JPH107795A - Conductive resin sheet - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a conductive resin sheet which does not pollute the working environment, is reduced in the lowering of electrical conductivity caused by stretching, has an electrical conductivity suitable for preventing static buildup, and is free from deterioration of performance under low-humidity conditions by using a specified polyaniline composition. SOLUTION: This sheet is obtained by coating a resin sheet with a conductive polyaniline composition which contains a dopant comprising a proton acid, a nonpolar or lowly polar organic solvent, and a polyaniline capable of forming a composite with the dopant and which is soluble in a nonpolar or lowly polar organic solvent and drying the coated sheet. Examples of the most desirable dopant include dodecylbenzenesulfonic acid and camphorsulfonic acid. The use of this composition with a transparent resin sheet can provide a transparent conductive sheet. The sheet is used to give a bottom material for a conductive chip carrier tape, a conductive heat sealing tape, a conductive pressure-sensitive adhesive film, and a conductive bag.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a conductive resin sheet obtained by applying a conductive polyaniline composition containing a dopant which is a protonic acid, a non-polar or low-polarity organic solvent and polyaniline to the surface of a resin sheet and then drying. . Since the conductive resin sheet of the present invention has high conductivity, it is difficult to be charged, and depending on the selection of the material of the resin sheet, it is possible to impart transparency, so that it is suitable for packaging ICs and electronic device parts. .

[0002] The present invention relates to a bottom material of a conductive chip carrier tape using the above conductive resin sheet, a conductive heat seal tape, a conductive adhesive film and a conductive bag.

[0003]

2. Description of the Related Art Conventionally, when an insulating resin material such as vinyl chloride or polystyrene is used for transporting or storing semiconductors, static electricity is often generated due to friction with other insulators. For this reason, the semiconductor may be electrostatically damaged.

[0004] In order to prevent this, a method of adding a carbon filler (see JP-A-3-87097 and JP-A-3-87097)
However, in order to obtain a resistivity of about 10 ⁴ Ωcm to about 10 ⁸ Ωcm necessary for preventing electrostatic breakdown of a semiconductor, a large amount of carbon must be added. Therefore, there were problems such as contamination of the working environment. In addition, in the case of carrier tape used to mount electronic components on a printed circuit board, after the electronic components are inserted into the tape and taped, visually check the part number and check whether it is securely mounted on the printed base For optical inspection systems, the carrier tape itself often requires transparency, but the method of adding a carbon filler cannot provide such transparency, and a method of applying a carbon paste ( JP-A-5-12
No. 4678, Japanese Unexamined Patent Publication No. 6-312764, etc.) also have a problem that the transparency is not sufficient. Further, in the method using carbon, there is a problem that the conductivity in the stretched portion at the time of embossing the carrier tape is significantly reduced. In a method using a transparent filler such as tin oxide doped with antimony oxide (JP-A-4-214339, JP-A-3-187862, etc.), the contamination of the working environment is improved, and the tape is made transparent. However, in this case as well, there is a problem that the conductivity in the stretched portion during the embossing is significantly reduced. On the other hand, there is a method of adding a surfactant as an antistatic agent (Japanese Patent Application Laid-Open No. 3-87099). However, it is difficult to obtain a resistivity of 10 ¹² Ωcm or less by this method. Although it has an anti-static ability, there is a problem that the anti-static ability is reduced in a low humidity period in winter. Further, when a resin sheet using this method is used for an adhesive film, there is a problem that the adhesiveness changes due to leaching of a surfactant.

[0005]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a conductive resin sheet having a conductivity suitable for use in antistatic applications and having no reduction in antistatic ability at low humidity to contaminate the working environment. The object of the present invention is to provide a conductive film without causing any decrease in conductivity due to stretching.

Another object of the present invention is to provide a resin sheet,
An object of the present invention is to provide a conductive resin sheet having a transparent property after using a transparent resin sheet and having an appropriate conductivity for use in antistatic applications.

Another object of the present invention is to use a conductive polyaniline composition having a high conductivity among conductive polyaniline compositions, and to provide a conductive polyaniline composition having a conductivity suitable for use in antistatic applications with a smaller coating amount. An object of the present invention is to provide a conductive resin sheet, and to provide a conductive resin sheet excellent in transparency by using a resin sheet having lower transparency.

Another object of the present invention is to provide a conductive polyaniline composition having a higher conductivity since the composite of the polyaniline and the dopant has excellent solubility in a nonpolar or low-polarity solvent among conductive polyaniline compositions. Using the composition, to provide a conductive resin sheet having an appropriate conductivity to be used for antistatic applications with a smaller coating amount, as a resin sheet, using a resin sheet having a lower transparency, excellent in transparency An object of the present invention is to provide a conductive resin sheet.

Another object of the present invention is to provide a conductive chip carrier which has an appropriate electric conductivity for use in antistatic applications by using the above-mentioned conductive resin sheet, and which does not decrease in antistatic ability at low humidity. An object of the present invention is to provide a tape base material without contaminating a working environment and with a small decrease in conductivity due to stretching. It is still another object of the present invention to provide a conductive chip carrier tape base material having appropriate conductivity for use in antistatic applications and having transparency.

[0010] Another object of the present invention is to provide a conductive heat seal using the above conductive resin sheet, which has an appropriate conductivity for use in antistatic applications and has no reduction in antistatic ability at low humidity. Tape without polluting the work environment
To provide. It is still another object of the present invention to provide a conductive heat seal tape having a suitable conductivity for use in antistatic applications and having transparency.

Another object of the present invention is to use the above-mentioned conductive resin sheet, which has an electric conductivity suitable for use in antistatic applications, does not cause a decrease in antistatic ability at low humidity, and is free from exudates. An object of the present invention is to provide a conductive pressure-sensitive adhesive film which does not cause a change with time of the pressure-sensitive adhesive property without polluting the working environment. It is still another object of the present invention to provide a conductive pressure-sensitive adhesive film having a suitable conductivity for use in antistatic applications and having transparency.

Another object of the present invention is to provide a conductive bag having the above-mentioned conductive resin sheet, which has an appropriate conductivity for use in antistatic applications and has no reduction in antistatic ability at low humidity. To provide a work environment without polluting it. It is still another object of the present invention to provide a transparent conductive bag having conductivity suitable for use in antistatic applications.

[0013]

The present invention comprises a dopant which is a protic acid, a non-polar or low-polarity organic solvent and polyaniline, wherein the polyaniline forms a complex with the dopant which is a protic acid, The present invention relates to a conductive resin sheet obtained by applying a conductive polyaniline composition soluble in a solvent having a low content to the surface of a resin sheet and then drying.

[0014] The present invention also relates to a conductive resin sheet wherein the protonic acid is sulfonic acid.

[0015] The present invention also relates to a conductive resin sheet wherein the protonic acid is camphorsulfonic acid.

Further, the present invention relates to a conductive resin sheet wherein the protonic acid is dodecylbenzenesulfonic acid.

The present invention also relates to a conductive resin sheet wherein the resin sheet is made of a synthetic resin having transparency.

The present invention also relates to a bottom material for a conductive chip carrier tape, comprising the embossed conductive resin sheet.

[0019] The present invention also relates to a conductive heat seal tape comprising the conductive resin sheet having a heat seal layer.

The present invention also relates to a conductive pressure-sensitive adhesive film comprising the conductive resin sheet having a pressure-sensitive adhesive layer.

The present invention also relates to a conductive bag comprising the bag-shaped conductive resin sheet.

[0022]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, a protonic acid is
An acid having hydrogen as a counter ion, and a dopant is a compound having an effect of imparting conductivity to a complex formed by adding to basic and insulating polyaniline.

The dopant which is a protonic acid in the present invention has a function of imparting conductivity to polyaniline and, at the same time, making polyaniline soluble in a nonpolar or low-polarity organic solvent. In addition, this dopant forms a complex with polyaniline in the conductive polyaniline composition of the present invention.

The film obtained after removing the organic solvent from the conductive polyaniline composition by drying is a composite of polyaniline and a dopant, and has conductivity.

Hereinafter, a composite of polyaniline and a dopant is referred to as a polyaniline composite, and polyaniline not forming a composite with the dopant and polyaniline in the composite of the polyaniline and the dopant are simply referred to as polyaniline.

The chip carrier tape is a tape-shaped container used for packaging and transporting electronic components. Usually, a chip-shaped bottom material having an embossed portion for storing electronic components, and an embossed portion after storing the electronic components. And a tape-shaped lid member for covering the lid. The bottom material of the conductive chip carrier tape of the present invention means, among the bottom materials of the chip carrier tape, one having particularly antistatic ability.

The conductive heat sealing tape of the present invention is:
It means a tape having antistatic ability and thermocompression bonding, which is also used as a cover material of a chip carrier tape and a material of a conductive bag.

The conductive adhesive film of the present invention means a film having antistatic ability and adhesiveness, which is also used for transporting semiconductors and protecting tapes on surface circuits of semiconductors.

The conductive bag of the present invention means a packaging bag having antistatic ability, which is also used for storing semiconductors.

As the dopant which is a protonic acid in the present invention, hydrogenated phosphoric acid and sulfonic acid are particularly preferred from the viewpoint of solubility in non-polar or low-polarity organic solvents and imparting conductivity to polyaniline.

The dopant which is a protonic acid in the present invention is illustrated below, but the present invention is not limited to the following compounds.

Examples of the hydrogenated phosphoric acid include bis (2-ethylhexyl) hydrogenated phosphoric acid, diphenyl hydrogenated phosphoric acid and the like.

Examples of the sulfonic acid include n-hexylsulfonic acid, n-octylsulfonic acid, dodecylsulfonic acid,
Cetylsulfone, 4-dodecylbenzenesulfone,
Camphorsulfonic acid, poly (vinyl) sulfonic acid, dinonylnaphthalenesulfonic acid, p-chlorobenzenesulfonic acid, hydroxybenzenesulfonic acid, trichlorobenzenesulfonic acid, 4-nitrotoluene-2-sulfonic acid, 1-octanesulfonic acid, sulfone Polystyrene, sulfonated polyethylene, 4-octylbenzenesulfonic acid, 2-methyl-5-isopropylbenzenesulfonic acid, and the like.

Among the dopants that are protonic acids in the present invention, dodecylbenzenesulfonic acid and camphor are the most preferable ones in terms of solubility in non-polar or low-polarity organic solvents and conductivity-imparting properties to polyaniline. Sulfonic acid.

The molar ratio of the dopant, which is the protonic acid in the polyaniline composite of the present invention, to the aniline unit in the polyaniline is preferably from 0.5 to 2.0,
More preferably, it is 0.8 to 1.5. If it is less than 0.5, the solubility in non-polar or low-polarity organic solvents tends to be poor, and if it exceeds 2.0, the acidity of the conductive polyaniline composition tends to be too strong. When dissolving polyaniline in m-cresol using camphorsulfonic acid as a dopant, practical solubility can be obtained if camphorsulfonic acid is 0.5 with respect to the number of aniline repeats in polyaniline. .5
Is fine.

The non-polar or low-polarity organic solvent in the present invention preferably has a dielectric constant of 22 or less. When the dielectric constant exceeds 22, the organic solvent is produced from the conductive polyaniline composition due to the polarity of the solvent. The conductivity of the formed film tends to decrease.

The non-polar or low-polarity organic solvent preferably used in the present invention includes aromatic hydrocarbons substituted or unsubstituted by alkyl or the like, alkanes having 5 to 12 carbon atoms, alkenes, and mineral oils having 4 to 12 carbon atoms. , Halogenated alkanes, aliphatic alcohols, alkyl ethers, ketones, halogenated aromatic hydrocarbons, cycloalkanes, cycloalkenes, heterocyclic compounds and mixtures thereof. Compounds which are preferably used as a non-polar or low-polarity organic solvent are exemplified below, but the present invention is not limited to the following exemplified compounds.

Benzene, toluene, p-xylene, m-
Xylene, a mixture of isomers of xylene, naphthalene, ethylbenzene, styrene, aniline, pentane, hexane, heptane, octane, nonane, decane, decahydronaphthalene, chloroform, bromoform, dichloromethane, monochloromethane, chlorobenzene, o-dichlorobenzene, m -Dichlorobenzene, p-dichlorobenzene, m-cresol, an isomer mixture of cresol,
Penzyl alcohol, 2-butanol, 1-butanol, hexanol, pentanol, decanol, 2-methyl-1-propanol, hexanone, butanone, pentanone, morpholine, perfluorodecalin, perfluorobenzene and the like.

Among the non-polar or low-polarity organic solvents in the present invention, particularly preferable ones in view of the solubility of the complex of the polyaniline and the dopant include xylene, toluene, m-cresol and an isomer mixture of cresol. And a mixed solvent thereof. In addition, N-methylpyrrolidone (dielectric constant 32), methanol (dielectric constant 32.6), N, N-dimethylformamide (dielectric constant 36.7), and acetonitrile (dielectric constant 37.5) having a dielectric constant exceeding 22 are used. Such a polar organic solvent tends to have low conductivity.

The compounding ratio of the nonpolar or low-polarity organic solvent in the conductive polyaniline composition of the present invention is such that the concentration of the complex of polyaniline and the dopant is usually 0.01 to 10% by weight, preferably 0.1 to 10% by weight. It is blended so as to be 10% by weight, more preferably 0.1 to 7.5% by weight. If it exceeds 10% by weight, it becomes difficult to dissolve in an organic solvent,
When the amount is less than the weight percentage, formation of a coating film becomes difficult.

In the present invention, the weight average molecular weight of the polyaniline is preferably 10,000 to 300,000, and
More preferably, it is from 000 to 200,000. 1
If it is less than 000, the film-forming properties tend to be poor, and if it exceeds 300,000, the solubility in non-polar or low-polarity organic solvents tends to decrease.

As the monomer used in the polymerization of polyaniline in the present invention, a compound represented by the following structural formula is preferable in terms of solubility in a nonpolar or low-polarity organic solvent.

[0043]

Embedded image (Where n is an integer from 0 to 4, m is an integer from 1 to 5 and n
+ M is 5. R ¹ represents alkyl, alkenyl, alkoxy, cycloalkyl, cycloalkenyl, alkanoyl, alkylthio, allylthioalkyl, allyloxy, alkylallyl, allylalkyl, alkoxyalkyl, alkylsulfonyl, allyl, allylthio, alkoxycarbonyl, and is the same. Or different. From the industrial point of view, a polymer produced using an aniline monomer having no substituent is most preferable because it is inexpensive.

The polymerization of polyaniline in the present invention can be carried out by using a known method such as electrolytic oxidation polymerization or chemical oxidation polymerization. From the industrial viewpoint, it is preferable to produce the polyaniline by chemical oxidation polymerization.

The polyaniline after the chemical oxidative polymerization is obtained as a powder. The powder is dedoped with a base and then dried to obtain a basic polyaniline. In this case, it is particularly preferable to use a volatile base such as ammonia or an organic amine since it can be completely removed in the subsequent drying step. Further, the drying of the undoped polyaniline is preferably performed at 50 ° C. or less in vacuum from the viewpoint of solubility in an organic solvent.

In order to obtain the conductive polyaniline composition according to the present invention, a method of mixing the basic polyaniline powder and a dopant which is a protonic acid and then dissolving it in a nonpolar or low-polarity organic solvent is used. It is preferred in that respect.
The polyaniline and the dopant form a complex in the conductive polyaniline composition. Therefore, the solid obtained by removing the solvent from the conductive polyaniline composition of the present invention has a high conductivity of 10 S / cm or more. Is shown.

The conductive polyaniline composition of the present invention may contain a surfactant, and the surfactant improves the solubility of the polyaniline of the present invention. The surfactant used in the present invention is not particularly limited. Examples thereof include 4-hexylethylphenol, 3-pentadecylphenol, nonylphenol, 4-dodecylresorcinol, 4- (tert-octyl) phenol, and , 6
-Di-tert-butyl-4-methylphenol, 3,
4-dimethylphenol, 2,6-dimethylphenol, methyl paratoluenesulfonate, ethyl paratoluenesulfonate, n-hexylparatoluenesulfonate, isopropylaminealkylarylsulfonate, 1-dodecanol, 1-tridecanol, 1-docosanol, CH ₃ ( CH ₂ ) _X CH ₂ (OCH ₂ CH ₂ ) _n O
H (x = 10-14, n = 1.3; x = 6.8, n =
1.0; x = 10-12, n = 3; x = 6-8, n =
Ethoxylate represented by 2), poly (oxy-1,
2-ethanediol) and the like are used. The mixing ratio of these surfactants is generally 0 to 100% by weight, preferably 50 to 100% by weight, based on the complex of the dopant and the polyaniline.
% By weight.

The conductive polyaniline composition of the present invention can contain an insulating or semiconductive thermoplastic polymer, if necessary, for adjusting the viscosity or imparting heat sealability. Examples of such thermoplastic polymers include polyethylene, polypropylene, polystyrene, polyethylvinyl acetate, polybutadiene, polyisoprene, ethylene vinylene copolymer, ethylene propylene copolymer, polysiloxane, polysulfone, polycarbonate, and acrylonitrile copolymer. Coalesce or homopolymer, nylon 12, nylon 8, nylon 6, nylon 6,6, nylon 4,6, amorphous nylon, polyvinyl acetate, polyvinyl alcohol, polyether, polyvinyl butyral, polyvinyl pyrrolidone, polyvinyl chloride, polyvinyl acetate, Vinyl chloride-vinyl acetate copolymer, polyvinylidene chloride, polyacrylate,
There are linear polymers such as rubber such as polyester, polyamideimide, polyimide, polyurethane, polysulfone, and polyisoprene. In addition, the thermoplastic polymer in the present invention is not limited to the above exemplified compounds. The mixing ratio of these thermoplastic polymers is usually 0 to 50,000% by weight, preferably 200 to 10,000% by weight, based on the composite of the dopant and polyaniline.

Next, the conductive polyaniline composition of the present invention is applied to the surface of a resin sheet. The material of the resin sheet used in the present invention is not particularly limited. Examples thereof include polyolefins such as polyethylene and polypropylene, and polyethylene. Polyester such as terephthalate, nylon,
Polyfluoroethylene, cellophane, acrylic resin, polycarbonate, polyvinyl butyral, polyvinylidene chloride, polyimide, polyamide imide, polystyrene,
Polyphenylene sulfide, polytetrafluoroethylene, acrylonitrile-acryl-styrene polymer blend, acrylonitrile-butadiene-styrene polymer blend, polyvinyl chloride, high impact polystyrene, acrylonitrile-styrene copolymer, styrene-acryl ester copolymer Polymerized polymer,
Examples include polyacrylester and polymethacrylester. Any number of these resins may be laminated to take advantage of the characteristics of each resin. In the case of lamination, a layer of paper, cloth, a metal film, or the like may be present for the purpose of reinforcement or the like (however, in this case, it is difficult to impart transparency). Alternatively, a plurality of the above resins may be blended and used. The surface of the resin sheet may be subjected to a corona discharge treatment or various primer treatments in order to improve the adhesion at the time of lamination and to improve the coating property of the conductive polyaniline composition. When blending the resin, an additive for improving compatibility may be included. When these resins are laminated, they may be laminated before or after the application of the conductive polyaniline composition. By applying the conductive polyaniline composition of the present invention to a resin sheet in the middle of lamination, a conductive resin sheet having a polyaniline layer between the laminated resins can be obtained, and such a conductive resin sheet is also a conductive resin sheet of the present invention. Included in resin sheet. However, the outermost surface layer is preferably formed of a conductive polyaniline composition from the viewpoint of antistatic properties. The resin sheet in the present invention may contain additives such as a lubricant and a plasticizer, if necessary, but the kind and amount thereof are limited to a range that does not impair the transparency of the resin sheet. This is preferable since transparency can be imparted to the film.
For the purpose of assisting the antistatic property, an unconventional conductivity-imparting agent such as carbon, metal powder, a transparent filler such as potassium titanate or tin oxide, or a surfactant may be added to the resin sheet. The thickness of the resin sheet is usually 0.01 to 1 mm,
Preferably it is 0.02 to 0.6 mm, more preferably 0.1 to 0.6 mm.
05 to 5 mm.

The conductive resin sheet of the present invention has a visible light transmittance at a wavelength of 550 nm of 30% or more.
It is preferable from the viewpoint of securing the transparency of the conductive resin sheet. More preferably, it is 50% or more. More preferably 70
% Or more is good. The synthetic resin having a see-through property in the present invention means a kind that can have the above-mentioned preferable visible light transmittance when processed into a resin sheet. Examples of the synthetic resin having transparency in the present invention include polyethylene terephthalate, polyethylene, nylon, cellophane, polycarbonate, polyvinylidene chloride, polystyrene, acrylonitrile-acryl-styrene-based polymer blend, polyvinyl chloride, high-impact polystyrene, acrylonitrile-styrene. Acrylic resins such as styrene-acrylic ester-based copolymers, styrene-methacrylic ester-based copolymers, polyacrylic esters, and polymethacrylic esters are preferably used.

The surface resistance of the conductive resin sheet of the present invention is:
10 ³ Ω / □ to 10 ¹² Ω / □ is preferred and 10 ⁴ Ω / □
More preferably if ¹⁰ 10 Ω / □ in the, more preferably 10 ⁴ Ω / □ from 10 ⁸ Ω / □. When the surface resistance of the conductive film exceeds 10 ¹² Ω / □, the antistatic property tends to be lost, and when the surface resistance is less than 10 ³ Ω / □, there is a tendency to be affected by the discharge of static electricity from a charged body such as a human body.

In the present invention, the conductive polyaniline composition applied to the surface of the resin sheet is used in an amount sufficient to give the conductive resin sheet the electric conductivity necessary for preventing the generation of static electricity. The preferred amount of the conductive polyaniline composition applied to the resin sheet surface varies depending on the material and use of the sheet, but the weight per square centimeter after drying and removing the organic solvent is 0.05 μg to 1 μm.
It is preferable to set the range to be 0 mg. 0.05 μg /
If it is less than cm ² , it is difficult to obtain a surface resistance of 10 ¹² Ω or less, and if it exceeds 10 mg / cm ² , the transparency of the conductive resin sheet tends to be lost. A particularly preferred coating amount is 0.2 μg / cm ² to 1 mg / cm ² , and within this range, the conductivity required for antistatic can be obtained, and the transparency of the conductive resin sheet is not impaired.

The resin sheet on which the conductive polyaniline composition is applied need not necessarily be flat. For example,
The bottom material of the conductive chip carrier tape may be applied to the resin sheet after the embossed portion is formed.
However, a method of forming and processing after applying a flat resin sheet is preferable in that uniform application is easy.

A film obtained by applying a conductive polyaniline composition to the surface of a resin sheet and drying it may contain an excess of protonic acid that does not form a complex with polyaniline. It is preferable to remove this by washing with a solvent from the viewpoint of preventing contamination of the packaged object such as a semiconductor. The solvent used for this washing is selected from those that dissolve the compounded protonic acid and do not attack the resin sheet. Preferred solvents include alcohols such as methanol and ethanol, acetone and the like. In addition, an alkaline aqueous solution having a hydrogen ion concentration exceeding 7 removes even a protonic acid which forms a complex with polyaniline and impairs the conductivity of the film, and thus is not suitable as a solvent used for cleaning.

The method for applying the conductive polyaniline composition to the surface of the resin sheet is not particularly limited, and a general method such as spray coating, roll coating, dip coating and the like can be used. However, the relative humidity in the air at the time of application is preferably 50% or less. If the humidity exceeds 50%, the viscosity of the polyaniline composition increases during the coating operation, and it tends to be difficult to perform uniform coating. It is more preferably 40% or less, and further preferably 20% or less. In addition, when the organic solvent in the conductive polyaniline composition is of a type that attacks the resin sheet, rapid application and drying may be required. For example, when the organic solvent in the conductive polyaniline composition is toluene and the resin sheet is polystyrene, the content of the organic solvent in the conductive polyaniline composition and the amount of the coating liquid vary depending on the amount of the coating solution, but at least the appearance within 5 sands. It is preferable to set the conditions for the upper drying.

In the bottom material of the conductive chip carrier tape of the present invention, any of the above-listed resins can be used as the material of the resin sheet. Among them, transparency, dimensional accuracy, workability and the like are included. From the viewpoint, polystyrene resins, polyvinyl chloride resins, and polyester resins are particularly preferred.

The bottom material of the conductive chip carrier tape of the present invention is obtained by embossing the sheet-shaped conductive resin sheet of the present invention. The embossing may be performed after the conductive resin sheet is cut into a required width or before the cutting. The thickness of the bottom material of the conductive chip carrier tape of the present invention is preferably 0.1 mm to 0.5 mm, and varies depending on the application. For example, a chip carrier tape for QFP mounting is preferably used in a thickness of 0.3 mm to 0.4 mm because of its wide width, and a chip carrier tape for small components such as chip capacitors is preferably used in a thickness of 0.1 mm to 0.1 mm. 0.3 mm is preferably used. The width of the conductive chip carrier tape of the present invention varies depending on the application and is not particularly limited. However, from the viewpoint of the standard of an automatic mounting machine for chip components, the width is 8 mm, 12 mm, 16 mm, 2 mm or 12 mm.
4 mm, 32 mm, 44 mm, and 56 mm widths are preferably used.

As a method for embossing the conductive resin sheet of the present invention, general methods such as vacuum forming, pressure forming, stamping and the like can be used. For example, in the method by stamping molding, a polymer film that has been sent out from a roll and pre-ripened is continuously embossed in a mold at 40 ° C. to 60 ° C. and wound up by a take-up roll.

The size of the emboss (pocket) is usually 2 to 50 mm in length, 2 to 50 mm in width, 2 to 7 mm in depth, and 1
It is provided at an interval of ５5 mm.

The conductive heat sealing tape of the present invention includes 1) a conductive resin sheet of the present invention having heat sealing properties, and 2) a heat sealing layer on the conductive resin sheet of the present invention as a support layer. 3)
For example, there is a method in which a conductive polyaniline composition is further applied to the heat seal layer of 2) and then dried.

When a single-layer resin sheet is used as the conductive resin sheet, the material of the resin sheet of the resin sheet is preferably polyethylene resin, polyvinyl chloride resin or the like from the viewpoint of heat sealing properties. Usually, a multilayer sheet that makes use of the characteristics of various resins is used, and such a multilayer sheet is more preferable in many cases because it makes use of the characteristics of a plurality of resins. From the viewpoint of toughness, a polyester resin, a polyethylene resin, a polypropylene resin, a polyamide resin, or the like is preferable as the support layer of the multilayer sheet. As the heat seal layer, a polyethylene-vinyl acetate copolymer resin, polyethylene Resin,
Polyester resins, polystyrene resins, polyvinyl chloride resins, polyacrylonitrile resins, and the like can be used. Other layers may be provided between the heat seal layer and the support layer or on the side opposite to the heat seal layer as viewed from the support layer, depending on the purpose. For example, in a heat seal tape used for a lid material of a chip carrier tape, it is also preferable to provide an intermediate layer as a cushion material, and the intermediate layer is made of a polyethylene-vinyl acetate copolymer resin, a polyethylene resin, a polypropylene resin, or the like. It is suitable.

The thickness of the resin sheet as the support layer is preferably 1 μm or more from the viewpoint of strength, and preferably 0.5 mm or less from the viewpoint of flexibility. From the viewpoint of workability during coating, the range is more preferably 4 μm or more and 0.3 mm or less. As described above, the conductive heat seal tape of the present invention preferably uses a multilayer sheet. However, the method for multilayering is not particularly limited, and may be co-extrusion, extrusion lamination, hot melt lamination, or dry lamination.
A general method such as wet lamination can be used. It is also a preferable method to use an anchor coating agent for improving the adhesion between the layers, and for this, a general-purpose material such as polyethyleneimine, urethane, and isocyanate can be used.

The conductive adhesive film of the present invention includes:
1) a material comprising the conductive resin sheet of the present invention having tackiness; 2) a material obtained by laminating a pressure-sensitive adhesive on the conductive resin sheet of the present invention as a support layer; and 3) a further conductive material on the pressure-sensitive adhesive layer of 2). And the like, which are dried after the application of the conductive polyaniline composition.

There is no particular limitation on the material of the resin sheet of the conductive resin sheet used as the support, and a suitable material varies depending on the detailed use. For example, it is used for transporting a semiconductor or protecting a surface circuit of the semiconductor. Examples of suitable materials include polyethylene, polyolefin such as polypropylene, polyester such as polyethylene terephthalate, nylon, polyfluoroethylene, polyvinyl chloride, cellophane, acrylic resin, polycarbonate, polyvinyl butyral, polyvinylidene chloride, polyimide, polyamide imide, and polystyrene. , Polyphenylene sulfide,
And polytetrafluoroethylene.

The conductive resin sheet used for the support layer of the conductive pressure-sensitive adhesive film of the present invention has a structure in which the conductive polyaniline of the present invention is applied to both sides or one side of the resin sheet.
The support of the conductive pressure-sensitive adhesive film of the present invention can be subjected to back surface treatment in order to prevent adhesion between the films, and the back surface treatment agent is not particularly limited. For example, long-chain alkyl acrylate copolymer, Those containing a long-chain alkyl group such as a long-chain alkyl vinyl ester copolymer, a long-chain alkyl vinyl ether copolymer, a long-chain alkyl acrylamide copolymer, a silicone (polysiloxane) type, a fluorine resin type, and the like. . Further, the support layer in the present invention may be subjected to a corona treatment or a primer treatment in order to improve the adhesion to the pressure-sensitive adhesive composition.

The thickness of the conductive resin sheet is preferably 5 to 300 μm, more preferably 15 to 200 μm, and particularly preferably 2 to 300 μm, from the viewpoint of workability such as application of an adhesive.
0 to 150 μm. When the thickness of the support material is 5 μm or less or 300 μm or more, the transportability of the support material during application of the adhesive tends to decrease.

The pressure-sensitive adhesive used in the pressure-sensitive adhesive layer of the conductive pressure-sensitive adhesive film of the present invention includes an acrylic pressure-sensitive adhesive, a polybutadiene-based pressure-sensitive adhesive, a polyvinyl butyral-based pressure-sensitive adhesive, a polyvinyl formal-based pressure-sensitive adhesive, a vinyl acetate-based pressure-sensitive adhesive, Urethane-based adhesives and the like are preferred. The thickness of the pressure-sensitive adhesive layer is desirably greater than the surface roughness of the adhesive surface, and is preferably 1 to
It is 200 μm, more preferably 5 to 150 μm, particularly preferably 5 to 100 μm. If the thickness is less than 1 μm, the adhesive strength tends to decrease, and if it exceeds 200 μm, the adhesive tends to remain.

In the conductive bag of the present invention, the same conductive resin sheet as the heat seal tape can be suitably used. Further, from the viewpoint of barrier properties against moisture and oxygen, it is more preferable to use a polyester resin coated with polyvinylidene chloride for the support layer.

In the conductive heat-sealing tape and the conductive adhesive film of the present invention, on the heat sealant layer,
When applying the conductive polyaniline composition on the pressure-sensitive adhesive layer of the pressure-sensitive adhesive film, the coating amount is 5 μg in the above range.
/ Cm ² or less. 5 μg / cm ²
If it exceeds 300, heat sealability and adhesiveness tend to deteriorate. In this case, it is more preferably 1 μg / cm ² or less. By mixing the heat sealant resin in the conductive polyaniline composition in advance, the heat sealant layer can be formed simultaneously with the formation of the conductive layer when the conductive polyaniline composition is applied and dried. As described above, the heat sealant resin in this case is selected from an insulating or semiconductive thermoplastic polymer having a dielectric constant of 22 or less. In this case, the amount of the heat sealant resin added to the conductive polyaniline composition is preferably in the range of 0.5 times to 100 times the weight ratio of the polyaniline in the present invention. If it is less than 0.5 times tend to heat sealing property is deteriorated, when it exceeds 100 times 10 ¹²
It tends to be difficult to obtain a surface resistance of Ω or less.
More preferably, it is 1 times or more and 20 times or less. In this case, the coating amount of the polyaniline composition is more preferably 0.5 μg or more in the above range.

[0070]

Hereinafter, the present invention will be described with reference to examples.
The present invention is not limited to this.

(Synthesis Example 1) 120 ml of aniline (special grade, manufactured by Wako Pure Chemical Industries, Ltd.), 150 ml of 35% hydrochloric acid (special grade, manufactured by Wako Pure Chemical Industries, Ltd.) and 120 ml of distilled water were mixed in 3 liters. Placed in an Erlenmeyer flask and cooled to 0 ° C.
While maintaining the temperature at 0 ° C., 138 g of ammonium peroxydisulfate dissolved in 300 ml of distilled water (special grade, manufactured by Wako Pure Chemical Industries, Ltd.) while stirring the solution in the Erlenmeyer flask.
Was added over 2 hours to polymerize aniline. After the addition of ammonium peroxydisulfate, the mixture was kept at 0 ° C. for 3 hours with stirring. Since polyaniline is in the form of powder, it was filtered, sufficiently washed with distilled water, and then washed with methanol and ether. The thoroughly washed powdered polyaniline was then dried in a vacuum oven at 50 ° C. under reduced pressure.

Next, 100 g of polyaniline was placed in 10 liters of 3% aqueous ammonia and stirred for 2 hours. After filtering the basic polyaniline powder thus obtained, sufficiently washing with distilled water, washing with methanol, and washing with ether are performed.
Then, it was dried at 50 ° C. under reduced pressure in a vacuum dryer. The yield of the basic polyaniline was 36%.

(Synthesis Example 2) 1.4 g of the basic polyaniline obtained in Synthesis Example 1 and 5.2 g of dodecylbenzenesulfonic acid (manufactured by Kanto Chemical Co., Ltd.) were well mixed in a glove box purged with nitrogen. This mixture is dissolved in toluene 120
g in an ultrasonic washer for 48 hours, followed by centrifugation. Further, insolubles were removed by decantation to obtain a toluene solution of polyaniline. This solution is referred to as polyaniline solution 1.

(Synthesis Example 3) 1.4 g of the basic polyaniline obtained in Synthesis Example 1 and 5.2 g of dodecylbenzenesulfonic acid (manufactured by Kanto Chemical Co., Ltd.) were thoroughly mixed in a glove box purged with nitrogen. This mixture is mixed with xylene 120
g in an ultrasonic washer for 48 hours, followed by centrifugation. Further, insolubles were removed by decantation to obtain a xylene solution of polyaniline. This solution is referred to as polyaniline solution 2.

(Synthesis Example 4) 2.61 g of the basic polyaniline obtained in Synthesis Example 1 and 3.39 of camphorsulfonic acid were obtained.
g was mixed well in a glove box purged with nitrogen.
This mixture was slowly added with stirring to 294 g of m-cresol in a glass container with a lid in the glove box. The container capable of being covered was tightly covered, and was subjected to an ultrasonic cleaning machine for 48 hours. Thereafter, insolubles were removed by decantation to obtain a polyaniline m-cresol solution. This solution is referred to as polyaniline solution 3.

(Synthesis Example 5) 100 g of a toluene solution of polyaniline obtained in the same manner as in Synthesis Example 2 was placed in a glass container capable of being covered, and 2 g of GP polystyrene (weight average molecular weight 300,000) was added thereto. The mixture was stirred for 24 hours using a stirrer to obtain a slightly viscous toluene solution of polyaniline. This solution is referred to as polyaniline solution 4.

(Synthesis Example 6) Pellets of acrylonitrile / acrylic rubber / styrene resin (Vitax VW8700-N, manufactured by Hitachi Chemical Co., Ltd.) are extruded at a temperature of 220 ° C. to form a resin sheet having a thickness of 0.3 mm. Obtained. This is referred to as a resin sheet 1.

(Synthesis Example 7) In a four-necked flask equipped with a stirrer, a thermometer, a condenser, and a dropping funnel, 190 parts by weight of 2-ethylhexyl acrylate and 10 parts by weight of vinyl acetate (glass transition temperature of homopolymer: 30 ° C.) , 6 parts by weight of acrylic acid, 0.4 parts by weight of azobisisobutyronitrile and 50 parts by weight of ethyl acetate, and the air in the flask was replaced with nitrogen. After the temperature in the flask was raised to 60 ° C. to start the polymerization, the temperature was lowered to 55 ° C. and the temperature was lowered to 55 ° C. for 8 hours.
And polymerization was carried out. In the latter half of the polymerization, ethyl acetate was added dropwise at a rate of 5 m1 / 10 minutes as the viscosity increased. The copolymer composition thus obtained had a solid content of 40% by weight and a weight average molecular weight of the copolymer of 1.2 million. The copolymer solution was immersed in methanol, filtered to separate only solids, dried, and dried.
An adhesive composition solution 1 was prepared by mixing 3 parts by weight of a bifunctional isocyanate compound (diphenylmethane diisocyanate, Nippon Polyurethane Millionate MT) with 0 parts by weight and a mixture of 50 parts by weight of xylene.

Example 1 Transparent polystyrene resin sheet (Electrical Chemical Industry Co., Ltd.)
Made, clearen sheet CST2401, thickness 0.3m
In m), the polyaniline solution 1 obtained in Synthesis Example 2 was spread quickly to a thickness of about 1 μm using a Baker film applicator. Immediately, it was dried with cold air of a dryer for 5 seconds.
This resin sheet is further placed on a hot plate at 80 ° C. for 1 hour.
Dried for hours. The weight of the coating film after drying was 1 μg per square centimeter. The same operation was performed on the other surface of the resin sheet, and coating films were provided on both surfaces of the resin sheet. Next, this resin sheet was immersed in ethanol to wash off dodecylbenzenesulfonic acid which did not form a complex with polyaniline. 80 of this resin sheet
It dried for 1 hour with a hot air dryer at ℃ to obtain a conductive resin sheet having a polyaniline composite layer. For visible light with a wavelength of 550 nm, the light transmittance of this conductive resin sheet is 55
%, Which was a transparent conductive resin sheet. The surface resistance value of this conductive resin sheet was 10 ⁴ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor. This conductive resin sheet is cut into a width of 24 mm, and is subjected to embossing with pockets having a length of 13 mm, a width of 13 mm, and a depth of 4.9 mm at intervals of 3 mm by hot plate press molding to obtain a bottom material of the conductive chip carrier tape. Was. The surface resistance between the adjacent bottoms was 10 ⁵ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor.

Example 2 A conductive resin sheet having a polyaniline composite layer was obtained in the same manner as in Example 1 except that the resin sheet 1 obtained in Synthesis Example 6 was used. The weight of the coating film after drying one side was 1 μg per square centimeter. Wavelength 550nm
For visible light, the light transmittance of this conductive resin sheet is 5
2%, which was a conductive resin sheet having transparency.
The surface resistance value of this conductive resin sheet is 10 ⁴ Ω / □,
The value was sufficient to prevent electrostatic breakdown of the semiconductor. This conductive resin sheet was embossed in the same manner as in Example 1 to obtain a bottom material of the conductive chip carrier tape. The surface resistance between the adjacent bottoms was 10 ⁵ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor.

Embodiment 3
. The polyaniline solution 2 obtained in Synthesis Example 3 was sprayed on a polyethylene terephthalate resin sheet (APGP00, manufactured by Denki Kagaku Kogyo KK, thickness 0.3 mm) using a spray gun. The sheet was dried on a hot plate at 100 ° C. for 1 hour. The weight of the coating film after drying was 3 μg per square centimeter. The same operation was performed on the other surface of the resin sheet, and coating films were provided on both surfaces of the resin sheet. Next, this resin sheet was immersed in acetone to wash off dodecylbenzenesulfonic acid which did not form a complex with polyaniline. The resin sheet was dried with a hot air dryer at 80 ° C. for 1 hour to obtain a conductive resin sheet having a polyaniline composite layer. In the case of visible light having a wavelength of 550 nm, the light transmittance of the conductive resin sheet was 67%, and the conductive resin sheet was transparent. The surface resistance value of this conductive resin sheet was 10 ³ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor. A pocket similar to that of Example 1 was formed in this conductive resin sheet by vacuum forming, and further cut to a width of 24 mm to obtain a bottom material of the conductive chip carrier tape. The surface resistance between the adjacent bottoms was 10 ⁵ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor.

Example 4 The polyaniline solution 4 obtained in Synthesis Example 5 was applied to a transparent hard vinyl chloride sheet (Eviron 3005 manufactured by Taihei Chemical Co., Ltd., 0.3 mm in thickness) using a baker film applicator to a thickness of about 3 mm. I spread it. 50 of this resin sheet
Dried on a hot plate at 2 ° C. for 2 hours. The weight of the coating film after drying was 2 μmg per square centimeter. The same operation was performed on the other surface of the resin sheet, and coating films were provided on both surfaces of the resin sheet. Next, this resin sheet was immersed in acetone to wash off dodecylbenzenesulfonic acid which did not form a complex with polyaniline. The resin sheet was dried with a hot air dryer at 60 ° C. for 2 hours to obtain a conductive resin sheet having a polyaniline composite layer. In the case of visible light having a wavelength of 550 mm, the light transmittance of the conductive resin sheet was 69%, and the conductive resin sheet was transparent. The surface resistance value of the conductive resin sheet was 10 ⁴ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor. This conductive resin sheet is 24 mm wide.
Then, embossing was performed by hot plate molding with pockets having a length of 13 mm, a width of 13 mm, and a depth of 4.9 mm at intervals of 3 mm to obtain a bottom material of the conductive chip carrier tape. The surface resistance between adjacent bottoms is 10 ⁶ Ω / □,
The value was sufficient to prevent electrostatic breakdown of the semiconductor.

Example 5 Polyethylene terephthalate resin sheet (APGP00, manufactured by Denki Kagaku Kogyo KK, thickness 0.3 mm) and synthesis example 4
A conductive resin sheet having a polyaniline composite layer was obtained in the same manner as in Example 1, except that the film was not washed with ethanol, using the polyaniline solution 3 obtained in the above.
The weight of the coating film after drying one side was 3 μg per square centimeter. For visible light with a wavelength of 550 nm,
The light transmittance of this conductive resin sheet was 50%, and the conductive resin sheet was transparent. The surface resistance value of this conductive resin sheet was 10 ³ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor. This conductive resin sheet was embossed in the same manner as in Example 1 to obtain a bottom material of the conductive chip carrier tape. The surface resistance value between adjacent bottom portions was 10 ⁴ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor.

Comparative Example 1 Acrylonitrile / acrylic rubber / styrene resin (Vitax VW8700-N, manufactured by Hitachi Chemical Co., Ltd.)
15 g of expanded graphite (specific gravity: 1.95, porosity: 69.3%) was added to 300 g of the pellets, extruded three times at a temperature of 220 ° C., and mixed well. During the mixing operation, the expanded graphite scattered around and significantly contaminated the working environment. The extruded strand was cut with a chopper to obtain an expanded graphite dispersed resin bellet. This was extruded at a temperature of 220 ° C.
A resin sheet having a thickness of mm was obtained. In the case of visible light having a wavelength of 550 nm, the light transmittance of this resin sheet was 0%, and the resin sheet had no transparency. The surface resistance value of this sheet was as large as 10 ⁷ Ω / □ to 10 ¹¹ Ω / □. This resin sheet was embossed in the same manner as in Example 1 to obtain a bottom material of the chip carrier tape. The surface resistance between adjacent bottoms was 10 ¹⁴ Ω / □, which was insufficient for preventing electrostatic breakdown of the semiconductor.

Comparative Example 2 Transparent polystyrene resin sheet (Electrical Chemical Industry Co., Ltd.)
Made, clearen sheet CST2401, thickness 0.3m
m), a carbon conductive paint (Chemitite CT200 manufactured by Toshiba Chemical Co., Ltd.) diluted three times with ethanol was quickly spread to a thickness of about 1 μm using a baker film applicator. This resin sheet was dried on a hot plate at 80 ° C. for 1 hour. The weight of the coating film after drying was 10 μg per square centimeter. The same operation was performed on the other surface of the resin sheet, and coating films were provided on both surfaces of the resin sheet. The resin sheet was dried with a hot air dryer at 80 ° C. for 1 hour to obtain a conductive resin sheet having a carbon layer. In the case of visible light having a wavelength of 550 nm, the light transmittance of this sheet was 10%, and the sheet had low transparency. The surface resistance value of this conductive resin sheet is 10 ⁵ Ω / □
This is a value sufficient to prevent electrostatic breakdown of the semiconductor. This conductive resin sheet was cut into a width of 24 mm, and subjected to embossing with pockets having a length of 13 mm, a width of 13 mm, and a depth of 4.9 mm at intervals of 3 mm by hot plate molding to obtain a bottom material of the chip carrier tape. The surface resistance between adjacent bottoms was 10 ¹³ Ω / □, which was insufficient to prevent electrostatic breakdown of the semiconductor.

Comparative Example 3 Transparent polystyrene resin sheet (Electrical Chemical Industry Co., Ltd.)
Made, clearen sheet CST2401, thickness 0.3m
m), a tin-antimony transparent antistatic paint (TEPW-20 manufactured by Mitsubishi Metals Corporation) was quickly spread to a thickness of about 1 μm using a baker film applicator. This resin sheet was dried on a hot plate at 80 ° C. for 1 hour. . The weight of the coating film after drying was 30 μg per square centimeter, and the same operation was performed on the other surface of the resin sheet to provide the coating film on both surfaces of the resin sheet. The resin sheet was dried with a hot air dryer at 80 ° C. for 1 hour to obtain a conductive resin sheet having a tin-antimony layer. In the case of visible light having a wavelength of 550 nm, the light transmittance of this resin sheet was 60%, and a transparent conductive resin sheet was obtained. The surface resistance value of this conductive resin sheet is 10 ⁹ Ω
/ □, a value that can prevent electrostatic breakdown of the semiconductor. This conductive resin sheet was cut into a width of 24 mm, and embossed by hot plate molding with pockets having a length of 13 mm, a width of 13 mm and a depth of 4.9 mm at an interval of 3 mm to obtain a bottom material of a chip carrier tape. The surface resistance between adjacent bottoms was 10 ¹³ Ω / □, which was insufficient to prevent electrostatic breakdown of the semiconductor.

Example 6 Polyethylene terephthalate resin sheet (diafoil # 25 manufactured by Diafoil Hoechst Co., Ltd., thickness 25 μm)
m), a polyethyleneimine solution (P-100 manufactured by Nippon Shokubai Kagaku Co., Ltd.) was applied as an anchor coating agent on one side. Low-density polyethylene (Mitsui Petrochemical Co., Ltd.)
Mirason 16-P) was extruded and laminated to a thickness of 20 μm to obtain a laminated resin sheet. A conductive resin sheet having a polyaniline composite layer on both surfaces was obtained in the same manner as in Example 1 except that this laminated resin sheet was used. The weight of the coating film after drying one side was 1 μg per square centimeter. The surface resistance value of the conductive resin sheet is 1
0 ⁴ Ω / □ and has become a value sufficient for preventing the semiconductor electrostatic breakdown. In the case of visible light having a wavelength of 550 mm, the light transmittance of this conductive resin sheet was 67%, and the conductive resin sheet was transparent. 90 parts by weight of a polyester resin (byron manufactured by Toyobo Co., Ltd., glass transition temperature: 50 ° C.) and a vinyl chloride-vinyl acetate copolymer resin (vinylite VAGH manufactured by Union Carbide Co.) were placed on the low-density polyethylene side of the obtained conductive resin sheet. 2) A heat sealant layer having a thickness of 2 μm and consisting of 10 parts by weight was formed by a gravure reverse method. Next, the polyaniline solution 1 synthesized in Synthesis Example 2 was mixed with 7 parts by weight of dodecylbenzenesulfonic acid,
It was diluted 5-fold (by weight) with a diluent consisting of 93 parts by weight of toluene. The diluted polyaniline solution was applied on the heat sealant layer side of the conductive resin sheet to a thickness of 3 μm using a Baker-Film applicator, and dried at room temperature to obtain a conductive heat seal tape. The surface resistance of the tape on the polyethylene terephthalate resin layer side is 1
0 ⁴ Ω / □, the surface resistance value of the heat seal layer side is 10 ⁸ Ω /
□ and a value sufficient to prevent electrostatic breakdown of the semiconductor. In the case of visible light having a wavelength of 550 mm, the light transmittance of this conductive heat seal tape was 65%, and the conductive heat seal tape was transparent.

Example 7 A laminated resin sheet having a polyaniline composite layer on one surface was prepared in the same manner as in Example 6, except that the polyaniline solution was applied only on the polyethylene terephthalate resin side.

Ethylene-vinyl acetate copolymer hot
Adhesive (EVA Tex 8 manufactured by Denki Kagaku Kogyo Co., Ltd.)
1) Polyaniline solution synthesized in Synthesis Example 2 in 10 parts by weight
Add 90 parts by weight of 1 and stir well while heating to 70 ° C.
Dissolved. This solution is applied to the low-density polymer
Coat the chilled side with a baker film applicator.
Cloth and dried at room temperature to form a heat seal layer having a thickness of 2 μm.
Thus, a conductive heat seal tape was obtained. Tape poly
The surface resistance of the ethylene terephthalate resin side is 10 ^FourΩ /
□, surface resistance of heat seal layer side is 10⁷Ω / □
The deviation plane is also a value sufficient to prevent electrostatic breakdown of the semiconductor.
became. In the case of visible light having a wavelength of 550 nm,
The light transmittance of Toseal tape is 54%,
It became a conductive heat seal tape.

Example 8 Polyethylene terephthalate resin sheet (diafoil # 25 manufactured by Diafoil Hoechst Co., Ltd., 25 μm thick)
A conductive resin sheet having a polyaniline composite layer was obtained in the same manner as in Practical Example 1, except for using. The weight of the coating film after drying one side is 1 μg per square centimeter.
Met. In the case of visible light having a wavelength of 550 nm, the light transmittance of the conductive resin sheet after both-side coating was 70%, and a transparent conductive resin sheet was obtained. The surface resistance value of this conductive resin sheet was 10 ⁴ Ω / □, which was a value sufficient to prevent electrostatic breakdown of the semiconductor. The pressure-sensitive adhesive composition solution prepared in Synthesis Example 7 was applied to one surface of a conductive resin sheet using a baker film applicator so that the thickness after drying was 10 μm, and was applied at 120 ° C. for 1 hour using an explosion-proof dryer. Dried. Next, the polyaniline solution 1 synthesized in Synthesis Example 2 was diluted 5-fold (weight ratio) with a diluent comprising 7 parts by weight of dodecylbenzenesulfonic acid and 93 parts by weight of toluene. The diluted polyaniline solution was applied on the adhesive layer side of the conductive resin sheet to a thickness of 3 μm using a baker film applicator, and then dried at room temperature to obtain a conductive adhesive film. The surface resistance of the conductive adhesive film on the polyethylene terephthalate resin layer side is 10 ⁴ Ω / □, and the surface resistance value on the adhesive layer side is 10 ⁸ Ω / □, a value sufficient to prevent electrostatic breakdown of semiconductors. It became. With visible light having a wavelength of 550 nm, the light transmittance of this conductive pressure-sensitive adhesive film was 65%, and a conductive pressure-sensitive adhesive film having transparency was obtained.

Example 9 A polyaniline composite was produced in the same manner as in Example 7 except that a polyvinylidene chloride-coated polyethylene terephthalate resin sheet (thickness: 100 μm) was used instead of the polyethylene terephthalate resin sheet (the heat-sealing layer side was a polyethylene terephthalate resin). A conductive heat seal tape having a layer and having heat sealability was obtained. The surface resistance of the conductive heat seal tape on the polyvinylidene chloride resin side is 10 ⁴ Ω / □, and the surface resistance on the heat seal layer side is 1
0 ⁷ Ω / □, all the values were sufficient to prevent electrostatic breakdown of the semiconductor. For visible light with a wavelength of 550 nm,
The light transmittance of this conductive heat seal tape was 50%, and it became a transparent conductive heat seal tape. This conductive heat seal tape is folded in two with the heat seal layer side inside, and the end perpendicular to the folded part is pressure-bonded with a heat sealer to provide an excellent antistatic ability and a transparent semiconductor housing. A conductive bag suitable for was obtained.

Comparative Example 4 Polyethylene terephthalate resin sheet (diafoil # 25 manufactured by Diafoil Hoechst Co., Ltd., thickness 25 μm)
m), a polyethyleneimine solution (P-100 manufactured by Nippon Shokukan Chemical Co., Ltd.) was applied as an anchor coating agent on one side. Low-density polyethylene (Mitsui Petrochemical Co., Ltd.)
90 parts by weight of Mirason 16-P), expanded graphite (specific gravity: 1.
95, porosity 69.3%)
It was extruded and laminated to a thickness of 0 μm to obtain a laminated resin sheet. When the expanded graphite was mixed with the low-density polyethylene, the expanded graphite scattered around and significantly contaminated the working environment. 90 parts by weight of a polyester resin (pylon manufactured by Toyobo Co., Ltd., glass transition temperature: 50 ° C.) and a vinyl chloride-vinyl acetate copolymer resin (vinylite VAGH manufactured by Union Carbide Co.) 1 on the low density polyethylene side of the laminated resin sheet
0 parts by weight, expanded graphite (specific gravity 1.95, porosity 69.3)
%) A heat sealant layer having a thickness of 2 μm and consisting of 10 parts by weight was formed by a gravure reverse method to obtain a conductive heat seal tape. The surface resistance of the heat-sealing layer side of this conductive heat-sealing tape is 10 ⁵ Ω / □ to 1
And 0 ⁹ Ω / □, while the variation is large, becomes a value sufficient for preventing the semiconductor electrostatic breakdown. Wavelength 550nm
With visible light, the light transmittance of this conductive heat seal tape was 4%, and the conductive heat seal tape had no transparency. In addition, this conductive heat seal tape had poor heat sealability due to a large amount of carbon.

[0093]

The conductive resin sheet of the present invention has a conductivity suitable for use in antistatic applications. In addition, problems that occur in the conventional method, such as a decrease in antistatic ability at low humidity and contamination of the working environment, can be solved. In addition, if a transparent resin sheet is used, it is possible to impart transparency to the conductive resin sheet after having appropriate conductivity for use in antistatic applications.

Further, according to the present invention, a conductive sheet having a higher conductivity can be obtained, so that a conductive resin sheet having a conductivity suitable for use in antistatic applications with a smaller coating amount can be obtained. Further, even if a resin sheet having lower transparency is used, the transparency can be maintained.

When a resin sheet having excellent transparency is used, a conductive resin sheet having extremely excellent transparency can be obtained.

Further, according to the present invention, by using the conductive resin sheet of the present invention as a raw material, the base material of the conductive chip carrier tape exhibiting the effect of the conductive resin sheet of the present invention, the conductive heat seal A tape, a conductive adhesive film and a conductive bag are obtained.

Claims (9)

[Claims] 1. A conductive material comprising a dopant which is a protic acid, an organic solvent having a nonpolar or low polarity and polyaniline, wherein the polyaniline forms a complex with a dopant which is a protic acid and is soluble in a nonpolar or low polarity solvent. A conductive resin sheet obtained by applying a conductive polyaniline composition to the surface of a resin sheet and then drying. 2. The method according to claim 1, wherein the protonic acid is sulfonic acid.
The conductive resin sheet according to the above. 3. The conductive resin sheet according to claim 2, wherein the protonic acid is camphorsulfonic acid. 4. The conductive resin sheet according to claim 2, wherein the protonic acid is dodecylbenzenesulfonic acid. 5. The conductive resin sheet according to claim 1, wherein the resin sheet is a see-through synthetic resin sheet. 6. A conductive chip carrier tape bottom material comprising the conductive resin sheet according to claim 1, which is embossed. 7. The method according to claim 1, further comprising a heat seal layer.
A conductive heat seal tape comprising the conductive resin sheet according to any one of the above. 8. A conductive pressure-sensitive adhesive film comprising the conductive resin sheet according to claim 1, which has a pressure-sensitive adhesive layer. 9. A conductive bag comprising the conductive resin sheet according to claim 1 in the form of a bag.