KR20160114602A - Cover tape for electronic parts packaging - Google Patents

Abstract

It can be stably stored even when it is stored for a long period of time in a high temperature and high humidity environment at a temperature of 40 DEG C and a humidity of 90% at a temperature of 60 DEG C in a rolled state and can stably maintain an antistatic property, Provided is a cover tape for packaging electronic parts which can suppress the occurrence of charging due to friction on the surface of the layer opposite to the surface of the layer. The cover tape for packaging electronic parts includes a base layer, a sealant layer provided on one side of the base layer, and a conductive polymer layer provided on the other side of the base layer.

Description

[0001] COVER TAPE FOR ELECTRONIC PARTS PACKAGING [0002]

The present invention relates to a cover tape for packaging electronic parts.

The present application claims priority based on Japanese Patent Application No. 2014-013989 filed on January 29, 2014, and Japanese Patent Application No. 2014-198471 filed on September 29, 2014, the content of which is hereby incorporated by reference herein .

Background Art [0002] In recent years, surface mounting of electronic components has progressed greatly, and surface mount technology has progressed greatly, and chip-type electronic parts with higher performance and smaller size have been developed and their demands are increasing rapidly. A carrier tape is used as one of the packaging forms. Such electronic parts are housed in the respective pockets of these carrier tapes and sealed with cover tape as a cover.

The cover tape is usually kept in a rolled state until it is used for a carrier tape. While being kept in a wound state, the front and back surfaces of the cover tape are in contact with each other. As a result, the front and back surfaces of the cover tape become similarly adhered or in close contact with each other, and blocking may occur.

The blocking refers to the fact that, when the cover tape stored in the wound state was released by the manufacturing process or the taping packing machine, the top and bottom surfaces of the cover tape stored in the wound state contacted while being stored, State that can not be solved at all or can not be solved reliably.

In view of this, a large number of cover tapes, which have not been blocked in the past, have been developed.

For example, a method of adding an anti-blocking agent to a sealant (Patent Document 1), a method of adding an antistatic agent to an adhesive (Patent Document 2), and a method of using a sealant having a glass transition temperature of 40 캜 or higher (Patent Document 3); a method in which an ethylene-acetic acid vinyl copolymer resin, a fatty acid amide type antiblocking agent and a particle shape antiblocking agent are contained in a heat seal layer (Patent Document 4); a method in which a thermoplastic resin and a thermoplastic resin (Patent Document 5), a method in which an antistatic anti-blocking layer is laminated (Patent Document 6), a method in which a contact preventive layer is formed on a heat sealant layer by gravure And a method of providing the pattern as a stripe pattern by a printing method (Patent Document 7).

The cover tape has at least a base layer (base material layer) and a sealant layer. In the conventional methods such as the methods of Patent Documents 1 to 7, blocking preventive agents are contained in the sealant layer or blocking agents are added to the surface of the sealant layer A method of providing an anti-blocking layer is used. However, it is the present situation that a sufficient anti-blocking measure can not be attained only by the improvement of the sealant layer.

Further, the cover tape may be conveyed in a wound state by a ship, a truck or the like, and may be stored for a long period of time at a high temperature of about 60 DEG C during this conveyance period. When exposed under such a storage environment, the cover tape tends to cause blocking, which causes troubles.

Further, in countries such as Southeast Asia, a cover tape in a rolled state may be stored for a long time under a high temperature and high humidity environment. When exposed under such an environment, the cover tape in the wound state tends to cause blocking, which causes troubles.

However, the conventional anti-blocking methods such as Patent Documents 1 to 7 do not assume the case where the cover tape in a rolled state is stored for a long time at a high temperature of about 60 DEG C or for a long period of time under a high temperature and high humidity environment, There is a problem that blocking is frequently caused when a cover tape in a rolled state is transported or stored for a long time in a high temperature and high humidity region.

When the cover tape in the wound state is stored for a long time under a high temperature and high humidity environment, the antistatic performance of the surface of the base layer of the cover tape deteriorates and environmental dust (environmentally existing dust) The electronic parts enclosed in the respective pockets and sealed by the cover tape may be destroyed.

As a conventional antistatic method, a method in which a surface active agent having antistatic function is applied to a base layer or a surface active agent is coated on the surface of a base layer is generally known (Patent Document 8).

However, the surfactant has a low antistatic property under low humidity, and the surfactant is water-soluble, so that the water resistance is low. Particularly, when the tape is used for a carrier tape for housing small electronic parts, the cover tape tends to be peeled off when the cover tape is left to adhere after storing the electronic parts.

In view of this, recently, as a conductive packaging material for antistatic treatment of the surface of a base layer instead of a surfactant, a conductive polymer layer (a) and a carbon nanotube (c) (Patent Document 9). Patent Document 9 may contain PET (polyethylene terephthalate) sheet as the base layer, polyethylene dioxythiophene polystyrene sulfate as the conductive polymer, and colloidal silica (h) as the conductive layer. A surface resistance value of 10 ¹ to 10 ¹² Ω / square at a relative humidity of 15%, a conductive packaging material having a visible light transmittance of 80% or more, a material which can be used as a cover tape for packaging electronic parts, .

Also disclosed is a composition for a conductive coating which can be used as a cover tape for packaging electronic components, has a high transparency, and is capable of forming a conductive coating film with a small change in resistance over time even when exposed to air. As the conductive coating composition, a water soluble or water dispersible π conjugated conductive polymer And a water-soluble antioxidant and water have been developed (Patent Document 10). In the example of Patent Document 10, a composition for conductive coating in which a water dispersion of a composite of poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid as a water dispersible π conjugated conductive polymer is applied to a PET film have.

However, when the conductive layer of Patent Document 9 or the composition for conductive coating of Patent Document 10 is applied to the base layer, the adhesiveness of the conductive layer or the composition for the conductive coating is insufficient and the followability of the coating film to the base layer is low As the process of making the cover tape progresses, there is a problem that the coating film is broken and the conductivity is abruptly inhibited. In addition, in the cover tapes of Patent Document 9 and Patent Document 10, an environment is not supposed to be stored in a high temperature and high humidity environment at a temperature of 40 DEG C and a humidity of about 90%. Under such circumstances, in the conventional cover tape, There is a problem that the prevention performance is largely lowered.

In addition, with the recent miniaturization of electronic devices, miniaturization and lightweighting of electronic components to be mounted are progressing drastically. As a result, the electronic parts adhere to the cover tape due to the charging caused by the friction between the cover tape and the electronic part during transportation and the charging that occurs when the cover tape is peeled off, Is becoming a problem.

In such a situation, a technique relating to a cover tape for packaging electronic parts that can prevent troubles caused by static electricity has been proposed.

For example, Patent Document 11 discloses that a sealant layer is provided on a base layer and a sealant layer is formed of a polyolefin-based resin and a polyether / polyolefin copolymer in order to suppress the charge generated during peeling from the carrier tape A cover tape is disclosed which is characterized in that it includes a cover tape.

Patent Document 12 discloses that the surface resistance value of the surface of the sealant layer is in the range of 10 ⁴ to 10 ¹² Ω / □ (23 ° C. to 15% RH) in order to suppress the charging caused by the friction between the cover tape and the electronic component Environment), and the like is disclosed

Japanese Laid-Open Patent Publication No. 2012-188509 Japanese Laid-Open Patent Publication No. 2009-035645 Japanese Patent Application Laid-Open No. 2001-106256 Japanese Laid-Open Patent Publication No. 2001-315847 Japanese Patent Application Laid-Open No. 2004-262548 Japanese Patent Application Laid-Open No. 2004-051105 Japanese Laid-Open Patent Publication No. 2004-001876 Japanese Patent Application Laid-Open No. 63-105061 Japanese Patent Application Laid-Open No. 2005-081766 Japanese Laid-Open Patent Publication No. 2010-196022 Japanese Laid-Open Patent Publication No. 2012-214252 Japanese Laid-Open Patent Publication No. 2012-30897

Although the first embodiment of the present invention is a high temperature environment of 60 占 폚 in a rolled state, it can be stably stored even after storage for a long period of time in a high temperature and high humidity environment at a temperature of 40 占 폚 and a humidity of about 90% A cover tape which can be stably held can be provided.

The technique disclosed in Patent Document 11 is a technique for suppressing the charging that occurs when the cover tape is peeled off from the carrier tape. The technique disclosed in Patent Document 12 is a technique for preventing the friction between the cover tape and the electronic component This is a technique for suppressing the charging caused by the charging.

In other words, the techniques disclosed in Patent Documents 11 and 12 only focus on the surface of the sealant layer in the surface of the cover tape.

However, as electronic components become smaller and lighter, there is a possibility that some static electricity may cause a process trouble, so that importance of countermeasures against static electricity of the cover tape is increasing day by day. Therefore, it is necessary to review the situation in which a charging that has not been a problem so far occurs, and to suppress the occurrence of charging as much as possible.

For example, when the carrier tape sealed by the cover tape is transported in a state wound on the reel, the bottom surface of the carrier tape and the surface of the cover tape (the surface opposite to the surface of the sealant layer) It is necessary to suppress the occurrence of charging due to such friction.

That is, in addition to the surface of the sealant layer, measures against static electricity have also been required for the surface opposite to the surface of the sealant layer, which has not been examined so far.

Therefore, a second aspect of the present invention is to provide a cover tape for packaging electronic parts, which can suppress the occurrence of charging due to friction on the surface opposite to the surface of the sealant layer.

Means for Solving the Problems The present inventors have studied extensively in order to solve the above problems. As a result, the cover tape for packaging electronic parts includes at least a base layer and a sealant layer. The base layer has a light transmittance of 85% or more and a relative humidity of 12% or more and 50% or less And the surface layer of the base layer is a biaxially stretched film having a surface resistance value of 1 x 10 < ⁹ > / & squ & or less and containing at least one or more selected from polyester, polypropylene or nylon, It has been found that a cover tape for packaging electronic parts having a conductive polymer layer can solve all of the above problems. The first embodiment of the present invention has been further studied based on these findings and has been completed.

That is, the first embodiment of the present invention includes the following aspects.

[1] A cover tape for packaging electronic components, comprising at least a base layer and a sealant layer, wherein the base layer has a light transmittance of 85% or more and a relative humidity of 12% Wherein the electronic component packaging tape has a surface resistance value of 1 x 10 < ⁹ > OMEGA / & squ & or less.

[2] The electronic device according to [1], wherein the substrate layer is a biaxially stretched film containing at least one kind selected from polyester, polypropylene, or nylon, and the surface of the base layer comprises a conductive polymer layer Cover tape for packing parts.

[3] The cover tape for packaging electronic parts according to [1] or [2], wherein the conductive polymer layer contains poly (3,4-ethylene dioxythiophene).

[4] The cover tape for packaging electronic parts according to [3], wherein the conductive polymer layer further contains polystyrene sulfonic acid.

[5] The sealant according to any one of [1] to [5], wherein the sealant layer has a surface resistance of less than 1 x 10 < ¹¹ > 4]. ≪ / RTI >

[6] The cover tape for packaging electronic parts according to any one of [1] to [5], wherein the conductive polymer layer contains silica particles.

The above problem of the second embodiment of the present invention is achieved by the second embodiment of the present invention described in (7) to (13) below.

(7) A magnetic sensor comprising a base layer, a sealant layer provided on one side of the base layer, and a conductive polymer layer provided on the other side of the base layer, And a voltage of -2200 to 2200V.

(8) The cover tape for electronic part packaging according to (7), wherein the friction voltage on the surface of the conductive polymer layer is from -800 to 800 V.

(9) The electroconductive polymer layer according to any one of the above items (1) to (3), wherein the conductive polymer layer is composed of a positive compound positioned on the positive side in the charging column of the conductive polymer layer, The cover tape for packaging electronic parts according to (7) or (8) above, which comprises a negative compound positioned on the negative side in heat.

(10) The cover tape for electronic part packaging according to any one of (7) to (9), wherein the conductive polymer layer comprises an ester compound.

(11) The cover tape for packaging electronic parts according to any one of (7) to (10), wherein the conductive polymer layer comprises at least one of an aziridinyl compound and a ring-opening compound thereof.

12, the base layer provided with the conductive polymer layer, the surface resistance value in under the environment of temperature 25 ℃, humidity of 12 ~ 65% RH 1 × 10 11 Ω / □ or less the characteristics as above-mentioned (7) to which The electronic part packing cover tape according to any one of the above (11).

(13) The cover tape for packaging electronic parts according to any one of (7) to (12), wherein the base layer has a total light transmittance of 85% or more.

The above-described problems of the first and second embodiments of the present invention can be achieved at the same time by the following third embodiment of the present invention (14) to (15).

(14) A cover tape for packaging electronic components, characterized by comprising a base layer, a sealant layer provided on one side of the base layer, and a conductive polymer layer provided on the other side of the base layer, (1) to (13), wherein the electroconductive polymer layer contains at least one of an aziridinyl compound and a ring-opening compound thereof and poly (3,4-ethylenedioxythiophene) Cover tape for packing parts.

(15) The cover tape for electronic parts packaging according to (14), wherein the conductive polymer layer further contains polystyrene sulfonic acid.

The cover tape for packing electronic parts according to the first embodiment of the present invention is a high temperature environment of 60 占 폚 in a rolled state but does not cause blocking even after being stored for a long period of time in a high temperature and high humidity environment at a temperature of 40 占 폚 and a humidity of about 90% And the antistatic performance can be stably maintained.

According to the cover tape for packaging electronic parts of the second embodiment of the present invention, it is possible to suppress the occurrence of charging due to friction on the surface of the conductive polymer layer, that is, the surface opposite to the surface of the sealant layer.

According to the cover tape for packaging electronic parts of the third embodiment of the present invention, the effects of the first embodiment of the present invention and the second embodiment of the present invention can be simultaneously exhibited.

1 is a schematic perspective view showing an example of a state in which a cover tape for packaging electronic parts according to a second embodiment of the present invention is sealed to a carrier tape.
2 is a schematic cross-sectional view showing an example of a cover tape for packaging electronic parts according to a second embodiment of the present invention.
3 is a schematic perspective view for explaining a method of measuring the frictional electrification voltage of the electronic part packing cover tape according to the thirteenth embodiment.

First Embodiment

The cover tape for packaging electronic parts according to the first embodiment of the present invention (hereinafter occasionally referred to simply as cover tape) comprises at least a base layer and a sealant layer, wherein the base layer has a light transmittance of 85% , And has a surface resistance value of 1 x 10 ⁹ ? /? Or less over a relative humidity of 12% or more and 50% or less under a temperature environment of 25 占 폚.

A cover tape according to a first embodiment of the present invention includes at least a base layer and a heat seal layer.

As the base layer, films having various materials appropriately processed depending on the application can be used, provided that the base layer has mechanical strength capable of withstanding an external force applied to tape processing, heat sealing to carrier tape, and heat resistance to withstand heat sealing. Specific examples thereof include polyethylene terephthalate, polystyrene terephthalate, polyethylene naphthalate, nylon 6, nylon 66, polypropylene, polymethylpentene, polyvinyl chloride, polyacrylate, polymethacrylate, polyimide, Polyesters, polyethersulfone, polyphenylene ether, polycarbonate, ABS resin, and the like can be given as an example of the base layer film material.

In the first embodiment of the present invention, the base layer is preferably a biaxially stretched film containing at least one selected from polyester, polypropylene, and nylon, more preferably a biaxially stretched film containing a polyester , And a biaxially stretched polyethylene terephthalate film (hereinafter sometimes referred to as an O-PET film) are particularly preferable.

The base layer needs to have a light transmittance of 85% or more. When the light transmittance of the substrate layer is 85% or more, the transparency of the cover tape can be maintained, and thus the identification and inspection of the electronic parts by the sensor and the like can be performed. When the light transmittance is less than 85%, the transparency of the cover tape is lowered, and the electronic parts can not be identified or inspected by a sensor or the like in some cases.

It is preferable that the surface of the base layer has a conductive polymer layer. In this case, according to the first embodiment of the present invention, the base layer provided with the conductive polymer layer can stably have a density of 1 x 10 < ⁹ > / Lt; / RTI > or less. Further, by providing the conductive polymer layer on the surface of the substrate layer, the cover tape of the first embodiment of the present invention can be prevented from being blocked even if it is stored for a long period of time for 30 days or more under a high temperature environment of 60 占 폚 in a wound state, It is possible to stably maintain the antistatic performance even when stored for a long period of time for 30 days or more under a high temperature and high humidity environment of 40 占 폚 and a humidity of about 90%.

The conductive polymer layer used in the first embodiment of the present invention contains at least a solubilized polymer having a conductive polymer and an anionic group.

The conductive polymer is not particularly limited, but a π conjugated conductive polymer is preferable because it has excellent transparency, low volume resistivity, and exhibits an excellent antistatic function by the addition of a small amount.

The π conjugated system conductive polymer is not particularly limited as long as it is an organic polymer having a main chain of π conjugated system, and examples thereof include polypyrrole, polythiophene, polyacetylene, polyphenylene, polyphenylene vinylene, polyaniline Polyesters, polythiophene vinylenes, and copolymers of these. In view of stability in air, polypyrrole, polythiophene and polyaniline are preferable.

Specific examples of the π-conjugated conductive polymer include polypyrrole, poly (N-methylpyrrole), poly (3-methylpyrrole), poly (3-ethylpyrrole) Poly (3,4-dimethylpyrrole), poly (3,4-dibutylpyrrole), poly (3,4-dibutylpyrrole) (3-methyl-4-carboxypyrrole), poly (3-methyl-4-carboxypyrrole) Poly (3-methoxypyrrole), poly (3-ethoxypyrrole), poly (3-butoxypyrrole) (3-methylthiophene), poly (3-methylthiophene), poly (3-methylthiophene) (3-heptylthiophene), poly (3-octylthiophene), poly (3-decylthiophene), poly Bromothiophene), Poly (3-chlorothiophene), poly (3-iodothiophene), poly (3-cyanothiophene) (3-methoxythiophene), poly (3-ethoxythiophene), poly (3-butoxythiophene), poly ), Poly (3-hexyloxythiophene), poly (3-heptyloxythiophene), poly (3-octyloxythiophene) (3-methyl-4-methoxythiophene), poly (3,4-ethylenedioxythiophene), poly (3-methyl-4-carboxythiophene), poly (3-methyl-4-carboxythiophene) Poly (3-isopropylaniline), poly (2-aniline sulfonic acid), poly (3- Rinseol acid) and the like.

The solubilized polymer having an anionic group is used for solubilizing the? -Conjugated conductive polymer. The solubilized polymer having an anionic group is coordinated to an? -Conjugated conductive polymer via an anionic group. As a result, the? -Conjugated conductive polymer and the solubilized polymer having an anionic group form a complex to function as a dopant for the? -Conjugated conductive polymer .

The solubilized polymer having an anionic group (hereinafter sometimes referred to as a polyanion) has a constitutional unit having at least an anionic group. The anionic group of the polyanion functions as a dopant for the pi conjugated system conductive polymer and improves the conductivity and heat resistance of the pi conjugated system conductive polymer.

Specific examples of the polyanion include polyvinylsulfonic acid, polystyrenesulfonic acid, polyallylsulfonic acid, polyacrylosulfonic acid, polymethacrylosulfonic acid, poly (2-acrylamido-2-methylpropanesulfonic acid), polyisoprene (2-acrylamido-2-methylpropane carboxylic acid), polyisoprenecarboxylic acid, polyacrylic acid, and the like can be given as examples of the polyacrylic acid, polyacrylic acid, sulfonic acid, polyvinylcarboxylic acid, polystyrenecarboxylic acid, polyallylcarboxylic acid, polyacrylic carboxylic acid, polymethacrylic carboxylic acid . These may be homopolymers or copolymers of two or more.

Among these, polystyrene sulfonic acid, polyacryl sulfonic acid, and polymethacryl sulfonic acid are preferable, and polystyrene sulfonic acid is particularly preferable. Polystyrenesulfonic acid, polyacrylic sulfonic acid and polymethacryl sulfonic acid are excellent in heat resistance and environmental resistance because they absorb heat energy and decompose by themselves to alleviate pyrolysis of the? -Conjugated conductive polymer component. In addition, compatibility with a binder added to the conductive polymer layer and dispersibility are excellent, if necessary.

Of these conductive polymers, poly (3,4-ethylenedioxythiophene) is preferable from the viewpoints of conductivity and heat resistance, and it is preferable to prevent adhesion of cover tapes under a high temperature (60 ° C) environment and to prevent (3,4-ethylenedioxythiophene) / polystyrenesulfonic acid complex (so-called PEDOT / PSS) is more preferable from the viewpoint of maintaining the antistatic performance of the poly (3,4-ethylenedioxythiophene) / polystyrene sulfonic acid. The reason why PEDOT / PSS exerts particularly excellent adhesion preventing effect is presumed is as follows. That is, since the conductive polymer layer containing PEDOT / PSS is presumed to have a low surface energy, it is difficult for the substance to adhere to the surface of the conductive polymer layer, and the binder used in PEDOT / PSS is generally Is a thermosetting resin, and since the thermosetting resin is not softened by heat after curing and is excellent in weather resistance, it can be considered that the cover tape is hardly deteriorated and adhered.

The amount of the solubilized polymer having an anionic group is preferably in the range of 0.1 to 10 moles, more preferably in the range of 1 to 7 moles per 1 mole of the pi conjugated system conductive polymer. If the amount of the solubilized polymer is less than 0.1 mol per 1 mol of the? -conjugated conductive polymer, the doping effect with respect to the? -conjugated conductive polymer tends to become weak, and the conductivity may become insufficient. When the amount of the solubilized polymer relative to 1 mole of the? -Conjugated conductive polymer is more than 10 moles, the content ratio of the? -Conjugated conductive polymer is decreased, so that sufficient conductivity is hardly obtained.

The conductive polymer layer used in the first embodiment of the present invention may contain various additives in addition to the solubilized polymer having a conductive polymer and an anion group. Examples of other additives include polymers having a binder function, antistatic agents, polymers having electron attracting groups, inorganic fillers, organic fillers, and other additives. It is preferable that silica particles are contained.

The conductive polymer layer used in the first embodiment of the present invention is applied to the surface of the substrate layer as a conductive polymer solution by dissolving the conductive polymer, the solubilized polymer having an anion group, and other additives in a solvent.

Examples of the solvent include water, methanol, ethanol, isopropanol, butanol, propylene carbonate, N-methylpyrrolidone, dimethylformamide, dimethylacetamide, cyclohexanone, acetone, methyl ethyl ketone, methyl isobutyl ketone, Toluene, ethyl acetate, and butyl acetate. One solvent may be used alone, or two or more solvents may be used.

Examples of the application method of the conductive polymer solution include a gravure coat, a comma coat, a roll coat, and the like. After the conductive polymer solution is applied, it can be dried according to a known drying method.

The thickness of the conductive polymer layer is preferably 0.020 to 2.0 mu m. When the thickness is within this range, the light transmittance of the substrate layer can be stably set to 85% or more while the conductive polymer layer forms a network of conductivities. The thickness of the conductive polymer layer is more preferably 0.020 to 1.0 占 퐉, and particularly preferably 0.020 to 0.5 占 퐉. When the thickness of the conductive polymer layer is thinner than 0.020 탆, the conductive polymer layer tends to peel off. When the thickness exceeds 2.0 탆, the light transmittance of the base layer may be lower than 85%.

In the first embodiment of the present invention, the sealant layer is not particularly limited as long as it is conventionally known. Preferably has a surface resistance value of less than 1 x 10 < ¹¹ > OMEGA / & squ & over a relative humidity of 12% or more and 50% or less under a temperature environment of 25 DEG C.

Second Embodiment

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, an embodiment for carrying out a cover tape for packaging electronic parts according to a second embodiment of the present invention (hereinafter referred to as "cover tape " as appropriate) will be described with reference to the drawings.

"Cover tape for electronic parts packaging"

First, the configuration of the cover tape according to the second embodiment of the present invention will be described with reference to Figs. 1 and 2. Fig.

As shown in Fig. 1, the cover tape 10 is used as a lid of a carrier tape 20 in which recessed pockets 21 are continuously provided to match the shape of an electronic component.

Specifically, the cover tape 10 is sealed (for example, heat sealed) on the surface of the carrier tape 20, thereby sealing the opening of the pocket 21 of the carrier tape 20. As a result, the electronic parts housed in the pockets 21 of the carrier tape 20 can be protected from being dropped or mixed with foreign matter during transportation.

Further, the cover tape 10 integrally with the carrier tape 20 constitutes a package 100 for electronic parts. The bottom surface 20a of the carrier tape 20 and the surface 10a of the cover tape 10 come into contact (friction) when the package body 100 is transported while being wound around the reel.

2, the cover tape 10 includes a base layer 1, a sealant layer 2 provided on one side of the base layer 1, and a sealant layer 2 on the other side of the base layer 1 And a conductive polymer layer (3) provided on the substrate.

The thickness of the entire cover tape 10 is preferably 20 to 100 mu m, more preferably 40 to 60 mu m. It is possible to avoid a situation in which the cover tape 10 is twisted when the cover tape 10 is sealed to the carrier tape 20 because the thickness of the entire cover tape 10 is within the predetermined range, It is possible to improve the property.

Next, each layer constituting the cover tape 10 will be described.

<Base layer>

The base layer (1) is a main layer constituting the cover tape (10). The base layer 1 is excellent in mechanical strength that can withstand an external force applied to the carrier tape 20 when the cover tape 10 is heat sealed and when used for the carrier tape 20, If heat resistance is available, a film processed with various materials can be used.

(Base layer: total light transmittance)

The base layer 1 preferably has a total light transmittance of 85% or more, more preferably 90% or more.

The total light transmittance of the base layer 1 is not less than the predetermined value so that it is possible to appropriately carry out inspection of whether or not the electronic component is properly stored in the pockets 21 of the carrier tape 20 through the cover tape 10 have.

The total light transmittance of the base layer 1 can be measured by a method specified in JIS K7105-1981.

As the material of the base layer 1, for example, a resin such as a polyester resin, a polyamide resin, a polyolefin resin, a polyacrylate resin, a polymethacrylate resin, a polyimide resin, a polycarbonate resin, ABS resin, and the like. Of these, as the material of the substrate layer 1, a polyester-based resin is preferable, and in particular, polyethylene terephthalate capable of improving mechanical strength is preferable. When a polyamide resin is selected as the material of the substrate layer 1, nylon 6 is preferable because it can improve mechanical strength and flexibility. The base layer 1 may contain a lubricant in a range that does not impair its properties.

The material of the base layer 1 may be selected so that the surface resistance value becomes a predetermined value or less and the total light transmittance becomes the above-mentioned predetermined value or more.

The substrate layer 1 may be a single-layer film composed of any one of the above resins, but may be a laminate of two or more layers selected from the above resins.

As the base layer 1, an unoriented film may be used. However, in order to increase the mechanical strength of the cover tape 10 as a whole, it is preferable to use a film stretched in the uniaxial or biaxial direction.

The thickness of the base layer 1 is preferably 9 to 25 탆, more preferably 9 to 16 탆.

The thickness of the base layer 1 is not more than the predetermined value and the rigidity of the cover tape 10 is not excessively increased so that even if the torsional stress is applied to the carrier tape 20 after the sealing, It is possible to reduce the possibility of peeling off following the deformation of the tape 20. If the thickness of the base layer 1 is equal to or larger than the predetermined value, the mechanical strength of the cover tape 10 becomes suitable. Even if the cover tape 10 is rapidly peeled from the carrier tape 20, It is possible to reduce the possibility that the substrate 10 is broken.

<Sealant Layer>

The sealant layer 2 is a layer provided on one surface side of the base layer 1. When the cover tape 10 is sealed (for example, heat sealed) to the carrier tape 20, ). &Lt; / RTI &gt;

The sealant layer 2 is composed of an acrylic resin or a polyester resin and an antistatic agent. Examples of the antistatic agent include any one selected from among metal fillers such as tin oxide, zinc oxide, titanium oxide, and carbon, and surfactants such as polyoxyethylene alkylamine, quaternary ammonium, and alkylsulfonate; . &Lt; / RTI &gt; The carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.

The sealant layer 2 is preferably made of oxide particles mainly containing any one of silicon, magnesium and calcium, for example, silica, talc, etc., or polyethylene particles, polyacrylate particles, Polystyrene particles, and polystyrenes, or an alloy thereof.

It is preferable to adjust the material so that the surface resistance value becomes 10 ⁴ to 10 ¹² Ω / □ (measurement condition: 23 ° C. to 15% RH) so that the static electricity can be quickly discharged to the sealant layer 2 .

The thickness of the sealant layer 2 is preferably 1 to 15 占 퐉, more preferably 1 to 5 占 퐉, so that the sealing work and the peeling work can be suitably performed.

<Conductive polymer layer>

The conductive polymer layer 3 is a layer provided on the other surface side (the surface opposite to the surface side where the sealant layer 2 is provided) of the base layer 1 and the surface 10a of the cover tape 10 Layer.

(Conductive polymer layer: friction voltage vs. voltage)

The friction voltage of the conductive polymer layer 3 is preferably -2200 to 2200 V, more preferably -800 to 800 V, and particularly preferably -500 to 500 V. In other words, the maximum value of the frictional voltage of the conductive polymer layer 3 is 2200 V or less, preferably 800 V or less, and particularly preferably 500 V or less.

When the frictional voltage of the conductive polymer layer 3 is within the predetermined range, it is possible to suppress the occurrence of charging due to friction on the surface of the conductive polymer layer 3.

Concretely, when the carrier tape 20 sealed by the cover tape 10 is transported while being wound around the reel, the bottom surface 20a of the carrier tape 20 and the cover tape 10 (The conductive polymer layer 3) of the surface 10a of the conductive polymer layer 3, and occurrence of charging due to such friction can be suppressed.

The frictional electrification voltage of the conductive polymer layer 3 is obtained by subjecting the cover tape 10 and the material to be subjected to friction (such as the polystyrene-based carrier tape 20 described later) The surface of the cover tape 10 (surface of the conductive polymer layer 3) was rubbed twice in one direction (for example, speed: about 100 mm / s, distance: about 50 mm) As shown in FIG. The frictional electrification voltage of the surface of the conductive polymer layer 3 may be directly measured. Alternatively, the frictional electromotive voltage of the material to be frictional may be measured and calculated from the measurement result.

(Conductive polymer layer: object of friction)

The bottom surface 20a of the carrier tape 20 is assumed to be the subject of the friction of the conductive polymer layer 3 (hereinafter referred to as "friction object" as appropriate), but the present invention is not limited thereto, It is possible to consider a substance that is likely to come into contact with the conductive polymer layer 3 during the transportation of the package body 100 or in the process of mounting the electronic component.

Examples of the material to be subjected to friction of the conductive polymer layer 3 (hereinafter referred to as "friction material" as appropriate) include polystyrene, polyethylene terephthalate, polycarbonate and the like which are used as the material of the carrier tape 20 However, the present invention is not limited to these, and includes polyethylene, rubber (a material obtained by processing natural rubber, synthetic rubber, etc.), etc., which may come into contact with each other during transportation of the package 100 or mounting process of electronic parts.

(Conductive polymer layer: positive compound, negative compound)

The conductive polymer layer 3 preferably includes a "positive chemical compound" located on the positive side in the charging column and a "negative chemical compound" located on the negative side in the charging column than the material to be rubbed.

Since the conductive polymer layer 3 contains the positive compound and the negative compound, when the conductive polymer layer 3 rubs against the friction object, the positive compound is positively charged and the negative compound is negatively charged, Is electrically neutralized in the conductive polymer layer (3). As a result, the frictional electrification voltage of the electroconductive polymer layer 3 can be surely set within the above-mentioned predetermined range, and the occurrence of electrification due to friction on the surface of the electroconductive polymer layer 3 can be reliably suppressed.

The position of the charging column can be measured by changing the object to be measured in the method of measuring the friction voltage.

As the defining compound, an aziridine compound and a ring-opening compound thereof may be mentioned when the material to be frictioned is polystyrene or rubber.

Herein, the aziridinyl compound is a compound having an aziridinyl group and includes, for example, N, N'-hexamethylene-1,6-bis (1-aziridinecarboxamide), N, Bis (1-aziridinecarboxamide), trimethylolpropane-tri- beta -aziridinylpropionate), N, N'-toluene-2,4- (2-methyl aziridine) propionate, bisisophthaloyl-1-2-methyl aziridine, tri-1-aziridinylphosphine, Pin oxide, tris-2-methyl aziridine phosphine oxide, and the like. Commercially available products include Chemitite PZ-33 and DZ-22E manufactured by Nippon Shokubai Co., Ltd.

The "ring-opening compound" (a ring-opening compound of an aziridinyl compound) is a compound in which the aziridinyl group in the above aziridinyl compound is opened.

As a negative compound, an ester compound can be exemplified when the material to be frictioned is assumed to be polystyrene or rubber.

Here, the ester compound is a compound produced by combining an organic acid or an inorganic acid with an alcohol by a dehydration reaction, and examples thereof include polyethylene terephthalate, polystyrene terephthalate, polyethylene naphthalate, and derivatives thereof have.

The content of the positive chemical compound and the content of the negative chemical compound in the conductive polymer layer 3 are not particularly limited and may be suitably set in consideration of the mechanical characteristics of the entire conductive polymer layer 3 and the cover tape 10 .

Further, by adjusting the contents of the positive and negative compounds in the conductive polymer layer 3, the frictional electrification voltage of the conductive polymer layer 3 can be set to a desired value. In addition, since the positive compound and the negative compound have various charging tendencies (distance from the material to be frictioned in the charging heat) depending on the material, the conductive polymer layer 3 is formed by appropriately selecting the positive and negative compounds to be used, Can be set to a desired value.

The conductive polymer layer 3 preferably contains a conductive polymer in order to lower the surface resistance value and preferably contains a surfactant in order to improve wettability and leveling property when the layer is formed.

As the conductive polymer, for example, polyaniline, polypyrrole and the like can be mentioned, but a compound of polyethylene dioxythiophene / polystyrene sulfonic acid (PEDOT / PSS) system can be suitably used. As the surfactant, a low-molecular-type or polymer-type surfactant may be used, but alkyl fluoride can be suitably used.

(Base layer + conductive polymer layer: surface resistance value)

The base layer 1 provided with the conductive polymer layer 3 preferably has a surface resistance value of 1 x 10 &lt; ¹¹ &gt; OMEGA / &amp; squ &amp; or less under an environment of a temperature of 25 DEG C and a humidity of 12 to 65% ^And more preferably ⁹ Ω / □ or less.

Since the surface resistance value of the base layer 1 provided with the conductive polymer layer 3 is not more than the predetermined value, the static electricity can be quickly discharged even if it is charged. In addition, since the surface resistance value of the base layer 1 provided with the conductive polymer layer 3 is kept below the predetermined value under the above-described environment, even if the working environment such as peeling of the cover tape 10 is dry, It is possible to discharge the static electricity, thereby preventing occurrence of trouble based on the static electricity.

The surface resistance value of the base layer 1 provided with the conductive polymer layer 3 can be measured according to the method specified in JIS K6911-1995.

<Other layers>

(Middle layer)

The cover tape 10 may be provided with an intermediate layer (not shown) between the base layer 1 and the sealant layer 2. This intermediate layer improves the cushioning property of the entire cover tape 10 and improves the adhesion between the cover tape 10 and the carrier tape 20 at the time of sealing.

The intermediate layer includes a resin. Examples of the resin include an olefin resin, a styrene resin, and a cyclic olefin resin. Among them, the use of an olefin resin makes it possible to reliably improve the adhesion .

The thickness of the intermediate layer 3 is preferably 10 to 30 占 퐉, more preferably 15 to 25 占 퐉 in order to ensure the effect of improving the adhesion.

(Adhesive layer)

The cover tape 10 may be provided with an adhesive layer (not shown) between the layers. This adhesive layer can improve the adhesiveness between the respective layers.

The adhesive layer includes a resin and a conductive material. Examples of the resin include an adhesive resin for dry laminating or an anchor coat for a urethane resin. In general, a polyester polyol, a polyether polyol, or the like And a combination of an isocyanate compound and an isocyanate compound. As the conductive material, for example, a metal filler such as tin oxide, zinc oxide, titanium oxide, or carbon, or an organic conductive material such as a conductive polymer, or a mixture thereof may be used. The carbon includes fillers of various shapes made of carbon such as carbon black, white carbon, carbon fiber, and carbon tube.

Further, in each layer of the cover tape 10, the presence or absence of a reaction between materials may be irrelevant to a portion described as "contains" a plurality of materials. Specifically, when an aziridinyl compound is contained as a positive chemical compound in the conductive polymer layer (3), the aziridinyl compound may or may not react with another compound (such as a negative compound) Or may be included in the conductive polymer layer 3 in a state after reacted with the conductive polymer layer 3.

&Quot; Method for manufacturing cover tape for packaging electronic parts &quot;

The method for manufacturing the cover tape 10 according to the second embodiment of the present invention is not particularly limited. For example, a method of applying a predetermined material to one surface of the base layer 1 and drying the same, And the sealant layer 2 is laminated on the other surface of the substrate layer 1 by the extrusion laminating method. Alternatively, the sealant layer 2 may be laminated on the other surface of the base layer 1 after the sheet is formed by extrusion processing.

When an intermediate layer (not shown) is provided, it may be laminated on the other surface of the base layer 1 by the extrusion laminating method, or may be laminated on the other surface of the base layer 1, Naming can be done. When an adhesive layer (not shown) is provided, the material of the adhesive layer may be applied to the surface to be treated in accordance with a conventionally known coating method.

According to the cover tape 10 according to the second embodiment of the present invention described above, since the frictional electrification voltage on the surface of the conductive polymer layer 3 is within a predetermined range, Generation can be suppressed.

According to the cover tape 10 of the second embodiment of the present invention, since the conductive polymer layer 3 contains a positive chemical compound and a negative chemical compound, the surface of the conductive polymer layer 3, The voltage can be reliably set within a predetermined range, and occurrence of charging due to friction on the surface can be reliably suppressed.

According to the cover tape 10 of the second embodiment of the present invention, since the aziridinyl compound (or the ring-opening compound thereof) is contained as the positive chemical compound and the ester compound is contained as the negative chemical compound, In the case of polystyrene or rubber, the occurrence of charging due to friction in the conductive polymer layer 3 can be suppressed more reliably.

According to the cover tape 10 of the second embodiment of the present invention, since the surface resistance value of the base layer 1 provided with the conductive polymer layer 3 is not more than the predetermined value, even if charged, Discharge can be performed. In addition, the surface resistance value of the base layer 1 provided with the conductive polymer layer 3 is maintained at the predetermined value or less under the above environment, so that even if the working environment such as peeling of the cover tape 10 is dry, It is possible to discharge the static electricity, thereby preventing occurrence of trouble based on the static electricity.

According to the cover tape 10 according to the second embodiment of the present invention, since the total light transmittance of the base layer 1 is equal to or larger than the predetermined value, the electronic parts can be correctly placed on the pockets 21 of the carrier tape 20 It is possible to appropriately perform inspection of whether or not it is stored through the cover tape 10.

The cover tape for packaging electronic parts according to the third embodiment of the present invention can be manufactured in the same manner as the cover tape for packing electronic parts according to the first embodiment of the present invention and the cover tape for packing electronic parts according to the second embodiment of the present invention . However, the conductive polymer layer is characterized in that it contains at least one of an aziridinyl compound and a ring-opening compound thereof and poly (3,4-ethylenedioxythiophene). It is preferable that the conductive polymer layer further contains polystyrene sulfonic acid.

Example

Examples of the present invention will be described below, but the present invention is not limited at all by these examples.

The cover tape was evaluated according to the following test method.

<Blocking resistance>

Two sheets of the cover tape were put on a smooth plate in such a manner that the top and bottom surfaces of the cover tape were in contact with each other, and two cover tapes were pressed with a cushioning disk having a diameter of 30 mm. A weight of 1 kg was placed on the disk and stored for several days under each environment. After storage, the two cover tapes were peeled off and peeled without resistance was evaluated as &amp; cir &amp;, while resistance was evaluated as peeling, DELTA, and the peeled surface was peeled off.

&Lt; Light transmittance >

Cover tape was stored for several days under different environments. After storage, the light transmittance was measured according to JIS K7105. When the light transmittance was 85% or more, the result was &amp; cir &amp; and when the light transmittance was less than 85%, the light transmittance was X.

<Surface resistance value>

Cover tape was stored for several days under each environment. After storage, the surface resistance value of the substrate layer was measured by a surface resistivity meter manufactured by TREK under the conditions of 25 ° C and 30% RH and 25 ° C and 50% RH in accordance with IEC61340 5-1.

Examples 1 to 12

As the cover tape, the surface of the O-PET substrate layer of the conductive type cover tape CSL-Z7302 manufactured by Sumitomo Bakelite Co., Ltd. was cleaned with acetone.

As a conductive polymer solution containing poly (3,4-ethylenedioxythiophene) and polystyrene sulfonic acid, 43 parts by mass of a PEDOT / PSS complex aqueous solution, 46.3 parts by mass of ion-exchanged water, 0.1 part by mass of toluene sulfonic acid and 0.6 parts by mass of triethylamine was mixed with 10 parts by mass of tetramethylol methane-tris (1-aziridinyl propionate) / isopropanol solution was uniformly mixed with gravure Coated, dried and UV-cured to prepare a cover tape having a conductive polymer layer having a thickness of 150 nm.

The cover tape of the first embodiment of the present invention was stored in a storage environment and the number of days of storage as shown in Tables 1 and 2 to evaluate surface resistance, light transmittance, and blocking.

Tables 1 and 2 show the evaluation results of the cover tape for packaging electronic parts of the first embodiment of the present invention. The security environment of Examples 3, 6, 9 and 12 is an environment in a 60 ° C oven.

Comparative Examples 1 to 4

As the cover tape, the substrate layer surface of the conductive type cover tape CSL-Z7302 manufactured by Sumitomo Bakelite Co., Ltd. was cleaned with acetone. A comparative cover tape having a conductive surfactant was coated on the surface of the substrate layer of the cover tape so that a polymer surface active agent (Acryt 1SX-1090, manufactured by Daicel Fine Chemical Co., Ltd.) as a conductive surfactant had a thickness of 150 nm .

The cover tape of this comparison was stored in the storage environment and the number of days of storage as shown in Table 3 to evaluate surface resistance, light transmittance, and blocking.

Table 3 shows the evaluation results of the obtained cover tape for packaging electronic parts obtained.

Examples 13 to 15 and Comparative Example 5

&Quot; Production of test materials &quot;

As a base layer, a biaxially stretched polyester film (E5102, manufactured by Toyo Boseki Co., Ltd.) having a thickness of 16 mu m was prepared.

Then, a sealant layer was formed on one surface of the substrate layer, and a conductive polymer layer was formed on the other surface in the following order.

Isopropyl alcohol (IPA) and water were added to a PEDOT / PSS dispersion (WED-SM manufactured by Soken Chemical & Engineering Co., Ltd.), and triethylamine (Wako Pure Chemical Industries: TEA) did. Then, a positive and negative compound (Plascoat Z565, Z760, manufactured by Nippon Kayaku Chemical Co., Ltd .: carbodiimide V-02-L2 made by Ko Gogaku Co., Ltd.) was added as a binder resin and stirred for 30 seconds. This solution was coated on the other surface of the base layer so as to have a wet film thickness of 4 탆 using a bar coater or a gravure coater and dried at 100 캜 to form a conductive polymer layer. The compounding weights of the respective reagents are shown in Table 4.

According to the above method, cover tapes (disclosure materials Nos. 1 to 4) were produced.

"Various measurement conditions"

<Friction Voltage>

The frictional electrification voltage on the surfaces of the conductive polymer layers of the disclosures 1 to 4 was measured according to the following method (see Fig. 3).

(1) A plate-like rubber body 40 (1.0 × 10 ¹³ Ω or more) is provided on a wheeled seat 30 (less than 1.0 × 10 ¹¹ Ω), and two rectangular pillar- (Not less than 1.0 x 10 &lt; ¹³ &gt; OMEGA and a thickness of not less than 10 mm) were provided at predetermined intervals. The carrier tape 70 assumed as a subject of friction was fixed to the two insulators 50 using a double-sided tape. The carrier tape 70 was made of a polystyrene-based sheet (Cleancel CST2401 made by Denki Kagaku KK) cut to a width of 8 mm.

Further, the wheel mounting base 30 was always in a grounded state.

(2) The carrier tape 70 was discharged by using an ionizer (BLH-H manufactured by Kasuga Electric Co., Ltd.).

(3) The wheel mounting base 30 was moved and the carrier tape 70 was moved under the measurement probe 60 of the surface electrometer (manufactured by TREK: MODEL 370) to confirm that the electric charge was removed.

The interval between the carrier tape 70 and the measurement probe 60 was 1 to 2 mm.

(4) The cover tape 10 (width: 8 mm) was wound on a bar-shaped support 80 (less than 1.0 x 10 ⁹ ?) So that the conductive polymer layer became the surface layer. It is preferable that the support 80 is made of a conductor such as a film or a metal overlaid with carbon in order to reduce the influence of charging by hand.

Then, the cover tape 10 was also subjected to static elimination using an ionizer.

(5) The wheel mounting base 30 is moved so that the carrier tape 70 is moved from under the measurement probe 60 and the surface of the carrier tape 70 is rubbed by the cover tape 10 wound around the support body 80 .

The friction caused by the cover tape 10 is twice frictionally applied to the carrier tape 70 in the longitudinal direction in one direction (speed: about 100 mm / s, distance: about 50 mm).

(6) The wheel attachment base 30 was moved to move the carrier tape 70 under the measurement probe 60 within 5 seconds after the friction operation, and the friction voltage was measured.

(7) The frictional electrification voltage on the surface of the conductive polymer layer of the cover tape 10 was calculated from the result of measuring the frictional electrification voltage of the carrier tape 70. [

Before the friction operation, the carrier tape 70 and the surface of the conductive polymer layer of the cover tape 10 are electrically discharged, so that the magnitude of both voltages is 0V. Therefore, when the frictional electrification voltage of the carrier tape 70 is a measurement result of 100 V, the frictional electrification voltage on the surface of the conductive polymer layer of the cover tape 10 can be calculated as -100 V (= 0 V-100 V) have.

In Examples 13 to 15, when the frictional electrification voltage on the surface of the conductive polymer layer of the cover tape 10 is directly measured in view of excellent electrostatic discharge property of the cover tape 10, An error (fluctuation) occurs. Therefore, by measuring the carrier tape 70, an accurate value of the frictional electrification voltage on the surface of the conductive polymer layer of the cover tape 10 is calculated.

For the purpose of reference, the triboelectric charge on the surface of the sealant layer was also measured. The measurement method was the same as the above (1) to (7) except that the cover tape 10 was wound around the rod-shaped support 80 so that the sealant layer was not the conductive polymer layer in the above (4) ). &Lt; tb &gt; &lt; TABLE &gt;

<Surface resistance value>

The surface resistance values of the substrate layers (base layer + conductive polymer layer, sealant layer) of the disclosures 1 to 4 were measured in accordance with IEC61340 5-1 at 25 ° C and 30% RH and at 25 ° C and 50% RH The surface resistance value of the base layer was measured by a surface resistivity meter manufactured by TREK.

[Review of results]

As shown in Table 4, in the disclosed material 1 (Example 13), the frictional electromotive force (absolute value) on the surface of the conductive polymer layer was 413 V, and the occurrence of electrification by friction on the surface . Further, in the disclosure 1, it was found that the surface resistance value of the substrate layer (base layer + conductive polymer layer) was 5.0 × 10 ⁶ Ω / square, and the static electricity could be quickly discharged even if charged.

Also, with respect to the disclosures 3 and 4 (Examples 14 and 15), too, the frictional electromotive force (absolute value) on the surface of the conductive polymer layer became a predetermined value or less, thereby suppressing the occurrence of electrification I could see what I could do.

On the other hand, in the disclosure 2 (Comparative Example 5), since the positive electrode compound was not contained in the conductive polymer layer, the frictional electromotive force (absolute value) on the surface of the conductive polymer layer became 3000 V, It is not possible to sufficiently suppress the occurrence of charging caused by the above-mentioned problems.

1 substrate layer
2 sealant layer
3 conductive polymer layer
10 Cover tape for electronic parts packing (Cover tape)
10a The surface of the cover tape (the surface of the conductive polymer layer)
20 carrier tape
20a bottom surface of the carrier tape
100 package

Claims (16)

A base layer,
A sealant layer provided on one side of the substrate layer,
A conductive polymer layer provided on the other surface side of the base layer
And a cover tape for covering the electronic parts. The method according to claim 1,
The base layer has a light transmittance of 85% or more,
Wherein the base layer provided with the conductive polymer layer has a surface resistance value of 1 x 10 &lt; ⁹ &gt; / - or less over a relative humidity of 12% to 50% Cover tape for packing parts. The method according to claim 1 or 2,
Wherein the base layer is a biaxially stretched film containing at least one or more selected from polyester, polypropylene, and nylon. The method according to claim 1 or 2,
Wherein the conductive polymer layer contains poly (3,4-ethylenedioxythiophene). The method of claim 4,
Wherein the conductive polymer layer further contains polystyrene sulfonic acid. The method according to claim 1 or 2,
Wherein the sealant layer has a surface resistivity of less than 1 x 10 &lt; ¹¹ &gt; OMEGA / &amp; squ &amp; over a relative humidity of from 12% to 50% under a temperature environment of 25 DEG C. The method according to claim 1 or 2,
Wherein the conductive polymer layer contains silica particles. The method according to claim 1,
Wherein the conductive polymer layer has a frictional electrification voltage of -2200 to 2200 V on the surface thereof. The method according to claim 1 or 8,
Wherein the conductive polymer layer has a frictional electrification voltage of -800 to 800 V on the surface of the conductive polymer layer. The method according to claim 1 or 8,
Wherein the conductive polymer layer includes a positive compound positioned on the positive side in the charging direction of the conductive polymer layer and a negative compound positioned on the negative side in the charging heat than the material to be frictioned Cover tape for packing electronic parts characterized by. The method according to any one of claims 1 to 8,
Wherein the conductive polymer layer comprises an ester compound. The method according to any one of claims 1 to 8,
Wherein the conductive polymer layer comprises at least one of an aziridinyl compound and a ring-opening compound thereof. The method according to claim 1 or 8,
Wherein the base layer provided with the conductive polymer layer has a surface resistance value of 1 x 10 &lt; ¹¹ &gt; ohm / square or less under an environment of a temperature of 25 DEG C and a humidity of 12 to 65% RH. The method according to claim 1 or 8,
Wherein the base layer has a total light transmittance of 85% or more. The method according to claim 1,
The electrically conductive polymer layer
At least one of an aziridinyl compound and a ring-opening compound thereof,
Poly (3,4-ethylene dioxythiophene)
And a cover tape for packaging electronic parts. 16. The method of claim 15,
The electrically conductive polymer layer
A cover tape for electronic part packaging, further comprising polystyrene sulfonic acid.

Images