JP2020535658A5 - - Google Patents
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- JP2020535658A5 JP2020535658A5 JP2020517572A JP2020517572A JP2020535658A5 JP 2020535658 A5 JP2020535658 A5 JP 2020535658A5 JP 2020517572 A JP2020517572 A JP 2020517572A JP 2020517572 A JP2020517572 A JP 2020517572A JP 2020535658 A5 JP2020535658 A5 JP 2020535658A5
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- 230000003595 spectral effect Effects 0.000 claims description 26
- 238000001228 spectrum Methods 0.000 claims description 26
- 238000005259 measurement Methods 0.000 claims description 21
- 239000011159 matrix material Substances 0.000 claims description 19
- 239000004065 semiconductor Substances 0.000 claims 19
- 238000005303 weighing Methods 0.000 claims 19
- 238000004519 manufacturing process Methods 0.000 claims 9
- 238000000034 method Methods 0.000 claims 9
- 238000005286 illumination Methods 0.000 claims 5
- 230000003287 optical effect Effects 0.000 claims 4
- 230000010365 information processing Effects 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 3
- 230000007847 structural defect Effects 0.000 claims 3
- 238000012417 linear regression Methods 0.000 claims 2
- 238000003062 neural network model Methods 0.000 claims 2
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201762564119P | 2017-09-27 | 2017-09-27 | |
| US62/564,119 | 2017-09-27 | ||
| US16/138,813 | 2018-09-21 | ||
| US16/138,813 US10732515B2 (en) | 2017-09-27 | 2018-09-21 | Detection and measurement of dimensions of asymmetric structures |
| PCT/US2018/052507 WO2019067375A1 (en) | 2017-09-27 | 2018-09-25 | DETECTION AND MEASUREMENT OF DIMENSIONS OF ASYMMETRIC STRUCTURES |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020535658A JP2020535658A (ja) | 2020-12-03 |
| JP2020535658A5 true JP2020535658A5 (cg-RX-API-DMAC7.html) | 2021-11-04 |
| JP7052024B2 JP7052024B2 (ja) | 2022-04-11 |
Family
ID=65807567
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020517572A Active JP7052024B2 (ja) | 2017-09-27 | 2018-09-25 | 非対称構造の検出及び寸法計測 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10732515B2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP7052024B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR102431942B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN111095510B (cg-RX-API-DMAC7.html) |
| DE (1) | DE112018005533T5 (cg-RX-API-DMAC7.html) |
| TW (1) | TWI771499B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2019067375A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102823322B1 (ko) * | 2019-07-08 | 2025-06-23 | 에이에스엠엘 네델란즈 비.브이. | 계측 방법 및 연관된 컴퓨터 제품 |
| CN110596011B (zh) * | 2019-08-26 | 2020-12-29 | 华中科技大学 | 一种材料介电张量测量方法 |
| KR102506098B1 (ko) * | 2019-09-11 | 2023-03-06 | 타이완 세미콘덕터 매뉴팩쳐링 컴퍼니 리미티드 | 웨이퍼 결정 배향을 추정하는 방법 및 시스템 |
| US11356851B2 (en) * | 2019-12-03 | 2022-06-07 | Harris Global Communications, Inc. | Communications system having multiple carriers with selectively transmitted real information and fake information and associated methods |
| CN111667111B (zh) * | 2020-06-02 | 2023-04-07 | 上海哥瑞利软件股份有限公司 | 一种集成电路晶圆制造中的良率预测方法 |
| US11530913B2 (en) * | 2020-09-24 | 2022-12-20 | Kla Corporation | Methods and systems for determining quality of semiconductor measurements |
| WO2022146543A2 (en) * | 2020-10-30 | 2022-07-07 | The Board Of Trustees Of The Leland Stanford Junior University. | Metasurface polarization filtering for characterization of samples |
| US12405223B2 (en) * | 2020-10-30 | 2025-09-02 | The Board Of Trustees Of The Leland Stanford Junior University | Matrix-based characterization and measurements for semiconductor thin-film material |
| US12013355B2 (en) * | 2020-12-17 | 2024-06-18 | Kla Corporation | Methods and systems for compact, small spot size soft x-ray scatterometry |
| CN113029024B (zh) * | 2021-03-01 | 2021-11-16 | 长鑫存储技术有限公司 | 半导体结构的测量方法及设备 |
| CN113035735B (zh) * | 2021-03-01 | 2022-05-27 | 长鑫存储技术有限公司 | 半导体结构的测量方法、系统、介质和电子设备 |
| US12062583B2 (en) * | 2021-03-11 | 2024-08-13 | Applied Materials Israel Ltd. | Optical metrology models for in-line film thickness measurements |
| CN113219792B (zh) * | 2021-04-29 | 2022-07-19 | 华中科技大学 | 一种快照式套刻误差测量装置及其测量方法 |
| CN113834515B (zh) * | 2021-08-18 | 2024-04-16 | 之江实验室 | 一种高时空分辨双光子激光直写原位红外探测装置与方法 |
| CN115435697B (zh) * | 2022-08-19 | 2025-12-23 | 上海大学 | 一种基于线性回归模型的微结构台阶高度表征方法 |
| US20240159656A1 (en) * | 2022-11-11 | 2024-05-16 | Onto Innovation Inc. | Combined modeling and machine learning in optical metrology |
| KR20250112148A (ko) | 2024-01-16 | 2025-07-23 | 연세대학교 산학협력단 | 광학 측정 시스템에서 시료의 파라미터를 예측하는 방법 및 컴퓨터 프로그램, 그리고 이를 구현하기 위한 컴퓨터 프로그램이 저장된 기록 매체 |
Family Cites Families (42)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5166752A (en) | 1990-01-11 | 1992-11-24 | Rudolph Research Corporation | Simultaneous multiple angle/multiple wavelength ellipsometer and method |
| US5608526A (en) | 1995-01-19 | 1997-03-04 | Tencor Instruments | Focused beam spectroscopic ellipsometry method and system |
| US6734967B1 (en) | 1995-01-19 | 2004-05-11 | Kla-Tencor Technologies Corporation | Focused beam spectroscopic ellipsometry method and system |
| US5808738A (en) | 1995-06-13 | 1998-09-15 | University Of South Florida | Multiangle, multiwavelength particle characterization system and method |
| US5859424A (en) | 1997-04-08 | 1999-01-12 | Kla-Tencor Corporation | Apodizing filter system useful for reducing spot size in optical measurements and other applications |
| US6859278B1 (en) | 2001-01-16 | 2005-02-22 | J.A. Woollam Co. Inc. | Multi-AOI-system for easy changing angles-of-incidence in ellipsometer, polarimeter and reflectometer systems |
| US6429943B1 (en) | 2000-03-29 | 2002-08-06 | Therma-Wave, Inc. | Critical dimension analysis with simultaneous multiple angle of incidence measurements |
| US6917419B2 (en) | 2000-09-20 | 2005-07-12 | Kla-Tencor Technologies Corp. | Methods and systems for determining flatness, a presence of defects, and a thin film characteristic of a specimen |
| US6895075B2 (en) | 2003-02-12 | 2005-05-17 | Jordan Valley Applied Radiation Ltd. | X-ray reflectometry with small-angle scattering measurement |
| JP4938219B2 (ja) | 2001-12-19 | 2012-05-23 | ケーエルエー−テンカー コーポレイション | 光学分光システムを使用するパラメトリック・プロフィーリング |
| US6816570B2 (en) | 2002-03-07 | 2004-11-09 | Kla-Tencor Corporation | Multi-technique thin film analysis tool |
| US7061627B2 (en) | 2002-03-13 | 2006-06-13 | Therma-Wave, Inc. | Optical scatterometry of asymmetric lines and structures |
| US7478019B2 (en) | 2005-01-26 | 2009-01-13 | Kla-Tencor Corporation | Multiple tool and structure analysis |
| US7567351B2 (en) | 2006-02-02 | 2009-07-28 | Kla-Tencor Corporation | High resolution monitoring of CD variations |
| US7755764B2 (en) | 2007-01-26 | 2010-07-13 | Kla-Tencor Corporation | Purge gas flow control for high-precision film measurements using ellipsometry and reflectometry |
| US8699027B2 (en) | 2007-07-27 | 2014-04-15 | Rudolph Technologies, Inc. | Multiple measurement techniques including focused beam scatterometry for characterization of samples |
| US7907264B1 (en) | 2007-09-07 | 2011-03-15 | Kla-Tencor Corporation | Measurement of thin film porosity |
| US7929667B1 (en) | 2008-10-02 | 2011-04-19 | Kla-Tencor Corporation | High brightness X-ray metrology |
| NL2004539A (en) * | 2009-06-22 | 2010-12-23 | Asml Netherlands Bv | Object inspection systems and methods. |
| US8525993B2 (en) * | 2009-10-07 | 2013-09-03 | Nanometrics Incorporated | Scatterometry measurement of asymmetric structures |
| IL217843A (en) | 2011-02-11 | 2016-11-30 | Asml Netherlands Bv | A system and method for testing, a lithographic system, a cell for lithographic processing, and a method for producing a device |
| US8841591B2 (en) | 2011-04-04 | 2014-09-23 | The Board Of Trustees Of The Leland Stanford Junior University | Grating-enhanced optical imaging |
| US9228943B2 (en) | 2011-10-27 | 2016-01-05 | Kla-Tencor Corporation | Dynamically adjustable semiconductor metrology system |
| WO2014062972A1 (en) | 2012-10-18 | 2014-04-24 | Kla-Tencor Corporation | Symmetric target design in scatterometry overlay metrology |
| US9581430B2 (en) | 2012-10-19 | 2017-02-28 | Kla-Tencor Corporation | Phase characterization of targets |
| US8860937B1 (en) | 2012-10-24 | 2014-10-14 | Kla-Tencor Corp. | Metrology systems and methods for high aspect ratio and large lateral dimension structures |
| US10769320B2 (en) | 2012-12-18 | 2020-09-08 | Kla-Tencor Corporation | Integrated use of model-based metrology and a process model |
| US9116103B2 (en) | 2013-01-14 | 2015-08-25 | Kla-Tencor Corporation | Multiple angles of incidence semiconductor metrology systems and methods |
| US9291554B2 (en) | 2013-02-05 | 2016-03-22 | Kla-Tencor Corporation | Method of electromagnetic modeling of finite structures and finite illumination for metrology and inspection |
| US10101670B2 (en) | 2013-03-27 | 2018-10-16 | Kla-Tencor Corporation | Statistical model-based metrology |
| US9875946B2 (en) | 2013-04-19 | 2018-01-23 | Kla-Tencor Corporation | On-device metrology |
| US9255877B2 (en) * | 2013-05-21 | 2016-02-09 | Kla-Tencor Corporation | Metrology system optimization for parameter tracking |
| US9915522B1 (en) | 2013-06-03 | 2018-03-13 | Kla-Tencor Corporation | Optimized spatial modeling for optical CD metrology |
| US9383661B2 (en) | 2013-08-10 | 2016-07-05 | Kla-Tencor Corporation | Methods and apparatus for determining focus |
| US10935893B2 (en) | 2013-08-11 | 2021-03-02 | Kla-Tencor Corporation | Differential methods and apparatus for metrology of semiconductor targets |
| CN103499521B (zh) * | 2013-09-06 | 2015-10-21 | 清华大学 | 纳米颗粒关键几何特征量的测量方法 |
| US9354212B2 (en) | 2014-01-07 | 2016-05-31 | Applied Materials Israel Ltd. | Inspection having a segmented pupil |
| US20160139032A1 (en) | 2014-11-19 | 2016-05-19 | Kla-Tencor Corporation | Inspection system and method using an off-axis unobscured objective lens |
| US10072921B2 (en) | 2014-12-05 | 2018-09-11 | Kla-Tencor Corporation | Methods and systems for spectroscopic beam profile metrology having a first two dimensional detector to detect collected light transmitted by a first wavelength dispersive element |
| US9470639B1 (en) * | 2015-02-03 | 2016-10-18 | Kla-Tencor Corporation | Optical metrology with reduced sensitivity to grating anomalies |
| US10495446B2 (en) * | 2015-06-29 | 2019-12-03 | Kla-Tencor Corporation | Methods and apparatus for measuring height on a semiconductor wafer |
| SG11201803933PA (en) * | 2015-12-17 | 2018-06-28 | Asml Netherlands Bv | Optical metrology of lithographic processes using asymmetric sub-resolution features to enhance measurement |
-
2018
- 2018-09-21 US US16/138,813 patent/US10732515B2/en active Active
- 2018-09-25 WO PCT/US2018/052507 patent/WO2019067375A1/en not_active Ceased
- 2018-09-25 JP JP2020517572A patent/JP7052024B2/ja active Active
- 2018-09-25 DE DE112018005533.7T patent/DE112018005533T5/de active Pending
- 2018-09-25 KR KR1020207011998A patent/KR102431942B1/ko active Active
- 2018-09-25 CN CN201880057081.5A patent/CN111095510B/zh active Active
- 2018-09-27 TW TW107134112A patent/TWI771499B/zh active
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