying are shown in Table 1.

[Evaluation]
In the case of the carrier tape of the embodiment, excellent cleaning results and drying results can be obtained by directly facing the working holes and the through-flow holes, and the carrier tape most suitable for cleaning and drying of contaminated electronic components is. found.
On the other hand, in the case of the carrier tapes of Comparative Examples, sufficient cleaning results and drying results could not be obtained. In particular, in the case of the carrier tapes of Comparative Examples 2 and 3, foreign matters remained, and serious doubts were raised in practicality.

  The cover tape for a carrier tape and the carrier tape according to the present invention are used in the fields of manufacturing machinery, electricity, electronics, semiconductors, and the like.

DESCRIPTION OF SYMBOLS 1 Resin tape 3 Front surface 4 Storage emboss 5 Bottom 6 Working hole 10 Electronic component 20 Cover tape (cover tape for carrier tape)
20A Cover tape 21 Both sides 22 Through flow hole

Claims (7)

  A cover tape for a carrier tape, wherein a through-flow hole for cleaning is provided.   The cover tape for a carrier tape according to claim 1, wherein a plurality of through-flow holes for cleaning are provided at predetermined intervals in a longitudinal direction. A storage tape for storing electronic components is formed on the resin tape, and the storage tape is a carrier tape in which working holes are provided.
A carrier tape, wherein the carrier tape cover tape according to claim 1 is attached to a resin tape.   The carrier tape according to claim 3, wherein the carrier tape is dried after being washed with a washing liquid.   5. The carrier tape according to claim 3, wherein both sides of the carrier tape cover tape are adhered to the resin tape, and a remaining portion other than both sides of the carrier tape cover tape faces the resin tape.   6. The carrier tape according to claim 3, wherein at least the working hole of the storage emboss is substantially opposed to the through-flow hole of the carrier tape cover tape.   6. The carrier tape according to claim 3, wherein at least a bottom portion of the storage embossment, of the resin tape and the bottom portion of the storage embossment, faces the through-flow hole of the carrier tape cover tape.

Images