JP2020533208A5 - - Google Patents

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Publication number
JP2020533208A5
JP2020533208A5 JP2020514973A JP2020514973A JP2020533208A5 JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5 JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020514973 A JP2020514973 A JP 2020514973A JP 2020533208 A5 JP2020533208 A5 JP 2020533208A5
Authority
JP
Japan
Prior art keywords
multilayer film
dianhydride
film according
aromatic
acid dianhydride
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2020514973A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020533208A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2018/050583 external-priority patent/WO2019055466A1/en
Publication of JP2020533208A publication Critical patent/JP2020533208A/ja
Publication of JP2020533208A5 publication Critical patent/JP2020533208A5/ja
Pending legal-status Critical Current

Links

JP2020514973A 2017-09-13 2018-09-12 電子回路用途向け多層膜 Pending JP2020533208A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201762557901P 2017-09-13 2017-09-13
US62/557,901 2017-09-13
PCT/US2018/050583 WO2019055466A1 (en) 2017-09-13 2018-09-12 MULTILAYER FILM FOR ELECTRONIC CIRCUIT APPLICATIONS

Publications (2)

Publication Number Publication Date
JP2020533208A JP2020533208A (ja) 2020-11-19
JP2020533208A5 true JP2020533208A5 (enExample) 2021-09-30

Family

ID=63862197

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2020514973A Pending JP2020533208A (ja) 2017-09-13 2018-09-12 電子回路用途向け多層膜

Country Status (5)

Country Link
US (1) US11021606B2 (enExample)
JP (1) JP2020533208A (enExample)
KR (1) KR102630417B1 (enExample)
CN (1) CN111065516A (enExample)
WO (1) WO2019055466A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12442084B2 (en) * 2020-04-03 2025-10-14 Dupont Electronics, Inc. Metal-clad polymer films and electronic devices

Family Cites Families (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3410826A (en) 1967-04-10 1968-11-12 Du Pont Process for preparing shaped articles from polyamide acids before converting to insoluble polyimides
JPH0665708B2 (ja) 1985-11-29 1994-08-24 鐘淵化学工業株式会社 新規ポリイミドフィルム及びその製造法
US5166308A (en) 1990-04-30 1992-11-24 E. I. Du Pont De Nemours And Company Copolyimide film with improved properties
EP0459452A3 (en) * 1990-05-30 1992-04-08 Ube Industries, Ltd. Aromatic polyimide film laminated with metal foil
EP0474054B1 (en) 1990-08-27 1995-12-06 E.I. Du Pont De Nemours And Company Flexible multi-layer polyimide film laminates and preparation thereof
US5227244A (en) 1990-09-21 1993-07-13 E. I. Du Pont De Nemours And Company Polyimide film with metal salt coating resulting in improved adhesion
US5218034A (en) 1990-09-21 1993-06-08 E. I. Du Pont De Nemours And Company Polyimide film with tin or tin salt incorporation resulting in improved adhesion
US5308569A (en) 1990-11-27 1994-05-03 Ube Industries, Ltd. Process for the preparation of aromatic polyimide film
EP0659553A1 (en) 1993-12-22 1995-06-28 E.I. Du Pont De Nemours And Company Coextruded multi-layer aromatic polyimide film and preparation thereof
US5543222A (en) 1994-04-29 1996-08-06 E. I. Du Pont De Nemours And Company Metallized polyimide film containing a hydrocarbyl tin compound
JP4147639B2 (ja) 1998-09-29 2008-09-10 宇部興産株式会社 フレキシブル金属箔積層体
US6379784B1 (en) 1999-09-28 2002-04-30 Ube Industries, Ltd. Aromatic polyimide laminate
JP4362917B2 (ja) 2000-01-31 2009-11-11 宇部興産株式会社 金属箔積層体およびその製法
US6808818B2 (en) 2001-10-11 2004-10-26 Ube Industries, Ltd. Fusible polyimide and composite polyimide film
TWI298988B (en) * 2002-07-19 2008-07-11 Ube Industries Copper-clad laminate
KR20070039151A (ko) 2002-12-13 2007-04-11 가부시키가이샤 가네카 열가소성 폴리이미드 수지 필름, 적층체 및 그것을포함하는 인쇄 배선판의 제조 방법
US7285321B2 (en) * 2003-11-12 2007-10-23 E.I. Du Pont De Nemours And Company Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto
US20070178323A1 (en) * 2004-05-31 2007-08-02 Kaneka Corporation Polyimide multilayer body and method for producing same
CN101175633B (zh) * 2005-04-19 2011-12-21 宇部兴产株式会社 聚酰亚胺薄膜层合体
KR101102180B1 (ko) * 2009-01-23 2012-01-02 주식회사 두산 신규 연성 금속박 적층판 및 그 제조방법
US20130011687A1 (en) * 2010-01-18 2013-01-10 Kaneka Corporation Multilayer polymide film and flexible metal laminated board
TWI577546B (zh) * 2011-08-12 2017-04-11 宇部興產股份有限公司 聚醯亞胺金屬疊層體之製造方法
WO2013192467A1 (en) * 2012-06-22 2013-12-27 E. I. Du Pont De Nemours And Company Circuit board
KR102169537B1 (ko) * 2013-06-28 2020-10-23 닛테츠 케미컬 앤드 머티리얼 가부시키가이샤 폴리이미드, 수지 필름 및 금속 피복 적층체

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