JP2020529925A5 - - Google Patents
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- JP2020529925A5 JP2020529925A5 JP2020506743A JP2020506743A JP2020529925A5 JP 2020529925 A5 JP2020529925 A5 JP 2020529925A5 JP 2020506743 A JP2020506743 A JP 2020506743A JP 2020506743 A JP2020506743 A JP 2020506743A JP 2020529925 A5 JP2020529925 A5 JP 2020529925A5
- Authority
- JP
- Japan
- Prior art keywords
- laser
- sample
- correction
- gemstone
- reforming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023060725A JP7603333B2 (ja) | 2017-08-07 | 2023-04-04 | 内部材料のレーザ加工方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GBGB1712639.2A GB201712639D0 (en) | 2017-08-07 | 2017-08-07 | Method for laser machining inside materials |
| GB1712639.2 | 2017-08-07 | ||
| PCT/GB2018/052256 WO2019030520A1 (en) | 2017-08-07 | 2018-08-07 | METHOD FOR LASER MACHINING INSIDE MATERIALS |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023060725A Division JP7603333B2 (ja) | 2017-08-07 | 2023-04-04 | 内部材料のレーザ加工方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020529925A JP2020529925A (ja) | 2020-10-15 |
| JP2020529925A5 true JP2020529925A5 (https=) | 2021-09-16 |
| JP7262124B2 JP7262124B2 (ja) | 2023-04-21 |
Family
ID=59894878
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020506743A Active JP7262124B2 (ja) | 2017-08-07 | 2018-08-07 | 内部材料のレーザ加工方法 |
| JP2023060725A Active JP7603333B2 (ja) | 2017-08-07 | 2023-04-04 | 内部材料のレーザ加工方法 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023060725A Active JP7603333B2 (ja) | 2017-08-07 | 2023-04-04 | 内部材料のレーザ加工方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US11685003B2 (https=) |
| EP (2) | EP4534229A3 (https=) |
| JP (2) | JP7262124B2 (https=) |
| KR (1) | KR102588236B1 (https=) |
| ES (1) | ES3013117T3 (https=) |
| GB (1) | GB201712639D0 (https=) |
| WO (1) | WO2019030520A1 (https=) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB201712640D0 (en) | 2017-08-07 | 2017-09-20 | Univ Oxford Innovation Ltd | Method of laser modification of an optical fibre |
| DE102017007586A1 (de) * | 2017-08-11 | 2019-02-14 | Siltectra Gmbh | Fertigungsanlage zum Abtrennen von Wafern von Spendersubstraten |
| US12370622B2 (en) | 2018-06-02 | 2025-07-29 | Bruno Scarselli | Asset identification, registration, tracking and commercialization apparatuses and methods |
| GB2581172B (en) * | 2019-02-06 | 2022-01-05 | Opsydia Ltd | Laser machining inside materials |
| CN110133845A (zh) * | 2019-04-26 | 2019-08-16 | 中国科学院上海光学精密机械研究所 | 一种用于激光系统的自由曲面波前补偿元件的设计方法 |
| CN110788500B (zh) * | 2019-10-28 | 2022-02-01 | 北京航天控制仪器研究所 | 一种硬脆材料复杂构件飞秒激光精密成型加工系统 |
| JP7460274B2 (ja) * | 2020-02-21 | 2024-04-02 | 株式会社ディスコ | ウエーハの加工方法 |
| GB202002558D0 (en) | 2020-02-24 | 2020-04-08 | Ucl Business Ltd | Electronic device |
| JP7487039B2 (ja) * | 2020-08-04 | 2024-05-20 | 株式会社ディスコ | レーザー加工装置 |
| DE102020121283A1 (de) * | 2020-08-13 | 2022-02-17 | Trumpf Laser- Und Systemtechnik Gmbh | Laserbearbeitung eines werkstücks mit einer gekrümmten oberfläche |
| JP7608257B2 (ja) | 2021-04-23 | 2025-01-06 | 株式会社ディスコ | レーザー加工装置の調整方法、及びレーザー加工装置 |
| KR102547513B1 (ko) * | 2022-01-25 | 2023-06-26 | (주)오로스 테크놀로지 | 광학 검사 장치 |
| CN116689995A (zh) * | 2023-06-26 | 2023-09-05 | 浙江大学 | 一种金刚石内部的三维微区热操控方法 |
| WO2025074213A1 (en) | 2023-10-03 | 2025-04-10 | Opsydia Limited | Gemstone inscription viewing system and applications thereof |
| GB2642091A (en) | 2024-06-24 | 2025-12-31 | Opsydia Ltd | Laser system and method for modifying a sample |
| WO2026079004A1 (ja) * | 2024-10-07 | 2026-04-16 | 住友電気工業株式会社 | 光接続部品の製造装置および光接続部品の製造方法 |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3903890A (en) * | 1974-08-20 | 1975-09-09 | Johnson & Johnson | Disposable diaper of simple construction |
| US5287165A (en) | 1991-09-30 | 1994-02-15 | Kaman Aerospace Corporation | High sensitivity-wide dynamic range optical tilt sensor |
| EP0745980B1 (en) * | 1991-11-20 | 1999-06-16 | Sony Corporation | Optical pickup device |
| JPH05144056A (ja) | 1991-11-20 | 1993-06-11 | Sony Corp | デイスク傾き補正装置 |
| GB9514558D0 (en) * | 1995-07-17 | 1995-09-13 | Gersan Ets | Marking diamond |
| US5932119A (en) * | 1996-01-05 | 1999-08-03 | Lazare Kaplan International, Inc. | Laser marking system |
| US6992765B2 (en) | 2002-10-11 | 2006-01-31 | Intralase Corp. | Method and system for determining the alignment of a surface of a material in relation to a laser beam |
| DE102004053298B4 (de) * | 2004-08-26 | 2008-10-09 | ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H. | Scankopf als Teil einer Laser Bohr- und Schneideinrichtung |
| US20060102601A1 (en) * | 2004-11-12 | 2006-05-18 | The Regents Of The University Of California | Feedback controlled laser machining system |
| US7284396B2 (en) | 2005-03-01 | 2007-10-23 | International Gemstone Registry Inc. | Method and system for laser marking in the volume of gemstones such as diamonds |
| KR100631048B1 (ko) * | 2005-03-29 | 2006-10-04 | 한국기계연구원 | 레이저 가공용 자동초점장치 |
| KR100792593B1 (ko) * | 2005-10-12 | 2008-01-09 | 한국정보통신대학교 산학협력단 | 극초단 펄스 레이저를 이용한 단일 펄스 패턴 형성방법 및시스템 |
| DE102007055530A1 (de) | 2007-11-21 | 2009-05-28 | Carl Zeiss Ag | Laserstrahlbearbeitung |
| EP2211656B1 (en) * | 2007-11-30 | 2013-12-25 | California Institute of Technology | Gemstones and methods for controlling the appearance thereof |
| JP2009164296A (ja) * | 2007-12-28 | 2009-07-23 | Canon Inc | 露光装置およびデバイス製造方法 |
| JP5692969B2 (ja) * | 2008-09-01 | 2015-04-01 | 浜松ホトニクス株式会社 | 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム |
| JP5254761B2 (ja) * | 2008-11-28 | 2013-08-07 | 浜松ホトニクス株式会社 | レーザ加工装置 |
| WO2011096353A1 (ja) * | 2010-02-05 | 2011-08-11 | 株式会社フジクラ | 微細構造の形成方法および微細構造を有する基体 |
| JP4997512B2 (ja) * | 2010-03-26 | 2012-08-08 | 防衛省技術研究本部長 | ポリカーボネート内部への導電性材料の作製法、ポリカーボネート窓材及びダイシング法 |
| US11154948B2 (en) * | 2010-12-16 | 2021-10-26 | Bystronic Laser Ag | Laser beam machining device and a process of laser machining comprising a single lens for light focussing |
| JP5873488B2 (ja) * | 2011-05-25 | 2016-03-01 | 株式会社フジクラ | 微細孔を配した基体の製造方法、及び微細孔を配した基体 |
| GB2501117A (en) | 2012-04-13 | 2013-10-16 | Isis Innovation | Laser focusing method and apparatus |
| JP5575200B2 (ja) * | 2012-09-28 | 2014-08-20 | 浜松ホトニクス株式会社 | レーザ加工装置及びその製造方法 |
| GB2527553B (en) * | 2014-06-25 | 2017-08-23 | Fianium Ltd | Laser processing |
| US9281244B1 (en) * | 2014-09-18 | 2016-03-08 | Applied Materials, Inc. | Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process |
| GB2540537A (en) * | 2015-07-03 | 2017-01-25 | Univ Oxford Innovation Ltd | Crystal defects |
| GB201516681D0 (en) * | 2015-09-21 | 2015-11-04 | Renishaw Plc | Addictive manufacturing apparatus and an optical module for use in an addictive manufacturing apparatus |
-
2017
- 2017-08-07 GB GBGB1712639.2A patent/GB201712639D0/en not_active Ceased
-
2018
- 2018-08-07 EP EP25159751.4A patent/EP4534229A3/en active Pending
- 2018-08-07 WO PCT/GB2018/052256 patent/WO2019030520A1/en not_active Ceased
- 2018-08-07 JP JP2020506743A patent/JP7262124B2/ja active Active
- 2018-08-07 ES ES18758682T patent/ES3013117T3/es active Active
- 2018-08-07 KR KR1020207006800A patent/KR102588236B1/ko active Active
- 2018-08-07 EP EP18758682.1A patent/EP3664955B1/en active Active
- 2018-08-07 US US16/636,361 patent/US11685003B2/en active Active
-
2023
- 2023-04-04 JP JP2023060725A patent/JP7603333B2/ja active Active
- 2023-05-26 US US18/202,401 patent/US20230398639A1/en active Pending
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