JP2020532145A - 分割スリットライナードア - Google Patents
分割スリットライナードア Download PDFInfo
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- JP2020532145A JP2020532145A JP2020532872A JP2020532872A JP2020532145A JP 2020532145 A JP2020532145 A JP 2020532145A JP 2020532872 A JP2020532872 A JP 2020532872A JP 2020532872 A JP2020532872 A JP 2020532872A JP 2020532145 A JP2020532145 A JP 2020532145A
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- 238000012545 processing Methods 0.000 claims abstract description 74
- 230000006835 compression Effects 0.000 claims description 13
- 238000007906 compression Methods 0.000 claims description 13
- 239000006096 absorbing agent Substances 0.000 claims description 10
- 239000004065 semiconductor Substances 0.000 claims description 10
- 230000035939 shock Effects 0.000 claims description 10
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 abstract description 48
- 239000007789 gas Substances 0.000 description 25
- 239000012530 fluid Substances 0.000 description 9
- 239000002245 particle Substances 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- 238000009832 plasma treatment Methods 0.000 description 5
- 238000005530 etching Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 238000001020 plasma etching Methods 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000001947 vapour-phase growth Methods 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000010891 electric arc Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000013529 heat transfer fluid Substances 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
- H01J37/32513—Sealing means, e.g. sealing between different parts of the vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05D—HINGES OR SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS
- E05D15/00—Suspension arrangements for wings
- E05D15/56—Suspension arrangements for wings with successive different movements
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
- E06B3/50—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with more than one kind of movement
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B5/00—Doors, windows, or like closures for special purposes; Border constructions therefor
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B7/00—Special arrangements or measures in connection with doors or windows
- E06B7/16—Sealing arrangements on wings or parts co-operating with the wings
- E06B7/22—Sealing arrangements on wings or parts co-operating with the wings by means of elastic edgings, e.g. elastic rubber tubes; by means of resilient edgings, e.g. felt or plush strips, resilient metal strips
- E06B7/23—Plastic, sponge rubber, or like strips or tubes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- E—FIXED CONSTRUCTIONS
- E05—LOCKS; KEYS; WINDOW OR DOOR FITTINGS; SAFES
- E05Y—INDEXING SCHEME RELATING TO HINGES OR OTHER SUSPENSION DEVICES FOR DOORS, WINDOWS OR WINGS AND DEVICES FOR MOVING WINGS INTO OPEN OR CLOSED POSITION, CHECKS FOR WINGS AND WING FITTINGS NOT OTHERWISE PROVIDED FOR, CONCERNED WITH THE FUNCTIONING OF THE WING
- E05Y2201/00—Constructional elements; Accessories therefore
- E05Y2201/60—Suspension or transmission members; Accessories therefore
- E05Y2201/622—Suspension or transmission members elements
- E05Y2201/624—Arms
- E05Y2201/626—Levers
-
- E05Y2999/00—
-
- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B3/00—Window sashes, door leaves, or like elements for closing wall or like openings; Layout of fixed or moving closures, e.g. windows in wall or like openings; Features of rigidly-mounted outer frames relating to the mounting of wing frames
- E06B3/32—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing
- E06B3/34—Arrangements of wings characterised by the manner of movement; Arrangements of movable wings in openings; Features of wings or frames relating solely to the manner of movement of the wing with only one kind of movement
- E06B3/42—Sliding wings; Details of frames with respect to guiding
- E06B3/46—Horizontally-sliding wings
- E06B3/4636—Horizontally-sliding wings for doors
- E06B3/4645—Horizontally-sliding wings for doors with the sliding wing flush closing or moving a considerable distance towards the opening when closing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/16—Vessels
- H01J2237/166—Sealing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
Abstract
Description
本明細書で説明する諸実施形態は、概して、RF帰還経路を有するスリットライナードアを備える基板処理チャンバ構成要素アセンブリに関する。
半導体業界では、デバイスは、エッチング及び堆積など、ますますサイズを小型化させて構造を生成する多くの製造処理によって製造されている。一部の製造処理では粒子が発生して、処理の間に基板を頻繁に汚染し、デバイスの欠陥の原因となり得る。デバイスの形状が小型化するにつれて、欠陥の影響を受けやすくなり、粒子汚染物質に対する要件がより厳しくなる。したがって、デバイスの形状が小型化するにつれて、粒子汚染の許容レベルが低下してきている。さらに、欠陥のない、更なる小型デバイスの製造は、基板が処理されるプラズマ処理チャンバで利用されるプラズマの均一性が良好であることに依存している。
Claims (15)
- 上面、後面、及び前面を有する第1ドア部分と、
第1ドア部分の前面に配置されたRF導電性ガスケットと、
側面、底面及び前面を有する第2ドア部分と、
第1ドア部分を第2ドア部分に連結するリンケージアセンブリであって、第1ドア部分に対する第2ドア部分の垂直移動と、第1ドア部分を第2ドア部分から離間させる水平移動とを変換するように構成されたリンケージアセンブリとを備える分割スリットライナードアアセンブリ。 - 垂直移動を提供するように構成されたアクチュエータであって、第2ドア部分の底面に連結されたアクチュエータをさらに備える、請求項1に記載の分割スリットライナードアアセンブリ。
- 上面に配置された緩衝器をさらに備える、請求項1に記載の分割スリットライナードアアセンブリ。
- リンケージアセンブリはさらに、第1ドア部分を第2ドア部分へ付勢する引張ばねリンケージを備えている、請求項1に記載の分割スリットライナードアアセンブリ。
- リンケージアセンブリはさらに、
第1ドア部分を第2ドア部分に連結するリンケージの一方端に形成された長穴と、
第1ドア部分を第2ドア部分から離れるように付勢する、リンケージ上に配置された圧縮付勢ばねとを備えている、請求項4に記載の分割スリットライナードアアセンブリ。 - リンケージは、第1端で第1ドア部分に連結し、第2端で第2ドア部分に連結し、
水平移動が第1ドア部分を第2ドア部分から離間させるとき、第1端は弧状に移動している、請求項5に記載の分割スリットライナードアアセンブリ。 - RF導電性ガスケットはイットリアから形成されている、請求項1に記載の分割スリットライナードアアセンブリ。
- PTFEで形成されたシールをさらに備える、請求項7に記載の分割スリットライナードアアセンブリ。
- チャンバ本体と、
チャンバ本体の上に配置された蓋アセンブリであって、処理容積が、蓋アセンブリとチャンバ本体によって囲まれた領域内に形成されている蓋アセンブリと、
処理容積内に配置された静電チャックと、
静電チャックを囲み、処理容積とともに配置されたライナーと、
チャンバ本体及びライナーを貫通して形成された開口部と、
分割スリットライナードアアセンブリであって、
上面、後面、及び前面を有する第1ドア部分と、
第1ドア部分の前面に配置されたRF導電性ガスケットと、
側面、底面及び前面を有する第2ドア部分と、
第1ドア部分を第2ドア部分に連結するリンケージアセンブリであって、第1ドア部分に対する第2ドア部分の垂直移動と、第1ドア部分を第2ドア部分から離間させる水平移動とを変換するように構成されたリンケージアセンブリとを備える分割スリットライナードアアセンブリとを備える半導体処理チャンバ。 - 垂直移動を提供するように構成されたアクチュエータであって、第2ドア部分の底面に連結されたアクチュエータをさらに備える、請求項9に記載の半導体処理チャンバ。
- 上面に配置された緩衝器をさらに備える、請求項9に記載の半導体処理チャンバ。
- リンケージアセンブリはさらに、第1ドア部分を第2ドア部分へ付勢する引張ばねリンケージを備えている、請求項9に記載の半導体処理チャンバ。
- リンケージアセンブリはさらに、
第1ドア部分を第2ドア部分に連結するリンケージの一方端に形成された長穴と、
第1ドア部分を第2ドア部分から離して、ライナーに押し付けるように付勢する、リンケージ上に配置された圧縮付勢ばねとを備えている、請求項12に記載の半導体処理チャンバ。 - リンケージは、第1端で第1ドア部分に連結し、第2端で第2ドア部分に連結し、
水平移動が第1ドア部分を第2ドア部分から離間させるとき、第1端は弧状に移動している、請求項13に記載の半導体処理チャンバ。 - RF導電性ガスケットはイットリアから形成され、PTFEで形成されたシールをさらに備えている、請求項9に記載の半導体処理チャンバ。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US15/726,139 US10636629B2 (en) | 2017-10-05 | 2017-10-05 | Split slit liner door |
US15/726,139 | 2017-10-05 | ||
PCT/US2018/052262 WO2019070427A1 (en) | 2017-10-05 | 2018-09-21 | LINER WITH SEPARATE SLOTS |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2020532145A true JP2020532145A (ja) | 2020-11-05 |
JP2020532145A5 JP2020532145A5 (ja) | 2020-12-17 |
JP7019819B2 JP7019819B2 (ja) | 2022-02-15 |
Family
ID=65993428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2020532872A Active JP7019819B2 (ja) | 2017-10-05 | 2018-09-21 | 分割スリットライナードア |
Country Status (6)
Country | Link |
---|---|
US (1) | US10636629B2 (ja) |
JP (1) | JP7019819B2 (ja) |
KR (1) | KR102340272B1 (ja) |
CN (1) | CN111213221B (ja) |
TW (1) | TWI797166B (ja) |
WO (1) | WO2019070427A1 (ja) |
Families Citing this family (4)
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US11335543B2 (en) * | 2020-03-25 | 2022-05-17 | Applied Materials, Inc. | RF return path for reduction of parasitic plasma |
US11427910B2 (en) * | 2020-10-20 | 2022-08-30 | Sky Tech Inc. | Atomic layer deposition equipment capable of reducing precursor deposition and atomic layer deposition process method using the same |
US20220165553A1 (en) * | 2020-11-20 | 2022-05-26 | Applied Materials, Inc. | L-motion slit door for substrate processing chamber |
TWI760137B (zh) * | 2021-03-09 | 2022-04-01 | 香港商彗創工程有限公司 | 風閘和抽風設備 |
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