JP2000007021A - Embossed carrier tape, and its cover tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the adhesive property of a heat seal part by providing a biaxially orientated polyethylene terephthalate film for a base material, and providing an adhesive layer containing a specified powder together with a polymer having a repeated unit to be expressed by a specified equation on the base material. SOLUTION: A polymer having a polycarbonate structure in an adhesive layer 32 has the repeated unit to be expressed by an equation I (where, R represents straight or branched 2-2 deg.C hydrocarbon), and its molecular weight is not less than 10,000 in average weight, preferably not less than 30,000 (usually up to 300,000). The powder to be used together with the polymer having the polycarbonate structure on the adhesive layer 32 is 0.01-32 μm, more specifically, 0.5-15 μm in mean grain size, and the use amount is 5-60 wt.% of the whole adhesive layer 32, more preferably, 15-45 wt.%.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an embossed tape for transporting components such as electronic components, and more particularly to an improvement in a cover tape.

[0002]

2. Description of the Related Art With the miniaturization of components and the development of surface mounting technology on printed circuit boards, the embossed rear tape has been increasing in place of conventional magazines (sticks) and trays, as the packaging of electronic components has become smaller. I have. The mounting efficiency of the embossed rear-tape can be greatly improved, for example, the mounting area of the mounting machine is small and the mounting speed can be increased.

As shown in FIG. 1, an embossed rear tape is an embossed plastic sheet (bottom material) in which recesses for receiving electronic components are continuously aligned in the longitudinal direction.
And a heat-sealed cover tape (lid material). The usage method is to store the electronic components in the recesses, heat seal the cover tape, transport it to the mounting site in this packaging form, and automatically cover it with the mounting machine. -This is to mount the storage parts on the printed circuit board while peeling the loop.

[0004] Here, the cover tape is made of a hot-melt adhesive on a film base material so that heat sealing is facilitated and that no trouble occurs at the time of mounting due to adhesion of the housed parts. What applied the agent is used.
Also, at the time of heat sealing, as shown in FIG. 2, the cover tape is used to prevent the storage parts from adhering to the cover tape.
Only the ends in the width direction of the tape are continuously sealed.

[0005] By the way, in recent years, computer related equipment,
2. Description of the Related Art With the rapid spread of electronic devices represented by mobile phones and the like, demand for electronic components has been greatly increased. Along with this, in the above-mentioned embossing tape, the taping speed has been increased in the taping work for heat sealing the cover tape after the electronic components are stored in the recesses. For example, in the past, the taping speed was 2 m /
Recently, the speed has been increased to about 5 m / min or more.

[0006]

However, when the taping speed is increased, sufficient heat is not applied to the cover tape, so that the adhesiveness of the heat seal portion is reduced. Sea
Therefore, it is easy to cause troubles such as dropping of the stored parts during transportation.

In view of the above circumstances, the present invention improves the heat sealability of an embossed rear tape which is a carrier for components such as electronic components, so that even if the taping speed is increased, It is an object of the present invention to maintain good seal strength without lowering the adhesiveness of a heat seal portion, and to avoid problems such as falling off of stored parts.

[0008]

Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, have used a specific film as a base material of a cover tape and an adhesive provided thereon. By using a layer containing a specific polymer and powder as the layer, heat sealability is excellent, and even if the taping speed is increased, the adhesiveness of the heat seal portion does not decrease. It has been found that good seal strength can be maintained and problems such as falling off of stored parts can be avoided, and the present invention has been completed.

That is, the present invention relates to a plastic sheet in which a concave portion for accommodating a component is embossed, and a heat-sealed plastic sheet.
The above-mentioned cover tape of an embossed carrier tape comprising a cover tape to be sealed, wherein a biaxially stretched polyethylene terephthalate film is used as a base material. formula; (Wherein R is a linear or branched hydrocarbon having 2 to 20 carbon atoms) and a polymer having an average particle diameter of 0.01 to 30 μm along with a polymer having a repeating unit represented by the formula: A cover tape of an embossed tape which is provided with an adhesive layer containing 60% by weight (claim 1), in particular, the powder has a volume resistivity of 1 × 10 ⁸ Ω · cm.
A cover tape having the above-mentioned structure, which is the following conductor (claim 2), and in this case, the adhesive layer has a surface resistance of 1
According to a third aspect of the present invention, the cover tape has a configuration of × 10 ¹² Ω or less.

[0010] The present invention also provides an embossed rear tape using the above-described cover tape, that is, a plastic sheet in which a recess for accommodating parts is embossed and a heat seal. An embossed carrier tape comprising a cover tape, wherein the cover tape comprises a substrate comprising a biaxially stretched polyethylene terephthalate film and the specific polymer and powder thereon. Characterized by having an adhesive layer having
(Claim 4).

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show an example of an embossed rear tape as an electronic component carrier using a cover tape of the present invention.

In both figures, embossed rear tape 1
Is plastic sheet 2 as bottom material, and
And a cover tape 3 as a lid material to be sealed. The plastic sheet 2 is embossed by using a suitable plastic such as polyethylene terephthalate, and by continuously aligning the recessed portions 2a for receiving the electronic components 4 in the longitudinal direction, and forming the plastic sheet 2 in the width direction. A plurality of feed through holes 2b are formed along one longitudinal side of the one end portion.

The embossed carrier tape 1 is used in such a manner that an electronic component 4 is accommodated in a recess 2a of a plastic sheet 2 and a cover tape 3 is heat-sealed thereon. The above component 4 is covered, and the whole is wound in this state to form a tape wound body. At the time of the above heat seal, the cover
As shown in FIG. 2, only the ends 3a of the cover tape 3 in the width direction are continuously sealed so that the electronic component 4 does not adhere to the tape 3. At the time of mounting, the above-mentioned tape wound body is transported and automatically covered using an appropriate mounting machine.
The electronic component 4 housed in the recess 2a is mounted on a printed circuit board (not shown) while the tape 3 is peeled off.

[0014] In this Embossia rear tape 1,
As shown in FIG. 3, the cover tape 3 uses a biaxially stretched polyethylene terephthalate film as the base material 31 and, on the base material 31, a polymer having a polycarbonate structure. An adhesive layer 32 containing a powder having an average particle diameter of 0.01 to 30 μm is provided, whereby the heat sealability is improved.

The reason why the biaxially stretched polyethylene terephthalate film is used as the base material 31 is that it is excellent in workability, mechanical strength, flexibility and heat non-shrinkage. The thickness of the base material 31 is preferably 6 to 100 μm, particularly preferably 12 to 50 μm. If it is less than 6 μm, the rigidity is poor, and if it exceeds 100 μm, it is too hard and the adhesion becomes unstable. On the surface of the base material 31 on which the adhesive layer 32 is provided,
If necessary, a surface treatment such as a corona treatment can be performed, or an anchor coat layer can be provided. Further, on the surface opposite to the surface on which the adhesive layer 32 is provided, a layer coated with an antistatic agent, a conductive paint, a release agent, or the like may be provided as necessary.

The polymer having a polycarbonate structure in the adhesive layer 32 has the following formula: (Wherein, R is a linear or branched hydrocarbon having 2 to 20 carbon atoms), and has a molecular weight of 10,000 or more, preferably 3
It is better to be at least 10,000 (usually up to 300,000).

[0017] As the above polymer, polycarbonate
Polyester synthesized from todole (or a derivative thereof) and dicarboxylic acid (or a derivative thereof), polyester synthesized from polycarbonate dicarboxylic acid and diol, polycarbonate todiol and diisocyanate And a polyester synthesized from polycarbonate and dicarboxylic acid. Of these, a polyester synthesized from polycarbonate and dicarboxylic acid is preferably used.

This polyester has a diol component essentially containing polycarbonate and a dicarboxylic acid having a molecular skeleton of an aliphatic or alicyclic hydrocarbon group having 2 to 20 carbon atoms. It can be obtained by subjecting a dicarboxylic acid component to an esterification reaction by a conventional method using no catalyst or an appropriate catalyst. In this reaction, the diol component and the dicarboxylic acid component are desirably subjected to an equimolar reaction so that the molecular weight of the obtained polyester falls within the above range, but in order to promote the esterification reaction,
The reaction may be carried out using either one in excess.

The polycarbonate used here
Is a polycarbonate having a repeating unit represented by the above formula.
A dial with a bone structure, with a number average molecular weight of 400
The number is preferably 900 or more (usually up to 10,000).
For example, polyhexamethylene carbonatediol,
Examples thereof include poly (3-methylpentene carbonate) diol, polypropylene carbonatediol, and mixtures and copolymers thereof. Commercially available products include “PLACCEL CD205PL” manufactured by Daicel Chemical Industries, Ltd.
"CD208PL", "CD210PL", "C"
D220PL "," CD205HL "," CD20 "
8HL ”,“ CD210HL ”,“ CD220H ”
L "and the like.

As the diol component, in addition to these components, ethylene glycol, propylene glycol, butanediol, hexanediol, octanediol, decanediol, octadecandiol, etc., if necessary. And other components such as linear diols and branched diols. These other diols are used in an amount of not more than 50% by weight, preferably not more than 30% by weight of the whole diol component. Also, if necessary, polymer
In order to increase the molecular weight of the polymer, a small amount of a tri- or higher functional polyol component may be added.

The dicarboxylic acid component has 2 to 2 carbon atoms.
The aliphatic or alicyclic hydrocarbon group of 0 has a molecular skeleton, and the above-mentioned hydrocarbon group may be linear or branched. Specifically, succinic acid, methyl succinic acid, adipic acid, pimelicic acid, azelaic acid, sebacic acid, 1,12-dodecandioic acid, 1,14-tetradecandioic acid, tetrahydrophthalic acid, endomethylenetetrahydrophthalic acid, Acid anhydrides and lower alkyl esters.

Such a polyester or other polymer having a polycarbonate structure is usually subjected to a crosslinking treatment by an appropriate means to obtain a cohesive force, an adhesive force,
Good results can be obtained with respect to the peelability at the time of peeling. The crosslinking method may be arbitrary, but as a crosslinking agent, a polyfunctional compound having a functional group that reacts with a hydroxyl group or a carboxyl group contained in a polymer such as polyester, for example, a polyisocyanate compound, an epoxy compound, an aziridine compound, a metal A method of performing a crosslinking treatment using a chelate compound, a metal alkoxide compound, or the like is preferable.

Among the above crosslinking agents, polyisocyanate
Compounds are most preferred. Specifically, lower aliphatic polyisocyanates such as ethylene diisocyanate, butylene diisocyanate, and hexamethylene diisocyanate
Alicyclic polyisocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; 2,4-tolylene diisocyanate; 4,4 ' Aromatic polyisocyanates such as diphenylmethane diisocyanate and xylylene diisocyanate. Besides, trimethylolpropane adduct of tolylene diisocyanate, trimethylolpropane adduct of hexamethylene diisocyanate and the like are also used.

One of these crosslinking agents is used alone or in a mixture of two or more. The amount used is appropriately selected according to the balance with a polymer such as polyester. Usually, the ratio is preferably 0.5 to 5 parts by weight with respect to 100 parts by weight of a polymer such as polyester, which is a good result in balance characteristics such as cohesive strength, adhesive strength, and peeling property upon peeling. Can be obtained.

In the adhesive layer 32, the powder used together with the polymer having the above-mentioned polycarbonate structure is as follows:
Average particle size of 0.01 to 30 μm, especially 0.5 to 15
μm. When the average particle diameter is less than 0.01 μm, the electronic components 4 housed in the recess 2 a tend to adhere to the adhesive layer 32. Become. The shape of the powder is not particularly limited, such as a true sphere, an ellipse, a needle, a plate, and an irregular shape. Needles and plates are preferred in that they are resistant to shear during processing and can reduce the amount of addition.

The type of the powder is not limited, and may be either an organic substance or an inorganic substance. When transporting electronic components such as semiconductors, the cover together with the embossed plastic sheet 2 is used to prevent damage to the storage components due to static electricity.
Tape 3 may also be required to be conductive. In this case, as the powder, a conductive material having a volume resistivity of 1 × 10 ⁸ Ω · cm or less, for example, conductive particles composed of any of carbon black, metal oxide, metal-coated particles, or a combination thereof is used. When the surface resistance of the adhesive layer 3 is 1 × 1
It is desirable to set the resistance to 0 ¹² Ω or less.

The amount of powder used is 5 to 5 for the entire adhesive layer 32.
60% by weight, particularly preferably 15 to 45% by weight
It is. When the content is less than 5% by weight, the electronic component 4 is
If it exceeds 60% by weight,
Poor adhesion during sealing. When the above-described conductor (conductive particles) is used as the powder, it is preferable that the content be in the range of 10 to 50% by weight of the entire adhesive layer 32. 1
If the amount is less than 0% by weight, the conductive effect is poor or unstable. If the amount exceeds 50% by weight, the transparency tends to decrease in addition to the tendency to decrease the adhesiveness.

The adhesive layer 32 is formed by mixing the above-mentioned powder and, if necessary, various additives such as a crosslinking agent, a tackifier, a plasticizer, a coloring agent and an antistatic agent. The composition is formed by directly applying and drying the composition on the substrate 31, or applying and drying the composition on a release liner, and then transferring the composition onto the substrate 31. The thickness of the adhesive layer 32 is preferably 1 μm or more, particularly preferably 5 to 60 μm. If the thickness is too small, the adhesion will be poor.

The cover tape 3 configured as described above is
Plastic sheet 2 for excellent heat sealability
After the electronic component 4 is stored in the recess 2a of FIG.
In order to continuously seal both end portions 3a in the width direction in the manner shown in (1), even if the taping speed is increased to about 5 m / min or more, the above-mentioned end portions (heat seal portions) are obtained. 3
Since the adhesive strength does not decrease at a, and good seal strength can be maintained, there is no fear that the stored electronic component 4 will fall off. Further, at the time of mounting, the cover tape 3 can be automatically and easily separated by using an appropriate mounting machine, so that the electronic component 4 can be smoothly mounted on the printed circuit board. .

Although the above example shows an embossed rear tape as an electronic component carrier, the present invention is not limited to the electronic component carrier, but is applicable to various component carriers other than electronic components. In this case, the same effect as above can be obtained.

[0031]

Next, an embodiment of the present invention will be described in more detail. It should be noted that the present invention is not limited by these embodiments.

Example 1 A four-necked separable flask equipped with a stirrer, a thermometer and a water separation tube was charged with polycarbonate [Placcel CD210PL manufactured by Daicel Industries, Ltd., hydroxyl value: 115 KOHmg / g] 250 g (hydroxyl group: 0.
512 equivalents), 51.8 g of sebacic acid (acid group: 0.51
2 equivalents), and 127 mg of dibutyltin oxide (hereinafter referred to as DBTO) as a catalyst, and stirring under stirring in the presence of a small amount of toluene as a solvent for discharging reaction water.
The temperature was raised to 0 ° C. and kept at this temperature. After a while, effluent separation of water was observed, and the reaction began to proceed. The reaction was continued for about 24 hours to obtain a polyester having a weight average molecular weight of 550,000.

This polyester was diluted with toluene so that the solid content concentration became 25% by weight, and the cured resin spherical powder [100 parts (solid content) of the polyester [Epostar manufactured by Nippon Shokubai Co., Ltd.] M30 ”, average particle diameter: 3 μm] 30 parts, isocyanate-based crosslinking agent [Coronate H manufactured by Nippon Polyurethane Co., Ltd.] as a crosslinking agent
L "], and the mixture was sufficiently stirred with a stirrer to obtain an adhesive composition. The ratio of the cured resin spherical powder in the adhesive composition was 23% by weight.

Next, a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm was used as a base material, and the above-mentioned adhesive composition was coated on one side of the base material with a thickness of 20 μm after drying.
After coating to a thickness of μm, the coating was dried to produce a cover tape of an embossed carrier tape as an electronic component carrier.

Example 2 A four-neck separable flask equipped with a stirrer, thermometer and water separation tube was charged with polycarbonate ["PLACCEL CD220PL" manufactured by Daicel Industries, Ltd., hydroxyl value: 56. 250 g of 1 KOH mg / g (hydroxyl group:
0.25 equivalents), 56.1 g of azelaic acid (acid group: 0.1
25 equivalents) and 62 mg of DBTO as a catalyst, and heated to 180 ° C. with stirring in the presence of a small amount of toluene as a solvent for discharging reaction water, and the temperature was maintained. After a while, effluent separation of water was observed, and the reaction began to proceed. The reaction was continued for about 25 hours, and the weight average molecular weight was 7.8.
Ten thousand polyesters were obtained.

This polyester is diluted with toluene so that the solid content concentration becomes 25% by weight, and the conductive powder is mixed with 100 parts (solid content) of the polyester by a conductive powder [Pastran 5110S manufactured by Mitsui Kinzoku Kogyo KK]. 50 parts of a powder obtained by coating a tin oxide conductive layer on aluminum borate, average particle diameter: 5 μm, volume resistivity: 6 × 10 ¹ Ω · cm]
3 parts of an isocyanate-based cross-linking agent ["Coronate HL" manufactured by Nippon Polyurethane Co., Ltd.] was added as a cross-linking agent, and the mixture was sufficiently stirred with a stirrer to obtain an adhesive composition. In the adhesive composition, the ratio of the conductive powder was 33% by weight.

Next, a biaxially oriented polyethylene terephthalate film having a thickness of 25 μm was used as a base material, and the above-mentioned adhesive composition was coated on one side of the base material with a thickness of 20 μm after drying.
After coating to a thickness of μm, the coating was dried to produce a cover tape of an embossed carrier tape as an electronic component carrier. The surface resistance of the cover tape on the side of the adhesive layer was 1 × 10 ⁹ Ω.

In order to examine the performance of the cover tape of Examples 1 and 2, the cover tape was slit to a width of 9.3 mm, and the recess for storing electronic parts was continuously connected. And embossed amorphous polyethylene terephthalate film and a 12 mm-wide plastic sheet were combined to form an embossed tape. At this time, after the electronic components are stored in the recesses of the plastic sheet, the seal temperature is set to 180 ° C. and the pressure is set to 2.
Under the conditions of 5 kg and a taping speed of 6 m / min, both ends of the cover tape in the width direction were continuously heat-sealed.

With respect to the embossed carrier tapes of Examples 1 and 2 manufactured as described above, the presence or absence of attachment of electronic components to the cover tape was examined. Also, the cover tape
The adhesive strength of the seal portion was measured at a peeling speed of 300 mm / min. These results were as shown in Table 1 below.

[0040]

From the results shown in Table 1, the embossed carrier tapes of Examples 1 and 2 showed no adhesion of electronic components to the cover tape, and had a taping speed of 6 m / min. Even at high speeds, the heat seal has good adhesion,
It can be seen that since the seal strength can be sufficiently maintained, there is no problem such as falling off of electronic components. In the above Examples 1 and 2, when the cured resin spherical powder or the conductive powder was not blended into the adhesive composition, the electronic component might adhere to the cover tape, It was also confirmed from another test that incorporation of too much of each of the powders described above would cause inconvenience such as a decrease in the adhesiveness of the heat seal portion.

[0042]

As described above, according to the present invention, a polymer having a polycarbonate structure and a powder having a specific average particle size are formed on a substrate made of a biaxially stretched polyethylene terephthalate film. By providing the included adhesive layer, heat sealability can be improved, and even if the taping speed is increased, the adhesiveness of the heat seal portion does not decrease, and a good seal is obtained. It is possible to provide an embossed rear tape and a cover tape that can maintain the strength of the roll and avoid problems such as falling off of stored parts.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embossed rear-tape of the present invention.

FIG. 2 is a plan view of the embossed rear tape.

FIG. 3 is a cross-sectional view of a cover tape of the embossed rear tape.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 embossed rear tape 2 plastic sheet (bottom material) 2 a hollow portion 3 cover tape (lid material) 3 a heat seal portion 31 base material 32 adhesive layer 4 electronic component

Continued on front page (72) Inventor Yasuyuki Tokunaga 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation (72) Inventor Waka Hikasaka 1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko stock In-house F term (reference) 3E067 AA11 AB41 AC04 AC11 AC18 BA02A BB14A BC07A CA24 DA08 EA06 EA11 EB27 EC01 ED08 EE46 FA01 FA09 FC01 GD07

Claims (4)

[Claims] An embossed rear tape comprising a plastic sheet having an embossed concave portion for accommodating a part and a cover tape heat-sealed to the plastic sheet. Attach biaxially stretched polyethylene terephthalate
Tofilm is used as a substrate, and on this substrate, the following formula: (Wherein R is a linear or branched hydrocarbon having 2 to 20 carbon atoms) and a polymer having an average particle diameter of 0.01 to 30 μm along with a polymer having a repeating unit represented by the formula: An embossed tape which is provided with an adhesive layer containing 60% by weight. 2. The powder has a volume resistivity of 1 × 10 ⁸ Ω · cm.
The cover tape of an embossed tape according to claim 1, which is a conductor as described below. 3. The embossed tape according to claim 2, wherein the adhesive layer has a surface resistance of 1 × 10 ¹² Ω or less. 4. An embossed rear-tape comprising a plastic sheet embossed with a recess for storing parts and a cover tape heat-sealed to the plastic sheet.
An embossed riape tape characterized in that the cover tape comprises the cover tape according to any one of claims 1 to 3.