KR102588236B1 - 재료 내부의 레이저 가공방법 - Google Patents

재료 내부의 레이저 가공방법 Download PDF

Info

Publication number
KR102588236B1
KR102588236B1 KR1020207006800A KR20207006800A KR102588236B1 KR 102588236 B1 KR102588236 B1 KR 102588236B1 KR 1020207006800 A KR1020207006800 A KR 1020207006800A KR 20207006800 A KR20207006800 A KR 20207006800A KR 102588236 B1 KR102588236 B1 KR 102588236B1
Authority
KR
South Korea
Prior art keywords
laser
sample
correction
delete delete
focus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
KR1020207006800A
Other languages
English (en)
Korean (ko)
Other versions
KR20200038977A (ko
Inventor
마틴 제임스 부스
패트릭 살터
Original Assignee
옥스포드 유니버시티 이노베이션 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 옥스포드 유니버시티 이노베이션 리미티드 filed Critical 옥스포드 유니버시티 이노베이션 리미티드
Publication of KR20200038977A publication Critical patent/KR20200038977A/ko
Application granted granted Critical
Publication of KR102588236B1 publication Critical patent/KR102588236B1/ko
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50Working by transmitting the laser beam through or within the workpiece
    • B23K26/53Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046Automatically focusing the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626Energy control of the laser beam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70Auxiliary operations or equipment
    • B23K26/702Auxiliary equipment
    • B23K26/705Beam measuring devices
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microscoopes, Condenser (AREA)
  • Laser Beam Processing (AREA)
KR1020207006800A 2017-08-07 2018-08-07 재료 내부의 레이저 가공방법 Active KR102588236B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GBGB1712639.2A GB201712639D0 (en) 2017-08-07 2017-08-07 Method for laser machining inside materials
GB1712639.2 2017-08-07
PCT/GB2018/052256 WO2019030520A1 (en) 2017-08-07 2018-08-07 METHOD FOR LASER MACHINING INSIDE MATERIALS

Publications (2)

Publication Number Publication Date
KR20200038977A KR20200038977A (ko) 2020-04-14
KR102588236B1 true KR102588236B1 (ko) 2023-10-11

Family

ID=59894878

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020207006800A Active KR102588236B1 (ko) 2017-08-07 2018-08-07 재료 내부의 레이저 가공방법

Country Status (7)

Country Link
US (2) US11685003B2 (https=)
EP (2) EP4534229A3 (https=)
JP (2) JP7262124B2 (https=)
KR (1) KR102588236B1 (https=)
ES (1) ES3013117T3 (https=)
GB (1) GB201712639D0 (https=)
WO (1) WO2019030520A1 (https=)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB201712640D0 (en) 2017-08-07 2017-09-20 Univ Oxford Innovation Ltd Method of laser modification of an optical fibre
DE102017007586A1 (de) * 2017-08-11 2019-02-14 Siltectra Gmbh Fertigungsanlage zum Abtrennen von Wafern von Spendersubstraten
US12370622B2 (en) 2018-06-02 2025-07-29 Bruno Scarselli Asset identification, registration, tracking and commercialization apparatuses and methods
GB2581172B (en) * 2019-02-06 2022-01-05 Opsydia Ltd Laser machining inside materials
CN110133845A (zh) * 2019-04-26 2019-08-16 中国科学院上海光学精密机械研究所 一种用于激光系统的自由曲面波前补偿元件的设计方法
CN110788500B (zh) * 2019-10-28 2022-02-01 北京航天控制仪器研究所 一种硬脆材料复杂构件飞秒激光精密成型加工系统
JP7460274B2 (ja) * 2020-02-21 2024-04-02 株式会社ディスコ ウエーハの加工方法
GB202002558D0 (en) 2020-02-24 2020-04-08 Ucl Business Ltd Electronic device
JP7487039B2 (ja) * 2020-08-04 2024-05-20 株式会社ディスコ レーザー加工装置
DE102020121283A1 (de) * 2020-08-13 2022-02-17 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitung eines werkstücks mit einer gekrümmten oberfläche
JP7608257B2 (ja) 2021-04-23 2025-01-06 株式会社ディスコ レーザー加工装置の調整方法、及びレーザー加工装置
KR102547513B1 (ko) * 2022-01-25 2023-06-26 (주)오로스 테크놀로지 광학 검사 장치
CN116689995A (zh) * 2023-06-26 2023-09-05 浙江大学 一种金刚石内部的三维微区热操控方法
WO2025074213A1 (en) 2023-10-03 2025-04-10 Opsydia Limited Gemstone inscription viewing system and applications thereof
GB2642091A (en) 2024-06-24 2025-12-31 Opsydia Ltd Laser system and method for modifying a sample
WO2026079004A1 (ja) * 2024-10-07 2026-04-16 住友電気工業株式会社 光接続部品の製造装置および光接続部品の製造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0545133A2 (en) * 1991-11-20 1993-06-09 Sony Corporation Optical pickup device and focusing servo device employed therein
JP2008531143A (ja) * 2005-03-01 2008-08-14 インターナショナル ジェムストーン レジストリー インコーポレイテッド ダイアモンドのような宝石用原石の体積内にレーザマーキングするための方法及びシステム
JP2010125507A (ja) * 2008-11-28 2010-06-10 Hamamatsu Photonics Kk レーザ加工装置
JP2013027930A (ja) * 2012-09-28 2013-02-07 Hamamatsu Photonics Kk レーザ加工装置及びその製造方法
JP2014503359A (ja) * 2010-12-16 2014-02-13 バイストロニック レーザー アクチェンゲゼルシャフト 光合焦用レンズが単一のレーザビームマシニング装置及びレーザマシニング方法

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3903890A (en) * 1974-08-20 1975-09-09 Johnson & Johnson Disposable diaper of simple construction
US5287165A (en) 1991-09-30 1994-02-15 Kaman Aerospace Corporation High sensitivity-wide dynamic range optical tilt sensor
JPH05144056A (ja) 1991-11-20 1993-06-11 Sony Corp デイスク傾き補正装置
GB9514558D0 (en) * 1995-07-17 1995-09-13 Gersan Ets Marking diamond
US5932119A (en) * 1996-01-05 1999-08-03 Lazare Kaplan International, Inc. Laser marking system
US6992765B2 (en) 2002-10-11 2006-01-31 Intralase Corp. Method and system for determining the alignment of a surface of a material in relation to a laser beam
DE102004053298B4 (de) * 2004-08-26 2008-10-09 ARGES Gesellschaft für Industrieplanung und Lasertechnik m.b.H. Scankopf als Teil einer Laser Bohr- und Schneideinrichtung
US20060102601A1 (en) * 2004-11-12 2006-05-18 The Regents Of The University Of California Feedback controlled laser machining system
KR100631048B1 (ko) * 2005-03-29 2006-10-04 한국기계연구원 레이저 가공용 자동초점장치
KR100792593B1 (ko) * 2005-10-12 2008-01-09 한국정보통신대학교 산학협력단 극초단 펄스 레이저를 이용한 단일 펄스 패턴 형성방법 및시스템
DE102007055530A1 (de) 2007-11-21 2009-05-28 Carl Zeiss Ag Laserstrahlbearbeitung
EP2211656B1 (en) * 2007-11-30 2013-12-25 California Institute of Technology Gemstones and methods for controlling the appearance thereof
JP2009164296A (ja) * 2007-12-28 2009-07-23 Canon Inc 露光装置およびデバイス製造方法
JP5692969B2 (ja) * 2008-09-01 2015-04-01 浜松ホトニクス株式会社 収差補正方法、この収差補正方法を用いたレーザ加工方法、この収差補正方法を用いたレーザ照射方法、収差補正装置、及び、収差補正プログラム
WO2011096353A1 (ja) * 2010-02-05 2011-08-11 株式会社フジクラ 微細構造の形成方法および微細構造を有する基体
JP4997512B2 (ja) * 2010-03-26 2012-08-08 防衛省技術研究本部長 ポリカーボネート内部への導電性材料の作製法、ポリカーボネート窓材及びダイシング法
JP5873488B2 (ja) * 2011-05-25 2016-03-01 株式会社フジクラ 微細孔を配した基体の製造方法、及び微細孔を配した基体
GB2501117A (en) 2012-04-13 2013-10-16 Isis Innovation Laser focusing method and apparatus
GB2527553B (en) * 2014-06-25 2017-08-23 Fianium Ltd Laser processing
US9281244B1 (en) * 2014-09-18 2016-03-08 Applied Materials, Inc. Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
GB2540537A (en) * 2015-07-03 2017-01-25 Univ Oxford Innovation Ltd Crystal defects
GB201516681D0 (en) * 2015-09-21 2015-11-04 Renishaw Plc Addictive manufacturing apparatus and an optical module for use in an addictive manufacturing apparatus

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0545133A2 (en) * 1991-11-20 1993-06-09 Sony Corporation Optical pickup device and focusing servo device employed therein
JP2008531143A (ja) * 2005-03-01 2008-08-14 インターナショナル ジェムストーン レジストリー インコーポレイテッド ダイアモンドのような宝石用原石の体積内にレーザマーキングするための方法及びシステム
JP2010125507A (ja) * 2008-11-28 2010-06-10 Hamamatsu Photonics Kk レーザ加工装置
JP2014503359A (ja) * 2010-12-16 2014-02-13 バイストロニック レーザー アクチェンゲゼルシャフト 光合焦用レンズが単一のレーザビームマシニング装置及びレーザマシニング方法
JP2013027930A (ja) * 2012-09-28 2013-02-07 Hamamatsu Photonics Kk レーザ加工装置及びその製造方法

Also Published As

Publication number Publication date
US11685003B2 (en) 2023-06-27
JP2020529925A (ja) 2020-10-15
KR20200038977A (ko) 2020-04-14
JP7603333B2 (ja) 2024-12-20
EP4534229A2 (en) 2025-04-09
JP7262124B2 (ja) 2023-04-21
EP3664955A1 (en) 2020-06-17
GB201712639D0 (en) 2017-09-20
EP3664955C0 (en) 2025-02-26
WO2019030520A1 (en) 2019-02-14
EP3664955B1 (en) 2025-02-26
US20230398639A1 (en) 2023-12-14
EP4534229A3 (en) 2025-07-09
US20200164470A1 (en) 2020-05-28
ES3013117T3 (en) 2025-04-11
JP2023093522A (ja) 2023-07-04

Similar Documents

Publication Publication Date Title
KR102588236B1 (ko) 재료 내부의 레이저 가공방법
KR102623898B1 (ko) 재료들 내부에서의 레이저 가공
KR102102010B1 (ko) 광변조 제어 방법, 제어 프로그램, 제어 장치, 및 레이저광 조사 장치
JP2006500237A (ja) 光学アクセラレータ及び汎用の光学渦巻
Orlov et al. Light engineering and silicon diffractive optics assisted nonparaxial terahertz imaging
WO2013153371A1 (en) Laser focusing method and apparatus with control system for correction of the optical aberration
KR20140084122A (ko) 광변조 제어 방법, 제어 프로그램, 제어 장치 및 레이저광 조사 장치
Hering et al. Automated aberration correction of arbitrary laser modes in high numerical aperture systems
US20150085346A1 (en) Method for Scanning Along a Continuous Scanning Trajectory With a Scanner System
KR20190133145A (ko) 수차 보정 방법 및 광학 장치
Dai et al. Define and measure the dimensional accuracy of two-photon laser lithography based on its instrument transfer function
Wang et al. Femtosecond laser processing with aberration correction based on Shack-Hartmann wavefront sensor
GB2594553A (en) Laser machining inside materials
CN112567281A (zh) 用于显微镜的照明总成、显微镜和用于照明显微镜中的样本空间的方法
Takiguchi et al. Suppression of backside damage in nanosecond internal-focusing pulse laser dicing with wavefront modulation
Khan Design and Numerical Simulation of Dielectric Photonic Crystal Devices and Investigation of an Optical Characterization Method
HK40033333A (en) Method for laser machining inside materials
HK40033333B (en) Method for laser machining inside materials
Xiaoli et al. Three-dimensional measurement enabled by single-layer all-in-one transmitting-receipting optical metasystem
US12523893B2 (en) Thermo-optical spatial light modulator

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20200306

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20210806

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20221102

Patent event code: PE09021S01D

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

Patent event code: PE07011S01D

Comment text: Decision to Grant Registration

Patent event date: 20230707

GRNT Written decision to grant
PR0701 Registration of establishment

Comment text: Registration of Establishment

Patent event date: 20231006

Patent event code: PR07011E01D

PR1002 Payment of registration fee

Payment date: 20231006

End annual number: 3

Start annual number: 1

PG1601 Publication of registration