GB201712639D0 - Method for laser machining inside materials - Google Patents

Method for laser machining inside materials

Info

Publication number
GB201712639D0
GB201712639D0 GBGB1712639.2A GB201712639A GB201712639D0 GB 201712639 D0 GB201712639 D0 GB 201712639D0 GB 201712639 A GB201712639 A GB 201712639A GB 201712639 D0 GB201712639 D0 GB 201712639D0
Authority
GB
United Kingdom
Prior art keywords
laser machining
inside materials
machining inside
materials
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
GBGB1712639.2A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oxford University Innovation Ltd
Original Assignee
Oxford University Innovation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oxford University Innovation Ltd filed Critical Oxford University Innovation Ltd
Priority to GBGB1712639.2A priority Critical patent/GB201712639D0/en
Publication of GB201712639D0 publication Critical patent/GB201712639D0/en
Priority to EP18758682.1A priority patent/EP3664955B1/en
Priority to KR1020207006800A priority patent/KR102588236B1/ko
Priority to PCT/GB2018/052256 priority patent/WO2019030520A1/en
Priority to US16/636,361 priority patent/US11685003B2/en
Priority to ES18758682T priority patent/ES3013117T3/es
Priority to JP2020506743A priority patent/JP7262124B2/ja
Priority to EP25159751.4A priority patent/EP4534229A3/en
Priority to JP2023060725A priority patent/JP7603333B2/ja
Priority to US18/202,401 priority patent/US20230398639A1/en
Ceased legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
    • B23K26/046—Automatically focusing the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/705—Beam measuring devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0005—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing
    • B28D5/0011—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by breaking, e.g. dicing with preliminary treatment, e.g. weakening by scoring

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Microscoopes, Condenser (AREA)
  • Laser Beam Processing (AREA)
GBGB1712639.2A 2017-08-07 2017-08-07 Method for laser machining inside materials Ceased GB201712639D0 (en)

Priority Applications (10)

Application Number Priority Date Filing Date Title
GBGB1712639.2A GB201712639D0 (en) 2017-08-07 2017-08-07 Method for laser machining inside materials
EP25159751.4A EP4534229A3 (en) 2017-08-07 2018-08-07 Method for laser machining inside materials
US16/636,361 US11685003B2 (en) 2017-08-07 2018-08-07 Method for laser machining inside materials
KR1020207006800A KR102588236B1 (ko) 2017-08-07 2018-08-07 재료 내부의 레이저 가공방법
PCT/GB2018/052256 WO2019030520A1 (en) 2017-08-07 2018-08-07 METHOD FOR LASER MACHINING INSIDE MATERIALS
EP18758682.1A EP3664955B1 (en) 2017-08-07 2018-08-07 Method for laser machining inside materials
ES18758682T ES3013117T3 (en) 2017-08-07 2018-08-07 Method for laser machining inside materials
JP2020506743A JP7262124B2 (ja) 2017-08-07 2018-08-07 内部材料のレーザ加工方法
JP2023060725A JP7603333B2 (ja) 2017-08-07 2023-04-04 内部材料のレーザ加工方法
US18/202,401 US20230398639A1 (en) 2017-08-07 2023-05-26 Method for laser machining inside materials

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GBGB1712639.2A GB201712639D0 (en) 2017-08-07 2017-08-07 Method for laser machining inside materials

Publications (1)

Publication Number Publication Date
GB201712639D0 true GB201712639D0 (en) 2017-09-20

Family

ID=59894878

Family Applications (1)

Application Number Title Priority Date Filing Date
GBGB1712639.2A Ceased GB201712639D0 (en) 2017-08-07 2017-08-07 Method for laser machining inside materials

Country Status (7)

Country Link
US (2) US11685003B2 (https=)
EP (2) EP4534229A3 (https=)
JP (2) JP7262124B2 (https=)
KR (1) KR102588236B1 (https=)
ES (1) ES3013117T3 (https=)
GB (1) GB201712639D0 (https=)
WO (1) WO2019030520A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220111469A1 (en) * 2019-02-06 2022-04-14 Opsydia Limited Laser machining inside materials

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GB201712640D0 (en) 2017-08-07 2017-09-20 Univ Oxford Innovation Ltd Method of laser modification of an optical fibre
DE102017007586A1 (de) * 2017-08-11 2019-02-14 Siltectra Gmbh Fertigungsanlage zum Abtrennen von Wafern von Spendersubstraten
US12370622B2 (en) 2018-06-02 2025-07-29 Bruno Scarselli Asset identification, registration, tracking and commercialization apparatuses and methods
CN110133845A (zh) * 2019-04-26 2019-08-16 中国科学院上海光学精密机械研究所 一种用于激光系统的自由曲面波前补偿元件的设计方法
CN110788500B (zh) * 2019-10-28 2022-02-01 北京航天控制仪器研究所 一种硬脆材料复杂构件飞秒激光精密成型加工系统
JP7460274B2 (ja) * 2020-02-21 2024-04-02 株式会社ディスコ ウエーハの加工方法
GB202002558D0 (en) 2020-02-24 2020-04-08 Ucl Business Ltd Electronic device
JP7487039B2 (ja) * 2020-08-04 2024-05-20 株式会社ディスコ レーザー加工装置
DE102020121283A1 (de) * 2020-08-13 2022-02-17 Trumpf Laser- Und Systemtechnik Gmbh Laserbearbeitung eines werkstücks mit einer gekrümmten oberfläche
JP7608257B2 (ja) 2021-04-23 2025-01-06 株式会社ディスコ レーザー加工装置の調整方法、及びレーザー加工装置
KR102547513B1 (ko) * 2022-01-25 2023-06-26 (주)오로스 테크놀로지 광학 검사 장치
CN116689995A (zh) * 2023-06-26 2023-09-05 浙江大学 一种金刚石内部的三维微区热操控方法
WO2025074213A1 (en) 2023-10-03 2025-04-10 Opsydia Limited Gemstone inscription viewing system and applications thereof
GB2642091A (en) 2024-06-24 2025-12-31 Opsydia Ltd Laser system and method for modifying a sample
WO2026079004A1 (ja) * 2024-10-07 2026-04-16 住友電気工業株式会社 光接続部品の製造装置および光接続部品の製造方法

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220111469A1 (en) * 2019-02-06 2022-04-14 Opsydia Limited Laser machining inside materials

Also Published As

Publication number Publication date
US11685003B2 (en) 2023-06-27
JP2020529925A (ja) 2020-10-15
KR20200038977A (ko) 2020-04-14
JP7603333B2 (ja) 2024-12-20
EP4534229A2 (en) 2025-04-09
KR102588236B1 (ko) 2023-10-11
JP7262124B2 (ja) 2023-04-21
EP3664955A1 (en) 2020-06-17
EP3664955C0 (en) 2025-02-26
WO2019030520A1 (en) 2019-02-14
EP3664955B1 (en) 2025-02-26
US20230398639A1 (en) 2023-12-14
EP4534229A3 (en) 2025-07-09
US20200164470A1 (en) 2020-05-28
ES3013117T3 (en) 2025-04-11
JP2023093522A (ja) 2023-07-04

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Legal Events

Date Code Title Description
AT Applications terminated before publication under section 16(1)